CN201661917U - Light-emitting diode lighting device - Google Patents
Light-emitting diode lighting device Download PDFInfo
- Publication number
- CN201661917U CN201661917U CN2010201569089U CN201020156908U CN201661917U CN 201661917 U CN201661917 U CN 201661917U CN 2010201569089 U CN2010201569089 U CN 2010201569089U CN 201020156908 U CN201020156908 U CN 201020156908U CN 201661917 U CN201661917 U CN 201661917U
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- emitting diode
- light emitting
- illuminating apparatus
- diode illuminating
- gripping member
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Abstract
The utility model relates to a light-emitting diode lighting device which at least comprises a housing, a light-emitting diode substrate, at least two insulating clamping parts, as well as corresponding screws and a thermally conductive gasket, wherein at least one light-emitting diode chip is fixedly arranged on the surface of the light-emitting diode substrate; each insulating clamping part is provided with a screw hole by penetration for being locked by the screws so as to be fixed on the housing; furthermore, each insulating clamping part comprises a depressed part for clamping the light-emitting diode substrate; and the thermally conductive gasket is arranged between the housing and the light-emitting diode substrate for conducting thermal energy generated by the light-emitting diode chip. The light-emitting diode lighting device increases the insulation resistance under the situation of not sacrificing wiring space on the surface of the light-emitting diode substrate, thereby avoiding the improper electrical conduction and passing the test for safety specification.
Description
Technical field
The utility model relates to a kind of lighting device, particularly relates to a kind of light emitting diode illuminating apparatus.
Background technology
In view of the plurality of advantages of light emitting diode (LED), for example volume is little, the reaction time is short, consumed power is low, reliability is high, a large amount of producing feasibility height, so light emitting diode replaces traditional light-emitting component gradually, for example bulb or fluorescent lamp.
Fig. 1 is the partial cutaway schematic of traditional light emitting diode bulb.As shown in the figure, the light emitting diode aluminium base 102 that carries LED wafer 100 is locked in the surface of housing 106 by screw 104.On light emitting diode aluminium base 102 surfaces, necessary and screw 104 maintenances one predeterminable range just can be avoided user's that electrically conducting causes electric shock improperly near the wiring of screw 104, makes that light emitting diode bulb can be by the test of safety requirements.Yet, for undersized light emitting diode bulb, perhaps LED wafer 100 numbers more for a long time, the surface of light emitting diode aluminium base 102 there is no enough spaces and can be used as this space length.
This shows that above-mentioned existing light emitting diode illuminating apparatus obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of light emitting diode illuminating apparatus of new structure, in order to effectively avoiding electrically conducting improperly, and can be by the test of safety requirements, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The purpose of this utility model is, overcome the defective that existing light emitting diode illuminating apparatus exists, and a kind of light emitting diode illuminating apparatus of new structure is proposed, technical problem to be solved is to make it under the situation of the wiring space of not sacrificing the light emitting diode base plate surface, increased insulation and hindered resistance, thereby avoided electrically conducting improperly, the test with by safety requirements is very suitable for practicality.
The purpose of this utility model and solve its technical problem and realize by the following technical solutions.At least comprise housing, light emitting diode base plate, at least two insulating blanked clamper gripping members and corresponding screw, heat conduction pad according to a kind of light emitting diode illuminating apparatus that the utility model proposes.Wherein, light emitting diode base plate surface set has at least one LED wafer.The insulating blanked clamper gripping member is penetrated with a screw, in order to lock screw, to be fixed in housing; And the insulating blanked clamper gripping member has a depressed part, in order to the clamping light emitting diode base plate.The heat conduction pad is arranged between housing and the light emitting diode base plate, in order to the conduction heat energy that LED wafer produced.
The purpose of this utility model and solve its technical problem and also can be applied to the following technical measures to achieve further.
Aforesaid light emitting diode illuminating apparatus more comprises a heat conductive isolation sheet, is arranged between this light emitting diode base plate and this heat conduction pad.
Aforesaid light emitting diode illuminating apparatus, wherein said heat conductive isolation sheet is subjected to the clamping of this insulating blanked clamper gripping member simultaneously.
