CN201657496U - Aluminum substrate for manufacturing printed circuit boards - Google Patents
Aluminum substrate for manufacturing printed circuit boards Download PDFInfo
- Publication number
- CN201657496U CN201657496U CN2010201592757U CN201020159275U CN201657496U CN 201657496 U CN201657496 U CN 201657496U CN 2010201592757 U CN2010201592757 U CN 2010201592757U CN 201020159275 U CN201020159275 U CN 201020159275U CN 201657496 U CN201657496 U CN 201657496U
- Authority
- CN
- China
- Prior art keywords
- aluminum substrate
- aluminium base
- printed circuit
- rough surface
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses an aluminum substrate for manufacturing printed circuit boards, which is disposed at single edges or sandwiched layers of printed circuit boards to assist in heat dissipation. At least one surface on the aluminum substrate is a rough surface used for increasing combination force between the aluminum substrate and an insulating rubber sheet, wherein the rough surface is provided with pits formed by the corrosion trough the chemical reaction. The aluminum substrate is etched via chemical reaction methods so as to form the pits on the surface thereof, thereby increasing combination force of the aluminum substrate with prepreg in all directions, effectively enhancing close combination between the aluminum substrate and the insulating rubber sheet, and achieving finished products with high-voltage resistance much superior to that of an aluminum substrate processed via physical method. In addition, the aluminum substrate is low in cost, simple in process and more applicable to popularization and application in industries.
Description
Technical field
The utility model relates to the metal substrate field that printed substrate is used that makes, and in particular, what improvement related to is a kind of aluminium base that printed substrate is used of making.
Background technology
Along with popularizing and extensive use of electronic product, the technology that adopts metal substrate to make printed substrate is also being brought in constant renewal in and development; For example, be development and the demand that satisfies various electronic products, printed substrate based on the aluminium base making, develop to two-sided aluminium base even multiaspect aluminium base from the single-sided aluminum-base plate, promptly at the monolateral or interlayer of former printed wire panel products aluminium sheet being set increases radiating effect, with the service quality that improves electronic product and increase the service life; Aluminium base just becomes the problem of industry key breakthrough with unfailing performance after insulating cement combines thus, and aluminium base and insulating cement have the key of good combination to be the improvement of aluminium base surface treatments and effect; Existing aluminium base surface texture comprises: the surface texture that traditional physical method such as, nylon polish-brush bonding through brush coating water, ceramic polish-brush or plane wire drawing is handled out; Also comprise the surface texture of handling out through advanced person's nanometer method.
Though physical method is with low cost, technology is simple, the aluminium base surface that physical method is handled out is jagged, has reduced the high voltage performance of printed wire board finished product; Although the aluminium base adhesion that the nanometer method is handled out is strong, the high voltage performance of printed wire board finished product is good, yet with high costs, the complex process of nanometer method is not suitable for promoting the use of.
Therefore, prior art still haves much room for improvement and develops.
The utility model content
Order of the present utility model is, a kind of aluminium base that printed substrate is used of making is provided, and not only adhesion, finished product high voltage performance are better than the aluminium base handled out through traditional physical method, and with low cost, technology is simple, suitable industry is promoted the use of.
The technical solution of the utility model is as follows:
A kind ofly make the aluminium base that printed substrate is used, be arranged on auxiliary heat dissipation in the monolateral or interlayer of printed substrate; Has one side on the described aluminium base at least for being used to increase and the rough surface of the adhesion between the offset plate of insulating; Wherein, described rough surface is the pit that chemical reaction erodes away.
Described aluminium base, wherein, the random arrangement of described pit.
Described aluminium base, wherein, the shape of described pit is random.
Described aluminium base, wherein, the tomography of described rough surface is wavy.
A kind of aluminium base that printed substrate is used of making provided by the utility model, owing to adopted chemical reaction method that aluminium sheet is carried out corrosion treatment, formed pit in surface of aluminum plate, increased on all directions adhesion with prepreg, promoted combining closely of aluminium sheet and insulation film effectively, the finished product high voltage performance is better than the aluminium base that traditional physical method is handled out greatly, and with low cost, technology is simple, is more suitable for industry and promotes the use of.
Description of drawings
Fig. 1 is the utility model aluminium base schematic surface;
Fig. 2 is the utility model aluminium base surface tomography schematic diagram.
Embodiment
Below with reference to accompanying drawing, device embodiment of the present utility model and embodiment are described in detail.
A kind of aluminium base that printed substrate is used of making of the present utility model is used for being arranged on the monolateral of printed substrate or interlayer auxiliary heat dissipation; Have at least one side to be rough surface on the described aluminium base, be used for increasing and insulating adhesion between the offset plate; One of its embodiment, shown in attached 1 figure, described rough surface is the pit that chemical reaction erodes away.For being arranged on the monolateral aluminium base of printed substrate, one side can be the rough surface of band pit, and another side can be the smooth surface of band diaphragm; For the aluminium base that is arranged in the printed substrate interlayer, the two sides all can be the rough surface of band pit.
