CN201435870Y - Printed circuit board with tin windows - Google Patents
Printed circuit board with tin windows Download PDFInfo
- Publication number
- CN201435870Y CN201435870Y CN2009201319470U CN200920131947U CN201435870Y CN 201435870 Y CN201435870 Y CN 201435870Y CN 2009201319470 U CN2009201319470 U CN 2009201319470U CN 200920131947 U CN200920131947 U CN 200920131947U CN 201435870 Y CN201435870 Y CN 201435870Y
- Authority
- CN
- China
- Prior art keywords
- tin
- circuit board
- printed circuit
- window
- windows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a printed circuit board with tin windows, which comprises a substrate and a copper sheet line (1) which is laid on the substrate. The printed circuit board is characterizedby further comprising a plurality of rectangular tin windows (2) which are disposed on the copper sheet line (1) and have the length direction perpendicular to the welding direction of a wave crest.Compared with the prior art, the printed circuit board improves current carrying capacity and strengthens radiating effect. By altering the width of each tin window so as to lead tin quantity of the tin windows to be controlled conveniently, the printed circuit board is enabled to be applied to occasions with different requirements for radiation and current carrying.
Description
Technical field
The utility model relates to the electromagnetism components and parts, relates in particular to a kind of printed circuit board (PCB) with the tin window.
Background technology
Application at electron trade printed circuit board (PCB) (PCB) is quite universal, is used widely in various electrical equipment as the support plate of circuit.Present printed circuit board (PCB), in order to improve current capacity and to strengthen radiating effect, on the copper sheet circuit that needs are arranged, open round (some type) tin window or large tracts of land tin window, this structure has the following disadvantages: 1, round tin window is after wave soldering, if tin window density is excessive, tin window point connects tin easily; If tin window density is too small, tin window tin sticky quantity not sufficient, radiating effect is undesirable, and current capacity promotes limited.2, large tracts of land tin window can leave Xi Chuanchu and cause heap tin situation after wave soldering behind tin stove crest, makes the tin face thickness at the place of windowing unbalanced, and the height disunity influences follow-up assembling.
The utility model content
The utility model is to solve the above-mentioned deficiency of prior art, designs that a kind of current capacity is strong, good heat dissipation effect, tin face thickness be uniformly with the printed circuit board (PCB) of tin window.
For solveing the technical problem, the technical scheme that the utility model proposes is: a kind of printed circuit board (PCB) with the tin window comprises substrate, the copper sheet circuit on the substrate that is laid in, be arranged on a plurality of rectangle tin windows on the copper sheet circuit, described tin window length direction is vertical with the wave soldering direction.
The length of side of described tin window is 1.5 millimeters to 5 millimeters, and the minimum range between the adjacent tin window edge is 1 millimeter.
The disclosed a kind of printed circuit board (PCB) of the utility model with the tin window, the tin window is a rectangle, its length direction is vertical with the wave soldering direction.Compared with prior art, this printed circuit board (PCB) has improved current capacity, has strengthened radiating effect.Control tin amount on the tin window easily by the width of revising the tin window, make this printed circuit board (PCB) can be applied to heat radiation and current-carrying are had the place of different requirements.
Description of drawings
Below in conjunction with drawings and Examples the utility model is made detailed explanation, wherein:
Fig. 1 is a traditional printing circuit board schematic diagram;
Fig. 2 is the utility model printed circuit board (PCB) schematic diagram.
Embodiment
Fig. 1 shows the traditional printing circuit board, and as can be seen from the figure traditional printing circuit board tin window is round tin window 3 or large tracts of land tin window 4.Round tin window 3 is after wave soldering, if tin window 3 density are excessive, tin window point 3 connects tin easily; If tin window 3 density are too small, tin window 3 tin sticky quantity not sufficients, radiating effect is undesirable, and current capacity promotes limited.Large tracts of land tin window 4 can leave Xi Chuanchu and cause heap tin situation after wave soldering behind tin stove crest, make the tin face thickness of tin window 4 unbalanced, and the height disunity influences follow-up assembling.
Fig. 2 shows the utility model printed circuit board (PCB), as can be seen from the figure printed circuit board (PCB) comprises substrate, be laid in copper sheet circuit 1 on the substrate is arranged on a plurality of rectangle tin windows 2 on the copper sheet circuit 1, and tin window 2 length directions are vertical with wave soldering direction (promptly advancing the plate direction).Four-headed arrow indicates the wave soldering direction among the figure.Preferably, the length of side of tin window 2 is 1.5 millimeters to 5 millimeters, and the minimum range between adjacent tin window 2 edges is 1 millimeter.Like this when pcb board when crossing wave soldering, because the length direction of tin window 2 is vertical with the wave soldering direction, crest in the tin stove can contact the long limit of tin window 2 simultaneously, can break away from another long limit of this tin window when breaking away from again simultaneously, can guarantee the tin amount equilibrium on the whole piece Xi Dao.Distance between adjacent tin window 2 edges is more than 1 millimeter, can guarantee wave soldering after each tin window 2 do not connect tin.When pcb board being had different heat radiation requirements and current capacity requirement, can realize easily by the length of side of revising the tin window.By this, the utility model printed circuit board (PCB) has been realized tin amount equilibrium on the tin window, and the unanimity of physical height has good heat radiation and current capacity.
Better embodiment of the present utility model has more than been described, but the those of skill in the art in the present technique field are to be understood that, these only illustrate, and can make numerous variations or modification to these execution modes, and not deviate from principle of the present utility model and essence.All fall within the scope of the utility model protection.
Claims (2)
1, a kind of printed circuit board (PCB) with the tin window, comprise substrate, be laid in copper sheet circuit (1) on the substrate, it is characterized in that also comprising: be arranged on a plurality of rectangle tin windows (2) on the copper sheet circuit (1), described tin window (2) length direction is vertical with the wave soldering direction.
2, printed circuit board (PCB) as claimed in claim 1 is characterized in that: the length of side of described tin window (2) is 1.5 millimeters to 5 millimeters, and the minimum range between adjacent tin window (2) edge is 1 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201319470U CN201435870Y (en) | 2009-05-22 | 2009-05-22 | Printed circuit board with tin windows |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201319470U CN201435870Y (en) | 2009-05-22 | 2009-05-22 | Printed circuit board with tin windows |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201435870Y true CN201435870Y (en) | 2010-03-31 |
Family
ID=42054683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201319470U Expired - Lifetime CN201435870Y (en) | 2009-05-22 | 2009-05-22 | Printed circuit board with tin windows |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201435870Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469695A (en) * | 2010-10-29 | 2012-05-23 | 海尔集团公司 | Printed circuit board, tinning line thereof and tinning method thereof |
-
2009
- 2009-05-22 CN CN2009201319470U patent/CN201435870Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469695A (en) * | 2010-10-29 | 2012-05-23 | 海尔集团公司 | Printed circuit board, tinning line thereof and tinning method thereof |
| CN102469695B (en) * | 2010-10-29 | 2016-09-21 | 海尔集团公司 | Printed circuit board (PCB) and tining circuit thereof and tining method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100331 |
|
| CX01 | Expiry of patent term |