Aforesaid light emitting diode illuminating apparatus, at least one end of wherein said heat conductive isolation sheet more is subjected to the application of force of this insulating blanked clamper gripping member and this screw and is locked between this insulating blanked clamper gripping member and this housing.
Aforesaid light emitting diode illuminating apparatus more comprises a heat conductive isolation sheet, is arranged between this heat conduction pad and this housing.
Aforesaid light emitting diode illuminating apparatus, at least one end of wherein said heat conductive isolation sheet more is subjected to the application of force of this insulating blanked clamper gripping member and this screw and is locked between this insulating blanked clamper gripping member and this housing.
Aforesaid light emitting diode illuminating apparatus more comprises an extra heat conductive isolation sheet, is arranged between this light emitting diode base plate and this heat conduction pad.
Aforesaid light emitting diode illuminating apparatus, wherein said extra heat conductive isolation sheet is subjected to the clamping of this insulating blanked clamper gripping member simultaneously.
Aforesaid light emitting diode illuminating apparatus, the material of wherein said insulating blanked clamper gripping member are plastic cement.
Aforesaid light emitting diode illuminating apparatus, the depression of the depressed part of wherein said insulating blanked clamper gripping member go deep into direction perpendicular to this screw direction.
Aforesaid light emitting diode illuminating apparatus, being shaped as of wherein said insulating blanked clamper gripping member is double-deck cylindric.
Aforesaid light emitting diode illuminating apparatus, wherein said heat conduction pad are surperficial one-body molded with this housing.
Aforesaid light emitting diode illuminating apparatus, the material of wherein said heat conduction pad are aluminium.
Aforesaid light emitting diode illuminating apparatus, wherein said light emitting diode base plate are aluminium base, ceramic substrate or copper base.
Aforesaid light emitting diode illuminating apparatus, wherein said light emitting diode base plate comprises wiring layer and heat-conducting layer in regular turn, and wherein this LED wafer is bonded to the surface of this wiring layer.
Aforesaid light emitting diode illuminating apparatus, the set form of wherein said LED wafer can be module or packaging body.
Aforesaid light emitting diode illuminating apparatus, the packaging body of wherein said LED wafer are that surface adhering element (SMD) packaging body or pin run through through hole (PTH) packaging body.
Aforesaid light emitting diode illuminating apparatus more comprises a high-voltage insulation layer between wherein said wiring layer and the heat-conducting layer.
Aforesaid light emitting diode illuminating apparatus, wherein said housing comprise lower house, upper shell and electrode contact site in regular turn, and wherein this insulating blanked clamper gripping member is fixed in the surface of this lower house.
Aforesaid light emitting diode illuminating apparatus more comprises a power supply unit, is arranged in this lower house and the defined space of this upper shell.
Aforesaid light emitting diode illuminating apparatus more comprises a lampshade, and this light emitting diode base plate, this insulating blanked clamper gripping member, this screw and this heat conduction pad are capped in this lampshade.
The utility model compared with prior art has tangible advantage and beneficial effect.By technique scheme, the utility model light emitting diode illuminating apparatus has following advantage and beneficial effect at least: the utility model is under the situation of the wiring space of not sacrificing the light emitting diode base plate surface, increase insulation and hindered resistance, thereby avoided electrically conducting improperly, and the test by safety requirements.
In sum, the utility model relates to a kind of light emitting diode illuminating apparatus, and it comprises housing, light emitting diode base plate, at least two insulating blanked clamper gripping members and corresponding screw, heat conduction pad at least.Light emitting diode base plate surface set has at least one LED wafer.The insulating blanked clamper gripping member is penetrated with a screw, in order to lock screw, to be fixed in housing; And the insulating blanked clamper gripping member has a depressed part, in order to the clamping light emitting diode base plate.The heat conduction pad is arranged between housing and the light emitting diode base plate, in order to the conduction heat energy that LED wafer produced.The utility model has obvious improvement technically, and has tangible good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the partial cutaway schematic of traditional light emitting diode bulb.
