CN206650911U - A kind of pcb board and television set with radiator structure - Google Patents
A kind of pcb board and television set with radiator structure Download PDFInfo
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- CN206650911U CN206650911U CN201720139941.2U CN201720139941U CN206650911U CN 206650911 U CN206650911 U CN 206650911U CN 201720139941 U CN201720139941 U CN 201720139941U CN 206650911 U CN206650911 U CN 206650911U
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- heat
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Abstract
Utility model discloses a kind of pcb board and television set with radiator structure.Pcb board includes pcb board body, the pcb board body includes substrate and the insulating barrier being covered on the substrate, the pcb board body sets multiple heat-sink unit regions on the surface of heat dissipation region, the substrate surface at the heat-sink unit region sets tin layers, multiple heat-sink unit regions are arranged at intervals, and offer at least one through hole at least one heat-sink unit region.After heat dissipation region is separated into several heat-sink unit regions, it is possible to reduce the area coverage of tin cream, reduce and even avoid heap tin and Lian Xi, also reduce the cost of tin cream on pcb board.Meanwhile the through hole being arranged in heat-sink unit region can strengthen the heat dispersion of pcb board, after through hole is arranged on heat-sink unit region, through hole can be avoided too intensive, the spacing of through hole is bigger, convenient wiring, improves the current capacity of pcb board wiring channel and the performance of pcb board.
Description
Technical field
Printed circuit board (PCB) (Printed Circuit Board, PCB) technical field is the utility model is related to, is especially related to
And a kind of pcb board and television set with radiator structure.
Background technology
Electronic component on pcb board can generate heat at work, especially for powerful electronic component, with greater need for
Radiating in time, cause temperature too high in order to avoid radiating is bad, cause failure.Pcb board generally comprises substrate (such as copper-clad plate or more bases
Plate) and the insulating barrier (such as green paint) that is covered on substrate, in order to improve heat dispersion, in the prior art, typically by pcb board
The insulating barrier of the non-electronic component side of heat dissipation region scrapes off so that substrate is exposed.In order to prevent substrate exposure for a long time by oxygen
Change, influence radiating and other performances, tin layers can be set on the surface of exposed substrate, tin layers are typically welded by wave-soldering etc.
Technique is arranged at the surface of substrate.In the prior art, often scraped off as much as possible absolutely in the non-electronic component side of heat dissipation region
Edge layer so that substrate bare area becomes big, improves the thermal diffusivity of pcb board, but such that substrate surface needs what is set
Tin layers area also increases, and increases tin cream cost, and easily forms heap tin in welding or connect tin, leads to not pass through pcb board
The acceptance of work.
In addition, in order to improve heat dispersion, often also need to get through hole in heat dissipation region, by the heat of electronic component side
Amount passes to non-electronic component side by through hole.Heat dissipation region can open up through hole as much as possible, to obtain more preferably thermal diffusivity
Can, but through hole too secret meeting causes pcb board wiring channel to narrow, and influences the current capacity of passage, influences the performance of pcb board.
Utility model content
First purpose of the present utility model is to propose a kind of pcb board with radiator structure, can meet radiating requirements,
And can, which is reduced, even avoids heap tin and Lian Xi phenomenon, reduces tin cream cost, reduces wiring difficulty.
To use following technical scheme up to this purpose, the utility model：
A kind of pcb board with radiator structure, including pcb board body, the pcb board body include substrate and are covered in institute
The insulating barrier on substrate is stated, the pcb board body sets multiple heat-sink unit regions, the radiating list on the surface of heat dissipation region
The substrate surface at first region sets tin layers, and multiple heat-sink unit regions are arranged at intervals, and at least one described scattered
At least one through hole is offered in hot cell region.
Wherein, the insulating barrier is located at the region outside the heat-sink unit region,
Wherein, when the tin layers are welded by the welding procedure welded along straight line, along the adjacent institute of welding direction arrangement
The minimum that the distance between heat-sink unit region is stated not less than the company's of avoiding tin requires spacing.
