CN102095103A - Light emitting diode (LED) illuminating lamp and lamp thereof - Google Patents
Light emitting diode (LED) illuminating lamp and lamp thereof Download PDFInfo
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- CN102095103A CN102095103A CN2010106244995A CN201010624499A CN102095103A CN 102095103 A CN102095103 A CN 102095103A CN 2010106244995 A CN2010106244995 A CN 2010106244995A CN 201010624499 A CN201010624499 A CN 201010624499A CN 102095103 A CN102095103 A CN 102095103A
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- fin
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- thermal diffusion
- diffusion plate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention provides a light emitting diode (LED) illuminating lamp and a lamp thereof. A power source (2), radiating fins and an LED light source (an LED lamp core) (3) are integrated, wherein the radiating fins are formed by laminating a plurality of fins (4) which are formed by punching, so that the cost of the radiating fins is reduced, the radiating area is increased, and the heat dissipating capacity is improved; the ribs (4) are provided with a louver or crossed vents, so that the influence of the postures of the radiating fins on the heat dissipating capacity is reduced; and the power source is separated from the radiating fins, and a power source chamber shell (3) can be provided with ventilation holes, so that the heat dissipation of the power source is improved, the structure is simplified, and the cost is reduced.
Description
Technical field
The invention belongs to the LED lighting technical field, specially referring to collection led light source (LED wick), fin and driving power is the LED illuminating lamp of one.
Technical background
The LED illumination is considered to human environmental protection lighting engineering of future generation.But current LED illuminating product cost height hampers its application popularization, and the basic reason that LED illuminating product cost is high is that the LED heat radiation causes.People are to thermal conduction study and technical research, and are very ripe.But practitioner in electronic chip (comprising LED) heat radiation industry, generally lack these ripe knowledge, or even the ABC of thermal conduction study, such as, Natural Heat Convection is adopted in the heat radiation of LED lamp, and free convection is the intensification because air is heated, the buoyancy-driven that density descends and produces, drive limitedly, it is unimpeded just extremely important to heat radiation to guarantee that air flows, and particularly air unimpeded in radiated rib flows more important.
Existing a kind of LED bulb lamp, fin is at the middle part, and fin stretches out from the central tube radiation, is power supply in the central tube, and fin is arranged along axial direction, and when horizontal, air is flowed through just not smooth in the fin, and the heat dispersion influence is very big.Fin is to adopt the aluminothermy casting forming, (1) injection moulding cost height, and (2) also will be furnished with turnning and milling fine finishining, (3) fin wall thickness, material (aluminium material) consumption is big, (4) fin depth as shallow, promptly the fin area of dissipation is little, thereby heat dissipation capacity is very limited.This in addition structural design, power supply is being wrapped at the fin center, power-supply ambient temperature, encapsulating (silica gel), thereby power supply heat sinking again is not good, and the life-span is not high, and encapsulating further increases cost again.
Summary of the invention
The present invention be directed to the above problem, propose a kind of LED illuminating lamp, be particularly suitable for the design of LED bulb lamp.Not only improve the heat dissipation capacity of fin, and reduced the material and the manufacturing cost of fin, also proposed to reduce the thermal conduction resistance of the inner encapsulation of LED wick, and the dielectric strength that improves inner electricity, help reducing the power supply cost.
The formation of LED illuminating lamp of the present invention mainly includes: wick, fin and power supply, wick and power supply are separately positioned on the both sides, front and back of fin.Feature of the present invention is: fin has adopted several splintery fins to form, the laminated structure that stays the slices in gap to build between the fin, the fin root has adopted lamination layer pressure type structure or flange nest plate type structure or lamination layer pressure type structure and flange nest plate type combining structure; Wick and power supply are separately positioned on the both sides, front and back of fin; It is the parts that sheet metal (preferably aluminium sheet) adopts the Sheet Metal Forming Technology moulding that fin more than 3/5ths is arranged in the fin; Have venetian blind type structure, fork row formula structure blow vent on the fin.
