CN217035054U

CN217035054U - PCB of LED display module and LED display module

Info

Publication number: CN217035054U
Application number: CN202123300442.2U
Authority: CN
Inventors: 王磊
Original assignee: Leyard TV Technology Co Ltd
Current assignee: Leyard TV Technology Co Ltd
Priority date: 2021-12-23
Filing date: 2021-12-23
Publication date: 2022-07-22
Anticipated expiration: 2031-12-23

Abstract

The utility model provides a PCB of an LED display module and the LED display module, wherein the PCB of the LED display module comprises: a base plate; the first latticed copper sheet is laid on the surface of the bottom plate and is provided with a first avoidance area; the capacitor bonding pad group comprises two capacitor bonding pads which are arranged at intervals along the length direction of the bottom plate; the first solid copper sheet is arranged in the first avoidance area, and the two capacitor bonding pads are connected through the first solid copper sheet. The technical scheme of the application effectively solves the problem that the warpage degree of the PCB in the related technology is too large.

Description

PCB of LED display module and LED display module

Technical Field

The utility model relates to the technical field of LED display, in particular to a PCB of an LED display module and the LED display module.

Background

The PCB structure is a multi-board press-fit structure, and when the PCB is pressed, the whole copper sheet is often used for interference. The copper sheet of whole piece dispels the heat and leads to the copper sheet skinning at the excessive speed for the PCB warpage is too big, makes LED display module's display surface unevenness.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a PCB of an LED display module and the LED display module, so as to solve the problem of overlarge warping degree of the PCB in the related art.

In order to achieve the above object, according to an aspect of the present invention, there is provided a PCB board of an LED display module, including: a base plate; the first latticed copper sheet is laid on the surface of the bottom plate and is provided with a first avoidance area; the capacitor bonding pad group comprises two capacitor bonding pads which are arranged at intervals along the length direction of the bottom plate; the first solid copper sheet is arranged in the first avoidance area, and the two capacitor bonding pads are connected through the first solid copper sheet.

Further, the PCB board is still including the roof that is located the bottom plate top and set up the intermediate lamella between roof and bottom plate, first solid copper sheet is including setting up first linkage segment and the second linkage segment on the bottom plate, first solid copper sheet is still including setting up the third linkage segment on the intermediate lamella, the third linkage segment is connected between first linkage segment and second linkage segment, first dodge regional being provided with the mounting hole, the mounting hole is located between two first linkage segments, the roof is used for installing a plurality of LED wafers.

Furthermore, one end of the first connecting section is connected with the first end of the third connecting section through the first connecting part, and one end of the second connecting section is connected with the second end of the third connecting section through the second connecting part.

Further, first connecting portion are including the first connecting hole that is located the one end of first linkage segment, be located the second connecting hole of the first end of third linkage segment and set up the connecting conductor in first connecting hole and second connecting hole.

Further, the PCB of the LED display module further comprises a second latticed copper sheet paved on the middle plate, and a second avoidance area for avoiding the second connecting section is arranged on the second latticed copper sheet.

Furthermore, the number of the capacitor pad groups is multiple, the capacitor pad groups are arranged at intervals along the width direction of the base plate, and the length of the first solid copper sheet between two capacitor pads in one middle capacitor pad group is smaller than the length of the first solid copper sheet between two capacitor pads in one capacitor pad group adjacent to the middle capacitor pad group.

Further, still be provided with a plurality of copper post pads on the bottom plate, a plurality of copper post pads all are connected with first latticed copper sheet, and a plurality of copper post pads set up along the border interval of bottom plate.

According to another aspect of the utility model, an LED display module is provided, which includes a PCB and a driving chip, wherein the PCB is the PCB of the LED display module, the driving chip is disposed on a bottom plate of the PCB, and the driving chip is connected to a first latticed copper sheet of the PCB.

Further, the LED display module further comprises a second solid copper sheet, the second solid copper sheet is arranged on the surface, far away from the bottom plate, of the driving chip, and the grounding pin of the driving chip is connected with the second solid copper sheet.

Furthermore, the driving chips are arranged on the bottom plate at intervals, the two driving chips are connected through a signal line, and a third avoidance area for avoiding the signal line is arranged on the first latticed copper sheet.

By applying the technical scheme of the utility model, the PCB of the LED display module comprises: the base plate, first latticed copper sheet, electric capacity pad group and first solid copper sheet. The first latticed copper sheet is laid on the surface of the bottom plate and is provided with a first avoidance area. The capacitor bonding pad group comprises two capacitor bonding pads. The two capacitor pads are arranged at intervals along the length direction of the bottom plate. The first solid copper sheet is arranged in the first avoidance area, and the two capacitor bonding pads are connected through the first solid copper sheet. For the copper sheet of the whole piece in the correlation technique, the first latticed copper sheet of this application can reduce the heat radiating area of copper sheet, has reduced the radiating rate, has reduced the PCB board angularity effectively for LED display module's display surface is more level and smooth. Therefore, the technical scheme of the application can solve the problem that the warpage of the PCB board in the related art is too large. And the first solid copper sheet is a power supply path, so that the through-current capacity of the capacitor bonding pad group can be ensured.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:

FIG. 1 shows a partial schematic view of a side of a PCB board of an embodiment of a PCB board of an LED display module according to the utility model;

FIG. 2 shows a schematic top view of a bottom plate of the PCB board of FIG. 1;

FIG. 3 shows a partial schematic view of a bottom plate of the PCB board of FIG. 2;

FIG. 4 shows a schematic top view of a middle plate of the PCB board of FIG. 1;

fig. 5 shows a partial schematic view of an intermediate plate of the PCB board of fig. 4.

