CN201611655U - 一种发光二极管 - Google Patents

一种发光二极管 Download PDF

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Publication number
CN201611655U
CN201611655U CN2010201313797U CN201020131379U CN201611655U CN 201611655 U CN201611655 U CN 201611655U CN 2010201313797 U CN2010201313797 U CN 2010201313797U CN 201020131379 U CN201020131379 U CN 201020131379U CN 201611655 U CN201611655 U CN 201611655U
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light
emitting diode
storage tank
shell
luminescent crystal
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曾广祥
林之波
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Shenzhen Teng Niu Technology Co., Ltd.
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曾广祥
林之波
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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Abstract

本实用新型涉及半导体器件,尤其涉及半导体器件中的一种发光二极管。所述发光二极管,包括隔光的外壳,所述外壳设有容置槽,所述容置槽内设有发光晶体,所述发光晶体设有至少有一个电极,所述外壳设有导电架,所述导电架与所述电极连接,所述容置槽为锥状,所述容置槽内设有透明的封装填充物。所述发光二极管通过锥状的容置槽增加了反射面积,使发光晶体发射出来的光线可在容置槽的反射下,进行绕射混光,使投射出来的光线均匀分布,提高光线的利用率,通过透明的封装填充物来保护发光晶体,并且,锥状的容槽槽增加了与封装填充物的接触面积,有利于封装填充物与容槽槽的紧密贴合,实现发光二极管在户外长期使用。

Description

一种发光二极管
【技术领域】
本实用新型涉及半导体器件,尤其涉及半导体器件中的一种发光二极管。
【背景技术】
发光二极管(Light Emitting Diode,简称:LED)是一种能够将电能转化为可见光的固态的半导体器件。随着照明技术的发展,发光二极管广泛的应用于各种户外显示屏照明中,但是,现有发光二极管的光线容易向四周发散,发射的无效光无法被反射区的斜面集中,光线也无法被反射区折射混光,容易造成光线的浪费、混色、不均匀等现象,并且,户外通常存在雨水天气和紫外线照射,发光晶体容易暴露在雨水和紫外线中,造成发光二极管损坏,不适于在户外长期使用。
【实用新型内容】
为了更好的克服上述发光二极管光线不集中、不均匀、混色、不适于在户外长期使用的缺陷,本实用新型提供了一种发光二极管。
本实用新型解决其技术问题采用的技术方案是:提供了一种发光二极管,包括隔光的外壳,所述外壳设有容置槽,所述容置槽内设有发光晶体,所述发光晶体设有至少有一个电极,所述外壳设有导电架,所述导电架与所述电极连接,所述容置槽为锥状,所述容置槽内设有透明的封装填充物。
本实用新型的进一步改进是:所述发光二极管的高度或等于大于2.5毫米。
本实用新型的进一步改进是:所述发光晶体包括红色发光二极管芯片、蓝色发光二极管芯片、绿色发光二极管芯片其中之一或其任意组合。
本实用新型的进一步改进是:所述红色发光二极管芯片至少有二个。
本实用新型的进一步改进是:所述蓝色发光二极管芯片至少有二个。
本实用新型的进一步改进是:所述绿色发光二极管芯片至少有二个。
本实用新型的进一步改进是:所述发光晶体与所述封装填充物的高度差为1至3毫米。
本实用新型的进一步改进是:所述容置槽的轴向剖面的两侧边之间的夹角大于或者等于160度。
本实用新型的进一步改进是:所述容置槽的表面为光滑表面或粗糙表面,所述容置槽为圆锥状或者棱锥状。
本实用新型的进一步改进是:所述导电架固定在所述外壳的侧面,所述导电架延伸有焊接引脚,所述焊接引脚折弯设置在所述外壳的底面下。
与现有技术相比,本实用新型具有的有益效果是:通过锥状的容置槽增加了反射面积,使发光晶体发射出来的光线可在容置槽的反射下,进行绕射混光,使投射出来的光线均匀分布,提高光线的利用率,通过透明的封装填充物来保护发光晶体,并且,锥状的容槽槽增加了与封装填充物的接触面积,有利于封装填充物与容槽槽的紧密贴合,实现发光二极管在户外长期使用。
【附图说明】
图1为本实用新型一种发光二极管的结构示意图;
图2为本实用新型所述发光二极管的俯视图;
图3为图2的剖面图A-A。
【具体实施方式】
下面结合附图和具体实施例对本实用新型作进一步的详细描述:结合图1至图3,一种发光二极管,包括隔光的外壳1,所述外壳1为块状物体,所述外壳1设有容置槽5,所述容置槽5内设有发光晶体3,具体为,所述发光晶体3设置在所述容置槽5的槽底,因此,所述容置槽5的侧面则形成反射面,所述发光晶体3设有至少有一个电极6,所述外壳1设有导电架4,所述导电架4与所述电极6电连接,所述容置槽5为锥状,所述容置槽5内设有透明的封装填充物2,所述封装填充物2与所述容置槽5紧密贴合,实现对所述发光晶体3的密封,可避免所述发光晶体3暴露在雨水和紫外线中,可防止氧化,有效的保护了所述发光二极管,使所述发光二极管可长期在户外使用。
所述发光二极管的高度或等于大于2.5毫米,由于这种发光二极管大都用于户外,需要封装一种防水胶体,这种防水胶体的密度较大,灌胶时,流动性较差,容易漫过发光二极管,使得发光二极管产生偏色、失真、混色不均、花屏等现象,导致采用该发光二极管的显示屏的清晰度较差,通过控制发光二极管的整体高度不低于2.5毫米,来避免灌胶时防水胶体漫过发光二极管,使采用该发光二极管的显示屏具有较好的混色效果和清晰度。
所述发光晶体3包括红色发光二极管芯片、蓝色发光二极管芯片、绿色发光二极管芯片其中之一或其任意组合。
所述红色发光二极管芯片至少有二个。
所述蓝色发光二极管芯片至少有二个。
所述绿色发光二极管芯片至少有二个。
所述发光晶体3与所述封装填充物2的高度差为1至3毫米。
所述容置槽5的轴向剖面的两侧边之间的夹角大于或者等于160度,优选的,所述容置槽5的轴向剖面的两侧边之间的夹角可以为160度,也可以为150度。
所述容置槽5的表面可以为光滑表面,也可以为粗糙表面,所述容置槽5可以为圆锥状,也可以为圆锥台状,也可以为棱锥状,也可以为棱锥台状,也可以为四棱锥台状,通过对容置槽5的侧表面,即反射面进行优化,来增加反射面积,使所述发光晶体3所散发出来的光线,可以在透明的封装填充物2中绕射混光,使投射出来的光线均匀分布,提高了光线的利用率。
如图2、3所示,所述导电架4固定在所述外壳1的侧面,所述导电架4延伸有焊接引脚,所述焊接引脚折弯设置在所述外壳1的底面下,具体为,所述导电架4大致为“L”状,所述导电架4包括相互折弯的主体部和焊接引脚,所述主体部固定在所述外壳1的侧面上,所述焊接引脚悬挂在所述外壳的底面下的附近区域。
以上内容是结合具体的优选实施方式对本实用新型所作的进一步详细说明,不能认定本实用新型的具体实施只局限于这些说明。对于本实用新型所属技术领域的普通技术人员来说,在不脱离本实用新型构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本实用新型的保护范围。