Fig. 2 A is the exploded view of the light emitting diode illuminating apparatus of the utility model first embodiment.
Fig. 2 B is the stereogram of the light emitting diode illuminating apparatus combination back (except the lampshade) of Fig. 2 A.
Fig. 2 C is along the partial cutaway schematic of hatching 2C-2C among Fig. 2 B.
Fig. 2 D is the partial cutaway schematic of another change type embodiment of first embodiment.
Fig. 2 E is the partial cutaway schematic of the another change type embodiment of first embodiment.
Fig. 2 F is the partial cutaway schematic of a change type embodiment again of first embodiment.
Fig. 3 A is the exploded view of the light emitting diode illuminating apparatus of the utility model second embodiment.
Fig. 3 B is the stereogram of the light emitting diode illuminating apparatus combination back (except the lampshade) of Fig. 3 A.
Fig. 3 C is along the partial cutaway schematic of hatching 3C-3C among Fig. 3 B.
Fig. 3 D is the partial cutaway schematic of another change type embodiment of second embodiment.
Fig. 3 E is the partial cutaway schematic of the another change type embodiment of second embodiment.
Fig. 3 F is the partial cutaway schematic of a change type embodiment again of second embodiment.
10: lampshade 12A: the insulating blanked clamper gripping member
120: screw 122: depressed part
12B: screw 14: light emitting diode base plate
140: wiring layer 141: LED wafer
142: high-voltage insulation layer 144: heat-conducting layer
149: space length 16: heat conductive isolation sheet
16B: extra heat conductive isolation sheet 18: heat conduction pad
20A: lower house 200: fin
20B: upper shell 20C: electrode contact site
22: power supply unit 100: LED wafer
102: light emitting diode aluminium base 104: screw
106: housing
The specific embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to its specific embodiment of light emitting diode illuminating apparatus, structure, feature and the effect thereof that the utility model proposes, describe in detail as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present utility model can be known to present in the following detailed description that cooperates with reference to graphic preferred embodiment.Explanation by the specific embodiment, when can being to reach technological means that predetermined purpose takes and effect to obtain one more deeply and concrete understanding to the utility model, yet appended graphic only provide with reference to the usefulness of explanation, be not to be used for the utility model is limited.
Fig. 2 A is the exploded view of light emitting diode (LED) lighting device of the utility model first embodiment, Fig. 2 B is the stereogram of the light emitting diode illuminating apparatus combination back (except the lampshade) of Fig. 2 A, Fig. 2 C is along the partial cutaway schematic of hatching 2C-2C among Fig. 2 B, Fig. 2 D is the partial cutaway schematic of another change type embodiment of first embodiment, Fig. 2 E is the partial cutaway schematic of the another change type embodiment of first embodiment, and Fig. 2 F is the partial cutaway schematic of a change type embodiment again of first embodiment.In the present embodiment, the outward appearance of light emitting diode illuminating apparatus is napiform root (bulb) shape of conventional incandescent bulb, yet shape of the present utility model is not limited thereto.
The light emitting diode illuminating apparatus of present embodiment mainly comprises lampshade 10, insulating blanked clamper gripping member 12A and corresponding screw 12B, light emitting diode base plate 14, heat conductive isolation sheet 16, heat conduction pad 18, housing (it comprises lower house 20A, upper shell 20B and electrode contact site 20C in regular turn) and power supply unit 22.Wherein, power supply unit 22 is positioned at lower house 20A and the defined space of upper shell 20B, and lampshade 10 is then in order to cover insulating blanked clamper gripping member 12A, screw 12B, light emitting diode base plate 14, heat conductive isolation sheet 16 and heat conduction pad 18.