Wherein, the welding procedure is Wave crest Welding technique, along the wave-soldering welding direction it is adjacent described in
The distance between heat-sink unit region is not less than 0.8mm.
Wherein, when the tin layers are welded by the welding procedure in welding direction, the adjacent heat-sink unit region it
Between distance require spacing not less than the minimum of the company's of avoiding tin.
Wherein, the heat-sink unit region is shaped as polygon or circle.
Wherein, the outer peripheral shape positioned at the heat-sink unit region at the heat dissipation region edge and the radiating area
The shape at the edge in domain is consistent.
Wherein, multiple heat-sink unit regions are arranged at intervals along vertical and horizontal respectively, form square heat dissipation region.
Wherein, the heat-sink unit region be shaped as the length of side be 1mm square, the internal diameter of the through hole is 0.4mm.
Second purpose of the present utility model is to propose a kind of television set, and its pcb board can meet radiating requirements, and and can subtracts
It is few even to avoid heap tin and Lian Xi phenomenon, tin cream cost is reduced, reduces wiring difficulty.
To use following technical scheme up to this purpose, the utility model：
A kind of television set, including above-mentioned pcb board.
Beneficial effect：The utility model proposes a kind of pcb board and television set with radiator structure.Pcb board includes PCB
Plate body, the pcb board body include substrate and the insulating barrier being covered on the substrate, and the pcb board body is in radiating area
The surface in domain sets multiple heat-sink unit regions, and the substrate surface at the heat-sink unit region sets tin layers, Duo Gesuo
Heat-sink unit region interval setting is stated, and at least one through hole is offered at least one heat-sink unit region.Will radiating
After region is separated into several heat-sink unit regions, it is possible to reduce the area coverage of tin cream, reduce and even avoid heap tin and Lian Xi,
Also reduce the cost of tin cream on pcb board.Meanwhile the through hole being arranged in heat-sink unit region can strengthen the radiating of pcb board
Performance, after through hole is arranged on heat-sink unit region, through hole can be avoided too intensive, the spacing of through hole is bigger, convenient wiring,
Improve the current capacity of pcb board wiring channel and the performance of pcb board.
Brief description of the drawings
Fig. 1 is the front schematic view of pcb board provided by the utility model.
Fig. 2 is the sectional view of pcb board provided by the utility model.
Wherein：
1-PCB plate bodies, 11- substrates, 12- insulating barriers, 13- heat-sink units region, 14- through holes, 15- tin layers.
Embodiment
It is clearer for the technical scheme and the technique effect that reaches that make technical problem that the utility model solves, use,
Further illustrate the technical solution of the utility model below in conjunction with the accompanying drawings and by embodiment.
Embodiment 1
As depicted in figs. 1 and 2, a kind of pcb board with radiator structure, including pcb board body 1 are present embodiments provided,
Pcb board body 1 includes substrate 11 and the insulating barrier 12 being covered on substrate 11, and substrate 11 is generally copper-clad plate, or more bases
Plate, i.e., the substrate to be formed is laminated with multi-layer sheet, the plate of the inner. layers of more substrates can also connect up, and insulating barrier 12 is usually to cover
The green paint on the surface of substrate 11 or other materials are covered, for protective substrate and prevents solder shorts etc..PCB
Substrate 11 surface of the plate body 1 at the surface of the heat dissipation region multiple heat-sink unit regions 13 of setting, heat-sink unit region 13 is set
Tin layers 15 are put, multiple heat-sink unit regions 13 are arranged at intervals, and are offered at least one heat-sink unit region 13 at least one
Through hole 14.The insulating barrier 12 on monoblock heat dissipation region surface is wiped off with prior art, then tin layers are completely covered and compare, by radiating area
After domain is separated into each heat-sink unit region 13, it is possible to reduce the area coverage of tin cream, reduce the cost of tin cream, and reduce very
To avoiding heap tin and Lian Xi, it is however generally that, after the spacing between each heat-sink unit region 13 exceedes certain value, it can keep away completely
Exempt from the phenomenon of even tin, when the area of of heat-sink unit region 13 itself is reduced to certain value, be avoided that heap tin.Certainly, each radiating
The increase of the spacing of unit area 13 and the reduction of the area in heat-sink unit region 13 can all reduce a part of heat dispersion, because
This, in actual applications, it is necessary to take into account heat dispersion and heap tin, connect the problem of tin.It is arranged on logical in heat-sink unit region 13
Hole 14 can be combined with heat-sink unit region 13, strengthen the heat dispersion of pcb board, meanwhile, also avoid through hole too intensive, through hole
Spacing it is bigger, convenient wiring, improve the current capacity of the wiring channel of pcb board and the performance of pcb board.The present embodiment
In, insulating barrier is located at the region outside heat-sink unit region 13, i.e., the insulating barrier in heat-sink unit region 13 be scraped or
Erode, it is convenient that tin layers are set in heat-sink unit region 13.
