CN201584403U - Chip cooling device and chip - Google Patents
Chip cooling device and chip Download PDFInfo
- Publication number
- CN201584403U CN201584403U CN2009202623675U CN200920262367U CN201584403U CN 201584403 U CN201584403 U CN 201584403U CN 2009202623675 U CN2009202623675 U CN 2009202623675U CN 200920262367 U CN200920262367 U CN 200920262367U CN 201584403 U CN201584403 U CN 201584403U
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- chip
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- radiator
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Abstract
The utility model provides a chip cooling device and a chip. The chip cooling device comprises a chip and a metal sheet, wherein one part of the metal sheet is abutted with the chip, and the other part of the metal sheet is abutted with a cooling body. The chip cooling device and the chip provided by the embodiment of the utility model can speed up the heat conduction of the chip so as to avoid the overhigh temperature of the chip.
Description
Technical field
The utility model relates to heat dissipation technology, particularly chip heat radiator and chip.
Background technology
Development along with science and technology, the integrated level of electronic circuit system is more and more higher, the use of on-site programmable gate array FPGA (Field Programmable Gate Array), application-specific integrated circuit ASIC integrated circuit (IC) chip such as (ApplicationSpecific Integrated Circuit) more and more widely, but the hear rate of chip is bigger, and heating surpasses rated temperature with regard to cisco unity malfunction in the chip operation process.How can fast and effeciently solve the heat dissipation problem of chip, guarantee that the chip operation temperature is lower than rated temperature, has become the problem that at first will consider in chip application and the product design.
Consider the packaging height of chip and cooperate the assembled construction part to have the processing technology tolerance with chip, at present prior art adopts and places flexible nonmetal Heat Conduction Material between chip and radiator and absorb tolerance and prevent that excessive simultaneously chip heat being conducted on the radiator by heat conductive pad of chip pressurized from dispelling the heat, as shown in Figure 1, chip 101 is welded on the pcb board 102, heat conductive pad 103 is embedded between chip 101 and the radiator 104, radiator 104 can comprise a recess, chip 101 and heat conductive pad 103 are arranged in recess, the non-notch part of radiator 104 and pcb board 102 against.
But the utility model proposes the people and find that prior art chips heat conducts to radiator by heat conductive pad, and the heat conductive pad conductive coefficient is low, heat transfer efficiency is low, can't conduct the heat that produces in the chip course of work fast and avoid chip temperature too high.
Summary of the invention
In view of this, the utility model provides a kind of chip heat radiator and chip, conducts with the heat of accelerating chip, and then avoids chip temperature too high.
The utility model is realized in the following manner:
A kind of chip heat radiator comprises chip and sheet metal, the part of described sheet metal and chip mutually against, another part of described sheet metal and radiator mutually against.
A kind of chip comprises sheet metal, the part of described sheet metal and described chip mutually against, another part of described sheet metal hangs.
The chip heat radiator and the chip that are provided among the utility model embodiment are provided, can accelerate the heat conduction of chip, and then avoid chip temperature too high.
Description of drawings
Fig. 1 is the schematic diagram of prior art chips heat abstractor;
Fig. 2 is the schematic diagram of the chip heat radiator that provides of embodiment of the utility model;
Fig. 3 is that the sheet metal bending is the schematic diagram of class " mouth " shape in an embodiment chips of the utility model heat abstractor;
Fig. 4 is that the sheet metal bending is the schematic diagram of class " second " shape in an embodiment chips of the utility model heat abstractor;
Fig. 5 is that the sheet metal bending is the schematic diagram of class " Contraband " shape or class " U " shape in an embodiment chips of the utility model heat abstractor.
Embodiment
The utility model embodiment provides a kind of chip heat radiator and chip, conducts with the heat of accelerating chip, and then avoids chip temperature too high.
The chip heat radiator that embodiment of the utility model provides comprises chip 201 and sheet metal 202 as shown in Figure 2, its chips 201 and sheet metal 202 mutually against.
Be understandable that the utility model embodiment chips 201 and sheet metal 202 are mutually against can also can adopting the mode that directly encapsulates or weld in the Chip Packaging process by modes such as welding by the compressing of foreign object.
In the present embodiment, sheet metal 202 can a part with chip 201 against, another part hangs, hang the part that can be directly and radiator lean, also can lean with radiator by bending the back, wherein, radiator can be radiator and/or metal surface.
In an embodiment of the present utility model, sheet metal 202 can bend and be shapes such as class " Contraband " shape, class " second " shape, class " U " shape or class " mouth " shape.Sheet metal 202 after the bending can comprise dual-side at least.Be understandable that a side and the chip 201 of sheet metal 202 lean, other at least one sides and radiator lean.