The material of insulating blanked clamper gripping member 12A can (but not limiting) be a plastic cement.In the present embodiment, being shaped as of insulating blanked clamper gripping member 12A double-deck cylindric (but not as limit), central authorities are penetrated with screw 120 (Fig. 2 C), in order to lock screw 12B.In general, insulating blanked clamper gripping member 12A has a depressed part 122, and its depression is goed deep into direction perpendicular to screw 120 directions, in order to clamping light emitting diode base plate 14.In another embodiment, except clamping light emitting diode base plate 14, also the heat conductive isolation sheet of clamping simultaneously 16, shown in Fig. 2 D.The insulating blanked clamper gripping member 12A of present embodiment is single element, yet in other embodiments, insulating blanked clamper gripping member 12A also can be made of a plurality of important documents of forming.Though present embodiment uses two insulating blanked clamper gripping member 12A, yet in other embodiments, also can use insulating blanked clamper gripping member 12A more than two.
Cross-section structure shown in Fig. 2 C, the insulating blanked clamper gripping member 12A of present embodiment is fixed in the upper surface of lower house 20A by screw 12B.Light emitting diode base plate 14 is subjected to two relative insulating blanked clamper gripping member 12A clampings.In another change type embodiment (Fig. 2 D), light emitting diode base plate 14 is subjected to two relative insulating blanked clamper gripping member 12A clampings simultaneously with heat conductive isolation sheet 16.Light emitting diode base plate 14 can (but not limiting) be aluminium base, ceramic substrate, copper base or the good material of other heat conduction, its composition is wiring layer 140 and heat-conducting layer 144 in regular turn from top to bottom, and the surperficial set of wiring layer 140 has at least one LED wafer 141.The set form of LED wafer 141 can adopt module, packaging body or other to be suitable for the form that engages with light emitting diode base plate 14.For example, LED wafer 141 can be the form of surface adhering element (SMD) packaging body, perhaps runs through the form of through hole (PTH) packaging body for pin.In the another change type embodiment of present embodiment, also can have a high-voltage insulation layer 142 between wiring layer 140 and the heat-conducting layer 144, shown in Fig. 2 E.Clamping mechanism by this, under the wiring space situation on sacrifice circuit wiring layer 140 surfaces not, the insulation that is increased between wiring and the screw 12B hinders resistance, thereby is avoided electrically conducting improperly, and can be by the test of safety requirements.In other words, present embodiment is by increasing space length 149 (that is, but the beeline from the wiring outer most edge of wiring layer 140 to mutual conduction its contiguous screw 12B), thereby the insulation that is increased between wiring and the screw 12B hinders resistance.
According to the various change type embodiment of above-mentioned the utility model first embodiment, with regard to the locus, heat conductive isolation sheet 16 is to place between light emitting diode base plate 14 and the heat conduction pad 18.With regard to set mechanism, heat conductive isolation sheet 16 can be subjected to the fixing of one or more strength.With Fig. 2 C, Fig. 2 E or Fig. 2 F is example, heat conductive isolation sheet 16 is except being subjected to light emitting diode base plate 14 and heat conduction pad 18 from upper and lower contact force, and its at least one end also is subjected to the locking force of insulating blanked clamper gripping member 12A and screw 12B and is locked between insulating blanked clamper gripping member 12A and the lower house 20A.With Fig. 2 D is example, and heat conductive isolation sheet 16 also is subjected to the chucking power of insulating blanked clamper gripping member 12A side direction simultaneously except being subjected to light emitting diode base plate 14 and heat conduction pad 18 from upper and lower contact force.The set mechanism of heat conductive isolation sheet 16 is not limited to above-mentioned various change type embodiment, also can do other variation.For example, the set of heat conductive isolation sheet 16 can only be subjected to light emitting diode base plate 14 and heat conduction pad 18 from upper and lower contact force (that is heat conductive isolation sheet 16 is not subjected to the application of force of insulating blanked clamper gripping member 12A or screw 12B); Perhaps, heat conductive isolation sheet 16 separately (or in conjunction with other set mechanism) reach set by fastener.