Fin adopts the many fins of number, and the laminated structure that blocks of horst gathers into folds, fin just can adopt the punch ram moulding, this process efficiency height, and precision is high again, need not turnning and milling fine finishining, and processing cost further reduces again; Fin thickness is attenuate as far as possible, helps saving the material material, and fin thickness is easy to reduce to below the 0.5mm, and this is to adopt injection moulding technology not realize.The many fins of number overlap together (being called lamination layer pressure type structure) by the fin root, and are simple in structure, and the efficiency of assembling height just can overlap together the root of the many fins of number such as a screw or rivet, and guarantees that thermal conduction resistance is low.Turn over sheet nest plate type structure, structure is simple equally, and this structure is a lot of in industrial heat exchanger application.
For a certain reason, fin also may adopt other technology manufacturing, such as the aluminothermy extrusion process.But in order to reduce cost, the present invention emphasizes that it is to adopt metallic plate (preferably formula aluminium sheet) that the fin more than 3/5ths should be arranged in the fin, adopts Sheet Metal Forming Technology machine-shaping.
LED lamp installation attitude is fixing, and for guaranteeing fin of the present invention, under various attitudes, air can guarantee good mobile unimpeded in fin, has blow vent on the fin, and employing venetian blind type structure, pitches row formula structure.Venetian blind type and fork row formula structure blow vent: one, adopt punch press processing easily, two, do not have waste material, do not reduce area of dissipation.For air is mobile unimpeded in fin, blow vent should be opened greatly as far as possible, and area should reach more than 1/3rd of this fin area.
Among the present invention, power supply is not included in the fin.Influence reduces to the power supply temperature environment in the led chip heating, and the shell of power supply room just can be opened pore, can further improve power supply heat sinking like this, and power supply also needn't be used the glue embedding, helps reducing the cost of power supply.
Description of drawings
The invention will be further described below in conjunction with the drawings and specific embodiments.
Fig. 1 is a kind of feature structure generalized section of LED illuminating lamp of the present invention, shows basic structural feature of the present invention, adopts lamination layer pressure type structure.
Fig. 2 is a kind of feature structure generalized section of LED illuminating lamp of the present invention, adopts flange nest plate pressure type structure.
Fig. 3 is a kind of feature structure generalized section of LED illuminating lamp of the present invention, adopts lamination layer pressure type and flange nest plate type combining structure.
Fig. 4 is a kind of feature structure generalized section of LED lighting of the present invention.
Fig. 5 is a kind of feature profile schematic diagram of venetian blind type.
Fig. 6 is a kind of feature profile schematic diagram of pitching the row formula.
Fig. 7,8,9 is respectively the schematic top plan view of three kinds of fins, and the cut line of the blow vent on the expression fin is radiation shapes.
Figure 10 is the used LED wick of a kind of the present invention, shows the basic structural feature of this kind wick.
Figure 11,12,13 is respectively three kinds of LED wicks that the present invention acted on, and has adopted three kinds and has strengthened the dielectric strength structure that improves ceramic insulation sheet edge.
Among the figure: 1, erection joint, 2, power supply, 3, the power supply room shell, 4, fin, 5, wick, 6, lampshade, 7, the heat conduction sleeve, 8, heat conduction core, 9, cut line, 10, thermal diffusion plate, 11, LED wafer, 12, outer insulator, 13, the ceramic insulation sheet, 14, insulating cement (lacquer).
The specific embodiment
LED illuminating lamp of the present invention shown in Figure 1 is provided with erection joint 1, and adopts screw type, and similar with existing bulb, erection joint can also be adopted buckle-type certainly.Shown in the figure, what fin 4 adopted is lamination layer pressure type structure, have 6 fins, its root blocks ofly closely overlaps together, by a screw wick 5 and several pieces fins are overlapped together, guarantee to contact closely between wick and the fin (among the figure the most preceding fin), make that the transmission of heat by contact thermal resistance is little.Be provided with lampshade 6 before the wick 5, fixedlying connected and can finish between fin and the erection joint 1 by power supply room shell 3, power supply room shell 3 should have the many passages of number, helps its inner power supply 2 heat radiations like this.Be direct contact between the fin root among the figure, can also adopt the structure that increases pad during design.
