CN201476670U - Radiating fin group, radiating fin and heat sink - Google Patents
Radiating fin group, radiating fin and heat sink Download PDFInfo
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- CN201476670U CN201476670U CN200920153836XU CN200920153836U CN201476670U CN 201476670 U CN201476670 U CN 201476670U CN 200920153836X U CN200920153836X U CN 200920153836XU CN 200920153836 U CN200920153836 U CN 200920153836U CN 201476670 U CN201476670 U CN 201476670U
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Abstract
The utility model relates to a radiating fin group, a radiating fin and a heat sink. The radiating fin group comprises first radiating fins and second radiating fins which are combined together, and each first radiating fin and each second radiating fin all comprise a substrate and an assembly plate connected with the substrate. The radiating fin group is characterized in that the areas of the substrates of the second radiating fins are smaller than the areas of the substrates of the first radiating fins, the assembly plates of the first radiating fins at least comprise a stepped structure with a first step and a second step, the assembly plates of the second radiating fins are matched with the first steps, and the substrates of the second radiating fins are arranged in the matching positions. With the enlarged space of the rear half section of the flow channel which is not adjacent to the radiating fan in the radiating fin group, the utility model not only ensures the heat exchange effect of the heat conduction pipe and the cooling pipe, but also effectively reduces the length and the flow resistance of the flow channel, and increases the flow velocity of air in the flow channel.
Description
Technical field
The utility model relates to a kind of heat dissipation technology, particularly a kind of radiating fin group, fin and heat abstractor.
Background technology
Along with electronics and information industry constantly develops, present computer processor is as central processing unit or display card processor etc., running frequency and speed are in continuous lifting, the heat of its generation also increases thereupon, and temperature constantly raises, and is having a strong impact on the runnability and the stability of electronic component.Therefore, for improving heat dispersion, present processor is nearly all arranged in pairs or groups has corresponding heat abstractor to move under normal working temperature, thus the problem of avoiding performance to descend even burn.
The present employed overwhelming majority's heat abstractor all adopts fin as thermal component, and the end of existing fin is the heat sink of an entity, and described heat sink is directly to contact with heater element (for example central processing unit or display card processor); And, extend outward a plurality of radiating fins from described heat sink.Heat sink in this fin and radiating fin are made by mould is one-body molded, are difficult to guarantee to form uniform gap between each radiating fin, and radiating effect is comparatively undesirable; In addition, the size of fin is fixed, and can only be fit to the use of the heater element suitable with its size, can not carry out accommodation according to the different size of heater element.
In order to address the above problem, heat abstractor is improved again, as shown in Figure 1, the radiating module form (as shown in Figure 1) that improved heat abstractor is made up of fin 1, heat pipe 2, fan 3, wherein fin is the combined type fin, and it is to be combined by the identical radiating fin of a plurality of physical dimensions.Each radiating fin has vertical surface, it relative two vertically has been bent to form fitting surface in the same way, each fitting surface near two ends with fin vertical surface intersection and fitting surface overbending direction oppositely extension be provided with projection, fitting surface outer fringe position that should projection is provided with the breach that is complementary with projection.Above-mentioned some radiating fins are arranged in pairs or groups mutually to locate by its corresponding projection and breach and are rearranged the radiating fin group.
The physical dimension of each radiating fin of existing fin is all consistent, cause the air flow channel that constitutes between radiating fin and the radiating fin long and narrow, air-flow flow velocity behind the runner that enters adjacent radiating fin formation reduces rapidly, because flow velocity descends, cause the heat exchanger effectiveness of radiating fin and fluid to reduce in the runner second half section.
The utility model content
The problem that the utility model solves provides a kind of radiating fin group, fin and heat abstractor, and the heat exchanger effectiveness that prevents radiating fin and air-flow is with corresponding reduction.
For addressing the above problem, the utility model provides a kind of radiating fin group, comprises first radiating fin and second radiating fin of mutual combination, the buck plate that each first and second radiating fin includes substrate and joins with substrate; It is characterized in that, the second radiating fin substrate area is less than the first radiating fin substrate, the first radiating fin buck plate is the hierarchic structure that comprises first rank and second rank at least, the buck plate of described second radiating fin is matched with described first rank, and the substrate of described second radiating fin is positioned at the coupling place.
The utility model provides also provides a kind of fin, comprises the combination that is formed by a plurality of aforesaid radiating fins.