Fig. 3 A is the exploded view of the light emitting diode illuminating apparatus of the utility model second embodiment, Fig. 3 B is the stereogram of the led lighting dress combination back (except the lampshade) of Fig. 3 A, Fig. 3 C is along the partial cutaway schematic of hatching 3C-3C among Fig. 3 B, Fig. 3 D is the partial cutaway schematic of another change type embodiment of second embodiment, Fig. 3 E is the partial cutaway schematic of the another change type embodiment of second embodiment, and Fig. 3 F is the partial cutaway schematic of a change type embodiment again of second embodiment.Present embodiment is similar to last embodiment, so similar elements is to use the components identical symbol, and descriptions such as the composition of individual elements, material are not then given unnecessary details.The difference of present embodiment and last embodiment maximum is, the heat conductive isolation sheet 16 of present embodiment is to be arranged between lower house 20A and the heat conduction pad 18, and the heat conductive isolation sheet 16 of last embodiment then is to be arranged between heat conduction pad 18 and the light emitting diode base plate 14.In other words, replace each other the position of the heat conductive isolation sheet 16 of two embodiment, heat conduction pad 18.Another change type embodiment according to second embodiment, also can increase by an extra heat conductive isolation sheet 16B (shown in Fig. 3 D), it is arranged between heat conduction pad 18 and the light emitting diode base plate 14, and light emitting diode base plate 14 and extra heat conductive isolation sheet 16B are subjected to the clamping of insulating blanked clamper gripping member 12A simultaneously.
In the another change type embodiment of present embodiment, also can have a high-voltage insulation layer 142 between wiring layer 140 and the heat-conducting layer 144, shown in Fig. 3 E.In addition, according to a change type embodiment again of present embodiment, the depressed part 122 of insulating blanked clamper gripping member 12A can only be a local dent, shown in Fig. 3 F.
Various change type embodiment according to above-mentioned the utility model second embodiment, with regard to the locus, heat conductive isolation sheet 16 is to be arranged between heat conduction pad 18 and the lower house 20A, and extra heat conductive isolation sheet 16B then is arranged between light emitting diode base plate 14 and the heat conduction pad 18.With regard to set mechanism, heat conductive isolation sheet 16 or extra heat conductive isolation sheet 16B can be subjected to the fixing of one or more strength.For heat conductive isolation sheet 16, with Fig. 3 C, Fig. 3 D, Fig. 3 E or Fig. 3 F is example, heat conductive isolation sheet 16 is except being subjected to heat conduction pad 18 and lower house 20A from upper and lower contact force, and its at least one end also is subjected to the locking force of insulating blanked clamper gripping member 12A and screw 12B and is locked between insulating blanked clamper gripping member 12A and the lower house 20A.The set mechanism of heat conductive isolation sheet 16 is not limited to above-mentioned various change type embodiment, also can do other variation.For example, the set of heat conductive isolation sheet 16 can only be subjected to heat conduction pad 18 and lower house 20A from upper and lower contact force (that is heat conductive isolation sheet 16 is not subjected to the application of force of insulating blanked clamper gripping member 12A or screw 12B); Perhaps, heat conductive isolation sheet 16 separately (or in conjunction with other set mechanism) reach set by fastener.
For extra heat conductive isolation sheet 16B, be example with Fig. 3 D, extra heat conductive isolation sheet 16B also is subjected to the chucking power of insulating blanked clamper gripping member 12A side direction simultaneously except being subjected to light emitting diode base plate 14 and heat conduction pad 18 from upper and lower contact force.The set mechanism of extra heat conductive isolation sheet 16B is not limited to above-mentioned various change type embodiment, also can do other variation.For example, the set of extra heat conductive isolation sheet 16B can only be subjected to light emitting diode base plate 14 and heat conduction pad 18 from upper and lower contact force (that is extra heat conductive isolation sheet 16B is not subjected to the application of force of insulating blanked clamper gripping member 12A); Perhaps, extra heat conductive isolation sheet 16B separately (or in conjunction with other set mechanism) reach set by fastener; Perhaps, in addition its at least one end can be subjected to the locking force of insulating blanked clamper gripping member 12A and screw 12B and be locked between insulating blanked clamper gripping member 12A and the lower house 20A.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art, in not breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (21)
1. light emitting diode illuminating apparatus is characterized in that it comprises:
One housing;
One light emitting diode base plate, its surperficial set has at least one LED wafer;
At least two insulating blanked clamper gripping members and corresponding screw, this insulating blanked clamper gripping member is penetrated with a screw, locks this screw, and to be fixed in this housing, wherein this insulating blanked clamper gripping member has a depressed part, this light emitting diode base plate of clamping; And
One heat conduction pad is arranged between this housing and this light emitting diode base plate, conducts the heat energy that this LED wafer produces.