Obviously, compare with advanced person's nanometer method, chemical reaction caustic solution of the present utility model neither needs expensive special equipment, does not also need super clean process environments to require and complicated technological process, and is with low cost, technology is simple; And compare with traditional physical method, chemical reaction caustic solution of the present utility model can not form burr on the surface of aluminium base, improved the high voltage performance of printed wire board finished product
In better embodiment of the present utility model, as shown in Figure 2, the tomography of described rough surface is wavy.This wavy tomography can be the cross section, it also can be vertical section, even can be section on any direction, isotropism with assurance and prepreg or insulating cement, effective combining closely of promotion and prepreg and insulating cement further improved the high voltage performance and the adhesion of printed wire board finished product.
Be preferably, described pit can randomly be arranged; And the shape of described pit can be random.For example, can spray vaporific corrosive liquids to the surface of aluminium base, the corrosivity by this liquid acts on the tiny pit of formation on the aluminium base surface; The big I of pit is determined by the fogging degree of vaporific corrosive liquids, specifically can determine by the size of adjusting nozzle and the pressure of spraying; The degree of depth of pit can be determined by the concentration of adjustment corrosive liquids and the length of etching time.
Should be understood that, for those of ordinary skills, can be improved according to the above description or conversion, and all these improvement and conversion all should belong to the protection range of the utility model claims.
Claims (4)
1. make the aluminium base that printed substrate is used for one kind, be arranged on auxiliary heat dissipation in the monolateral or interlayer of printed substrate; Has one side on the described aluminium base at least for being used to increase and the rough surface of the adhesion between the offset plate of insulating; It is characterized in that described rough surface is the pit that chemical reaction erodes away.
2. aluminium base according to claim 1 is characterized in that, the random arrangement of described pit.
3. aluminium base according to claim 1 is characterized in that the shape of described pit is random.
4. according to arbitrary described aluminium base in the claim 1 to 3, it is characterized in that the tomography of described rough surface is wavy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201592757U CN201657496U (en) | 2010-04-08 | 2010-04-08 | Aluminum substrate for manufacturing printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201592757U CN201657496U (en) | 2010-04-08 | 2010-04-08 | Aluminum substrate for manufacturing printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201657496U true CN201657496U (en) | 2010-11-24 |
Family
ID=43122723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201592757U Expired - Fee Related CN201657496U (en) | 2010-04-08 | 2010-04-08 | Aluminum substrate for manufacturing printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201657496U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110121235A (en) * | 2018-02-05 | 2019-08-13 | 深圳市五株科技股份有限公司 | Aluminum base circuit board and its processing method |
-
2010
- 2010-04-08 CN CN2010201592757U patent/CN201657496U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110121235A (en) * | 2018-02-05 | 2019-08-13 | 深圳市五株科技股份有限公司 | Aluminum base circuit board and its processing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102490491B1 (en) | Roughened copper foil, copper-clad laminate, and printed wiring board | |
| JP5275701B2 (en) | Aluminum material for printed wiring board and method for producing the same | |
| TW200700221A (en) | Copper clad laminated sheet and its manufacturing method | |
| CN209534386U (en) | A kind of anticorrosive heat insulating film-covered metal plate | |
| CN103002673A (en) | Manufacturing method for aluminum base and line layer communicating plate | |
| CN103325439A (en) | Tin-plated copper-coated brass wire and production method thereof and tin plating device | |
| CN201657496U (en) | Aluminum substrate for manufacturing printed circuit boards | |
| CN105407645A (en) | Etching method of thick-copper circuit board | |
| CN201947541U (en) | Aluminum substrate | |
| CN103596374B (en) | The method forming conducting wire on flexible PCB | |
| CN203368901U (en) | Reinforcing steel sheet of flexible circuit board | |
| CN103813639A (en) | Method for forming conductive circuit on flexible substrate | |
| CN109587934A (en) | A kind of circuit board | |
| CN105208768B (en) | Attached aluminium FPC substrate products and its etch process for LED illumination | |
| CN204307894U (en) | A kind of cleaning mechanism of surface treatment liquid medicine | |
| CN211792228U (en) | Circuit board of copper is pasted on aluminium | |
| CN211792231U (en) | Circuit board with good corrosion prevention effect | |
| CN202269091U (en) | Aluminum-based plate for manufacturing printed circuit boards | |
| CN103648253A (en) | Novel thermally conductive and insulating structure | |
| CN205378366U (en) | Be used as insulation board of baffle when pressfitting circuit board | |
| CN205793629U (en) | A kind of Multi-layer Al-based wiring board of high bond strength | |
| CN1539029A (en) | Copper on INVAR composite and method of making | |
| CN201657497U (en) | Metal-based circuit board and electronic equipment | |
| CN206686445U (en) | A kind of novel energy-saving aluminium base | |
| CN206422982U (en) | Aluminum surface of aluminum base copper clad laminate handles coupling agent sprinkling equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101124 Termination date: 20190408 |