CN203708629U - Wire-drawing processed aluminium-base copper-clad plate - Google Patents
Wire-drawing processed aluminium-base copper-clad plate Download PDFInfo
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- CN203708629U CN203708629U CN201320839692.XU CN201320839692U CN203708629U CN 203708629 U CN203708629 U CN 203708629U CN 201320839692 U CN201320839692 U CN 201320839692U CN 203708629 U CN203708629 U CN 203708629U
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- aluminum
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Abstract
The utility model discloses a wire-drawing processed aluminium-base copper-clad plate which includes an aluminium plate layer, a copper foil layer and an insulation layer which is disposed between the aluminium plate layer and the copper foil layer. A wire-drawing layer is manufactured between the aluminium plate layer and the insulation layer. Thready lines are distributed on the wire-drawing layer. By means of the wire-drawing processed aluminium-base copper-clad plate with a wire-drawing layer between the insulation layer and the aluminium plate layer, internal stress of combination of the insulation layer and the aluminium plate layer is eliminated for enabling the thready lines to be attached to the aluminium plate well. The bonding intensity of the plate is improved. The problem of technology defects of layering and chip falling and the like of the plate material during a hot pressing process since the insulation layer and the aluminium layer are different in expansion coefficient are solved. The quality of the product is enhanced.
Description
Technical field
The utility model relates to wiring board manufacturing technology field, is specifically related to a kind of aluminum-based copper-clad plate through wire drawing processing.
Background technology
In recent years, along with electronics, the fast development of technology and being rooted in the hearts of the people of energy-conserving and environment-protective theory such as electric, the heat dispersion of component circuit board is required also improving gradually, therefore, according to different clients' use needs, the aluminum base circuit board of some high heat radiations has been received extensive welcome in market.
Existing aluminum-based copper-clad plate, common configuration is made up of this three-decker of aluminum layer, insulating barrier and copper foil layer, aluminum layer smooth surface, and because the material of aluminum layer and insulating barrier is different, make both coefficient of expansion differences, cause in hot pressing both adhesions poor, easily cause plate layering, fall the hidden danger of quality of the products such as bits, have a strong impact on product quality.
Utility model content
The utility model provides a kind of aluminum-based copper-clad plate through wire drawing processing, solved the insulating barrier that exists in prior art and aluminum layer adhesion poor, there is the technological deficiencies such as product quality hidden danger.
The technical scheme that the utility model adopts is specific as follows:
Through an aluminum-based copper-clad plate for wire drawing processing, comprise aluminum layer, copper foil layer and be located at aluminum layer and copper foil layer between insulating barrier, between insulating barrier and aluminum layer, be manufactured with wire drawing layer, on wire drawing layer, be distributed with thread lines.
Preferably, the thickness of wire drawing layer is 10～50 μ m.
Preferred, the thickness of wire drawing layer is 20～30 μ m.
Preferably, thread lines is distributed on wire drawing layer equally spacedly.
Preferably, thread lines is not equidistantly distributed on wire drawing layer, and adjacent thread inter-ridge distance scope is 20～30 μ m.
The aluminum-based copper-clad plate through wire drawing processing that the utility model provides, tool has the following advantages:
By increase one deck wire drawing layer between insulating barrier and aluminum layer, eliminate insulating barrier and aluminum layer two internal stress of closing that hardens, thread lines can be better attached on aluminum layer, improve the adhesion strength of plate, solve and caused the layering of plate in hot pressing because insulating barrier is different with the aluminum layer coefficient of expansion, fallen the technological deficiencies such as bits, improved product quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model through the aluminum-based copper-clad plate of wire drawing processing.
Embodiment
As shown in Figure 1, a kind of aluminum-based copper-clad plate through wire drawing processing, structure from top to bottom comprises copper foil layer 1, insulating barrier 2, wire drawing layer 3, aluminum layer 4, on wire drawing layer 3, be distributed with some thread lines, according to actual conditions needs, these thread lines can be regular shape, be distributed on wire drawing layer 3 equally spacedly; Also can be irregular, equidistantly not be distributed on wire drawing layer, in the time not being equally spaced, adjacent thread inter-ridge distance scope is 20～30 μ m.
In the utility model, the thickness of wire drawing layer 3 is 10～50 μ m, and under this thickness range, the combination effect of each flaggy is all good; Find through inventor's lot of experiment validation, when the thickness of wire drawing layer 3 is during at 20～30 μ m, the adhesion between insulating barrier 2 and aluminum layer 4 is the strongest, and now, through the hot pressing product obtaining of making a plate, up-to-standard rate reaches 99%.
Claims (5)
1. the aluminum-based copper-clad plate through wire drawing processing, comprise aluminum layer (4), copper foil layer (1) and be located at aluminum layer (4) and copper foil layer (1) between insulating barrier (2), it is characterized in that: between described insulating barrier (2) and aluminum layer (4), be manufactured with wire drawing layer (3), on wire drawing layer, be distributed with thread lines.
2. the aluminum-based copper-clad plate through wire drawing processing according to claim 1, is characterized in that: the thickness of described wire drawing layer (3) is 10～50 μ m.
3. the aluminum-based copper-clad plate through wire drawing processing according to claim 2, is characterized in that: the thickness of described wire drawing layer (3) is 20～30 μ m.
4. the aluminum-based copper-clad plate through wire drawing processing according to claim 1, is characterized in that: described thread lines is distributed on wire drawing layer (3) equally spacedly.
5. the aluminum-based copper-clad plate through wire drawing processing according to claim 1, is characterized in that: it is upper that described thread lines is not equidistantly distributed in wire drawing layer (3), and adjacent thread inter-ridge distance scope is 20～30 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320839692.XU CN203708629U (en) | 2013-12-17 | 2013-12-17 | Wire-drawing processed aluminium-base copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320839692.XU CN203708629U (en) | 2013-12-17 | 2013-12-17 | Wire-drawing processed aluminium-base copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203708629U true CN203708629U (en) | 2014-07-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320839692.XU Expired - Fee Related CN203708629U (en) | 2013-12-17 | 2013-12-17 | Wire-drawing processed aluminium-base copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203708629U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107867037A (en) * | 2016-09-26 | 2018-04-03 | 江门市华锐铝基板有限公司 | A kind of pressing process of aluminum-based copper-clad plate |
| CN110121235A (en) * | 2018-02-05 | 2019-08-13 | 深圳市五株科技股份有限公司 | Aluminum base circuit board and its processing method |
-
2013
- 2013-12-17 CN CN201320839692.XU patent/CN203708629U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107867037A (en) * | 2016-09-26 | 2018-04-03 | 江门市华锐铝基板有限公司 | A kind of pressing process of aluminum-based copper-clad plate |
| CN110121235A (en) * | 2018-02-05 | 2019-08-13 | 深圳市五株科技股份有限公司 | Aluminum base circuit board and its processing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20141217 |
|
| EXPY | Termination of patent right or utility model |