CN102438432A - Chip heat-radiating device and electronic device - Google Patents
Chip heat-radiating device and electronic device Download PDFInfo
- Publication number
- CN102438432A CN102438432A CN2011103616280A CN201110361628A CN102438432A CN 102438432 A CN102438432 A CN 102438432A CN 2011103616280 A CN2011103616280 A CN 2011103616280A CN 201110361628 A CN201110361628 A CN 201110361628A CN 102438432 A CN102438432 A CN 102438432A
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- Prior art keywords
- radiator
- hole
- chip
- flat radiator
- chip heat
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Abstract
The embodiment of the invention provides a chip heat-radiating device and an electronic device. The chip heat-radiating device is arranged in the electronic device, the chip heat-radiating device comprises a flat plate type heat radiator which is provided with at least one hole, and the hole is used for inserting a guide pillar on a shell of the electronic device so that the flat plate type heat radiator is fixed on the shell of the electronic device. According to the chip heat-radiating device and the electronic device, because the flat plate type heat radiator is fixed on the shell of the electronic device, the problem of occupying the space on the PCB because of fixing the flat plate type heat radiator on the PCB by using a screw in the prior art can be avoided, and the space utilization radio of the PCB is increased.
Description
Technical field
The embodiment of the invention relates to heat dissipation technology, relates in particular to a kind of chip heat radiator and electronic equipment.
Background technology
In the use of electronic equipment; Printed circuit board (Printed Circuit Board; Abbreviation PCB) goes up the chip that is provided with and when work, can produce great amount of heat, can cause between the shell of electronic equipment, forming heat spot on the chip and above this chip.In order to address this problem, need on chip, increase flat radiator.In general, can adopt screw that flat radiator is fixed on the PCB.
But the said fixing mode can take the space of PCB, has caused the reduction of the space availability ratio of PCB.
Summary of the invention
The embodiment of the invention provides a kind of chip heat radiator and electronic equipment, in order to improve the space availability ratio of PCB.
One aspect of the present invention provides a kind of chip heat radiator; Be arranged in the electronic equipment; Comprise: comprise flat radiator; Offer at least one hole on the said flat radiator, be used to insert the guide pillar on the shell of said electronic equipment in said at least one hole, so that said flat radiator is fixed on the shell of said electronic equipment.
The embodiment of the invention provides a kind of electronic equipment again, comprises the said chip heat abstractor.
Can know by technique scheme; The embodiment of the invention is through offering at least one hole on the flat radiator; Make flat radiator to be fixed on the shell of electronic equipment through the guide pillar on the shell that inserts electronic equipment in this at least one hole; Because flat radiator is fixed on the shell of electronic equipment; So can avoid going up the problem that takies the space on the PCB that causes owing to adopting screw that flat radiator is fixed on PCB in the prior art, thereby improve the space availability ratio of PCB.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do one to the accompanying drawing of required use in embodiment or the description of the Prior Art below introduces simply; Obviously, the accompanying drawing in describing below is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The structural representation of the chip heat radiator that Fig. 1 provides for one embodiment of the invention;
The structural representation of the chip heat radiator that Fig. 2 provides for another embodiment of the present invention;
The structural representation of the chip heat radiator that Fig. 3 provides for another embodiment of the present invention;
The structural representation of the chip heat radiator that Fig. 4 provides for another embodiment of the present invention;
The structural representation of the chip heat radiator that Fig. 5 provides for another embodiment of the present invention.
Embodiment
For the purpose, technical scheme and the advantage that make the embodiment of the invention clearer; To combine the accompanying drawing in the embodiment of the invention below; Technical scheme in the embodiment of the invention is carried out clear, intactly description; Obviously, described embodiment is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The structural representation of the chip heat radiator that Fig. 1 provides for one embodiment of the invention; As shown in Figure 1; The chip heat radiator of present embodiment is arranged in the electronic equipment, can comprise flat radiator 10, offers at least one hole 20 on the flat radiator; Be used to insert the guide pillar 31 on the shell 30 of electronic equipment at least one hole 20, so that flat radiator 10 is fixed on the shell 30 of electronic equipment.
Alternatively, in the present embodiment, offer at least one hole 20 on the flat radiator 10 and comprise at least a in the scenario:
Offer at least one hole 20 on the base portion 11 of flat radiator 10, for example: offer a hole on the base portion 11 of flat radiator 10, for example: as shown in Figure 4, offer a hole on the base portion 11 of flat radiator 10;
Offer at least one hole 20 on the extension 12 of flat radiator 10, for example: offer two holes 20 on the extension 12 of flat radiator 10, for example: as shown in Figure 1, offer two holes 20 on the extension 12 of flat radiator 10.
