CN201476662U - Radiating fin, radiating fin group and heat sink - Google Patents
Radiating fin, radiating fin group and heat sink Download PDFInfo
- Publication number
- CN201476662U CN201476662U CN2009201538374U CN200920153837U CN201476662U CN 201476662 U CN201476662 U CN 201476662U CN 2009201538374 U CN2009201538374 U CN 2009201538374U CN 200920153837 U CN200920153837 U CN 200920153837U CN 201476662 U CN201476662 U CN 201476662U
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- radiating fin
- fin
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Abstract
The utility model relates to a radiating fin, a radiating fin group and a heat sink. The radiating fin comprises a fin substrate and an assembly plate connected with the fin substrate, the fin substrate and the assembly plate form a flow channel, and an airflow guide structure is arranged on the fin substrate and is used for guiding airflow in the flow channel. With the airflow guide structure on the fin substrate, the utility model can change the flow direction of the airflow through the airflow guide structure, and increase the airflow speed, thereby achieving better radiating effect.
Description
Technical field
The utility model relates to a kind of heat dissipation technology, particularly a kind of radiating fin, radiating fin group and heat abstractor.
Background technology
Along with electronics and information industry constantly develops, present computer processor is as central processing unit or display card processor etc., running frequency and speed are in continuous lifting, the heat of its generation also increases thereupon, and temperature constantly raises, and is having a strong impact on the runnability and the stability of electronic component.Therefore, for improving heat dispersion, present processor is nearly all arranged in pairs or groups has corresponding heat abstractor to move under normal working temperature, thus the problem of avoiding performance to descend even burn.
The present employed overwhelming majority's heat abstractor all adopts fin as thermal component, and the end of existing fin is the heat sink of an entity, and described heat sink is directly to contact with heater element (for example central processing unit or display card processor); And, extend outward a plurality of radiating fins from described heat sink.Heat sink in this fin and radiating fin are made by mould is one-body molded, are difficult to guarantee to form uniform gap between each radiating fin, and radiating effect is comparatively undesirable; In addition, the size of fin is fixed, and can only be fit to the use of the heater element suitable with its size, can not carry out accommodation according to the different size of heater element.
In order to address the above problem, heat abstractor is improved again, as shown in Figure 1, the radiating module form (as shown in Figure 1) that improved heat abstractor is made up of fin 1, heat pipe 2, fan 3, wherein fin is the combined type fin, and it is to be combined by the identical radiating fin of a plurality of physical dimensions.Each radiating fin has the fin substrate, it relative two vertically has been bent to form buck plate in the same way, each fitting surface near two ends with fin vertical surface intersection and fitting surface overbending direction oppositely extension be provided with projection, fitting surface outer fringe position that should projection is provided with the breach that is complementary with projection.Above-mentioned some radiating fins are arranged in pairs or groups mutually to locate by its corresponding projection and breach and are rearranged the radiating fin group.
Constitute long and narrow air flow channel in the radiating fin group of existing assembling between fin and the fin, air-flow has quite high flow velocity when entering the runner of adjacent radiating fin formation, but enter behind the runner owing to the viscous effect that air and fin surface form, long and narrow runner cause reasons such as flow resistance increase, the flow velocity of air can reduce rapidly, because flow velocity descends, the heat exchanger effectiveness of radiating fin and air-flow is with corresponding reduction in the runner second half section.
The utility model content
The problem that the utility model solves provides a kind of radiating fin, radiating fin group and heat abstractor, and the heat exchanger effectiveness that prevents radiating fin and air-flow is with corresponding reduction.
For addressing the above problem, the utility model provides a kind of radiating fin, comprising: fin substrate, the buck plate that joins with the fin substrate, described fin substrate and buck plate formation runner, be located on the described fin substrate air-flow guide frame that air-flow in the runner is led.
The utility model also provides a kind of radiating fin group, comprises the combination that is formed by a plurality of aforesaid radiating fins.
The utility model also provides a kind of heat abstractor, comprises the heat conduction substrate that contacts with heater element, heat pipe that joins with the heat conduction substrate and the radiating fin group of joining with described heat pipe.
Compared with prior art, the utlity model has following advantage: on the fin substrate, be provided with the air-flow guide frame, can change air flow direction, accelerate and the interior air-flow velocity of heat pipe contact-making surface runner, obtain better radiating effect by described air-flow guide frame.