2. light emitting diode illuminating apparatus according to claim 1 is characterized in that more comprising a heat conductive isolation sheet, is arranged between this light emitting diode base plate and this heat conduction pad.
3. light emitting diode illuminating apparatus according to claim 2 is characterized in that wherein said heat conductive isolation sheet is subjected to the clamping of this insulating blanked clamper gripping member simultaneously.
4. light emitting diode illuminating apparatus according to claim 2, at least one end that it is characterized in that wherein said heat conductive isolation sheet more is subjected to the application of force of this insulating blanked clamper gripping member and this screw and is locked between this insulating blanked clamper gripping member and this housing.
5. light emitting diode illuminating apparatus according to claim 1 is characterized in that more comprising a heat conductive isolation sheet, is arranged between this heat conduction pad and this housing.
6. light emitting diode illuminating apparatus according to claim 5, at least one end that it is characterized in that wherein said heat conductive isolation sheet more is subjected to the application of force of this insulating blanked clamper gripping member and this screw and is locked between this insulating blanked clamper gripping member and this housing.
7. light emitting diode illuminating apparatus according to claim 5 is characterized in that more comprising an extra heat conductive isolation sheet, is arranged between this light emitting diode base plate and this heat conduction pad.
8. light emitting diode illuminating apparatus according to claim 7 is characterized in that wherein said extra heat conductive isolation sheet is subjected to the clamping of this insulating blanked clamper gripping member simultaneously.
9. light emitting diode illuminating apparatus according to claim 1 is characterized in that wherein said insulating blanked clamper gripping member is the plastic cement holder.
10. light emitting diode illuminating apparatus according to claim 1 is characterized in that the depression of the depressed part of wherein said insulating blanked clamper gripping member is goed deep into direction perpendicular to this screw direction.
11. light emitting diode illuminating apparatus according to claim 10 is characterized in that being shaped as of wherein said insulating blanked clamper gripping member is double-deck cylindric.
12. light emitting diode illuminating apparatus according to claim 1 is characterized in that wherein said heat conduction pad is surperficial one-body molded with this housing.
13. light emitting diode illuminating apparatus according to claim 1 is characterized in that wherein said heat conduction pad is an aluminium flake.
14. light emitting diode illuminating apparatus according to claim 1 is characterized in that wherein said light emitting diode base plate is aluminium base, ceramic substrate or copper base.
15. light emitting diode illuminating apparatus according to claim 1 is characterized in that wherein said light emitting diode base plate comprises wiring layer and heat-conducting layer in regular turn, wherein this LED wafer is bonded to the surface of this wiring layer.
16. light emitting diode illuminating apparatus according to claim 15 is characterized in that the set form of wherein said LED wafer can be module or packaging body.
17. being surface adhering element packaging body or pin, light emitting diode illuminating apparatus according to claim 16, the packaging body that it is characterized in that wherein said LED wafer run through the through hole packaging body.
18. light emitting diode illuminating apparatus according to claim 15 is characterized in that more comprising a high-voltage insulation layer between wherein said wiring layer and the heat-conducting layer.
19. light emitting diode illuminating apparatus according to claim 1 is characterized in that wherein said housing comprises lower house, upper shell and electrode contact site in regular turn, wherein this insulating blanked clamper gripping member is fixed in the surface of this lower house.
20. light emitting diode illuminating apparatus according to claim 19 is characterized in that more comprising a power supply unit, is arranged in this lower house and the defined space of this upper shell.
