CN201655843U - 一种led封装结构 - Google Patents

一种led封装结构 Download PDF

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Publication number
CN201655843U
CN201655843U CN2010201651793U CN201020165179U CN201655843U CN 201655843 U CN201655843 U CN 201655843U CN 2010201651793 U CN2010201651793 U CN 2010201651793U CN 201020165179 U CN201020165179 U CN 201020165179U CN 201655843 U CN201655843 U CN 201655843U
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China
Prior art keywords
led
plate
led chip
conductive material
diffusion material
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Expired - Fee Related
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CN2010201651793U
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English (en)
Inventor
瞿红兵
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HANGZHOU WEILIGUANG OPTO-ELECTRONICS Co Ltd
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HANGZHOU WEILIGUANG OPTO-ELECTRONICS Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

一种LED封装结构，其包括LED芯片，BT板，BT板覆铜层，高导热材料，以及高温胶。在LED固晶区部分用高导热材料替换原来的BT板。LED芯片固晶在高导热材料上，使LED芯片直接与高导热材料接触，LED芯片打线在BT板覆铜层上，LED芯片外覆盖高温胶。如此LED产生的热量能迅速向下传导至驱动板上，大大改善散热性能。

Description

一种LED封装结构
所属技术领域：
本实用新型涉及一种LED的封装结构，特别是一种将LED固晶在高导热材料上的封装结构。
背景技术：
随着LED技术的改良以及成本的降低，在可预见的将来，LED光源势必取代目前灯泡或日光灯源等照明设备或其他显示装置的发光源，而成为最重要的发光组件，LED光源由于具有体积小、耗电量低、使用寿命长等特性，使其在用途的广泛性上不断增加。
在LED光源广泛应用的同时，LED的制程以及散热问题，已然成为目前LED结构设计上相当重要的考虑因素。
参照图1，传统LED光源都是将LED2固晶在BT板3上，然后在BT板覆铜区4打线和封胶1。该LED封装结构主要通过BT板3向外散发热量，但是BT板的导热能力相对较差，导致整体散热效果较差，使热量不能快速导出封装体外，容易产生热量聚集，由此产生较大的光衰，降低发光效率。因此LED不能使用大电流，以防因过热而损坏。
发明内容：
本实用新型所要解决的技术问题在于克服现有的LED封装的问题，提供一种改善散热性能，使LED能承受更大电流，提高LED功率的封装结构。
为解决上述技术问题，本使用新型采用一种LED封装结构，其包括LED芯片，BT板，BT板覆铜层，高导热材料，以及高温胶。在LED固晶区部分用高导热材料替换原来的BT板，高导热材料为铜、陶瓷，或者其它导热材料。LED芯片固晶在高导热材料上，使LED芯片直接与高导热材料一接触，LED芯片打线在BT板覆铜层上，LED芯片外覆盖高温胶。如此LED产生的热量能迅速向下传导至驱动板上。
本实用新型的有益效果是，高导热材料的导热性明显强于BT板，使LED点亮后产生的热量能够高效地向下传导至驱动板上，大大改善散热性能。因而能够使用更高功率的LED芯片，提高了单位LED封装的光通量，使其应用范围大大增加，可替代传统灯具。另外一方面，温控效果的提升，能使其发出的光波长漂移减小，可作为可控色温的产品。
附图说明：
下面结合附图和实施例对本实用新型进一步说明
图1是传统LED封装结构图。
图2是本实用新型剖视图。
图3是本实用新型俯视图。
图4是本实用新型第二应用实例。
附图标记如下：1、高温胶，2、LED芯片，3、BT板，4、BT板覆铜层，5、高导热材料，6、金线。
具体实施方式：
参见图2至图3，在原来BT板3的LED固晶区部分替换为高导热材料5。LED芯片2固晶在高导热材料5上，使LED芯片2直接与高导热材料5接触，LED芯片2的电极通过金线6连接到BT板覆铜层4，LED芯片2及金线6外覆盖高温胶1。
高导热材料5可以是陶瓷，铜等。
参见图4，是本实用新型第二应用实例，在原来BT板3的LED固晶区部分替换为高导热材料5，塑造成弧型嵌入BT板中，增加热沉与BT板的抱合力。

Claims (1)

1.一种LED封装结构，其特征是：在LED固晶区部分用高导热材料替换原来的BT板，高导热材料为铜或陶瓷，LED芯片固晶在高导热材料上。
CN2010201651793U 2010-04-20 2010-04-20 一种led封装结构 Expired - Fee Related CN201655843U (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102361060A (zh) * 2011-10-22 2012-02-22 华南师范大学 大功率led散热基座封装结构
CN103247751A (zh) * 2012-02-07 2013-08-14 苏州东山精密制造股份有限公司 芯片封装结构及其方法
CN110473952A (zh) * 2018-05-09 2019-11-19 深圳市聚飞光电股份有限公司 电路led支架及led

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102361060A (zh) * 2011-10-22 2012-02-22 华南师范大学 大功率led散热基座封装结构
CN103247751A (zh) * 2012-02-07 2013-08-14 苏州东山精密制造股份有限公司 芯片封装结构及其方法
CN110473952A (zh) * 2018-05-09 2019-11-19 深圳市聚飞光电股份有限公司 电路led支架及led

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Granted publication date: 20101124

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