Further, because the air-flow guide frame comprises deflector, and deflector and buck plate constitute the angle of inclination that can steering current flows to, flow resistance when deflector can reduce air-flow and climbs, and when air-flow entered the runner that forms between radiating fin group and adjacent radiating fin, a part of air-flow can upwards climb along deflector, formed local turbulence effects, thereby strengthen air-flow velocity, promote the heat exchange effect of heat pipe and radiating fin near the heat conduction pipe end.
Description of drawings
Fig. 1 is the structural representation of existing heat abstractor;
Fig. 2 is the first example structure schematic diagram of radiating fin provided by the utility model;
Fig. 3 is the structural representation of the fin substrate of the radiating fin among Fig. 2;
Fig. 4 is the effect schematic diagram that is assembled the radiating fin group that forms by the radiating fin among Fig. 2;
Fig. 5 is the second example structure schematic diagram of radiating fin provided by the utility model;
Fig. 6 is the heat abstractor schematic diagram in one embodiment that comprises radiating fin shown in Figure 2.
The specific embodiment
The air flow channel that constitutes between each radiating fin of existing fin is long and narrow, and air-flow flow velocity behind the runner that enters the adjacent fin formation reduces rapidly, because flow velocity descends, causes the heat exchanger effectiveness of fin and fluid to reduce in the runner second half section.
The utility model provides a kind of radiating fin, comprising:: fin substrate, the buck plate that joins with the fin substrate, described fin substrate and buck plate formation runner are located on the described fin substrate, the air-flow guide frame that air-flow in the runner is led.
The utility model can change air flow direction by described air-flow guide frame owing to be provided with the air-flow guide frame on the fin substrate, accelerates air-flow velocity, obtains better radiating effect.
Below in conjunction with accompanying drawing specific embodiment of the utility model is elaborated.
Fig. 2 is the first example structure schematic diagram of radiating fin provided by the utility model.As shown in Figure 2, the buck plate 202 that radiating fin 20 includes fin substrate 200 and joins with fin substrate 200, described buck plate 202 extends the kink that forms in the same way for fin substrate 200 relative two side ends.Radiating fin 20 also comprises air-flow guide frame 205, is positioned at the fin real estate to buck plate one side, and wherein the shape of air-flow guide frame 205 can be arc or shaped form or linear or stairstepping etc., air-flow guide frame 205 preferred arcs in the present embodiment.
In the present embodiment, air-flow guide frame 205 comprises installing plate 206 and deflector 204, when assembling installing plate 206 be connected by syndeton with fin substrate 200.202 one-tenth certain angles of inclination of deflector 204 and buck plate can guide to air-flow the wherein buck plate 202 of a side, and corresponding raising air-flow velocity.Wherein, the radian of described air-flow guide frame 205 and length and deflector 204 all can exert an influence to air-flow velocity with the angle of inclination of buck plate 202.Specifically, the length of described air-flow guide frame 205 is long more, and the effect of its water conservancy diversion is just good more.And deflector 204 and buck plate 202 general requirements are good at 30 degree between 60 degree.
In the present embodiment, described fin substrate 200 is for having a certain size platen surface structure.Angle is near 90 degree (can be between 95 degree at 85 degree) between described fin substrate 200 and the buck plate 202.In existing manufacturing process, buck plate 202 is made of one piece with fin substrate 200, for example by a block of metal panel through Sheet Metal Forming Technology and moulding.The material of described metal decking can adopt fine aluminium, aluminium alloy, fine copper or copper alloy.
Fig. 3 is the structural representation of the fin substrate of the radiating fin among Fig. 2, as shown in Figure 3, also is provided with the installing hole 203 that runs through fin substrate 200 thickness in the fin substrate 200 of described radiating fin.
Accordingly, in order to be connected, be formed with the erection column corresponding on the installing plate of air-flow guide frame with installing hole 203 on the fin substrate 200 with fin substrate 200.
In the present embodiment, installing hole 203 can be screw or draw-in groove etc.If installing hole 203 is screws, what form on the installing plate of air-flow guide frame and fin substrate 200 contact-making surfaces is bolt, and bolt passes screw air-flow guide frame and fin substrate are firmly installed.
