CN201489023U - Wafer transportation box - Google Patents

Abstract

The utility model provides a wafer transportation box which comprises a first baffle plate, a second baffle plate and a first handle which is connected with the first baffle plate and the second baffle plate. The wafer transportation box is characterized in that a first through hole is further arranged on the first baffle plate, and solves the problems of slow wafer heating and cooling speed in the prior art, and can improve working efficiency.

Description

A kind of wafer cassette

Technical field

The utility model designing semiconductor device field tests relates in particular to a kind of wafer cassette that can effectively utilize the electric oven space.

Background technology

Stress migration (SM, Stress Migration) is one of test item of standard in the semiconductor device reliability test.After semiconductor devices increased temperature (such as 200 degree, 250 degree etc.) baking certain hour (as 500 hours, 1000 hours), the resistance variations of the metal interconnect structure by testing described semiconductor devices was studied because stress makes the adhesiveness between metal level and the oxide layer.

Stress migration test is that wafer to be measured is put into a high temperature resistant wafer cassette, the baking oven of described wafer cassette being put into assigned temperature toasts again, through taking out described wafer cassette behind the certain hour, wait its interconnection structure changes in resistance of wafer cooling back test.

Fig. 1 is the structural representation of existing wafer cassette.As shown in Figure 1, wafer cassette 100 comprises: the first baffle plate 106a, second baffle 106b, and the first handle 104a that connects described first baffle plate 106a and described second baffle 106b.

Because 12 cun corresponding test requests of product wafer are more and more, and existing 12 cun wafer cassettes take up space and are far longer than 8 cun, so under the condition of limited of electric oven space, be difficult to accomplish rationally arrange to test (case).And, in stress migration test, wafer and wafer cassette are through high temperature (general 150 degree～300 degree) baking, can not directly operate wafer or wafer cassette, need wear high temperature resistant gloves wafer cassette is taken out electric oven, and described wafer cassette and wafer are cooled to just to take out wafer behind the normal temperature (generally needing about 2 hours) and test.Yet the stress migration test of general 12 cun product wafer only needs 2 wafer, and a wafer cassette that holds 12 cun wafers can hold 25 wafer.If the wafer of difference test is placed in the same wafer cassette, because baking zero-time difference, central reading point difference and baking cycle difference, deposit or the wafer of taking all needs to treat just can carry out after the cooling of whole wafer cassette, will the temperature environment and the stoving time of the wafer that do not need to take out be impacted like this.The great like this space of wafer cassette and the space of electric oven wasted also influenced the cycle length of testing.

And the wafer cassette that held 12 cun product wafers originally is unfavorable for the homogeneity of wafer heating-up temperature and the speed of cooling.

In addition, the material of wafer cassette before is almag manufacturing mostly, needs more material, and whole wafer cassette is relatively heavier.

The utility model content

For the space that solves wafer cassette in the prior art and the space of electric oven can not rationally utilize, can not rationally arrange the problem of testing, and wafer cassette is unfavorable for that the utility model provides a kind of new wafer cassette to the speed of the homogeneity of wafer heating-up temperature and cooling and problem such as cost an arm and a leg.

Wafer cassette of the present utility model comprises: first baffle plate, second baffle, and the first handle that connects described first baffle plate 206a and described second baffle, it is characterized in that, and on described first baffle plate, also be provided with first through hole.

Preferably, described first through hole is positioned at described first its centre.

Preferably, also be provided with first through hole on the described second baffle, described first through hole is positioned at the center of described second baffle.

Preferably, around first through hole of described first baffle plate and described second baffle, also be distributed with second through hole.

Preferably, also comprise second handle perpendicular to described first handle.

Preferably, the cross section of described first handle and described second handle is a polygon.

Preferably, described first handle and described second handle surface are provided with a plurality of grooves or projection.

Preferably, on first baffle plate of described wafer cassette or second baffle, also be provided with the support portion.

Preferably, also be provided with the inclination support portion on first baffle plate of described wafer cassette or second baffle, the dip plane of described inclination support portion becomes 5 to spend miter angle with surface level.