Alternatively; Offer at least one hole 20 on the base portion 11 of flat radiator 10; And offer at least one hole on the extension 12 of flat radiator 10; For example: as shown in Figure 5, offer on the base portion 11 of flat radiator 10 on the extension 12 of a hole 20 and flat radiator 10 and offer two holes 20.
In the present embodiment; Through offering at least one hole on the flat radiator; Make flat radiator to be fixed on the shell of electronic equipment through the guide pillar on the shell that inserts electronic equipment in this at least one hole; Because flat radiator is fixed on the shell of electronic equipment, thus can avoid owing to the employing screw is fixed on the problem that PCB goes up the space that takies PCB that causes with flat radiator, thus improved the space availability ratio of PCB.
Alternatively; In the present embodiment; If offer a hole 20 on the flat radiator; On the inner surface in a then said hole 20 internal thread is arranged, on the outer surface of guide pillar 31 external screw thread is arranged, said internal thread cooperates with said external screw thread; So that insert guide pillar 31 in the said hole 20; Thereby the contact pressure between the chip of realizing being provided with on flat radiator 10 and the PCB 40 50 is preassigned pressure threshold, the problem that can avoid chip too small owing to the contact pressure between flat radiator and the chip or that exist the slit to cause to be obstructed to the heat transferred of flat radiator, the problem of the chip that perhaps causes owing to the contact pressure between flat radiator and the chip is excessive damage.
Alternatively; The chip heat radiator that present embodiment provides can further include spring members; Be used for flat radiator 10 moved to chip 50 along guide pillar 31 and contact, the coefficient of elasticity of spring members can be according to the contact pressure setting between flat radiator 10 and the chip 50.Through the coefficient of elasticity of spring members is set according to preassigned pressure threshold; The problem that can avoid chip too small owing to the contact pressure between flat radiator and the chip or that exist the slit to cause to be obstructed to the heat transferred of flat radiator, the problem of the chip that perhaps causes damage owing to the contact pressure between flat radiator and the chip is excessive.
As shown in Figure 2, the spring members in the present embodiment can be helical spring 61, and helical spring is set on the guide pillar 31.
As shown in Figure 3, the spring members in the present embodiment can also be spring leaf 62, and spring card is located between the shell 30 of flat radiator 10 and electronic equipment.
Another embodiment of the present invention also provides a kind of electronic equipment, can comprise the chip heat radiator that the corresponding embodiment of chip and above-mentioned Fig. 1, Fig. 2 and Fig. 3 on shell, PCB, this PCB provides.
It is understandable that: the flat radiator 10 shown in Fig. 1 in the present embodiment～3 does not limit the flat radiator that the embodiment of the invention adopts other shapes only as an optional shape.
In several embodiment that the application provided, should be understood that device that is disclosed and equipment can be realized through other mode.For example, device embodiment described above only is schematically, for example; The division of said unit; Only be that a kind of logic function is divided, during actual the realization other dividing mode can be arranged, for example a plurality of unit or assembly can combine or can be integrated into another device or equipment; Or some characteristics can ignore, or do not carry out.Another point, the coupling each other that shows or discuss or directly coupling or communication to connect can be through some interfaces, the INDIRECT COUPLING of device or unit or communication connect, and can be electrically, machinery or other form.
What should explain at last is: above embodiment is only in order to explaining technical scheme of the present invention, but not to its restriction; Although with reference to previous embodiment the present invention has been carried out detailed explanation, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these are revised or replacement, do not make the spirit and the scope of the essence disengaging various embodiments of the present invention technical scheme of relevant art scheme.
Claims (7)
1. chip heat radiator; Be arranged in the electronic equipment; It is characterized in that, comprise flat radiator, offer at least one hole on the said flat radiator; Be used to insert the guide pillar on the shell of said electronic equipment in said at least one hole, so that said flat radiator is fixed on the shell of said electronic equipment.
2. chip heat radiator according to claim 1; It is characterized in that; Said chip heat radiator also comprises spring members; Be used for said flat radiator moved to chip along said guide pillar and contact, the coefficient of elasticity of said spring members is according to the contact pressure setting between said flat radiator and the said chip.
3. chip heat radiator according to claim 2 is characterized in that, said spring members is a helical spring, and said helical spring is set on the said guide pillar.
4. chip heat radiator according to claim 2 is characterized in that, said spring members is a spring leaf, and said spring card is located between the shell of said flat radiator and said electronic equipment.