If installing hole 203 is draw-in grooves, what form on the installing plate of air-flow guide frame is buckle, and described buckle can comprise connecting portion and the clamping part that is arranged on the connecting portion.Connecting portion is on installing plate and fin substrate 200 contact-making surfaces.Clamping part is formed in the apical margin of connecting portion, is used for cooperating with fin substrate 200 draw-in grooves, realizes engaging.
Fig. 4 is the effect schematic diagram that is assembled the radiating fin group that forms by the radiating fin among Fig. 2.As shown in Figure 4, when assembling, at first adjacent two radiating fins 20 are roughly alignd; Buck plate 202 close two ends is provided with breach 210 with fin substrate 200 intersections in each radiating fin 20; Buck plate 202 outer fringe positions that should breach 210 are provided with the projection 212 that is complementary with breach 210.Some radiating fins rearrange radiating fin group A in the collocation location mutually by its corresponding projection 212 and breach 210, and are formed with runner between adjacent two radiating fins 20.Not only can organize by such this kind of cooperation radiating fin group A and to unload facility, more can guarantee to form between the fitting surface of each radiating fin among the radiating fin group A and combine closely, can not produce the gap.Even for the flow velocity that makes air-flow in each runner, be formed with air-flow guide frame 205 on the fin substrate 200 of each radiating fin 20.
In the present embodiment, the quantity of radiating fin 20 can be according to actual conditions such as heat radiation requirements, electronic equipment space size and suitably adjustment among the radiating fin group A.In addition, the area size of fin substrate 200 is to become positively related corresponding relation with its heat dissipation to a certain extent in the radiating fin 20, and very roughly, the area of fin substrate 200 is big more, and heat dissipation is just good relatively more.But in actual applications, in the fin substrate 200 specific design of size be heat radiation is required with and the space size of applied electronic equipment carry out determining on the basis of comprehensive consideration.The size of the part that extends outward in the buck plate 202 in the radiating fin 20 is also to have certain related with its heat dissipation to a certain extent.Therefore in actual applications, the specific design of buck plate 202 is that runner in the proportionate relationship of buck plate 202 and fin substrate 200 and formation carries out the best of heat dissipation determining on the basis of comprehensive consideration.
Fig. 5 is the second example structure schematic diagram of radiating fin provided by the utility model.As shown in Figure 5, radiating fin 30 buck plate 302 that includes fin substrate 300 and join with fin substrate 300.Described buck plate 302 extends the kink that forms in the same way for fin substrate 300 relative two side ends.Radiating fin 30 also comprises air-flow guide frame 304, is positioned at fin substrate 300 towards buck plate one side.
In the present embodiment, air-flow guide frame 304 is directly sheared by fin substrate 300 and the bending back forms the arc tabs.Described arc tabs has relative extrados and intrados, and wherein, described extrados is the inlet corresponding to runner.The curve of described arc tabs is streamlined, the flow resistance in the time of reducing air-flow and climb.When air-flow entered the runner that forms between radiating fin, a part of air-flow wherein can upwards climb along tabs, thereby improved the flow velocity of air-flow.
Fig. 6 is the heat abstractor schematic diagram in one embodiment that comprises radiating fin group shown in Figure 2.As shown in Figure 6, described heat abstractor is to be applied in the electronic product, is used for the heater element to electronic product, and for example the central processing unit of computer is implemented heat radiation, makes that described central processing unit can safety and operation reposefully under normal working temperature.As shown in Figure 6, described heat abstractor comprises: heat conduction substrate B, heat pipe C, radiating fin group A and radiator fan E.
Heat conduction substrate B directly contacts with heater element D, for example is fitted in the back side of heater element D.The end of heat pipe C is to join with heat conduction substrate B, and the other end then is to link to each other with radiating fin group A, and in the present embodiment, heat conduction substrate B can be a metal derby, for example copper billet or aluminium block.Preferably, employing be the fine copper piece, with respect to aluminium block, the fine copper piece can faster absorption heater element moment caloric value and it is passed to heat pipe C apace.
