CN201611652U - 夹具 - Google Patents

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CN201611652U
CN201611652U CN2009200762071U CN200920076207U CN201611652U CN 201611652 U CN201611652 U CN 201611652U CN 2009200762071 U CN2009200762071 U CN 2009200762071U CN 200920076207 U CN200920076207 U CN 200920076207U CN 201611652 U CN201611652 U CN 201611652U
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anchor clamps
pin
lead
lead frame
connecting portion
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王利
陈涛
张新军
蒋美连
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Semiconductor Manufacturing International Beijing Corp
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Semiconductor Manufacturing International Shanghai Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

本实用新型提供一种夹具，所述夹具用于固定引线框架，所述夹具设置于引线键合设备上，所述引线键合设备包括一驱动装置，所述夹具包括爪部以及连接部，所述爪部的形状与所述引线框架的形状匹配，所述连接部的一端与所述爪部连接，所述连接部的另一端与所述驱动装置连接。本实用新型所提供的夹具可将引脚紧紧的固定在定位板上，避免引脚的焊接端松动，提高了产品的良率。

Description

夹具
技术领域
本实用新型涉及集成电路制造领域，尤其涉及一种用于固定引线框架的夹具。
背景技术
在集成电路制造领域，引线键合(Wire Bonding)工艺是整个封装工序中至关重要的一步，其功能是将引线的两端分别焊接到芯片的电极(Pad)和引线框架(Lead Frame)的引脚上，所述引线可以为金线或铝线，尽管金线的传导性能较佳，且具有良好的抗氧化性能，但由于铝线成本低廉，并且芯片的电极多为铝材料，铝线不容易受腐蚀的影响，因此业界通常采用铝线作为引线的材料。
目前，业界普遍采用引线键合设备来完成引线键合工艺，例如UAB320引线键合设备，所述引线键合设备包括夹具、定位板(未图示)以及驱动装置(未图示)。具体请参考图1A至图1C，其中，图1A为现有技术的夹具的俯视图，图1B为图1A的剖视图，图1C为现有技术的夹具的使用示意图。
如图1A和图1B所示，所述夹具10包括连接部11以及爪部，其中，连接部11为呈直角的折板，所述折板的一端与所述爪部连接，另一端与所述驱动装置连接，所述爪部包括三根直爪12，所述夹具10可在所述驱动装置的驱动下上下移动。
一般来说，引线键合工艺通常采用超声波焊接的方式来完成铝线焊接过程，如图1C所示，多个芯片20排列成行的粘接在冲压成型的引线框架30的一端，引线框架30的另一端则是对应每个芯片20而延伸出的三根引脚，所述引脚通常为细长条形，其端部为焊接端，其中，位于两侧的引脚31悬空，中间的引脚32与芯片20的底面电极连接。引线键合过程中，首先将引线框架30固定在所引线键合设备的定位板上，接着夹具10将所述引脚压在所述定位板上，再将两根铝线40分别焊接在芯片20顶面的电极和两侧的引脚31上，最后经过冲裁将引线框架30上连接各芯片20和引脚之间的连接切断，就可得到焊好引脚并引出线的半导体器件。
但是，在实际生产过程中发现，由于夹具10的直爪12仅仅将所述引脚的一部分压在所述定位板上，所述引脚的焊接端仍然呈悬臂梁状态，因此在焊接过程中，所述引脚的焊接端非常容易松动，导致焊接质量较差，经常出现脱焊或虚焊的情况，降低了产品的良率。
实用新型内容
本实用新型提供一种夹具，以解决现有的夹具在使用过程中，引脚的焊接端经常松动，导致产品的焊接质量差的问题。
为解决上述技术问题，本实用新型提出了一种夹具，所述夹具用于固定引线框架，其设置于引线键合设备上，所述引线键合设备包括一驱动装置，所述引线框架包括引脚，所述引脚的端部为焊接端，所述夹具包括爪部以及连接部，所述爪部的形状与所述引线框架的形状匹配，所述爪部包括两根端部相向对应弯折的弯爪以及位于所述两根弯爪之间的直爪，所述弯爪的端部对应于所述焊接端的边缘，所述弯爪的内侧开设有弧形缺口，所述连接部的一端与所述爪部连接，所述连接部的另一端与所述驱动装置连接。
可选的，所述连接部为呈直角的折板，所述连接部上设置有固定孔，所述连接部通过所述固定孔与所述驱动装置连接。
可选的，所述夹具是一体成型的。
可选的，所述夹具的材质为模具钢。
与现有技术相比，本实用新型所提供的夹具用于固定引线框架，其包括爪部和连接部，所述爪部的形状与所述引线框架的形状匹配，可将引脚的焊接端紧紧地压在定位板上，确保焊接过程中引脚的焊接端不会松动，可避免出现脱焊或虚焊的情况，提高了产品的良率，并且由于所述各爪仅仅压在焊接端的边缘，当中留有焊接铝线的空隙，可根据工艺要求制成具有一定弧度的铝线。
附图说明
图1A为现有技术的夹具的俯视图；
图1B为图1A的剖视图；
图1C为现有技术的夹具的使用示意图；
图2A为本实用新型一实施例所提供的夹具的俯视图；
图2B为图2A的剖视图；
图2C为本实用新型一实施例所提供的夹具的使用示意图。
具体实施方式
以下结合附图和具体实施例对本实用新型提出的夹具作进一步详细说明。根据下面说明和权利要求书，本实用新型的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比率，仅用以方便、明晰地辅助说明本实用新型实施例的目的。
请参考图2A至图2C，其中，图2A为本实用新型一实施例所提供的夹具的俯视图，图2B为图2A的剖视图，图2C本实用新型一实施例所提供的夹具的使用示意图。如图所示，所述夹具100用于固定引线框架300，其设置于引线键合设备上，所述引线键合设备包括定位板(未图示)以及驱动装置(未图示)，所述夹具100包括连接部110以及爪部，其中，连接部110的一端与所述爪部连接，另一端与所述驱动装置连接，所述爪部的形状与所述引线框架300的形状匹配，所述夹具结构简单，易于制作。
具体的说，所述引线框架300包括有多根引脚，所述引脚的端部为焊接端。优选的，所述爪部包括两根端部相向对应弯折的弯爪121，所述弯爪121的端部对应于所述焊接端的边缘，所述爪部还包括位于所述两根弯爪121之间的直爪122。所述每个爪在压紧所述引脚的焊接端时，仅仅压在焊接端的边缘，当中留有焊接铝线的空隙。所述夹具100可将引脚的焊接端紧紧地压在定位板上，避免焊接过程中引脚的焊接端松动。
优选的，弯爪121的内侧靠近端部的位置开设有弧形缺口123，在焊接过程中，所述弧形缺口123可以给焊接劈刀让位，可根据工艺要求制成具有一定弧度的铝线。
较佳的，连接部110为呈直角的折板，所述折板上设置有固定孔(未图示)，所述连接部110可通过所述固定孔与所述驱动装置连接，并在所述驱动装置的驱动下上下移动。
请继续参考图2C，引线键合过程一般采用超声波焊接的方式，多个芯片200粘接在冲压成型的引线框架300的一端，所述引线框架300的另一端则是对应每个芯片200而延伸出的三根引脚，所述引脚的端部为焊接端，其中，两侧的引脚310是悬空的，中间的引脚320则与芯片200的底面电极连接。
在引线键合过程中，首先将引线框架300固定在所述定位板上，接着夹具100将两侧的引脚310以及中间的引脚320压在所述定位板上，再利用焊接劈刀将两根铝线400分别焊接在芯片200顶面的电极和两侧的引脚310上，由于所述爪部的形状与所述引线框架300的形状匹配，更具体的说，由于所述弯爪121和直爪122牢牢压在所述引脚焊接端的边缘，且弯爪121的内侧开设有弧形缺口123，因此可避免焊接过程中引脚的焊接端松动，防止出现脱焊或虚焊的情况，提高了产品的良率，并且各爪之间留有焊接铝线的空隙，可根据工艺要求制成具有一定弧度的铝线。
在本实用新型一实施例中，夹具100是一体成型的，所述夹具100的材质优选为模具钢，其具有较高的硬度和强度，且耐磨性能较佳，确保在使用过程中，所述夹具100不会发生形变，可将所述引脚牢靠的固定在所述定位板上。当然，在本实用新型其它实施例中，也可采用其它不易发生形变的材料制作所述夹具。
综上所述，本实用新型提供一种用于固定引线框架的夹具，所述夹具设置于引线键合设备上，所述引线键合设备包括一驱动装置，所述夹具包括爪部以及连接部，所述爪部的形状与所述引线框架的形状匹配，所述连接部的一端与所述爪部连接，所述连接部的另一端与所述驱动装置连接。本实用新型所提供的夹具结构简单，易于制作，可将引脚紧紧的固定在定位板上，避免引脚的焊接端松动，确保在引线键合过程中不会出现脱焊或虚焊的情况，并且由于所述各爪仅仅压在焊接端的边缘，当中留有焊接铝线的空隙，可根据工艺要求制成具有一定弧度的铝线，提高了产品的良率。
显然，本领域的技术人员可以对本实用新型进行各种改动和变型而不脱离本实用新型的精神和范围。这样，倘若本实用新型的这些修改和变型属于本实用新型权利要求及其等同技术的范围之内，则本实用新型也意图包含这些改动和变型在内。