Specifically, if the welding procedure that tin layers 15 are welded by such as wave-soldering etc. along straight line is welded, along welding side
The minimum that the distance between adjacent heat-sink unit region 13 to arrangement cannot be less than the company's of avoiding tin requires spacing.Welded along straight line
The welding procedure connect refers to linearly weld along some direction in welding, such as wave-soldering, in welding along rectilinear direction
Welding, now, in order to avoid even the distance between tin, adjacent heat-sink unit region 13 requires not less than the minimum of the company's of avoiding tin
Spacing.In the application, the distance between heat-sink unit region 13 refers to the minimum spacing between the edge in heat-sink unit region 13.
Rather than the distance between adjacent heat-sink unit region 13 along welding direction arrangement can suitably be reduced, such as perpendicular to
The distance between heat-sink unit region 13 of welding direction arrangement can be less than the minimum spacing requirement of the company's of avoiding tin, can't produce
Sheng Lianxi phenomenons.Therefore the minimum spacing of the company's of avoiding tin of existing wave-soldering, can be set along wave-soldering in 0.8mm or so
The distance between the adjacent heat-sink unit region 13 of welding direction be not less than 0.8mm.Certainly, the specific value of spacing can also
Adjusted according to actual conditions, in the case where meeting the company's of avoiding tin, spacing is smaller, and the heat-sink unit region 13 that can be arranged is got over
More, area of dissipation also accordingly increases, and heat dispersion is more preferable.In actual applications, monoblock heat dissipation region of the prior art is struck off
The mode of tin layers is set, when tin layers are set using wave-soldering, heap tin and Lian Xi phenomenon easily occurs, and uses and is separated into radiating
Unit area 13 and after controlling the spacing in heat-sink unit region 13, can directly avoid this two kinds of defects, meet acceptance requirement.
If tin layers 15 are welded by the welding procedure in welding direction, between adjacent heat-sink unit region 13 away from
Spacing is required from the minimum not less than the company's of avoiding tin.For example by taking Reflow Soldering as an example, such a welding procedure is not in specific welding
Direction, therefore, the distance in all adjacent heat-sink unit regions 13 all can not require spacing less than the minimum of the company's of avoiding tin.But
For Reflow Soldering, the minimum of the company's of avoiding tin requires that spacing is smaller, can reach 0.4mm or so, and therefore, it is arranged close
Degree can increase.
In the present embodiment, heat-sink unit region 13 can be polygon, such as triangle, quadrangle, pentagon etc., also may be used
Think circle, can also be other irregular figures, the shape in heat-sink unit region 13 can be adjusted according to actual conditions
It is whole.More commonly used design is that heat-sink unit region 13 is designed as into square, and the relatively good arrangement of square specifically, can
To be square of the length of side as 1mm or so, heap tin can be now avoided, also will not cause heat dispersion not because area is too small
It is good.The internal diameter of through hole 14 could be arranged to 0.4mm, take into account heat dispersion and the influence to wiring.Through hole 14 for convenience arrange,
Arrangement is neat, can be arranged in the centre in heat-sink unit region 13.Certainly, through hole 14 can also be off-center, is arranged in inside
.Multiple heat-sink unit regions 13 of the present embodiment are arranged along vertical and horizontal respectively, form square heat dissipation region, such a
Arrangement mode can preferably control the spacing in the heat-sink unit region 13 linearly arranged, be very suitable for using crest
Weldering etc. has the heat radiation structure design of the pcb board of the welding procedure of welding direction.