The utility model provides also provides a kind of heat abstractor, comprises the heat conduction substrate that contacts with heater element, heat pipe that joins with the heat conduction substrate and the fin that joins with described heat pipe.
Compared with prior art, the utlity model has following advantage: in the radiating fin group, the second radiating fin substrate area is less than the first radiating fin substrate, make in the radiating fin group and increase with the non-conterminous runner of radiator fan second half section space, can guarantee the heat exchange effect of heat pipe and fin, can effectively shorten flow channel length again, reduce the runner flow resistance, promote the flow velocity of air in runner.
Description of drawings
Fig. 1 is the structural representation of existing heat abstractor;
Fig. 2 is the example structure schematic diagram of radiating fin group provided by the utility model;
Fig. 3 is for being joined the effect schematic diagram of the fin that forms by the assembling of the radiating fin among Fig. 2;
Fig. 4 is the heat abstractor schematic diagram in one embodiment that comprises radiating fin shown in Figure 2.
The specific embodiment
The physical dimension of each radiating fin of existing fin is all consistent, cause the air flow channel that constitutes between radiating fin and the radiating fin long and narrow, air-flow flow velocity behind the runner that enters adjacent radiating fin formation reduces rapidly, because flow velocity descends, cause the heat exchanger effectiveness of radiating fin and fluid to reduce in the runner second half section.
The utility model provides a kind of radiating fin group, comprises first radiating fin and second radiating fin of mutual combination, each first and and second radiating fin buck plate that includes substrate and join with substrate; It is characterized in that, the second radiating fin substrate area is less than the first radiating fin substrate, the first radiating fin buck plate is the hierarchic structure that comprises first rank and second rank at least, the buck plate of described second radiating fin is matched with described first rank, and the substrate of described second radiating fin is positioned at the coupling place.
In the radiating fin group of the present utility model, the second radiating fin substrate area is less than the first radiating fin substrate, make in the radiating fin group and increase with the non-conterminous runner of radiator fan second half section space, can guarantee the heat exchange effect of heat pipe and fin, can effectively shorten flow channel length again, reduce the runner flow resistance, promote the flow velocity of air in runner.
Fig. 2 is the example structure schematic diagram of radiating fin group provided by the utility model.As shown in Figure 2, the radiating fin group comprises first radiating fin 20 and second radiating fin 30 that is connected with first radiating fin 20.First buck plate 202 that first radiating fin 20 includes the first fin substrate 200 and joins with the first fin substrate 200, described first buck plate 202 is that the first fin substrate, 200 relative two side ends are extended the kink that forms in the same way, 202 one-tenth hierarchic structures of first buck plate of first radiating fin 20 comprise first rank and second rank.Second buck plate 302 that second radiating fin 30 includes the second fin substrate 300 and joins with the second fin substrate 300, described second buck plate 302 are that the second fin substrate, 300 relative two side ends are extended the kink that forms in the same way.Wherein second buck plate 302 of second radiating fin 300 just in time can embed first rank of first radiating fin, 20 first buck plates 202 and the space between second rank.
In the present embodiment, the fin substrate 302 of described second radiating fin 300 along the length of air flow direction less than the length on fin substrate 202 these directions of first radiating fin 200.
Except that present embodiment, the radiating fin group can also comprise first radiating fin, second radiating fin that is connected with first radiating fin and the 3rd radiating fin that is connected with second radiating fin.Wherein first fitting surface of first radiating fin becomes hierarchic structure, described hierarchic structure comprises first rank, second rank and the 3rd rank, wherein second buck plate of second radiating fin just in time can embed first rank of first radiating fin, first buck plate and the space between second rank, and second buck plate of the 3rd radiating fin just in time can embed second rank of first radiating fin, first buck plate and the space between the 3rd rank.
In addition, the radiating fin group can also comprise first radiating fin, second radiating fin that is connected with first radiating fin, the 3rd radiating fin that is connected with second radiating fin and the hot fin that scatters that is connected with the 3rd radiating fin ....Wherein first fitting surface of first radiating fin becomes hierarchic structure, and described hierarchic structure comprises first rank, second rank, the 3rd rank and quadravalence ..., follow-up other radiating fins that are connected with first radiating fin are just in time embedded in the space of each ladder.