5. chip heat radiator according to claim 1; It is characterized in that; If offer a hole on the said flat radiator, on the inner surface in a said hole internal thread is arranged, on the outer surface of said guide pillar external screw thread is arranged; Said internal thread cooperates with said external screw thread, so that insert said guide pillar in the said hole.
6. according to the described chip heat radiator of the arbitrary claim of claim 1 to 5, it is characterized in that, offer at least one hole on the said flat radiator and comprise at least a in the scenario:
Offer at least one hole on the base portion of said flat radiator; Perhaps
Offer at least one hole on the extension of said flat radiator.
7. an electronic equipment is characterized in that, comprises chip and the described chip heat radiator of the arbitrary claim of claim 1 to 6 on shell, printed circuit board, the said printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103616280A CN102438432A (en) | 2011-11-15 | 2011-11-15 | Chip heat-radiating device and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103616280A CN102438432A (en) | 2011-11-15 | 2011-11-15 | Chip heat-radiating device and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102438432A true CN102438432A (en) | 2012-05-02 |
Family
ID=45986218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103616280A Pending CN102438432A (en) | 2011-11-15 | 2011-11-15 | Chip heat-radiating device and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102438432A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104604351A (en) * | 2012-09-06 | 2015-05-06 | 萨基姆宽带联合股份公司 | Air-cooled electronic equipment and device for cooling an electronic component |
| CN104604352A (en) * | 2012-09-07 | 2015-05-06 | 汤姆逊许可公司 | Set top box having heat sink pressure applying means |
| CN104604352B (en) * | 2012-09-07 | 2016-11-30 | 汤姆逊许可公司 | There is the Set Top Box of heat sink device for exerting |
| WO2019007081A1 (en) * | 2017-07-05 | 2019-01-10 | 华为技术有限公司 | Processor fixing structure, component, and computer device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1458561A (en) * | 2002-01-31 | 2003-11-26 | 王松 | Heat radiation or shielding structure with heat source near outer casing inner wall for color display screen electric appliance |
| US20060120044A1 (en) * | 2004-12-04 | 2006-06-08 | Foxconn Technology Co., Ltd | Heat dissipating apparatus |
| CN1917189A (en) * | 2005-06-15 | 2007-02-21 | 蒂科电子公司 | Modular heat sink assembly |
| CN101212883A (en) * | 2006-12-27 | 2008-07-02 | 富准精密工业(深圳)有限公司 | Heat radiator combination |
| CN201584403U (en) * | 2009-12-29 | 2010-09-15 | 华为技术有限公司 | Chip cooling device and chip |
| CN201590413U (en) * | 2009-12-07 | 2010-09-22 | 中兴通讯股份有限公司 | Radiating structure of flip chip |
-
2011
- 2011-11-15 CN CN2011103616280A patent/CN102438432A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1458561A (en) * | 2002-01-31 | 2003-11-26 | 王松 | Heat radiation or shielding structure with heat source near outer casing inner wall for color display screen electric appliance |
| US20060120044A1 (en) * | 2004-12-04 | 2006-06-08 | Foxconn Technology Co., Ltd | Heat dissipating apparatus |
| CN1917189A (en) * | 2005-06-15 | 2007-02-21 | 蒂科电子公司 | Modular heat sink assembly |
| CN101212883A (en) * | 2006-12-27 | 2008-07-02 | 富准精密工业(深圳)有限公司 | Heat radiator combination |
| CN201590413U (en) * | 2009-12-07 | 2010-09-22 | 中兴通讯股份有限公司 | Radiating structure of flip chip |
| CN201584403U (en) * | 2009-12-29 | 2010-09-15 | 华为技术有限公司 | Chip cooling device and chip |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104604351A (en) * | 2012-09-06 | 2015-05-06 | 萨基姆宽带联合股份公司 | Air-cooled electronic equipment and device for cooling an electronic component |
| CN104604352A (en) * | 2012-09-07 | 2015-05-06 | 汤姆逊许可公司 | Set top box having heat sink pressure applying means |
| CN104604352B (en) * | 2012-09-07 | 2016-11-30 | 汤姆逊许可公司 | There is the Set Top Box of heat sink device for exerting |
| WO2019007081A1 (en) * | 2017-07-05 | 2019-01-10 | 华为技术有限公司 | Processor fixing structure, component, and computer device |
| US11133239B2 (en) | 2017-07-05 | 2021-09-28 | Huawei Technologies Co., Ltd. | Mechanical part for fastening processor, assembly, and computer device |
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Application publication date: 20120502 |