The radiator structure of electronic building brick
Technical field
The present invention is for a kind of radiator structure is provided, espespecially a kind of low cost of manufacture, production fast, manufacturing process's minimizing, environmental protection and the high radiating structure of electronic assemblies of radiating efficiency.
Background technology
Press, due to light-emitting diode (Light Emitting Diode, LED) be to utilize electric energy to be converted into the principle of luminous energy, in semiconductor, two terminals of both positive and negative polarity apply voltage, when electric current passes through, when electronics is combined with electric hole, dump energy just discharges with the form of light, comply with the difference of the material of its use, and can just make photon energy produce the light of different wave length in rank with it, because it has that brightness is high, the advantage of power saving, life-span length, and be applied to widely in all science and technology and daily life, become the indispensable articles for use of common people's lighting apparatus.
And the power of LED input only has 15~20% to convert light to, all the other 80~85% convert heat to, if these heat are not discharged outside in good time, will make so LED crystal grain interface temperature too high and affect luminous efficiency and luminescent lifetime.In practical, high power, high brightness LED throw light on its space of living in and position, to the good no great key that has of dispelling the heat.
A kind of improvement of LED lamp radiating module as shown in known techniques, it has LED lamp substantially, circuit board, radiating fin and heat conduction copper post form, wherein, this heat conduction copper post generally becomes T shape, and on circuit board, in LED lamp position, be provided with a hole, in radiating fin, be positioned at circuit board hole place and be provided with a shrinkage pool, make heat conduction copper post be inserted shrinkage pool, and make T shape hold the shrinkage pool end limit that is arranged in the hole of circuit board and is attached at radiating fin, by this, by LED lamp directly and the T shape end in contact of heating column, make heat directly by copper post, be transmitted to radiating fin, and obtained the object person of the heat radiation efficiently and effectively.
The improvement of right above-mentioned LED lamp radiating module, when using, exists following point and disappearance to wait to improve:
This radiating mode is the action of must punching on aluminium matter heat radiation pedestal, to be formed with shrinkage pool, then again heat conduction copper post is inserted in this shrinkage pool, this kind of mode not only takes time and effort, and and do not meet cost economic benefit, many shrinkage pool processing procedures in operation, its cost and production time-histories all will be consumed and incur loss through delay, therefore, not good in industrial competitiveness, again and, cause for this reason known techniques need be holed in advance, easily cause this shrinkage pool excessive or too small, while making heat conduction copper post insert shrinkage pool because elasticity is bad so that adaptation is not good (producing space in around), its radiating effect is reduced, and there is space because producing, in space, easily produce impurity, and then affect radiating effect, separately, principle of expanding with heat and contracting with cold processing procedure is adopted by this radiating module system, also consumptive material consuming time not only on processing procedure.
Summary of the invention
Therefore the present invention's inventor designs the patent of invention person of the radiating structure of electronic assemblies that this kind of low cost of manufacture, production fast, manufacturing process's minimizing, environmental protection and radiating efficiency are high.The present invention's main purpose is: the aluminium matter radiating seat system on this radiator structure is connected with a radiating fin, and be to be provided with at least one to close the mode of being forced into by provided thereon of at least one copper post heat carrier with mould on this aluminium matter heat radiation pedestal, and on the relative position of these copper post heat carriers, be to be respectively arranged with several electronic building bricks, while producing heat energy in order to do starting start when these electronic building bricks, by being oppositely arranged of these copper post heat carriers, effectively heat energy is derived rapidly, by above-mentioned technology, can be the action of must punching on aluminium matter heat radiation pedestal for this existing radiating mode of the improvement of commonly using LED lamp radiating module, to be formed with shrinkage pool, then again heat conduction copper post is inserted in this shrinkage pool, this kind of mode not only takes time and effort, and and do not meet cost economic benefit, many shrinkage pool processing procedures in operation, its cost and production time-histories all will be consumed and incur loss through delay, therefore, not good in industrial competitiveness, again and, cause for this reason known techniques need be holed in advance, easily cause this shrinkage pool excessive or too small, while making heat conduction copper post insert shrinkage pool because elasticity is bad so that adaptation is not good (producing space in around), its radiating effect is reduced, and there is space because producing, in space, easily produce impurity, and then affect radiating effect, separately, principle of expanding with heat and contracting with cold processing procedure is adopted by this radiating module system, on processing procedure, not only the problem points of also consumptive material consuming time is broken through, reach by punching press or close the mode of being forced into copper post heat carrier is inserted on aluminium matter heat radiation pedestal, and corresponding with the electronic building brick that produces heat energy, make it improve heat-conducting effect, and reduction manufacturing cost, produce fast, the practical improvement of manufacturing process's minimizing and environmental protection.
Accompanying drawing explanation
Fig. 1 is the stereogram of preferred embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of preferred embodiment of the present invention.
Fig. 3 is the heat radiation schematic diagram of preferred embodiment of the present invention.
Fig. 4 is the enforcement schematic isometric of another preferred embodiment of the present invention.
