CN201947541U - Aluminum substrate - Google Patents

Aluminum substrate Download PDF

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Publication number
CN201947541U
CN201947541U CN2010206949544U CN201020694954U CN201947541U CN 201947541 U CN201947541 U CN 201947541U CN 2010206949544 U CN2010206949544 U CN 2010206949544U CN 201020694954 U CN201020694954 U CN 201020694954U CN 201947541 U CN201947541 U CN 201947541U
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CN
China
Prior art keywords
aluminium base
aluminum substrate
utility
model
pit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206949544U
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Chinese (zh)
Inventor
邵国生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUIZHOU GREEN LABEL OPTO TECHNOLOGY Co Ltd
Original Assignee
HUIZHOU GREEN LABEL OPTO TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUIZHOU GREEN LABEL OPTO TECHNOLOGY Co Ltd filed Critical HUIZHOU GREEN LABEL OPTO TECHNOLOGY Co Ltd
Priority to CN2010206949544U priority Critical patent/CN201947541U/en
Application granted granted Critical
Publication of CN201947541U publication Critical patent/CN201947541U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

The utility model discloses an aluminum substrate. At least one surface of on the aluminum substrate is a coarse surface, which is obtained by forming pits by means of nanometer processing technology. The utility model utilizes the nanometer processing technology to form pits on the surface of the aluminum substrate. The binding force with prepreg in all directions is increased, and the tight binding between the aluminum substrate and the insulation colloidal film is effectively facilitated. The high pressure resistance performance of the product is greatly better than the aluminum substrate processed by the conventional physical method.

Description

Aluminium base
Technical field
The utility model relates to the metal substrate field that printed substrate is used that makes, and in particular, what improvement related to is a kind of aluminium base.
Background technology
Along with popularizing and extensive use of electronic product, the technology that adopts metal substrate to make printed substrate is also being brought in constant renewal in and development; For example, be development and the demand that satisfies various electronic products, printed substrate based on the aluminium base making, develop to two-sided aluminium base even multiaspect aluminium base from the single-sided aluminum-base plate, promptly at the monolateral or interlayer of former printed wire panel products aluminium sheet being set increases radiating effect, with the service quality that improves electronic product and increase the service life; Aluminium base just becomes the problem of industry key breakthrough with unfailing performance after insulating cement combines thus, and aluminium base and insulating cement have the key of good combination to be the improvement of aluminium base surface treatments and effect; Existing aluminium base surface texture generally all is the surface texture that traditional physical methods such as, nylon polish-brush bonding through brush coating water, ceramic polish-brush or plane wire drawing are handled out.
Though physical method is with low cost, technology is simple, the aluminium base surface that physical method is handled out is jagged, has reduced the high voltage performance of printed wire board finished product.
Therefore, prior art still haves much room for improvement and develops.
Summary of the invention
Order of the present utility model is, a kind of aluminium base is provided, and its adhesion, finished product high voltage performance are better than the aluminium base handled out through traditional physical method.
The technical solution of the utility model is as follows:
A kind of aluminium base has at least one side to be rough surface on the described aluminium base; Described rough surface is to adopt nano processing technology to handle the pit that forms.
Described aluminium base, wherein, the random arrangement of described pit.
Described aluminium base, wherein, the shape of described pit is random.
Described aluminium base, wherein, the tomography of described rough surface is wavy.
The beneficial effects of the utility model are:
Aluminium base provided by the utility model, owing to adopted nano processing technology that aluminium base is handled, formed pit on the aluminium base surface, increased on all directions adhesion with prepreg, promoted combining closely of aluminium base and insulation film effectively, the finished product high voltage performance is better than the aluminium base that traditional physical method is handled out greatly.
Description of drawings
Fig. 1 is the utility model aluminium base surface tomography schematic diagram.
Embodiment
Below with reference to accompanying drawing, device embodiment of the present utility model and embodiment are described in detail.
Aluminium base of the present utility model is used for being arranged on the monolateral of printed substrate or interlayer auxiliary heat dissipation; Have at least one side to be rough surface on the described aluminium base, be used for increasing and insulating adhesion between the offset plate; One of its embodiment, as shown in Figure 1, described rough surface is to adopt nano processing technology to handle the pit that forms.For being arranged on the monolateral aluminium base of printed substrate, one side can be the rough surface of band pit, and another side can be the smooth surface of band diaphragm; For the aluminium base that is arranged in the printed substrate interlayer, the two sides all can be the rough surface of band pit.
Obviously, compare with traditional physical method, the utility model can not form burr owing to adopt nano processing technology that aluminium base is handled on the surface of aluminium base, improved the high voltage performance of printed wire board finished product.
In better embodiment of the present utility model, as shown in Figure 1, the tomography of described rough surface is wavy.This wavy tomography can be the cross section, also can be vertical section, even can be the section on any direction, with the isotropism that guarantees to combine with prepreg, can effectively promote and the combining closely of insulating trips such as polyethylene, further improve the high voltage performance of printed wire board finished product.
Described pit can randomly be arranged; And the shape of described pit can be random.
Should be understood that, for those of ordinary skills, can be improved according to the above description or conversion, and all these improvement and conversion all should belong to the protection range of the utility model claims.

Claims (4)

1. an aluminium base has at least one side to be rough surface on the described aluminium base; It is characterized in that described rough surface is to adopt nano processing technology to handle the pit that forms.
2. aluminium base according to claim 1 is characterized in that, the random arrangement of described pit.
3. aluminium base according to claim 1 is characterized in that the shape of described pit is random.
4. according to arbitrary described aluminium base in the claim 1 to 3, it is characterized in that the tomography of described rough surface is wavy.
CN2010206949544U 2010-12-31 2010-12-31 Aluminum substrate Expired - Fee Related CN201947541U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206949544U CN201947541U (en) 2010-12-31 2010-12-31 Aluminum substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206949544U CN201947541U (en) 2010-12-31 2010-12-31 Aluminum substrate

Publications (1)

Publication Number Publication Date
CN201947541U true CN201947541U (en) 2011-08-24

Family

ID=44474875

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206949544U Expired - Fee Related CN201947541U (en) 2010-12-31 2010-12-31 Aluminum substrate

Country Status (1)

Country Link
CN (1) CN201947541U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106439614A (en) * 2016-10-13 2017-02-22 佛山赛威光电技术有限公司 Led lamp radiating device
CN106641865A (en) * 2016-10-13 2017-05-10 佛山赛威光电技术有限公司 Easy-to-mount LED lamp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106439614A (en) * 2016-10-13 2017-02-22 佛山赛威光电技术有限公司 Led lamp radiating device
CN106641865A (en) * 2016-10-13 2017-05-10 佛山赛威光电技术有限公司 Easy-to-mount LED lamp

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110824

Termination date: 20181231

CF01 Termination of patent right due to non-payment of annual fee