Heat pipe C welds with heat conduction substrate B and radiating fin group A respectively mutually by tin cream, plays the effect of heat conduction.Especially, with the welding of radiating fin group A the time, heat pipe C is welded on the buck plate of each radiating fin of radiating fin group A, for strengthening radiating effect, that part that is welded among the heat pipe C on the radiating fin group A can be designed as flat, to increase the contact area of itself and radiating fin as far as possible.
In addition, heat pipe C specifically can be the cylindricality metal tube (for example fine aluminium, aluminium alloy, fine copper or copper alloy) of hollow, and in pipe, be filled with volatile liquid (boiling point is lower), when the heat that is produced as heater element D reaches the boiling point of hydraulic fluid, hydraulic fluid is evaporated, and utilizes the evaporation process of hydraulic fluid to need a large amount of heats to dispel the heat.
Radiating fin group A is connected with the breach corresponding matching and is combined to form by being located at projection on the buck plate by a plurality of radiating fins that include fin substrate and buck plate, when a plurality of radiating fins are combined, be formed with runner between the adjacent radiating fin, in each runner, all include the air-flow guide frame of being located on the fin substrate.The radiating fin group A wherein buck plate of a side is the casing that is used to be assembled to electronic product, and the buck plate of opposite side is to be used for being fitted thereon for heat pipe C.The wide footpath of described runner is consistent with the height of buck plate in the radiating fin, and therefore a plurality of runners that form each other at interval evenly.
Radiator fan E is adjacent to radiating fin group A, preferably, radiator fan E can be arranged on and guarantee that its air outlet can be right against the runner of radiating fin group A, produce air-flow and act on radiating fin group A by its operation, make in each runner of radiating fin group A, to form air blast, quicken the discharge of heat on each radiating fin.
In actual applications, the heater element D of electronic product (for example central processing unit) can produce heat when operation, described heat can be passed to the heat conduction substrate B that joins with heater element D, heat conduction substrate B is passed to heat pipe C with heat, again heat is passed to the radiating fin group A of far-end by heat pipe C, operation by radiator fan E produces air-flow and acts on radiating fin group A, makes to form air blast in each runner of radiating fin group A.Part in the air blast in each described runner can upwards climb at its deflector of air-flow guide frame effect lower edge (promptly flowing to buck plate) for heat pipe C assembling, thereby increase the flow velocity of the air-flow that closes on heat pipe C, can in runner, form local turbulence effects, promote the heat exchange effect of heat pipe C and radiating fin group A, reach the purpose of improving the heat abstractor performance.
Though the utility model with preferred embodiment openly as above; but it is not to be used for limiting the utility model; any those skilled in the art are not in breaking away from spirit and scope of the present utility model; can make possible change and modification, therefore protection domain of the present utility model should be as the criterion with the scope that the utility model claim is defined.
Claims (11)
1. radiating fin, comprise the fin substrate, with the buck plate that the fin substrate joins, described fin substrate and buck plate formation runner is characterized in that, also comprise and being located on the described fin substrate, the air-flow guide frame that air-flow in the runner is led.
2. according to the described radiating fin of claim 1, it is characterized in that described air-flow guide frame comprises deflector and is suitable for deflector is mounted to the installing plate of fin substrate.
3. according to claim 1 or 2 described radiating fins, it is characterized in that described air-flow guide frame is arc or shaped form or linear or stairstepping.
4. according to the described radiating fin of claim 1, it is characterized in that described air-flow guide frame is directly sheared and is bent to form by the fin substrate.
5. according to the described radiating fin of claim 2, it is characterized in that described deflector has the angle of inclination that can steering current flows to respect to buck plate.
6. according to the described radiating fin of claim 1, it is characterized in that described buck plate is that the relative both sides of fin substrate are bent to form in the same way.
7. a radiating fin group comprises the combination that is formed as each described radiating fin in the claim 1 to 6 by a plurality of.
8. a heat abstractor comprises the heat conduction substrate that contacts with heater element, and the heat pipe with the heat conduction substrate joins is characterized in that, also comprises the radiating fin group as claimed in claim 7 of joining with described heat pipe.
9. heat abstractor as claimed in claim 8 is characterized in that, described radiating fin group and the heat pipe end that instructs heat pipe that joins is erected on the fitting surface of each radiating fin in the described radiating fin group.
10. heat abstractor as claimed in claim 9 is characterized in that, in described heat pipe with the radiating fin group in the fitting surface of each radiating fin part of joining be flat.