Wherein the figures include the following reference numerals:

1. a PCB board; 2. a driver chip; 10. a base plate; 20. a first latticed copper sheet; 30. a capacitor pad; 40. a first solid copper skin; 41. a first connection section; 42. a second connection section; 43. a third connection section; 50. a top plate; 60. a middle plate; 70. a second latticed copper sheet; 80. copper pillar pads.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be discussed further in subsequent figures.

As shown in fig. 1 to 3, the PCB of the LED display module of the present embodiment includes: the capacitor pad assembly comprises a base plate 10, a first latticed copper sheet 20, a capacitor pad group and a first solid copper sheet 40. The first latticed copper sheet 20 is laid on the surface of the base plate 10 and has a first relief area. The capacitor pad set includes two capacitor pads 30. Two capacitor pads 30 are provided at intervals along the length direction of the base plate 10. The first solid copper sheet 40 is arranged in the first avoidance area, and the two capacitor bonding pads 30 are connected through the first solid copper sheet 40.

By applying the technical solution of the present embodiment, the first latticed copper sheet 20 is laid on the surface of the bottom plate 10, and has a first avoidance area. The capacitor pad set includes two capacitor pads 30. Two capacitor pads 30 are provided at intervals along the length direction of the base plate 10. In order to prevent short circuit, the first solid copper sheet 40 is disposed in a first avoiding region (not shown), and the two capacitor pads 30 are connected through the first solid copper sheet 40. For the whole copper sheet in the related art, the first latticed copper sheet 20 of this embodiment can reduce the heat radiating area of copper sheet, has reduced the radiating rate, has reduced the PCB warpage effectively for the display surface of LED display module assembly is more level and smooth. Therefore, the technical scheme of the embodiment can solve the problem of excessive warping degree of the PCB in the related art. In addition, the first solid copper sheet 40 is a power supply path, which can ensure the current capacity of the capacitor pad group.

As shown in fig. 2 to 4, the PCB board further includes a top plate 50 positioned above the bottom plate 10 and an intermediate plate 60 disposed between the top plate 50 and the bottom plate 10, and the first solid copper sheet 40 includes a first connection section 41 and a second connection section 42 disposed on the bottom plate 10. The first solid copper skin 40 further comprises a third connecting section 43 arranged on the intermediate plate 60, the third connecting section 43 being connected between the first connecting section 41 and the second connecting section 42. The first avoiding region is provided with a mounting hole (not shown) located between the two first connecting segments 41, and the top plate 50 is used for mounting a plurality of LED chips (not shown). The mounting hole is provided with a pin of the connector. The first connecting section 41 and the second connecting section 42 on the bottom plate 10 are disconnected to avoid pins of a connector on the bottom plate 10, and the first connecting section 41 and the second connecting section 42 can be connected through the third connecting section 43 on the middle plate 60, so that the first solid copper sheet 40 can realize current capacity conveniently.

As shown in fig. 2 to 4, to achieve the through-flow, one end of the first connecting section 41 is connected to a first end of the third connecting section 43 through a first connecting portion, and one end of the second connecting section 42 is connected to a second end of the third connecting section 43 through a second connecting portion.

As shown in fig. 2 to 4, in order to achieve through-flow, the first connection portion includes a first connection hole (not shown in the drawings) at one end of the first connection section 41, a second connection hole (not shown in the drawings) at a first end of the third connection section 43, and connection conductors (not shown in the drawings) disposed in the first connection hole and the second connection hole. The second connection portion of the present embodiment has the same structure as that of the first connection portion.

As shown in fig. 2 to fig. 5, the PCB of the LED display module further includes a second latticed copper sheet 70 laid on the middle plate 60, and a second avoidance region (not shown in the figure) avoiding the second connecting section 42 is disposed on the second latticed copper sheet 70. For the whole copper sheet in the related art, the second latticed copper sheet 70 of this embodiment can further reduce the heat dissipation area of the copper sheet, reduce the heat dissipation speed, and effectively reduce the warpage of the PCB.

As shown in fig. 2 to 4, the number of the capacitor pad groups is three, and the three capacitor pad groups are arranged at intervals in the width direction of the base plate 10. In order to reduce the area of the bottom plate 10 occupied by the three capacitor pad groups, the length of the first solid copper sheet 40 between the two capacitor pads 30 in the middle one of the capacitor pad groups is smaller than the length of the first solid copper sheet 40 between the two capacitor pads 30 in the one of the capacitor pad groups adjacent to the middle one of the capacitor pad groups.