LED illuminating lamp of the present invention shown in Figure 2, fin 4 has adopted flange nest plate type structure, the root of fin 4 is processed to the hole with flange, be enclosed within on the heat conduction sleeve 7 blocks ofly, wick 5 is close on the end face of heat conduction sleeve 7 by screw, the heat of wick 5 passes to heat conduction sleeve 7 earlier, and contacting between the flange by fin 4 roots and the heat conduction sleeve passed on the fin again.Heat conduction sleeve 7 is separate parts among the figure, can utilize during design that a certain fin drawn becomes the heat conduction sleeve in the fin.
In the LED illuminating lamp of the present invention shown in Figure 3, fin has adopted the combining structure of lamination layer pressure type and flange nest plate type, and the heat conduction sleeve is the fin with front side in the fin, the drawn moulding.Wick 5 is attached to by screw on the end face of heat conduction core 8, and heat conduction core 8 is a cone.
Fig. 4 illustrates a kind of LED lighting of the present invention, is exactly to have removed wick 5 and lampshade 6 with difference shown in Figure 1.Adopt metallic plate (aluminium sheet), through stamping forming fin, sheet is thick can be approached, and to reduce material, reduces cost.But the intensity of fin descends, for guaranteeing the constant and fin bulk strength of spacing between the fin, a part should be set between the fin, make when a fin stress deformation displacement, adjacent fin is also wanted displacement, therefore increased bulk strength, a part can be designed to directly punching molding from the sheet material of fin own.
It is little that free convection drives, thereby the gap can not be too little between the fin, though otherwise fin quantity increased, heat dissipation capacity not to be increased.During design, the mean gap between the fin should be less than 2.0mm, and the thickness of fin (average thickness) should not increase fin thickness and can not effectively increase heat dissipation capacity, waste material on the contrary greater than 1.0mm again.
Fig. 5,6 shows the essential characteristic of venetian blind type and fork row formula blow vent respectively, can adopt the punch press punching molding.Fig. 7,8,9 shows three kinds of shapes of the cut line 9 of blow vent, is radiation shape.Shown in Figure 7 is the cut line shape of fork row formula blow vent, and Fig. 8 is the cut line shape of venetian blind type blow vent, and Fig. 9 can be above two kinds of cut line shapes.Adopting radiation shape cut line, mainly is in order to help the heat conduction in the fin.
Fin shown in Fig. 7,8,9 is symmetrical disc all, can also adopt asymmetric during design, even can also adopt similar petally, and lampshade also designs the imaging bud, and this LED illuminating lamp is spent as one.
Figure 10 illustrates the used LED wick basic structure of a kind of the present invention, LED wafer 11 is arranged on thermal diffusion plate 10 one sides (this face is called the A face of thermal diffusion plate), another side (this face is called the B face) is provided with ceramic insulation sheet 13, and sidewall is provided with outer insulator 12 round the edge of thermal diffusion plate 10.
The thickness of ceramic insulation sheet 13 should be born the High-Voltage Insulation effect greater than 0.15mm, can reach more than the 1500V, and such High-Voltage Insulation is arranged, and just can simplify power supply, adopts non-isolated driving power, reduces the power supply cost.Thermal diffusion plate 10 adopts copper or aluminum material or copper aluminum composite material, and it mainly acts on is that the high heat flux diffusion is reduced.
Thermal conduction resistance in the led chip mainly is because the LED chip area is little, forms due to the high heat flux.The LED wafer is arranged on the thermal diffusion plate of copper or aluminium, bears the ceramic insulation sheet of High-Voltage Insulation, then be arranged between thermal diffusion plate and heat conduction core or the fin.Its design philosophy is: not considering earlier the insulation (High-Voltage Insulation) between LED wafer and the thermal diffusion plate, at first is to reduce heat flow density, implements High-Voltage Insulation again, just can effectively reduce interior thermal conduction resistance.Naked or dielectric strength are low between thermal diffusion plate that employing metallic conduction material is made and the wafer, thereby the High-Voltage Insulation of thermal diffusion plate has just become subject matter.
As the thermal diffusion plate of thermal diffusion effect, it is enough big that its area and thickness are also wanted.The area of thermal diffusion plate should be more than five times of LED chip area sum on it, preferably selects more than ten times during design; The thickness of thermal diffusion plate should be greater than 0.4mm.If wafer is 1X1mm, 1W, the thickness of thermal diffusion plate should reach more than the 1.0mm, and its purpose and effect are exactly to make heat effectively diffusion in thermal diffusion plate, reduce heat flow density.
