CN201450003U - Chip packaging lug structure with flexible convex pad - Google Patents
Chip packaging lug structure with flexible convex pad Download PDFInfo
- Publication number
- CN201450003U CN201450003U CN 200920045309 CN200920045309U CN201450003U CN 201450003 U CN201450003 U CN 201450003U CN 200920045309 CN200920045309 CN 200920045309 CN 200920045309 U CN200920045309 U CN 200920045309U CN 201450003 U CN201450003 U CN 201450003U
- Authority
- CN
- China
- Prior art keywords
- chip
- convex pad
- flexible convex
- transition zone
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a chip packaging lug structure with a flexible convex pad, belonging to the technical field of the chip packaging, and comprising a chip body (1), a chip electrode (2), a chip surface protecting layer (3), the flexible convex pad (4), a transition layer (5) and a solder ball (6). The chip electrode (2) is embedded in the chip body (1), the chip surface protecting layer (3) is compounded on the surface of the chip body (1) and at the periphery of the surface of the chip electrode (2), and the middle part of the surface of the chip electrode (2) is exposed out of the chip surface protecting layer (3). The flexible convex pad (4) is arranged at the middle part of the surface of the chip electrode (2) and on the surface of the chip surface protecting layer (3) at a joint position of the middle part of the surface of the chip electrode (2) and the flexible convex pad. The transition layer (5) is compounded on the flexible convex pad (4). The solder ball (6) protrudes upwards and is arranged on the transitional layer (5). The chip packaging lug structure with the flexible convex pad has functions of absorbing and alleviating the stress without influencing the electrical property.
Description
(1) technical field
The utility model relates to a kind of chip encapsulating lug structure of flexible convex pad.Belong to the chip encapsulation technology field.
(2) background technology
Along with the development of chip encapsulation technology, the chip packaging lug of numerous species has appearred, as soldered ball projection, copper post projection etc.
The structure of this class encapsulating lug has such characteristics: being that thickness is the barrier layer and the Seed Layer of hundreds of nanometers on the chip electrode, is several microns to tens of microns electroplated metal layer on barrier layer and the Seed Layer, is soldered ball on the electroplated metal layer.This class chip packaging lug all forms basically successively by the following method: splash-proofing sputtering metal barrier layer and Seed Layer on chip, on Seed Layer, apply photoresist, on photoresist, leave window, in the photoresist opening, form electroplated metal layer by the mode of electroplating, remove barrier layer and Seed Layer under photoresist and the photoresist, on electroplated metal layer, form soldered ball then.
The structure of this class projection and generation type cause the problem of two aspects:
(1) chip opposing stress ability
Projection has bigger rigidity on the whole, and when being subjected to stress, barrier layer, Seed Layer and electroplated metal layer all are difficult to absorb gentle blow stress by deformation, cause easily chip lug or chip internal the fracture and lost efficacy.
(2) complex process
Owing to need use the projection electroplating technology, increase the complexity of whole projection technology.
(3) summary of the invention
The utility model is to overcome above-mentioned deficiency, and a kind of chip encapsulating lug structure of flexible convex pad with preferable opposing stress ability is provided.
The purpose of this utility model is achieved in that a kind of chip encapsulating lug structure of flexible convex pad; described structure comprises the chip body; chip electrode; the chip surface protective layer; the flexible convex pad; transition zone and soldered ball; described chip electrode is embedded on the chip body; the chip surface protective layer is compounded in chip body surface and neighboring, chip electrode surface; and the mid portion exposed chip sealer on chip electrode surface; described flexible convex pad be arranged at described chip electrode surface mid portion and with the chip surface protective layer surface of the mid portion joint place on described chip electrode surface; described transition zone is compound on the flexible convex pad, and described soldered ball is protruding upward to be arranged on the transition zone.
The beneficial effects of the utility model are:
1, good reliability
Since with the wafer junction be the flexible convex pad, do the time spent when being subjected to do not match power or external force of heat, the flexible convex pad works to absorb gentle blow stress, just helps whole packaging body to possess higher resisting temperature circulation and anti-drop ability, thereby has better reliability.
2, technology is simple relatively
Need use when making the soldered ball projection with copper post projection usually and electroplate and relevant pre-treating technology, the control relative complex; The protruding pad encapsulating lug structure of the novel flexible that the utility model proposes does not need to electroplate and relevant pre-treating technology, thereby makes whole technology obtain simplifying.
(4) description of drawings
Fig. 1 partly coats the flexible convex pad for transition zone of the present utility model, and soldered ball all coats the transition zone schematic diagram.
Fig. 2 all coats the flexible convex pad for transition zone of the present utility model, and soldered ball all coats the transition zone schematic diagram.
Fig. 3 all coats the flexible convex pad for transition zone of the present utility model, and soldered ball partly coats the transition zone schematic diagram.
Among the figure: chip body 1, chip electrode 2, chip surface protective layer 3, flexible convex pad 4, transition zone 5, soldered ball 6.
