CN107867037A - A kind of pressing process of aluminum-based copper-clad plate - Google Patents
A kind of pressing process of aluminum-based copper-clad plate Download PDFInfo
- Publication number
- CN107867037A CN107867037A CN201610845621.9A CN201610845621A CN107867037A CN 107867037 A CN107867037 A CN 107867037A CN 201610845621 A CN201610845621 A CN 201610845621A CN 107867037 A CN107867037 A CN 107867037A
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- CN
- China
- Prior art keywords
- aluminum
- heat conduction
- aluminium sheet
- high heat
- steel plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
- B32B37/065—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method resulting in the laminate being partially bonded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of pressing process of aluminum-based copper-clad plate, the pressing process first to aluminium sheet carry out hard processing, the congruent manner then taken be by by pressing steel plate, aluminium sheet, high heat conduction bonding sheet, copper foil, aluminium sheet, high heat conduction bonding sheet, copper foil ... pressing steel plate sequential combination formed heating platen group.The invention makes that between every two pieces of pressings steel plate the aluminum-based copper-clad plate of polylith single sided copper clad can be suppressed, and in the case of identical device configuration, improves 23 times of production capacities, reduces production cost.
Description
Technical field
The present invention relates to a kind of production technology, more particularly to a kind of pressing process of aluminum-based copper-clad plate.
Background technology
At present, the manufacturing process of aluminum-based copper-clad plate mainly includes the following steps that：Processing aluminium base, put thermally conductive insulating layer,
Place copper foil, vacuum hotpressing.Traditional mode of production includes pressing steel plate, copper foil, the aluminium base for scribbling thermally conductive insulating layer, PET
Film, pressing steel plate, two pieces of aluminum-based copper-clad plates for pressing one piece of single sided copper clad of compacting between steel plates, due to aluminium base and pressing
Steel plate is all that the metallic plate of hardness easily scratches abrasion, and one layer of PET film is also set up between aluminium base and pressing steel plate.This aluminium base
Traditional pressing process production capacity of copper-clad plate is relatively low, and pressing time length, energy consumption is big, and can also produce PET film waste material after pressing, both
Waste of resource, also pollute environment.
In the pressing process of copper-clad plate, because the openings of sizes of pressing machine is fixed, make the production capacity of every stove can not lean on
The setting for changing equipment is lifted.Patent CN102407626B discloses a kind of pressing process of improved aluminum-based copper-clad plate, with
Production capacity is improved, reduces energy consumption.This method is changed to lamination mode, makes that between every two pieces of pressings steel plate two pieces of lists can be suppressed
The aluminum-based copper-clad plate of copper foil is covered in face, while eliminates the use of PET film, traditional handicraft is contrasted, in the situation of identical device configuration
Under, production capacity is improved, reduces cost, while reduces the pollution to environment.
Due to PCB（Printed Circuit Board, printed substrate）It is indispensable portion in various electronic devices
Point, particularly the fast development of LED industry in recent years is, it is necessary to which more aluminum-based copper-clad plates, above-mentioned pressing process can not meet
The market demand.
The content of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of pressing process of improved aluminum-based copper-clad plate, improves
Production capacity, reduce energy consumption.
To achieve the above object, the technical scheme is that：
A kind of pressing process of aluminum-based copper-clad plate, is comprised the following steps that：
A. aluminium sheet is cleaned, removes the impurity and rusty stain of surface of aluminum plate, a face hard anodizing processing, it is hard to increase aluminium sheet
Degree, wire drawing process is simultaneously carried out, increase roughness；
B. the aluminium sheet obtained on pressing steel plate in covering step a, wire drawing is face-up, then covers high heat conduction bonding sheet, then cover
Lid copper foil, aluminium sheet is then covered on copper foil, wire drawing is face-up, covers high heat conduction bonding sheet and copper foil, so circulation, Zhi Daoyu
Untill anti-skidding frame height degree is concordant；
C. anti-sliding sash is buckled, finally plus pressing steel plate, is combined to form heating platen group by improved congruent manner,
180-200 DEG C of high temperature, vacuum 740Hg/mm, pressure carry out compacting 140 minutes under conditions of being 250-500psi, be made
Aluminum-based copper-clad plate；
Wherein described high heat conduction bonding sheet under the vacuum environment of HTHP with temperature rise by it is solid state transformed be liquid
And solidified under the effect of vacuum environment high pressure.
