CN202009541U - Tin window structure of grounding hole of printed circuit board (PCB) - Google Patents
Tin window structure of grounding hole of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN202009541U CN202009541U CN201120128646XU CN201120128646U CN202009541U CN 202009541 U CN202009541 U CN 202009541U CN 201120128646X U CN201120128646X U CN 201120128646XU CN 201120128646 U CN201120128646 U CN 201120128646U CN 202009541 U CN202009541 U CN 202009541U
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- CN
- China
- Prior art keywords
- tin
- pcb
- circuit board
- printed circuit
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a tin window structure of a grounding hole of a printed circuit board (PCB). The tin window structure comprises the grounding hole arranged on the PCB and a solder pad arranged around the grounding hole, wherein the solder pad is provided with a stripe-shaped tin solder, and the direction of a tin solder strip on the solder pad and the direction of wave soldering are tilted so as to form an angle. The tin window structure of the grounding hole of the PCB has the characteristics of balanced quantity of tin on the solder pad of the grounding hole after the wave soldering, consistent physical height and good grounding performance.
Description
Technical field
The utility model relates to printed circuit board (PCB), and what relate in particular to a kind of printed circuit board ground hole opens the tin window
Structure.
Background technology
Application at electron trade printed circuit board (PCB) (PCB) is quite universal, is used widely in various electrical equipment as the support plate of circuit.For electrical equipment and personal safety, all useful screw hole protective earthing on a lot of printed circuit board (PCB)s.The screw hole ground connection of present single-clad board, for the energy good earth, the pad in earthing screw hole generally is to open the tin window all, this structure has the following disadvantages: 1, the screw hole pad is after wave soldering, by tin stove crest at last the pad at the place of leaving can cause heap tin or scolding tin to block the situation of screw hole, heap tin makes tin face thickness everywhere unbalanced, and the height disunity influences follow-up assembling.Screw install the back pad and touch area and reduce, influence the ground connection effect, influence reliability of products; If screw hole is blocked by tin, screw can't assemble in the time of will causing the product final assembly; If 2 want not allow pad tin sticky when crossing wave-soldering, just must before wave soldering, increase the operation of keeping off pad together, operate more complicated, influence production efficiency.
The utility model content
The purpose of this utility model is to solve above-mentioned the deficiencies in the prior art, and what propose a kind of printed circuit board ground hole opens the tin window construction.
For solving the problems of the technologies described above, the technical scheme that the utility model proposes is: that designs a kind of printed circuit board ground hole opens the tin window construction, comprise: be arranged on the ground hole on the pcb board and be positioned at ground hole pad on every side, described pad is provided with the scolding tin of strip.
In an embodiment of the present utility model, tin window direction on the described pad and wave soldering direction inclination certain angle, the angle of inclination is 45 or 135 degree angles.
The width range of described soldering tin bar is 0.6 millimeter to 1 millimeter, and the minimum range between the adjacent soldering tin bar edge is 0.7 millimeter.
Compared with prior art, the utility model is with the elongate strip shape that the tin window construction is designed to tilt of opening of screw ground hole, it opens tin window direction and the wave soldering direction is 45 degree or 135 degree angles, this kind structure can be evenly when crossing the welding of crest stove on tin, can do not blocked the screw ground hole again by tin, production efficiency when having improved wave soldering, the security reliability of ground connection in the actual use of assurance product.
Description of drawings
Below in conjunction with drawings and Examples the utility model is made detailed explanation, wherein:
Fig. 1 is the schematic diagram of opening the tin window construction of traditional printing circuit board ground hole;
Fig. 2 is the schematic diagram of opening the tin window construction in the utility model printed circuit board ground hole.