Claims (5)

1.一种夹具，用于固定引线框架，其设置于引线键合设备上，所述引线键合设备包括一驱动装置，所述引线框架包括引脚，所述引脚的端部为焊接端，其特征在于，包括：
爪部，其形状与所述引线框架的形状匹配，所述爪部包括两根端部相向对应弯折的弯爪以及位于所述两根弯爪之间的直爪，所述弯爪的端部对应于所述焊接端的边缘，所述弯爪的内侧开设有弧形缺口；以及
连接部，一端与所述爪部连接，另一端与所述驱动装置连接。
2.如权利要求1所述的夹具，其特征在于，所述连接部为呈直角的折板。
3.如权利要求2所述的夹具，其特征在于，所述连接部上设置有固定孔，所述连接部通过所述固定孔与所述驱动装置连接。
4.如权利要求1所述的夹具，其特征在于，所述夹具是一体成型的。
5.如权利要求1所述的夹具，其特征在于，所述夹具的材质为模具钢。
CN2009200762071U 2009-06-12 2009-06-12 夹具 Expired - Fee Related CN201611652U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111180412A (zh) * 2020-01-03 2020-05-19 长电科技（宿迁）有限公司 一种侧边开槽的引线框架及其制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111180412A (zh) * 2020-01-03 2020-05-19 长电科技（宿迁）有限公司 一种侧边开槽的引线框架及其制造方法
CN111180412B (zh) * 2020-01-03 2021-05-04 长电科技（宿迁）有限公司 一种侧边开槽的引线框架及其制造方法

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