Preferably, the dip plane of described inclination support portion becomes 30 degree angles with surface level.

Preferably, the described wafer cassette wafer count that can hold is less than 25.

Preferably, the described wafer cassette wafer count that can hold is 10.

Preferably, the material of described wafer cassette can be for not comprising the aluminium alloy of magnesium.

Wafer cassette of the present utility model takes up space less, the wafer cassette of different event can be positioned in the same electric oven, helps the flexible arrangement of incident; Owing to increased by first through hole and/or the described wafer cassette of second through hole can make the described wafer of heating and cooling all very quick; The inclination support portion is set on the described wafer cassette can effectively prevents the wafer landing; It is that polygon or its are provided with groove or projection that described first handle and/or second handle are designed to the cross section, can be effectively anti-skidding; The material of described wafer cassette selects low price not comprise the aluminium alloy of magnesium, can the economical with materials expense and alleviate delivery cartridge weight by getting through the hole.

Description of drawings

Fig. 1 is the structural representation of existing wafer cassette.

Fig. 2 is the synoptic diagram of the wafer cassette of the utility model one embodiment.

Fig. 3 is the preferred embodiment synoptic diagram of first handle 204a or second handle 204b.

Fig. 4 is the floor map of support portion.

Fig. 5 is the schematic cross-section of inclination support portion 210.

The angle synoptic diagram of bottom surface and surface level when Fig. 6 is put on the surface level for wafer cassette 200.

Fig. 7 is the synoptic diagram of a kind of partitioning scheme of electric oven.

Fig. 8 is the synoptic diagram of partitioning scheme of the preferred embodiment of electric oven.

Embodiment

In order to make content of the present utility model clear and understandable more, content of the present utility model is described in detail below in conjunction with specific embodiments and the drawings.

Fig. 2 is the synoptic diagram of the wafer cassette of the utility model one embodiment.Wafer cassette 200 of the present utility model comprises: the first baffle plate 206a, second baffle 206b, and the first handle 204a that connects described first baffle plate 206a and described second baffle 206b also are provided with the first through hole 202a on the described first baffle plate 206a.

Heat release and heating that the described first through hole 202a helps wafer and wafer cassette 200 are set, can also save material; Preferably, the described first through hole 202a is positioned at the center of the described first baffle plate 206a, helps the heating and the heat release of crystal circle center position.

Preferably, also be provided with the first through hole 202a on the described second baffle 206b, the described first through hole 202a is positioned at the center of described second baffle 206b.

Preferably, around the first through hole 202a of described first baffle plate 206a and described second baffle 206b, also be distributed with the second through hole 202b, help the heating and the heat release of wafer peripheral like this, further, the described second through hole 202b is uniformly distributed in around the described first through hole 202a.

Preferably, described wafer cassette 200 also comprises the second handle 204b perpendicular to described first handle 204a, described second handle 204b is set helps, when described wafer cassette 200 lies against surface level, pick up or put down described wafer cassette, the handled easily personnel application of force.

Preferably, the cross section of described first handle 204a and described second handle 204b is a polygon, can prevent that operating personnel from dropping to the ground wafer cassette 200 because of carelessness, promptly plays anti-skidding effect.

Fig. 3 is the preferred embodiment synoptic diagram of first handle 204a or second handle 204b.Preferably, as shown in Figure 3, described first handle 204a and described second handle 204b surface are provided with a plurality of grooves 208 or projection 208, play anti-skidding effect.

Fig. 4 is the floor map of support portion.Preferably, as shown in Figure 4, also be provided with support portion 210 on the first baffle plate 206a of described wafer cassette or second baffle 206b, described support portion 210 is used for playing a supportive role when described wafer cassette 200 keeps flat.

Fig. 5 is the schematic cross-section of inclination support portion 210.Preferably, as shown in Figure 5, also be provided with inclination support portion 210a on the first baffle plate 206a of described wafer cassette or second baffle 206b, like this, when described wafer cassette 200 was put on the surface level, wafer can not slide out; The dip plane of described inclination support portion 210a becomes 5 to spend miter angle with surface level, as becomes 15 degree, 20 degree, 25 degree, preferable when 30 degree, 35 are spent.