Claims (9)

1.一种发光二极管,包括隔光的外壳(1),其特征在于:所述外壳(1)设有容置槽(5),所述容置槽(5)内设有发光晶体(3),所述发光晶体(3)设有至少有一个电极(6),所述外壳(1)设有导电架(4),所述导电架(4)与所述电极(6)连接,所述容置槽(5)为锥状,所述容置槽(5)内设有透明的封装填充物(2)。
2.根据权利要求1所述的发光二极管,其特征在于:所述发光二极管的高度大于或等于2.5毫米。
3.根据权利要求1所述的发光二极管,其特征在于:所述发光晶体(3)包括红色发光二极管芯片、蓝色发光二极管芯片、绿色发光二极管芯片其中之一或其任意组合。
4.根据权利要求3所述的发光二极管,其特征在于:所述红色发光二极管芯片至少有二个。
5.根据权利要求3所述的发光二极管,其特征在于:所述蓝色发光二极管芯片至少有二个。
6.根据权利要求3所述的发光二极管,其特征在于:所述绿色发光二极管芯片至少有二个。
7.根据权利要求1所述的发光二极管,其特征在于:所述容置槽(5)的轴向剖面的两侧边之间的夹角大于或者等于160度。
8.根据权利要求1所述的发光二极管,其特征在于:所述容置槽(5)的表面为光滑表面或粗糙表面,所述容置槽(5)为圆锥状或者棱锥状。
9.根据权利要求1所述的发光二极管,其特征在于:所述导电架(4)固定在所述外壳(1)的侧面,所述导电架(4)延伸有焊接引脚,所述焊接引脚折弯设置在所述外壳(1)的底面下。
CN2010201313797U 2010-03-12 2010-03-12 一种发光二极管 Expired - Fee Related CN201611655U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103579211A (zh) * 2012-08-02 2014-02-12 乐金显示有限公司 发光二极管封装

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103579211A (zh) * 2012-08-02 2014-02-12 乐金显示有限公司 发光二极管封装
CN103579211B (zh) * 2012-08-02 2016-12-28 乐金显示有限公司 发光二极管封装

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