As shown in Figure 3, for 202 bendings of sheet metal among the embodiment of the present utility model are the schematic diagram of class " mouth " shape, wherein, in the chip heat radiator that present embodiment provides, also comprise elastic insert 203, elastic insert 203 can be filled in the sheet metal 202 of similar " mouth " shape, radiator in the present embodiment can be radiator 204, wherein, radiator 204 leans with sheet metal 202 1 sides of class " mouth " shape, and another side and the chip 201 of sheet metal 202 lean.In the present embodiment,, can make Metal Flake material centre be full of elastomeric material, Metal Flake material still can closely be contacted with radiator with chip after overaging by filling elastic insert 203 in the sheet metal 202.Be understandable that in the present embodiment, sheet metal 202 also can be class " Contraband " shape.Concrete a kind of mode can for: a side and the chip 201 of sheet metal 202 lean, another and this side opposed side edges and radiator lean, elastic insert 203 is embedded in the sheet metal, leans with the side that leans with chip of sheet metal 202 with side that radiator leans respectively.Be understandable that, sheet metal class " mouth " shape, wherein side that leans with radiator and/or the side that leans with chip can be discontinuous, and be promptly jagged.
In the present embodiment, sheet metal parcel elastic insert, a part of area contacts with chip, and a part of area contacts with radiator, and chip heat is conducted to radiator, and by the radiator heat-dissipation at chip back, it is little to take up room.The chip heat radiator that present embodiment provides both can solve the tolerance problem in the chip application process, also can increase the chip cooling path, solved the heat dissipation problem of chip.
As shown in Figure 4, for 202 bendings of sheet metal among the embodiment of the present utility model are the schematic diagram of class " second " shape, in the chip heat radiator of present embodiment, also comprise elastic insert 203 and pcb board 205.In the present embodiment, radiator can be radiator 204.Sheet metal 202 parts contact with chip 201, elastic insert 203 places between the part and radiator 204 that sheet metal 202 contacts with chip 201, elastic insert 203 can be pushed down sheet metal 202, so that sheet metal 202 well contacts with chip 201, sheet metal 202 another part place between radiator 204 and the pcb board 205, by the pcb board 205 and the clamping force of radiator 204 sheet metal 202 are well contacted with radiator 204.Like this, by sheet metal chip heat is conducted to radiator and dispel the heat, heat can be conducted to the larger area radiator, radiating efficiency is higher.Should be understood that in the chip heat radiator of present embodiment, need there be bigger taboo cloth district at the back of pcb board, causes the PCB short circuit, the device that is suitable for dispelling the heat and has relatively high expectations after preventing that sheet metal is installed.Concrete a kind of mode is: a side and the chip 201 of sheet metal 202 lean, and the another side of this side and elastic insert 203 lean, and another and this side opposed side edges and the radiator of sheet metal 202 lean.In the present embodiment, owing to also be embedded with elastic insert between radiator and the chip, can absorb tolerance and prevent that the chip pressurized is excessive.
As shown in Figure 5, for the schematic diagram of 202 bendings of sheet metal among the embodiment of the present utility model, in the chip heat radiator of present embodiment, also comprise elastic insert 203, radiator 204, and pcb board 205 for class " Contraband " or class " U " shape.Wherein, pcb board 205 comprises screening cover 2051, and in the present embodiment, the radiator that contacts with sheet metal 202 is a screen 2051.Sheet metal 202 1 sides contact with chip 201, and elastic insert 203 places between the part and radiator 204 that sheet metal 202 contacts with chip 201.Another side of sheet metal 202 and the screening cover 2051 of pcb board 205 lean.Wherein, the screening cover 2051 of another side of sheet metal 202 and pcb board 205 leans and can also sheet metal 202 and screening cover 2051 be tightened up by screw.Concrete a kind of mode can for: a side and the chip 201 of sheet metal 202 lean, and the another side of this side and elastic insert 203 lean, and another and this side opposed side edges and the radiator of sheet metal 202 lean.In addition, elastic insert 203 can also lean with radiator 204.In the present embodiment, owing to also be embedded with elastic insert between radiator and the chip, can absorb tolerance and prevent that the chip pressurized is excessive.
In the chip heat radiator that the utility model provides, chip is avoided contacting with the nonmetallic materials of low thermal conductivity, directly contact with the Metal Flake material of high thermal conductivity coefficient, the Metal Flake material part area of high thermal conductivity coefficient directly contacts with chip, the part area contacts with radiator, heat on the chip is transmitted on the radiator by sheet metal, has solved the heat dissipation problem of chip heat point source devices such as ASIC, FPGA, integral body has promoted the environmental adaptation temperature of veneer.
Embodiment of the present utility model also provides a kind of chip, and this chip comprises sheet metal in encapsulation, and the part of sheet metal links to each other with chip, and another part hangs.
In the present embodiment, this sheet metal has elasticity, and is bent.
The chip that utilizes present embodiment to provide, can by sheet metal hang part, lean with radiator (comprise and being connected), the area of dissipation of chip has obtained increase, can strengthen the thermal diffusivity of chip.
Be understandable that, more than disclosed only be several specific embodiment of the present utility model, obviously, those skilled in the art can carry out various changes and modification and not break away from spirit and scope of the present utility model the utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (12)
1. a chip heat radiator is characterized in that, comprises chip and sheet metal, the part of described sheet metal and chip mutually against, another part of described sheet metal and radiator mutually against.
