CN201611655U - 一种发光二极管 - Google Patents
一种发光二极管 Download PDFInfo
- Publication number
- CN201611655U CN201611655U CN2010201313797U CN201020131379U CN201611655U CN 201611655 U CN201611655 U CN 201611655U CN 2010201313797 U CN2010201313797 U CN 2010201313797U CN 201020131379 U CN201020131379 U CN 201020131379U CN 201611655 U CN201611655 U CN 201611655U
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- storage tank
- shell
- luminescent crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Led Device Packages (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201313797U CN201611655U (zh) | 2010-03-12 | 2010-03-12 | 一种发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201313797U CN201611655U (zh) | 2010-03-12 | 2010-03-12 | 一种发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201611655U true CN201611655U (zh) | 2010-10-20 |
Family
ID=42962290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010201313797U Expired - Fee Related CN201611655U (zh) | 2010-03-12 | 2010-03-12 | 一种发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201611655U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103579211A (zh) * | 2012-08-02 | 2014-02-12 | 乐金显示有限公司 | 发光二极管封装 |
-
2010
- 2010-03-12 CN CN2010201313797U patent/CN201611655U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103579211A (zh) * | 2012-08-02 | 2014-02-12 | 乐金显示有限公司 | 发光二极管封装 |
CN103579211B (zh) * | 2012-08-02 | 2016-12-28 | 乐金显示有限公司 | 发光二极管封装 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Bright photoelectric communication Science and Technology Ltd. of Shenzhen nine Assignor: Ceng Guangxiang|Lin Zhibo Contract record no.: 2012440020006 Denomination of utility model: Electric parameter detecting circuit for light emitting diode Granted publication date: 20101020 License type: Exclusive License Record date: 20120213 |
|
C53 | Correction of patent for invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Zeng Guangxiang Inventor before: Zeng Guangxiang Inventor before: Lin Zhibo |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: CENG GUANGXIANG LIN ZHIBO TO: CENG GUANGXIANG |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170830 Address after: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Street Fuk Road red Technology Park Block 1 C floor Patentee after: Shenzhen Teng Niu Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Futian District sea Zhuzilin four home Bihai court 33A Co-patentee before: Lin Zhibo Patentee before: Zeng Guangxiang |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101020 Termination date: 20180312 |
|
CF01 | Termination of patent right due to non-payment of annual fee |