In the present embodiment, described fin substrate 200,300 is for having a certain size platen surface structure.Angle is near 90 degree (can be between 95 degree at 85 degree) between described fin substrate 200,300 and the buck plate 202,302.In existing manufacturing process, buck plate 202,302 and fin substrate 200,300 are made of one piece, for example by a block of metal panel through Sheet Metal Forming Technology and moulding.The material of described metal decking can adopt fine aluminium, aluminium alloy, fine copper or copper alloy.
Fig. 3 is for being joined the effect schematic diagram of the fin that forms by the assembling of the radiating fin among Fig. 2.As shown in Figure 3, in each first radiating fin 20 in first buck plate 202 and second radiating fin 30 second buck plate 302 near two ends be provided with breach 210 with the first fin substrate 200 and the second fin substrate, 300 intersections respectively, first buck plate 202 and second buck plate, 302 outer fringe positions that should breach 210 be provided with the projection 212 that is complementary with breach 210.In when assembling, in first buck plate, 202 first rank of second buck plate, 302 embeddings, first radiating fin 20 that at first will the second adjacent radiating fin 30 and the space on second rank; Second radiating fin 30 rearranges the radiating fin group in the collocation location mutually by projection 212 on its corresponding projection 212 and breach 210 and first radiating fin, first rank and breach 210; Corresponding projection 212 on projection 212 on first radiating fin, second rank and adjacent first radiating fin with another of breach 210 second rank and breach 210 be the collocation location mutually.A plurality of radiating fin groups connect to form fin A.Wherein, between adjacent two first radiating fins 20 and second radiating fin 30, be formed with runner.Not only can organize by such this kind of cooperation fin A and to unload facility, more can guarantee to form between the fitting surface of each radiating fin among the fin A and combine closely, can not produce the gap.Because the second fin substrate 302 of second radiating fin 300 is shorter than the length on the first fin substrate, 202 these directions of first radiating fin 200 along the length of air flow direction, make in the radiating fin group and increase with the non-conterminous runner of radiator fan second half section space, can guarantee the heat exchange effect of heat pipe and heat radiation, can effectively shorten flow channel length again, reduce the runner flow resistance, promote the flow velocity of air in runner.
In the present embodiment, the quantity of radiating fin group can be according to actual conditions such as heat radiation requirements, electronic equipment space size and suitably adjustment among the fin A.In addition, the area size of the first fin substrate 200 is to become positively related corresponding relation with its heat dissipation to a certain extent in first radiating fin 20, and very roughly, the area of the first fin substrate 200 is big more, and heat dissipation is just good relatively more.But in actual applications, in the first fin substrate 200 specific design of size be heat radiation is required with and the space size of applied electronic equipment carry out determining on the basis of comprehensive consideration.The second fin substrate 300 can fully guarantee that by the runner second half section space that forms the heat exchange effect of heat pipe and heat radiation is advisable along the relation of the length on the first fin substrate, 202 these directions of the length of air flow direction and first radiating fin 200 in second radiating fin 30.The size of the part that is extended outward by second buck plate 302 in first buck plate 202 in first radiating fin 20 and second radiating fin 30 is also to have certain related with its heat dissipation to a certain extent.Therefore in actual applications, to be that runner in the proportionate relationship of buck plate 202,302 and fin substrate 200,300 and formation carries out the best of heat dissipation on the basis of comprehensive consideration definite for the specific design of buck plate 202,302.
Fig. 4 is the heat abstractor schematic diagram in one embodiment that comprises radiating fin shown in Figure 2.As shown in Figure 4, described heat abstractor is to be applied in the electronic product, is used for the heater element to electronic product, and for example the central processing unit of computer is implemented heat radiation, makes that described central processing unit can safety and operation reposefully under normal working temperature.As shown in Figure 4, described heat abstractor comprises: heat conduction substrate B, heat pipe C, fin A and radiator fan E.
Heat conduction substrate B directly contacts with heater element D, for example is fitted in the back side of heater element D.The end of heat pipe C is to join with heat conduction substrate B, and the other end then is to link to each other with radiating fin group A, and in the present embodiment, heat conduction substrate B can be a metal derby, for example copper billet or aluminium block.Preferably, employing be the fine copper piece, with respect to aluminium block, the fine copper piece can faster absorption heater element moment caloric value and it is passed to heat pipe C apace.
Heat pipe C welds with heat conduction substrate B and fin A respectively mutually by tin cream, plays the effect of heat conduction.Especially, with the welding of fin A the time, heat pipe C is welded on the buck plate of each radiating fin of fin A, is to strengthen radiating effect, that part that is welded among the heat pipe C on the fin A can be designed as flat, to increase the contact area of itself and radiating fin as far as possible.