Embodiment
What Fig. 1 showed traditional single-clad board earthing screw hole opens the tin window construction.As can be seen from the figure, the tin window 2 opened of traditional printing circuit board ground connection ground hole 3 is all opened the tin window for whole pad.After wave soldering, pad 1 can leave Xi Chuanchu at last in wave soldering and cause heap tin situation, makes the tin face thickness of pad 1 unbalanced, and the height disunity influences follow-up assembling.In addition, have only heap tin part with contact, also influence the ground connection effect.If Non-Dewetting when thinking ground hole pad wave soldering, the operation of must increase keeping off pad is together operated more complicated, influences production efficiency.
What Fig. 2 showed the utility model printed circuit board ground hole opens the tin window construction.As can be seen from the figure, the tin window construction of opening in the printed circuit board ground hole that the utility model proposes comprises: be arranged on the ground hole 1 on the pcb board and be positioned at ground hole pad 2 on every side, pad 2 is provided with the scolding tin 3 of strip.
The scolding tin of offering on the pad 2 that is provided with around the ground hole 1 on the printed circuit board (PCB) 3 is the slice shape, and the length direction of scolding tin 3 becomes 45 degree or 135 degree angles with wave soldering direction (promptly advancing the plate direction).The width of scolding tin 3 is 0.6 millimeter to 1 millimeter, and the minimum range between two adjacent tin windows is 0.7 millimeter.Like this when pcb board when crossing wave soldering because the length direction of scolding tin 3 becomes 45 or 135 degree angles with the wave soldering direction, can not pile tin, the tin amount equilibrium on the whole piece Xi Dao after crest leaves at the least significant end of tin window 2.Because tin window body width is very little, the tin sticky amount is also less, and each scolding tin can not connect tin after adjacent scolding tin 3 wave solderings under the scolding tin convergent force.By this, tin amount equilibrium on tin window during the opening the tin window construction and realized wave soldering of the utility model printed circuit board ground hole, the unanimity of physical height, the well behaved characteristics of ground connection.
Better embodiment of the present utility model has more than been described; but the those of skill in the art in the present technique field are to be understood that; these only illustrate, and these execution modes are made numerous variations or are revised within the scope all should fall into the utility model protection not deviating from principle of the present utility model and essence.
Claims (5)
- A printed circuit board ground hole open the tin window construction, comprising: be arranged on the ground hole on the pcb board and be positioned at pad around the ground hole, it is characterized in that: described pad is provided with the scolding tin of strip.
- 2. the tin window construction of opening as claimed in claim 1 is characterized in that: soldering tin bar direction on the described pad and the wave soldering direction angle that tilts.
- 3. the tin window construction of opening as claimed in claim 2 is characterized in that: soldering tin bar direction on the described pad and wave soldering direction angle of inclination are 45 degree, perhaps 135 degree angles.
- 4. the tin window construction of opening as claimed in claim 1 is characterized in that: the width range of described soldering tin bar is 0.6 millimeter to 1 millimeter.
- 5. the tin window construction of opening as claimed in claim 1 is characterized in that: the minimum range between the adjacent soldering tin bar edge is 0.7 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120128646XU CN202009541U (en) | 2011-04-27 | 2011-04-27 | Tin window structure of grounding hole of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120128646XU CN202009541U (en) | 2011-04-27 | 2011-04-27 | Tin window structure of grounding hole of printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202009541U true CN202009541U (en) | 2011-10-12 |
Family
ID=44751193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120128646XU Expired - Lifetime CN202009541U (en) | 2011-04-27 | 2011-04-27 | Tin window structure of grounding hole of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202009541U (en) |
-
2011
- 2011-04-27 CN CN201120128646XU patent/CN202009541U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000, 5 floor, Fengyun mansion, five road north, Nanshan District science and Technology Park, Shenzhen, Guangdong Patentee after: Shenzhen Weimei New Energy Co., Ltd. Address before: 518000 Fengyun Science and Technology Building, No. 5 Industrial Zone, North District, Nanshan High-tech Zone, Shenzhen City, Guangdong Province, 401-(Room 1-2) Patentee before: Shenzhen Vmax Power Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111012 |
|
| CX01 | Expiry of patent term |