Sinter the potsherd of porcelain into, fine and close, dielectric strength is high, the thermal conductivity factor height, thereby the present invention selects the ceramic insulation sheet that sinters porcelain into for use.Alumina ceramic plate is a ceramic substrate the most frequently used in the electronic component, and cost is low, the thermal conductivity factor height, and the thermal conductivity factor of 96 aluminium oxide ceramics can reach 20W/mK, thereby is first-selected ceramic insulation sheet material.
Ceramic insulation sheet and outer insulator are two parts, two kinds of materials, and ceramic insulation sheet thin thickness (generally being no more than 0.5mm), structure shown in Figure 10, ceramic insulation sheet 13 and outer insulator 12 junctions, dielectric strength is low, is easy to occur punch-through.For strengthening the dielectric strength of ceramic insulation sheet and outer insulator junction (edge of ceramic insulation sheet just), shown in Figure 11, the edge of ceramic insulation sheet 13 is greater than the edge of thermal diffusion plate 10, so just can strengthen the creep age distance of thermal diffusion plate edge and fin peripheral hardware conductors such as (heat conduction core), just increase dielectric strength naturally.During design, the edge of High-Voltage Insulation sheet should be more than the edge 0.5mm greater than thermal diffusion plate, enough to guarantee, reliable dielectric strengths.[0034] another kind of reinforcement has been shown among Figure 12 and has improved ceramic insulation sheet edge dielectric strength structure, the B face edge of thermal diffusion plate 10 has adopted chamfering structure, the edge of ceramic insulation sheet 13 is greater than the inside edge of thermal diffusion plate 10 chamferings, ceramic insulation sheet and thermal diffusion plate consistent size among the figure, because chamfering is arranged, naturally form an estuary, also illustrate among the figure, in this estuary, be filled with insulating cement (lacquer) 14, further improved the dielectric strength of thermal diffusion plate so again in ceramic insulation sheet edge.
In the led chip of the present invention shown in Figure 13, adopt and strengthen the dielectric strength structure that improves ceramic insulation sheet edge: adopted bulge-structure at the B of thermal diffusion plate 10 face, face (bearing the face of the heat transfer) projection of being close to ceramic insulation sheet 13, the edge of projection is less than the edge of ceramic insulation sheet 13, thereby in thermal diffusion plate 10 edges and ceramic insulation sheet 13 edges formation gap, shown in the figure, in this gap, also be filled with insulating cement (lacquer) 14, so just can strengthen the dielectric strength that improves ceramic insulation sheet edge.
Shown in Figure 10,11,12,13, ceramic insulation sheet 13 is (preferably welding) to be set at the B of thermal diffusion plate 10 face, also can be designed to the ceramic insulation sheet is arranged on the heat conduction core in the wick or contacts heat with wick on the fin import on the face (being called heat-absorbent surface), get final product so long as be provided with the ceramic insulation sheet between the B face of thermal diffusion plate and heat conduction core in the wick or the heat-absorbent surface on the fin.
Claims (10)
1. LED illuminating lamp, include wick (5), fin and power supply (2), wick (5) and power supply (2) are separately positioned on the both sides, front and back of fin, it is characterized in that: fin has adopted several splintery fins to form, leave the laminated structure in gap between the fin, the fin root has adopted lamination layer pressure type structure or flange nest plate type structure or lamination layer pressure type and flange nest plate type combining structure; It is the parts that sheet metal has adopted drawing that fin more than 3/5ths is arranged in the fin; Have venetian blind type structure, fork row formula structure blow vent on the fin (4).
2. LED illuminating lamp according to claim 1 is characterized in that: the ventilation area of the blow vent of venetian blind type, fork row formula structure should reach more than 1/3rd of this fin area.
3. LED illuminating lamp according to claim 1 is characterized in that: the heat conduction sleeve (7) in the fin is the part of wherein a certain fin root drawn moulding.
4. LED illuminating lamp according to claim 1 is characterized in that: the cut line (9) of the venetian blind type structure on the fin (4), fork row formula structure blow vent is radiation shapes.