21. light emitting diode illuminating apparatus according to claim 1 is characterized in that more comprising a lampshade, this light emitting diode base plate, this insulating blanked clamper gripping member, this screw and this heat conduction pad are capped in this lampshade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201569089U CN201661917U (en) | 2010-04-08 | 2010-04-08 | Light-emitting diode lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201569089U CN201661917U (en) | 2010-04-08 | 2010-04-08 | Light-emitting diode lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201661917U true CN201661917U (en) | 2010-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201569089U Expired - Fee Related CN201661917U (en) | 2010-04-08 | 2010-04-08 | Light-emitting diode lighting device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102095103A (en) * | 2010-12-28 | 2011-06-15 | 秦彪 | Light emitting diode (LED) illuminating lamp and lamp thereof |
| CN102109116A (en) * | 2010-12-27 | 2011-06-29 | 秦彪 | Led light module and led chip |
| CN103851381A (en) * | 2012-12-06 | 2014-06-11 | 深圳市海洋王照明工程有限公司 | Luminous module and lamp with luminous module |
| TWI454637B (en) * | 2011-03-07 | 2014-10-01 | ||
| CN107388056A (en) * | 2017-08-25 | 2017-11-24 | 中山进成塑料制品有限公司 | A kind of light fixture |
| CN107843823A (en) * | 2017-10-09 | 2018-03-27 | 江苏云意电气股份有限公司 | A kind of excitation diode bulge test method |
-
2010
- 2010-04-08 CN CN2010201569089U patent/CN201661917U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102109116A (en) * | 2010-12-27 | 2011-06-29 | 秦彪 | Led light module and led chip |
| WO2012088790A1 (en) * | 2010-12-27 | 2012-07-05 | Qin Biao | Led light module and led chip |
| TWI449863B (en) * | 2010-12-27 | 2014-08-21 | ||
| CN102109116B (en) * | 2010-12-27 | 2016-06-22 | 秦彪 | Led light module and led chip |
| CN102095103A (en) * | 2010-12-28 | 2011-06-15 | 秦彪 | Light emitting diode (LED) illuminating lamp and lamp thereof |
| TWI454637B (en) * | 2011-03-07 | 2014-10-01 | ||
| CN103851381A (en) * | 2012-12-06 | 2014-06-11 | 深圳市海洋王照明工程有限公司 | Luminous module and lamp with luminous module |
| CN103851381B (en) * | 2012-12-06 | 2016-05-04 | 深圳市海洋王照明工程有限公司 | Illuminating module and there is the light fixture of this illuminating module |
| CN107388056A (en) * | 2017-08-25 | 2017-11-24 | 中山进成塑料制品有限公司 | A kind of light fixture |
| CN107843823A (en) * | 2017-10-09 | 2018-03-27 | 江苏云意电气股份有限公司 | A kind of excitation diode bulge test method |
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Owner name: TOP ENERGY SAVING SYSTEM CORPORATION Free format text: FORMER OWNER: JIYI INVESTMENT CO., LTD., TAIWAN Effective date: 20101207 |
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Free format text: CORRECT: ADDRESS; FROM: BUILDING 3-8, NO.57, SECTION 1, DUNHUA SOUTH ROAD, SONGSHAN DISTRICT, TAIPEI CITY, TAIWAN, CHINA TO: BUILDING 3, NO.115, WUGONG ROAD 3, WUGU TOWNSHIP, TAIPEI COUNTY, TAIWAN PROVINCE |
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Effective date of registration: 20101207 Address after: Taiwan County, Taipei Province five shares of the township, five workers, three, 115, No. 3 Building Patentee after: Top Energy Saving System Co., Ltd. Address before: Songshan District, Taipei, China Dunhua South Road, No. 1, No. 3, building 57,, 8 Patentee before: GE Investment Co.,Ltd. |
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Owner name: CHANG WAH ELECTROMATERIALS INC. Free format text: FORMER OWNER: TOP ENERGY SAVING SYSTEM CORPORATION Effective date: 20131108 |
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Effective date of registration: 20131108 Address after: Taiwan City, Kaohsiung China Processing Zone East seven Street No. 16 6 floor Patentee after: Chang Wah Electronmaterials Inc. Address before: Taiwan County, Taipei, China five shares of the township, five workers, three, 115, No. 3, building Patentee before: Top Energy Saving System Co., Ltd. |
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Granted publication date: 20101201 Termination date: 20160408 |
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| CF01 | Termination of patent right due to non-payment of annual fee |