The angle synoptic diagram of bottom surface and surface level when Fig. 6 is put on the surface level for wafer cassette 200.Preferably, as shown in Figure 6, when wafer was put in surface level, the bottom surface 20 at the first baffle plate 206a or second baffle 206b place was angled with surface level 10, as 30 degree.

Preferably, the wafer count that described wafer cassette 200 can hold is less than 25, preferable is 10, because when generally needing to carry out stress migration test or other test, the wafer count of using is all much smaller than 25, and like this, bigger wafer cassette 200 has occupied very large space, be unfavorable for the space utilization of electric oven, change and make less wafer cassette 200 and can save space and cost effectively.

Fig. 7 is the synoptic diagram of a kind of partitioning scheme of electric oven.If wafer cassette 200 is bigger, and has only first handle 204a, when being unfavorable for that wafer cassette 200 is put on the surface level, operating personnel's the application of force, then wafer cassette 200 can only vertically be put in 300 li of electric ovens, with the present wafer cassette that holds 12 cun wafers is example, and each electric oven 300 can only be placed two wafer cassettes, and electric oven 300 is divided into two parts up and down by a dividing plate 302.

Fig. 8 is the synoptic diagram of partitioning scheme of the preferred embodiment of electric oven.If adopt wafer cassette 200 of the present utility model, electric oven 300 can be divided into upper, middle and lower 3 parts by dividing plate 302 and dividing plate 304.Part space, top is bigger, can hold the wafer cassette of vertical placement; A middle part is less, can hold the wafer cassette that keeps flat; A following part can hold the wafer cassette of two reduced sizes; Like this, can place the wafer cassette of several incidents simultaneously in an electric oven.Shown in Figure 8, be a kind of embodiment, operating personnel can plan as a whole to cut apart described electric oven according to the concrete size of wafer, make full use of the space of described electric oven.

The material of wafer cassette of the present utility model can be for not comprising the aluminium alloy of magnesium, because it is fine not comprise the aluminium alloy resistance to elevated temperatures of magnesium, and also very cheap.

Embodiment of the present utility model does not constitute the restriction to protection domain, just helps understanding content of the present utility model.

Claims (13)

1. wafer cassette comprises: first baffle plate, second baffle, and the first handle that connects described first baffle plate (206a) and described second baffle, it is characterized in that, and on described first baffle plate, also be provided with first through hole.

2. wafer cassette as claimed in claim 1 is characterized in that, described first through hole is positioned at described first its centre.

3. wafer cassette as claimed in claim 2 is characterized in that, also is provided with first through hole on the described second baffle, and described first through hole is positioned at the center of described second baffle.

4. wafer cassette as claimed in claim 3 is characterized in that, also is distributed with second through hole around first through hole of described first baffle plate and described second baffle.

5. wafer cassette as claimed in claim 4 is characterized in that, also comprises the second handle perpendicular to described first handle.

6. wafer cassette as claimed in claim 5 is characterized in that, the cross section of described first handle and described second handle is a polygon.

7. wafer cassette as claimed in claim 5 is characterized in that, described first handle and described second handle surface are provided with a plurality of grooves or projection.

8. as claim 6 or 7 described wafer cassettes, it is characterized in that, on first baffle plate of described wafer cassette or second baffle, also be provided with the support portion.

9. as claim 6 or 7 described wafer cassettes, it is characterized in that also be provided with the inclination support portion on first baffle plate of described wafer cassette or second baffle, the dip plane of described inclination support portion becomes 5 to spend miter angle with surface level.

10. wafer cassette as claimed in claim 9 is characterized in that, the dip plane of described inclination support portion becomes 30 degree angles with surface level.

11. wafer cassette as claimed in claim 10 is characterized in that, the wafer count that described wafer cassette can hold is less than 25.

12. wafer cassette as claimed in claim 11 is characterized in that, the wafer count that described wafer cassette can hold is 10.

13. wafer cassette as claimed in claim 12 is characterized in that, the material of described wafer cassette can be for not comprising the aluminium alloy of magnesium.

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