In addition, heat pipe C specifically can be the cylindricality metal tube (for example fine aluminium, aluminium alloy, fine copper or copper alloy) of hollow, and in pipe, be filled with volatile liquid (boiling point is lower), when the heat that is produced as heater element D reaches the boiling point of hydraulic fluid, hydraulic fluid is evaporated, and utilizes the evaporation process of hydraulic fluid to need a large amount of heats to dispel the heat.
Fin A is by comprising that radiating fin group that a plurality of first radiating fins and second radiating fin are formed is connected with the breach corresponding matching and is combined to form by being located at projection on each radiating fin buck plate.Wherein, first buck plate of first radiating fin becomes hierarchic structure, comprises first rank and second rank; Second buck plate of second radiating fin just in time can embed first rank of first radiating fin, first buck plate and the space between second rank, and second radiating fin rearranges the radiating fin group by corresponding projection on its second buck plate upper protruding block and breach and first radiating fin, first rank and the breach location of arranging in pairs or groups mutually.
Be formed with runner between adjacent first radiating fin and second radiating fin when a plurality of radiating fins are combined, space of formed runner second half section increases.The fin A wherein buck plate of a side is the casing that is used to be assembled to electronic product, and the buck plate of opposite side is to be used for being fitted thereon for heat pipe C.The wide footpath of described runner is consistent with the height of buck plate in the radiating fin, and therefore a plurality of runners that form each other at interval evenly.
Radiator fan E is adjacent to fin A, radiator fan E is arranged on guarantees that its air outlet can be right against the runner of fin A, produce air-flow and act on fin A by its operation, make and in each runner of fin A, form air blast, quicken the discharge of heat on each radiating fin, wherein the first radiating fin buck plate, first rank among the fin A and radiator fan are contiguous, are used to receive the air-flow that radiator fan produces.
In actual applications, the heater element D of electronic product (for example central processing unit) can produce heat when operation, described heat can be passed to the heat conduction substrate B that joins with heater element D, heat conduction substrate B is passed to heat pipe C with heat, again heat is passed to the fin A of far-end by heat pipe C, operation by radiator fan E produces air-flow and acts on fin A, makes to form air blast in each runner of fin A.Part in the air blast in each described runner can upwards climb at its deflector of air-flow guide frame effect lower edge (promptly flowing to buck plate) for heat pipe C assembling, thereby increase the flow velocity of the air-flow that closes on heat pipe C, can in runner, form local turbulence effects, promote the heat exchange effect of heat pipe C and fin A, reach the purpose of improving the heat abstractor performance.
Though the utility model with preferred embodiment openly as above; but it is not to be used for limiting the utility model; any those skilled in the art are not in breaking away from spirit and scope of the present utility model; can make possible change and modification, therefore protection domain of the present utility model should be as the criterion with the scope that the utility model claim is defined.
Claims (12)
1. radiating fin group comprises first radiating fin and second radiating fin of mutual combination, the buck plate that each first and second radiating fin includes substrate and joins with substrate; It is characterized in that, the second radiating fin substrate area is less than the first radiating fin substrate, the first radiating fin buck plate is the hierarchic structure that comprises first rank and second rank at least, the buck plate of described second radiating fin is matched with described first rank, and the substrate of described second radiating fin is positioned at the coupling place.
2. according to the described radiating fin group of claim 1, it is characterized in that, the described second radiating fin substrate along the length of air flow direction less than the length on first this direction of radiating fin substrate.
3. according to the described radiating fin group of claim 1, it is characterized in that described buck plate is that the relative both sides of fin substrate are bent to form in the same way.
4. according to the described radiating fin group of claim 3, it is characterized in that angle is 85 degree～95 degree between described substrate and the buck plate.
5. according to the described radiating fin group of claim 1, it is characterized in that the first radiating fin buck plate comprises first rank, second rank ... the hierarchic structure on N rank.
6. a fin comprises the combination that is formed as each described radiating fin group in the claim 1 to 4 by a plurality of.
7. a heat abstractor comprises the heat conduction substrate that contacts with heater element, and the heat pipe that joins with the heat conduction substrate, and radiator fan is characterized in that, also comprise the fin as claimed in claim 6 that joins with described heat pipe.
8. heat abstractor as claimed in claim 7 is characterized in that described heat pipe is the column tube of hollow, and is filled with volatile liquid in pipe.