Fig. 5 is the enforcement signal exploded view of another preferred embodiment of the present invention.
Drawing reference numeral explanation:
Radiating fin 10,10a
Step 11
Aluminium matter heat radiation pedestal 20,20a
Groove 21a
Main body 21,22a
Cylindrical shell 22
Ring wall 23a
Electronic building brick 30,30a
Copper post heat carrier 40,40a
Heat energy 50
Embodiment
Below in conjunction with accompanying drawing and embodiment, the invention will be further described.
Refer to shown in Fig. 1 and Fig. 2, be stereogram and the three-dimensional exploded view of preferred embodiment of the present invention, in figure, can know and find out that the present invention comprises a radiating fin 10, one is located at aluminium matter on this radiating fin 10 heat radiation pedestal 20 and is at least onely located on this aluminium matter heat radiation pedestal 20 and can be LED lamp or arbitrary electronic building brick 30 with the assembly that produces heat energy forms, and on this aluminium matter heat radiation pedestal 20, be define at least one respectively with these electronic building brick 30 positions corresponding copper post heat carrier 40 mutually, its aforementioned copper post heat carrier 40 is to utilize mould to see through to close by force the mode of being forced into be located on this aluminium matter heat radiation pedestal 20, separately can be further with impact style by force, be located on this aluminium matter heat radiation pedestal 20.In the present embodiment, aluminium matter heat radiation pedestal 20 is to be comprised of main body 21 and the cylindrical shell 22 that is resisted against main body 21 belows, and this main body 21 is placed on the radiating fin 10 formed steps 11 in inner side.
Please coordinate simultaneously and consult shown in Fig. 2 and Fig. 3, be three-dimensional exploded view and the heat radiation schematic diagram of preferred embodiment of the present invention, in figure, can know and find out, aluminium matter heat radiation pedestal 20 on this radiator structure is to be connected with a radiating fin 10, and on this aluminium matter heat radiation pedestal 20, be to be provided with at least one with mould, to close and be forced into (such as being punching press etc.) mode by 40 provided thereon of at least one copper post heat carriers, and on the relative position of these copper post heat carriers 40, be to be respectively arranged with several electronic building bricks 30, while producing heat energy 50 in order to do starting start when these electronic building bricks 30, by being oppositely arranged of these copper post heat carriers 40, can be effectively the heat energy of this electronic building brick 30 50 is derived rapidly and via copper post heat carrier 40 again by radiating fin 10 discharged in outside.
Please coordinate simultaneously and consult shown in Fig. 4 and Fig. 5, be enforcement schematic isometric and the enforcement signal exploded view of another preferred embodiment of the present invention, in figure, can know and find out, this radiator structure includes a radiating fin 10a, one aluminium matter heat radiation pedestal 20a, at least one copper post heat carrier 40a and at least one electronic building brick 30a form, the upper system of this radiating fin 10a is provided with this aluminium matter heat radiation pedestal 20a, on this aluminium matter heat radiation pedestal 20a, be to define groove 21a into one, and this upper system of aluminium matter heat radiation pedestal 20a defines several copper post heat carrier 40a that (such as being punching press etc.) mode arranges that are forced into by closing, and be to be provided with several electronic building brick 30a on the relative position of these copper post heat carriers 40a.In the present embodiment, aluminium matter heat radiation pedestal 20a system is comprised of main body 22a and the ring wall 23a that extended by main body 22a periphery one, and this ring wall 23a and main body 22a form groove 21a, and this ring wall 23a system is incorporated into inside radiating fin 10a.
Therefore the present invention's radiating structure of electronic assemblies is for improving the key problem in technology of commonly using:
One, this copper post heat carrier 40 is to close and be forced into (such as being punching press etc.) mode and be arranged on aluminium matter heat radiation pedestal 20 (because aluminium matter heat radiation pedestal 20 density are greater than copper post heat carrier 40 by mould utilization, therefore close and be forced into by force), there is quick production Ji Zhi manufacturing process and reduce advantage.
Two, these copper post heat carriers 40 are that correspondence is provided with electronic building brick 30 respectively, make this electronic building brick 30 can be respectively when distributing heat energy 50 by copper post heat carrier 40 by heat energy 50 heat conduction on radiating fin 10, and discharged in outside, there is the advantage of radiating efficiency height.
While three, inserting aluminium matter heat radiation pedestal 20 because of copper post heat carrier 40, need not adopt prior drilling technique, therefore can't damage material, there is the advantage of environmental protection.
Four, because copper post heat carrier 40 is corresponding with electronic building brick 30 positions respectively, therefore can have and optionally adopt copper post heat carrier 40 quantity, to the current high epoch of copper material price, have the advantage that lowers manufacturing cost.
The above, it is only structure preferred embodiment of the present invention, not technical scope of the present invention is imposed any restrictions, therefore any trickle modification, equivalent variations and modification that every foundation technical spirit of the present invention is done above embodiment all still belong in the scope of technical solution of the present invention.