2. chip heat radiator as claimed in claim 1, it is characterized in that, also comprise elastic insert, described sheet metal is class " mouth " shape or class " Contraband " shape, one side and the described chip of described sheet metal lean, another and described side opposed side edges and described radiator lean, and described elastic insert is embedded in the described sheet metal, lean with the side that leans with described chip of described sheet metal with side that described radiator leans respectively.
3. chip heat radiator as claimed in claim 2 is characterized in that, described radiator is a radiator.
4. chip heat radiator as claimed in claim 1, it is characterized in that, also comprise elastic insert, described sheet metal is class " Contraband " shape, one side and the described chip of described sheet metal lean, the another side of described side and described elastic insert lean, and another of described sheet metal and described side opposed side edges and described radiator lean.
5. chip heat radiator as claimed in claim 4 is characterized in that, described radiator is the screen of pcb board.
6. chip heat radiator as claimed in claim 5, it is characterized in that another of described sheet metal and described side opposed side edges and described radiator lean and specifically comprise: another of described sheet metal and described side opposed side edges are fastening and lean by the screen of screw and pcb board.
7. chip heat radiator as claimed in claim 1, it is characterized in that, also comprise elastic insert, described sheet metal is class " second " shape, one side and the described chip of described sheet metal lean, the another side of described side and described elastic insert lean, and another of described sheet metal and described side opposed side edges and described radiator lean.
8. chip heat radiator as claimed in claim 7 is characterized in that, described radiator is a radiator.
9. chip heat radiator as claimed in claim 8, it is characterized in that, the another side of the side of the described sheet metal that described and radiator lean also leans with pcb board, by described pcb board and clamping force between the described radiator make another side of described sheet metal and described radiator near.
10. chip heat radiator as claimed in claim 1 is characterized in that, described sheet metal is a planar metal sheet; Perhaps, described sheet metal bends at least and is dual-side, and a side and the described chip of described sheet metal lean, and at least one side and the radiator of described sheet metal lean.
11. chip heat radiator as claimed in claim 1 is characterized in that, described sheet metal links to each other by the mode of welding with the part that described chip leans.
12. a chip is characterized in that, comprises sheet metal, the part of described sheet metal and described chip mutually against, another part of described sheet metal hangs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202623675U CN201584403U (en) | 2009-12-29 | 2009-12-29 | Chip cooling device and chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202623675U CN201584403U (en) | 2009-12-29 | 2009-12-29 | Chip cooling device and chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201584403U true CN201584403U (en) | 2010-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202623675U Expired - Lifetime CN201584403U (en) | 2009-12-29 | 2009-12-29 | Chip cooling device and chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN201584403U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102438432A (en) * | 2011-11-15 | 2012-05-02 | 华为终端有限公司 | Chip heat-radiating device and electronic device |
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
| CN102686086A (en) * | 2012-05-17 | 2012-09-19 | 华为技术有限公司 | Radiating device and electronic component provided with same |
| CN102811591A (en) * | 2012-08-08 | 2012-12-05 | 慈溪市顺达实业有限公司 | Variable frequency motor controller of washing machine |
| CN105814978A (en) * | 2014-01-08 | 2016-07-27 | 恩菲斯能源公司 | Double insulated heat spreader |
| CN108027843A (en) * | 2015-09-11 | 2018-05-11 | 高通股份有限公司 | Clock unit spacing based on power density |
| CN108364922A (en) * | 2018-01-31 | 2018-08-03 | 北京比特大陆科技有限公司 | Liquid cooling heat radiation system |
-
2009
- 2009-12-29 CN CN2009202623675U patent/CN201584403U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102438432A (en) * | 2011-11-15 | 2012-05-02 | 华为终端有限公司 | Chip heat-radiating device and electronic device |
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
| CN102686086A (en) * | 2012-05-17 | 2012-09-19 | 华为技术有限公司 | Radiating device and electronic component provided with same |
| CN102811591A (en) * | 2012-08-08 | 2012-12-05 | 慈溪市顺达实业有限公司 | Variable frequency motor controller of washing machine |
| CN105814978A (en) * | 2014-01-08 | 2016-07-27 | 恩菲斯能源公司 | Double insulated heat spreader |
| CN105814978B (en) * | 2014-01-08 | 2018-06-22 | 恩菲斯能源公司 | Double insulation radiator |
| US10098261B2 (en) | 2014-01-08 | 2018-10-09 | Enphase Energy, Inc. | Double insulated heat spreader |
| CN108027843A (en) * | 2015-09-11 | 2018-05-11 | 高通股份有限公司 | Clock unit spacing based on power density |
| CN108027843B (en) * | 2015-09-11 | 2019-12-13 | 高通股份有限公司 | Clock unit spacing based on power density |
| CN108364922A (en) * | 2018-01-31 | 2018-08-03 | 北京比特大陆科技有限公司 | Liquid cooling heat radiation system |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100915 |