11. heat abstractor as claimed in claim 8 is characterized in that, also comprises the radiator fan that is adjacent to described radiating fin group, is used to produce the air-flow that acts on the radiating fin group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201538374U CN201476662U (en) | 2009-04-30 | 2009-04-30 | Radiating fin, radiating fin group and heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201538374U CN201476662U (en) | 2009-04-30 | 2009-04-30 | Radiating fin, radiating fin group and heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201476662U true CN201476662U (en) | 2010-05-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201538374U Expired - Fee Related CN201476662U (en) | 2009-04-30 | 2009-04-30 | Radiating fin, radiating fin group and heat sink |
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| CN (1) | CN201476662U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102345993A (en) * | 2011-08-26 | 2012-02-08 | 陈志明 | Liquid-evaporation-type heat radiator and manufacturing method thereof |
| WO2015043183A1 (en) * | 2013-09-29 | 2015-04-02 | 华为技术有限公司 | Heat dissipation apparatus |
| US20150090435A1 (en) * | 2013-09-29 | 2015-04-02 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
| CN106288879A (en) * | 2016-09-23 | 2017-01-04 | 佛山神威热交换器有限公司 | A kind of spiral baffle heat exchanger |
| CN108260324A (en) * | 2016-12-28 | 2018-07-06 | 仁宝电脑工业股份有限公司 | Electronic assembly |
| CN109891177A (en) * | 2016-10-27 | 2019-06-14 | 林德股份公司 | Heat-exchangers of the plate type |
| CN114518045A (en) * | 2020-11-18 | 2022-05-20 | 山东大学 | Condenser loop heat pipe with linear drainage component |
| CN116033704A (en) * | 2022-05-31 | 2023-04-28 | 荣耀终端有限公司 | Heat dissipation module and electronic equipment |
| CN114518046B (en) * | 2020-11-18 | 2024-05-17 | 山东大学 | Drainage component condenser loop heat pipe |
-
2009
- 2009-04-30 CN CN2009201538374U patent/CN201476662U/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102345993A (en) * | 2011-08-26 | 2012-02-08 | 陈志明 | Liquid-evaporation-type heat radiator and manufacturing method thereof |
| WO2015043183A1 (en) * | 2013-09-29 | 2015-04-02 | 华为技术有限公司 | Heat dissipation apparatus |
| US20150090435A1 (en) * | 2013-09-29 | 2015-04-02 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
| CN104519713A (en) * | 2013-09-29 | 2015-04-15 | 华为技术有限公司 | Heat dissipation device |
| CN104519713B (en) * | 2013-09-29 | 2017-08-25 | 华为技术有限公司 | Heat abstractor |
| US11604035B2 (en) | 2013-09-29 | 2023-03-14 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
| CN106288879A (en) * | 2016-09-23 | 2017-01-04 | 佛山神威热交换器有限公司 | A kind of spiral baffle heat exchanger |
| CN106288879B (en) * | 2016-09-23 | 2018-05-08 | 佛山神威热交换器有限公司 | A kind of spiral baffle heat exchanger |
| CN109891177A (en) * | 2016-10-27 | 2019-06-14 | 林德股份公司 | Heat-exchangers of the plate type |
| CN108260324B (en) * | 2016-12-28 | 2020-04-21 | 仁宝电脑工业股份有限公司 | Electronic device |
| CN108260324A (en) * | 2016-12-28 | 2018-07-06 | 仁宝电脑工业股份有限公司 | Electronic assembly |
| CN114518045A (en) * | 2020-11-18 | 2022-05-20 | 山东大学 | Condenser loop heat pipe with linear drainage component |
| CN114518045B (en) * | 2020-11-18 | 2023-09-29 | 山东大学 | Linear drainage component condenser loop heat pipe |
| CN114518046B (en) * | 2020-11-18 | 2024-05-17 | 山东大学 | Drainage component condenser loop heat pipe |
| CN116033704A (en) * | 2022-05-31 | 2023-04-28 | 荣耀终端有限公司 | Heat dissipation module and electronic equipment |
| CN116033704B (en) * | 2022-05-31 | 2023-11-24 | 荣耀终端有限公司 | Heat dissipation module and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20160430 |