As shown in fig. 2 to 4, a plurality of copper pillar pads 80 are further provided on the base plate 10 in order to solder the copper pillars to the PCB. A plurality of copper post pads 80 all are connected with first latticed copper sheet 20, and a plurality of copper post pads 80 set up along the border interval of bottom plate 10.

The application also provides an LED display module, as shown in fig. 2, the LED display module of the embodiment comprises a PCB board 1 and a driving chip 2. The PCB board is the PCB board of above-mentioned LED display module assembly, and driver chip 2 sets up on PCB board 1's bottom plate 10, and driver chip 2 connects on PCB board 1's first latticed copper sheet 20. Due to the fact that the PCB of the LED display module can solve the problem that the warping degree of the PCB in the related technology is too large, the LED display module with the PCB can solve the same technical problem. The LED display module further comprises a plurality of LED light-emitting chips, the LED light-emitting chips are arranged on the top plate 50, and the driving chip 2 is used for controlling the LED light-emitting chips.

As shown in fig. 2, in order to make the grounding pin of the driving chip 2 fully perform grounding heat dissipation, the LED display module further includes a second solid copper sheet (not shown in the figure), the second solid copper sheet is disposed on the surface of the driving chip 2 far away from the bottom plate 10, and the grounding pin of the driving chip 2 is connected to the second solid copper sheet.

As shown in fig. 2, the driving chips 2 are provided in plurality on the base plate 10 at intervals. In order to facilitate signal transmission between the two driving chips 2, the two driving chips 2 are connected by a signal line (not shown in the figure), and a third avoidance area (not shown in the figure) for avoiding the signal line is arranged on the first latticed copper sheet 20.

In the description of the present invention, it is to be understood that the directions or positional relationships indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the directions or positional relationships shown in the drawings, and are for convenience of description and simplicity of description only, and in the case of not making a reverse description, these directional terms do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … … surface," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a PCB board of LED display module assembly which characterized in that includes:

a base plate (10);

the first latticed copper sheet (20) is laid on the surface of the bottom plate (10) and is provided with a first avoidance area;

the capacitor bonding pad group comprises two capacitor bonding pads (30), and the two capacitor bonding pads (30) are arranged at intervals along the length direction of the bottom plate (10);

the first solid copper sheet (40) is arranged in the first avoidance region, and the capacitor bonding pads (30) are connected through the first solid copper sheet (40).

2. The PCB board of claim 1, further comprising a top plate (50) positioned above the bottom plate (10) and an intermediate plate (60) positioned between the top plate (50) and the bottom plate (10), wherein the first solid copper sheet (40) comprises a first connecting section (41) and a second connecting section (42) positioned on the bottom plate (10), wherein the first solid copper sheet (40) further comprises a third connecting section (43) positioned on the intermediate plate (60), wherein the third connecting section (43) is connected between the first connecting section (41) and the second connecting section (42), wherein a mounting hole is positioned in the first avoiding region, wherein the mounting hole is positioned between two first connecting sections (41), and wherein the top plate (50) is used for mounting a plurality of LED chips.

3. The PCB board of claim 2, wherein one end of the first connection section (41) is connected with a first end of the third connection section (43) by a first connection portion, and one end of the second connection section (42) is connected with a second end of the third connection section (43) by a second connection portion.

4. A PCB board according to claim 3, wherein the first connection portion comprises a first connection hole at one end of the first connection section (41), a second connection hole at a first end of the third connection section (43), and connection conductors disposed within the first and second connection holes.

5. The PCB board of claim 2, wherein the PCB board of the LED display module further comprises a second latticed copper sheet (70) laid on the middle board (60), and a second avoidance area for avoiding the second connection section (42) is arranged on the second latticed copper sheet (70).

6. The PCB board of claim 1, wherein the plurality of capacitor pad sets are arranged at intervals along a width direction of the base plate (10), and a length of the first solid copper skin (40) between two capacitor pads (30) in a middle one of the capacitor pad sets is smaller than a length of the first solid copper skin (40) between two capacitor pads (30) in a capacitor pad set adjacent to the middle one of the capacitor pad sets.

7. The PCB board according to claim 1, wherein a plurality of copper pillar pads (80) are further disposed on the bottom board (10), the plurality of copper pillar pads (80) are all connected with the first latticed copper sheet (20), and the plurality of copper pillar pads (80) are disposed at intervals along an edge of the bottom board (10).

8. An LED display module, comprising a PCB (1) and a driving chip (2), wherein the PCB is the PCB of the LED display module as claimed in any one of claims 1 to 7, the driving chip (2) is disposed on the bottom plate (10) of the PCB (1), and the driving chip (2) is connected on the first latticed copper sheet (20) of the PCB (1).

9. The LED display module according to claim 8, further comprising a second solid copper sheet disposed on a surface of the driving chip (2) away from the base plate (10), wherein the ground pin of the driving chip (2) is connected to the second solid copper sheet.

10. The LED display module according to claim 9, wherein the driving chips (2) are arranged on the bottom plate (10) at intervals, two driving chips (2) are connected through a signal line, and a third avoiding region for avoiding the signal line is arranged on the first latticed copper sheet (20).