(5) embodiment
The utility model chip encapsulating lug structure of flexible convex pad mainly is made up of chip body 1, chip electrode 2, chip surface protective layer 3, flexible convex pad 4, transition zone 5 and soldered ball 6.Described chip electrode 2 is embedded on the chip body 1; chip surface protective layer 3 is compounded in chip body 1 surface and chip electrode 2 surperficial neighborings; and the mid portion exposed chip sealer 3 on chip electrode 2 surfaces; described flexible convex pad 4 be arranged at described chip electrode 2 surfaces mid portion and with chip surface protective layer 3 surfaces of the mid portion joint place on described chip electrode 2 surfaces; described transition zone 5 is compound on the flexible convex pad 4, described soldered ball 6 protruding upward being arranged on the transition zone 5.
Described transition zone 5 all or part of flexible convex pad 4 surfaces that are coated on.
Described soldered ball 6 all or part of transition zone 5 surfaces that are coated on.
Described flexible convex pad 4 is the conducing composite material of matrix for conducting polymer composite or with the macromolecular material.
Described flexible convex pad 4 thickness are at 1 μ m～200 μ m.
Described transition zone 5 is individual layer or multiple layer metal material.
Described transition zone 5 thickness are at 0.01 μ m～100 μ m.
Its implementation procedure is:
With flexible convex pad 4 be arranged at described chip electrode 2 surfaces mid portion and with chip surface protective layer 3 surfaces of the mid portion joint place on described chip electrode 2 surfaces; then transition zone 5 is compound on the flexible convex pad 4; at last with soldered ball 6 protruding upward being arranged on the transition zone 5
Described flexible convex pad 4 can be realized by dual mode:
One, at chip surface protective layer 3 and chip electrode 2 exposed chip sealers 3 place's coating flexible material; then successively by exposure, develop and solidify, make the selectable fixed chip electrode of flexible material (2) surface mid portion and with chip surface protective layer 3 surfaces of the mid portion joint place on described chip electrode 2 surfaces.
(2), by the method for some glue and curing, make the selectable fixed chip electrode of flexible material 2 surfaces mid portion and with chip surface protective layer 3 surfaces of the mid portion joint place on described chip electrode 2 surfaces.
Described transition zone 5 can be realized by this mode: after the flexible convex pad is finished, the method of utilizing sputter or evaporation is at chip surface protective layer 3 and described one or more layers metal of flexible convex pad 4 surface depositions, and these metals deposited layers can be one or more of titanium, titanium tungsten, vanadium, nickel, copper, gold and other metal; Remove unnecessary metal by the method that applies photoresist, exposure, development, etching, remove photoresist then, keep the intermediate metal on the flexible convex pad.Described soldered ball 6 can be realized by prefluxing, the method for planting ball, backflow, also can realize by the method for printing soldering paste, backflow.
Claims (7)
1. chip encapsulating lug structure of flexible convex pad; it is characterized in that described structure comprises chip body (1); chip electrode (2); chip surface protective layer (3); flexible convex pad (4); transition zone (5) and soldered ball (6); described chip electrode (2) is embedded on the chip body (1); chip surface protective layer (3) is compounded in chip body (1) surface and the surperficial neighboring of chip electrode (2); and the mid portion exposed chip sealer (3) on chip electrode (2) surface; described flexible convex pad (4) be arranged at described chip electrode (2) surface mid portion and with chip surface protective layer (3) surface of the mid portion joint place on described chip electrode (2) surface; described transition zone (5) is compound on the flexible convex pad (4), and described soldered ball (6) is protruding upward to be arranged on the transition zone (5).
2. a kind of chip encapsulating lug structure of flexible convex pad according to claim 1 is characterized in that all or part of flexible convex pad (4) surface that is coated on of described transition zone (5).
3. a kind of chip encapsulating lug structure of flexible convex pad according to claim 1 and 2 is characterized in that all or part of transition zone (5) surface that is coated on of described soldered ball (6).
4. according to claim 1,2 or 3 described a kind of chip encapsulating lug structure of flexible convex pad, it is characterized in that described flexible convex pad (4) is the conducing composite material of matrix for conducting polymer composite or with the macromolecular material.
5. according to claim 1,2 or 3 described a kind of chip encapsulating lug structure of flexible convex pad, it is characterized in that described flexible convex pad (4) thickness is at 1 μ m～200 μ m.
6. according to claim 1,2 or 3 described a kind of chip encapsulating lug structure of flexible convex pad, it is characterized in that described transition zone (5) is individual layer or multiple layer metal material.
7. according to claim 1,2 or 3 described a kind of chip encapsulating lug structure of flexible convex pad, it is characterized in that described transition zone (5) thickness is at 0.01 μ m～100 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920045309 CN201450003U (en) | 2009-05-14 | 2009-05-14 | Chip packaging lug structure with flexible convex pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920045309 CN201450003U (en) | 2009-05-14 | 2009-05-14 | Chip packaging lug structure with flexible convex pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201450003U true CN201450003U (en) | 2010-05-05 |
Family
ID=42554726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920045309 Expired - Lifetime CN201450003U (en) | 2009-05-14 | 2009-05-14 | Chip packaging lug structure with flexible convex pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201450003U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017219330A1 (en) * | 2016-06-23 | 2017-12-28 | 彭鹏 | Flexible electrode |
-
2009
- 2009-05-14 CN CN 200920045309 patent/CN201450003U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017219330A1 (en) * | 2016-06-23 | 2017-12-28 | 彭鹏 | Flexible electrode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100505 |
|
| CX01 | Expiry of patent term |