9. heat abstractor as claimed in claim 7 is characterized in that, the material of described heat pipe is fine aluminium, aluminium alloy, fine copper or copper alloy.
10. heat abstractor as claimed in claim 7 is characterized in that, described fin and the heat pipe end of directing heat pipe concretely that joins is erected on the fitting surface of each radiating fin in the described fin.
11. heat abstractor as claimed in claim 7 is characterized in that, also comprises the radiator fan that is adjacent to described fin, is used for producing acting on radiating fin group air-flow.
12. heat abstractor as claimed in claim 7 is characterized in that, the described first radiating fin buck plate, first rank and radiator fan are contiguous, are used to receive the air-flow that radiator fan produces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920153836XU CN201476670U (en) | 2009-04-30 | 2009-04-30 | Radiating fin group, radiating fin and heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920153836XU CN201476670U (en) | 2009-04-30 | 2009-04-30 | Radiating fin group, radiating fin and heat sink |
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| Publication Number | Publication Date |
|---|---|
| CN201476670U true CN201476670U (en) | 2010-05-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920153836XU Expired - Fee Related CN201476670U (en) | 2009-04-30 | 2009-04-30 | Radiating fin group, radiating fin and heat sink |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883582A (en) * | 2011-07-15 | 2013-01-16 | 富瑞精密组件（昆山）有限公司 | Heat dissipation device |
| CN103369937A (en) * | 2013-07-26 | 2013-10-23 | 阳光电源股份有限公司 | Radiator |
| WO2015043183A1 (en) * | 2013-09-29 | 2015-04-02 | 华为技术有限公司 | Heat dissipation apparatus |
| CN105257560A (en) * | 2014-06-27 | 2016-01-20 | 台达电子工业股份有限公司 | Heat sink device |
| CN105283036A (en) * | 2015-05-05 | 2016-01-27 | 洛阳德威机电科技有限公司 | Combined-type cooling system |
| TWI576038B (en) * | 2011-07-13 | 2017-03-21 | 鴻準精密工業股份有限公司 | Heat sink |
| US11009301B2 (en) | 2014-06-27 | 2021-05-18 | Delta Electronics, Inc. | Heat dissipating fin assembly |
| US11604035B2 (en) | 2013-09-29 | 2023-03-14 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
| JP7269422B1 (en) | 2022-07-26 | 2023-05-08 | 古河電気工業株式会社 | heat sink |
-
2009
- 2009-04-30 CN CN200920153836XU patent/CN201476670U/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI576038B (en) * | 2011-07-13 | 2017-03-21 | 鴻準精密工業股份有限公司 | Heat sink |
| CN102883582A (en) * | 2011-07-15 | 2013-01-16 | 富瑞精密组件（昆山）有限公司 | Heat dissipation device |
| CN102883582B (en) * | 2011-07-15 | 2017-03-15 | 富瑞精密组件（昆山）有限公司 | Heat abstractor |
| CN103369937B (en) * | 2013-07-26 | 2016-08-10 | 阳光电源股份有限公司 | A kind of radiator |
| CN103369937A (en) * | 2013-07-26 | 2013-10-23 | 阳光电源股份有限公司 | Radiator |
| US11604035B2 (en) | 2013-09-29 | 2023-03-14 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
| WO2015043183A1 (en) * | 2013-09-29 | 2015-04-02 | 华为技术有限公司 | Heat dissipation apparatus |
| CN105257560A (en) * | 2014-06-27 | 2016-01-20 | 台达电子工业股份有限公司 | Heat sink device |
| US11009301B2 (en) | 2014-06-27 | 2021-05-18 | Delta Electronics, Inc. | Heat dissipating fin assembly |
| CN105283036A (en) * | 2015-05-05 | 2016-01-27 | 洛阳德威机电科技有限公司 | Combined-type cooling system |
| JP7269422B1 (en) | 2022-07-26 | 2023-05-08 | 古河電気工業株式会社 | heat sink |
| WO2024024763A1 (en) * | 2022-07-26 | 2024-02-01 | 古河電気工業株式会社 | Heat sink |
| JP2024016685A (en) * | 2022-07-26 | 2024-02-07 | 古河電気工業株式会社 | heat sink |
| TWI843632B (en) * | 2022-07-26 | 2024-05-21 | 日商古河電氣工業股份有限公司 | Radiator |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20160430 |