In above-mentioned steps, the improved congruent manner refers to by pressing steel plate, aluminium sheet, high heat conduction bonding sheet, copper foil, aluminium
Plate, high heat conduction bonding sheet, copper foil ... pressing steel plate sequential combination formed heating platen group, two pieces pressing steel plates between can press
The aluminum-based copper-clad plate of polylith single sided copper clad processed, production capacity is effectively improved, save resource, decrease the pollution to environment.
The beneficial effects of the invention are as follows：The lamination mode that the process of the present invention is to compacting aluminum-based copper-clad plate is carried out
Change, make that between every two pieces of pressings steel plate the aluminum-based copper-clad plate of polylith single sided copper clad can be suppressed, contrast patent
CN102407626, in the case of identical device configuration, 2-3 times of production capacity is improved, reduces production cost.
Brief description of the drawings
Fig. 1 is the schematic diagram that aluminum-based copper-clad plate is suppressed in pressing machine.
Lamination schematic diagram when Fig. 2 is the aluminum-based copper-clad plate compacting of the present invention.
Fig. 3 is the structural representation of anti-sliding sash.
In figure：Pressing machine frame 1, upper plate 2, heating plate 3, lower roof plate 4, bearing 5, hydraulic pressure 6, terraced letter stencil 7, sealing strip 8,
Press steel plate 9, lamination 10, anti-sliding sash 11, clamp 12 tightens the screw 13, aluminium sheet 21, high heat conduction bonding sheet 22, copper foil 23.
Embodiment
A kind of reference picture 1,2 and 3, the pressing process of aluminum-based copper-clad plate of the invention, is comprised the following steps that：A. it is right
Aluminium base 21 is cleaned, and is removed the impurity and rusty stain on the surface of aluminium base 21, a face hard anodizing processing, it is hard to be increased aluminium sheet
Degree, wire drawing process is simultaneously carried out, increase roughness；B. the aluminium sheet 21 obtained on pressing steel plate 9 in covering step a, wire-drawing surface
Upward, high heat conduction bonding sheet 22 is then covered, then covers copper foil 23, aluminium sheet 21 is then covered on copper foil 23, wire drawing is face-up,
High heat conduction bonding sheet 22 and copper foil 23, so circulation are covered, untill concordant with the anti-height of sliding sash 11；C. anti-sliding sash is buckled
11, finally plus pressing steel plate 9, it is combined to form heating platen group by improved congruent manner, in 180-200 DEG C of height
Temperature, vacuum 740Hg/mm, pressure carry out compacting 140 minutes under conditions of being 250-500psi, aluminum-based copper-clad plate is made.
Further, the high heat conduction bonding sheet under the vacuum environment of HTHP as the rise of temperature is by solid state transformed
Solidified for liquid and under the effect of vacuum environment high pressure.
The aluminum-based copper-clad plate pressing process of the present invention contrasts traditional aluminum-based copper-clad plate pressing process, in identical device configuration
In the case of, production capacity is improved, reduces energy consumption, saves resource, while reduce the pollution to environment, there is obvious progress to anticipate
Justice, it can widely popularize.