5. LED illuminating lamp according to claim 1 is characterized in that: be provided with thermal diffusion plate (10) in the wick (5), thermal diffusion plate (10) has adopted copper or aluminum material or copper aluminum composite material, and the thickness of thermal diffusion plate is greater than 0.4mm; LED wafer in the wick (5) is arranged on the A face of thermal diffusion plate (10); Be provided with the ceramic insulation sheet (13) that sinters porcelain between the heat-absorbent surface of the B face of thermal diffusion plate and heat conduction core (8) in the wick or fin, this potsherd insulating trip thickness is greater than 0.15mm.Be provided with insulator (12) round the edge of thermal diffusion plate sidewall, and link to each other with ceramic insulation sheet (13).
6. LED illuminating lamp according to claim 5 is characterized in that: ceramic insulation sheet (13) is an alumina ceramic plate.
7. LED illuminating lamp according to claim 5 is characterized in that: the insulation reinforcement of ceramic insulation sheet (13) edge improves structure have been adopted,
The edge of ceramic insulation sheet greater than the marginal texture of thermal diffusion plate,
Or the B face bulge-structure of thermal diffusion plate (10), this protruding edge less than the edge of ceramic insulation sheet (13),
Or the B face edge of thermal diffusion plate (10) has adopted chamfering structure.
8. a LED lighting includes erection joint (1), power supply (2) and fin, and erection joint (1) is screw type or buckle-type; Power supply (2) is arranged between erection joint (1) and the fin, the opposite side of fin is provided with LED wick installation position, the wick installation position is positioned at the middle part of fin, it is characterized in that: fin has adopted several splintery fins to form, leave the laminated structure in gap between the fin, the fin root has adopted lamination layer pressure type structure or flange nest plate type structure or lamination layer pressure type and flange nest plate type combining structure; It is the parts that sheet metal has adopted drawing that fin more than 3/5ths is arranged in the fin; Have venetian blind type structure, fork row formula structure blow vent on the fin (4), the cut line of this blow vent (9) is radiation shapes.
9. LED lighting according to claim 8 is characterized in that: be provided with a part between the fin.
10. LED lighting according to claim 8 is characterized in that: the mean gap between the fin is not less than 2.0mm, and the average thickness of fin is not more than 1.0mm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106244995A CN102095103A (en) | 2010-12-28 | 2010-12-28 | Light emitting diode (LED) illuminating lamp and lamp thereof |
| PCT/CN2011/073007 WO2012088807A1 (en) | 2010-12-28 | 2011-04-19 | Led illumination lamp and lamp fixture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106244995A CN102095103A (en) | 2010-12-28 | 2010-12-28 | Light emitting diode (LED) illuminating lamp and lamp thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102095103A true CN102095103A (en) | 2011-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106244995A Pending CN102095103A (en) | 2010-12-28 | 2010-12-28 | Light emitting diode (LED) illuminating lamp and lamp thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102095103A (en) |
| WO (1) | WO2012088807A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102287686A (en) * | 2011-07-05 | 2011-12-21 | 秦彪 | Solid-state lighting lamp |
| WO2013037138A1 (en) * | 2011-09-16 | 2013-03-21 | Qin Biao | Solid state illumination lamp |
| CN103032721A (en) * | 2011-10-05 | 2013-04-10 | 秦彪 | Light-emitting diode (LED) optical engine and LED illuminating lamp |
| CN104359065A (en) * | 2014-10-30 | 2015-02-18 | 力帆实业(集团)股份有限公司 | Motorcycle headlamp lighting structure |
| CN105423257A (en) * | 2015-12-07 | 2016-03-23 | 谢彦涛 | Radiator, manufacturing method of radiator and lamp with radiator |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104007797B (en) * | 2014-06-04 | 2017-05-10 | 吉首大学 | Computer cooling device |
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| CN105423257A (en) * | 2015-12-07 | 2016-03-23 | 谢彦涛 | Radiator, manufacturing method of radiator and lamp with radiator |
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| Publication number | Publication date |
|---|---|
| WO2012088807A1 (en) | 2012-07-05 |
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Application publication date: 20110615 |