CN201532952U - 一种3a肖特基二极管的引线 - Google Patents

一种3a肖特基二极管的引线 Download PDF

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Publication number
CN201532952U
CN201532952U CN 200920179935 CN200920179935U CN201532952U CN 201532952 U CN201532952 U CN 201532952U CN 200920179935 CN200920179935 CN 200920179935 CN 200920179935 U CN200920179935 U CN 200920179935U CN 201532952 U CN201532952 U CN 201532952U
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China
Prior art keywords
wire
lead
chip
schottky diode
leading
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Expired - Fee Related
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CN 200920179935
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English (en)
Inventor
陆国华
吴亚红
吴刚
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RUGAO RIXIN ELECTRONIC CO Ltd
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RUGAO RIXIN ELECTRONIC CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

本实用新型涉及一种3A肖特基二极管的引线，包括一对对称排列的引线，以及夹在引线之间的芯片，所述芯片通过焊片与引线的端部固定连接，其创新点在于：所述引线的引脚线径为1.18±mm。本实用新型的优点在于：焊接时，将一对引线对称放置在模具的下模内，两引线之间为芯片，芯片与两侧的引线之间置有焊片，再将上模盖在下模上，放入隧道炉内进行焊接。由于传统3A肖特基二极管的焊接模具引线内腔为1.2mm，这样引线不会被上模压到，保证了产品的焊接质量。

Description

一种3A肖特基二极管的引线
技术领域
本实用新型涉及一种3A肖特基二极管的引线，包括一对对称排列的引线，以及夹在引线之间的芯片，所述芯片通过焊片与引线的端部固定连接。
背景技术
肖特基二极管是近年来问世的低功耗、大电流、超高速半导体器件，其反向恢复时间极短，正向导通压降仅0.4V左右，而整流电流却可达到几千毫安。应用于低压、大电流输出场合的高频整流，高频率的检波和混频，以及在高速逻辑电路中用作箝位。
肖特基二极管主要包括引线、芯片，芯片设在一对对称分布的引线之间，其在生产过程中，需要通过在芯片及两侧引线之间放置焊片，并水平放置在模具内，通过加热使焊片熔化，实现芯片与引线的连接。传统3A肖特基二极管的焊接模具引线内腔为1.2mm，与二极管引线的直径相同，在进行焊接时，模具的上模压在引线上，易压伤引线脚，引起飞边。同时，引线脚受力后引线端部上翘，影响焊接性能，导致产品电性及整体合格率下降。
实用新型内容
本实用新型要解决的技术问题是提供一种可在焊接过程中不易被压伤、电性及合格率高的3A肖特基二极管的引线。
为解决上述技术问题，本实用新型的技术方案为：一种3A肖特基二极管的引线，包括一对对称排列的引线，以及夹在引线之间的芯片，所述芯片通过焊片与引线的端部固定连接，其创新点在于：所述引线的引脚线径为1.18±0.01mm。
本实用新型的优点在于：焊接时，将一对引线对称放置在模具的下模内，两引线之间为芯片，芯片与两侧的引线之间置有焊片，再将上模盖在下模上，放入隧道炉内进行焊接。由于传统3A肖特基二极管的焊接模具引线内腔为1.2mm，这样引线不会被上模压到，保证了产品的焊接质量。
附图说明
附图为本实用新型的3A肖特基二极管的引线的结构示意图。
具体实施方式
如附图所示，本实用新型涉及一种3A肖特基二极管的引线，包括引线1、芯片2、焊片3。
上述引线1为一对，对称排列，其端部之间夹由芯片2，该芯片2通过焊片3分别与引线1的端部固定连接，所述引线1的引脚线径为1.18±0.01mm。

Claims (1)

1.一种3A肖特基二极管的引线，包括一对对称排列的引线，以及夹在引线之间的芯片，所述芯片通过焊片与引线的端部固定连接，其特征在于：所述引线的引脚线径为1.18±0.01mm。
CN 200920179935 2009-11-13 2009-11-13 一种3a肖特基二极管的引线 Expired - Fee Related CN201532952U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200920179935 CN201532952U (zh) 2009-11-13 2009-11-13 一种3a肖特基二极管的引线

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200920179935 CN201532952U (zh) 2009-11-13 2009-11-13 一种3a肖特基二极管的引线

Publications (1)

Publication Number Publication Date
CN201532952U true CN201532952U (zh) 2010-07-21

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CN 200920179935 Expired - Fee Related CN201532952U (zh) 2009-11-13 2009-11-13 一种3a肖特基二极管的引线

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112750766A (zh) * 2020-12-14 2021-05-04 山东融创电子科技有限公司 一种长寿命二极管的制备工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112750766A (zh) * 2020-12-14 2021-05-04 山东融创电子科技有限公司 一种长寿命二极管的制备工艺

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Granted publication date: 20100721

Termination date: 20121113