Claims (2)
1. a kind of pressing process of aluminum-based copper-clad plate, it is characterised in that comprise the following steps that：
A. aluminium sheet is cleaned, removes the impurity and rusty stain of surface of aluminum plate, a face hard anodizing processing, it is hard to increase aluminium sheet
Degree, wire drawing process is simultaneously carried out, increase roughness；
B. the aluminium sheet obtained on pressing steel plate in covering step a, wire drawing is face-up, then covers high heat conduction bonding sheet, then cover
Lid copper foil, aluminium sheet is then covered on copper foil, wire drawing is face-up, covers high heat conduction bonding sheet and copper foil, so circulation, Zhi Daoyu
Untill anti-skidding frame height degree is concordant；
C. anti-sliding sash is buckled, finally plus pressing steel plate, is combined to form heating platen group by improved congruent manner,
180-200 DEG C of high temperature, vacuum 740Hg/mm, pressure carry out compacting 140 minutes under conditions of being 250-500psi, be made
Aluminum-based copper-clad plate；
In above-mentioned steps c, the improved congruent manner refer to by pressing steel plate, aluminium sheet, high heat conduction bonding sheet, copper foil, aluminium sheet,
High heat conduction bonding sheet, copper foil ... pressing steel plate sequential combination formed heating platen group.
A kind of 2. pressing process of aluminum-based copper-clad plate according to claim 1, it is characterised in that：The high heat conduction bonding sheet
Under the vacuum environment of HTHP with temperature rise by it is solid state transformed for liquid and vacuum environment high pressure effect under
Solidified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610845621.9A CN107867037A (en) | 2016-09-26 | 2016-09-26 | A kind of pressing process of aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610845621.9A CN107867037A (en) | 2016-09-26 | 2016-09-26 | A kind of pressing process of aluminum-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107867037A true CN107867037A (en) | 2018-04-03 |
Family
ID=61750704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610845621.9A Pending CN107867037A (en) | 2016-09-26 | 2016-09-26 | A kind of pressing process of aluminum-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107867037A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111674118A (en) * | 2020-06-09 | 2020-09-18 | 陕西卫宁电子材料有限公司 | Preparation method of aluminum-based microwave copper-clad plate and aluminum-based microwave copper-clad plate prepared by same |
| CN112040659A (en) * | 2020-09-03 | 2020-12-04 | 陕西卫宁电子材料有限公司 | Preparation method of hole-plugging aluminum-based copper-clad plate and hole-plugging aluminum-based copper-clad plate |
| CN113423186A (en) * | 2021-06-23 | 2021-09-21 | 浙江德加电子科技有限公司 | Processing technology of high-heat-conductivity aluminum substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203708629U (en) * | 2013-12-17 | 2014-07-09 | 浙江伟弘电子材料开发有限公司 | Wire-drawing processed aluminium-base copper-clad plate |
| CN203994924U (en) * | 2014-07-11 | 2014-12-10 | 景旺电子科技(龙川)有限公司 | A kind of novel PC B iterative structure |
| CN105196645A (en) * | 2015-11-05 | 2015-12-30 | 惠州市煜鑫达科技有限公司 | Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate |
-
2016
- 2016-09-26 CN CN201610845621.9A patent/CN107867037A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203708629U (en) * | 2013-12-17 | 2014-07-09 | 浙江伟弘电子材料开发有限公司 | Wire-drawing processed aluminium-base copper-clad plate |
| CN203994924U (en) * | 2014-07-11 | 2014-12-10 | 景旺电子科技(龙川)有限公司 | A kind of novel PC B iterative structure |
| CN105196645A (en) * | 2015-11-05 | 2015-12-30 | 惠州市煜鑫达科技有限公司 | Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111674118A (en) * | 2020-06-09 | 2020-09-18 | 陕西卫宁电子材料有限公司 | Preparation method of aluminum-based microwave copper-clad plate and aluminum-based microwave copper-clad plate prepared by same |
| CN112040659A (en) * | 2020-09-03 | 2020-12-04 | 陕西卫宁电子材料有限公司 | Preparation method of hole-plugging aluminum-based copper-clad plate and hole-plugging aluminum-based copper-clad plate |
| CN113423186A (en) * | 2021-06-23 | 2021-09-21 | 浙江德加电子科技有限公司 | Processing technology of high-heat-conductivity aluminum substrate |
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Application publication date: 20180403 |