In order to make full use of heat dissipation region to be radiated, it is more smooth to take into account heat dissipation region edge itself again, can be by position
It is consistent in the outward flange of shape in the heat-sink unit region 13 at the edge of heat dissipation region and the edge of heat dissipation region.Now,
Shape positioned at the heat-sink unit region 13 at the edge of heat dissipation region is not necessarily consistent with the shape of heat-sink unit region 13 of inside,
But in order to keep the neat in edge of heat dissipation region itself, the shape in the heat-sink unit region 13 at edge is adjusted, passed through
The heat-sink unit region 13 at edge is set, the utilization rate of heat dissipation region is further improved, improves heat dispersion.And it is located at radiating area
Through hole 14 can be provided with heat-sink unit region 13 inside domain, to improve heat dispersion.
Embodiment 2
Present embodiments provide a kind of television set, including above-mentioned pcb board.With prior art by monoblock heat dissipation region surface
Insulating barrier wipe off, then tin layers are completely covered and compare, after heat dissipation region is separated into each heat-sink unit region 13, it is possible to reduce
The area coverage of tin cream, the cost of tin cream is reduced, and reduces and even avoid heap tin and Lian Xi, it is however generally that, each radiating is single
After spacing between first region 13 exceedes certain value, can the company's of avoiding tin completely phenomenon, the face of of heat-sink unit region 13 itself
When product is reduced to certain value, heap tin is avoided that.Certainly, the increase of the spacing in each heat-sink unit region 13 and heat-sink unit region
The reduction of 13 area can all reduce a part of heat dispersion, therefore, in actual applications, it is necessary to take into account both.It is arranged on scattered
Through hole 14 in hot cell region 13 can be combined with heat-sink unit region 13, and the heat of electronic component side is passed through into through hole 14
Opposite side is passed to, strengthens the heat dispersion of pcb board, meanwhile, also avoid through hole too intensive, the spacing of through hole is bigger, convenient
Wiring, improves the current capacity of pcb board wiring channel and the performance of pcb board.
Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality
With new thought, there will be changes, this specification content should not be construed as in specific embodiments and applications
To limitation of the present utility model.
Claims (10)
- A kind of 1. pcb board with radiator structure, it is characterised in that including pcb board body (1), pcb board body (1) bag The insulating barrier (12) for including substrate (11) and being covered on the substrate (11), the pcb board body (1) is on the surface of heat dissipation region Multiple heat-sink unit regions (13) are set, and the substrate (11) surface at heat-sink unit region (13) place sets tin layers (15), multiple heat-sink unit regions (13) are arranged at intervals, and are offered at least one heat-sink unit region (13) At least one through hole (14).
- 2. pcb board as claimed in claim 1, it is characterised in that the insulating barrier (12) is located at the heat-sink unit region (13) region outside.
- 3. pcb board as claimed in claim 1, it is characterised in that the tin layers (15) pass through the welding procedure welded along straight line During welding, along the distance between adjacent described heat-sink unit region (13) of welding direction arrangement not less than the company's of avoiding tin most It is small to require spacing.
- 4. pcb board as claimed in claim 3, it is characterised in that the welding procedure is Wave crest Welding technique, along the ripple The distance between adjacent described heat-sink unit region (13) of welding direction of peak weldering is not less than 0.8mm.
- 5. pcb board as claimed in claim 1, it is characterised in that the welding procedure that the tin layers (15) pass through welding direction During welding, the distance between adjacent described heat-sink unit region (13) requires spacing not less than the minimum of the company's of avoiding tin.
- 6. the pcb board as described in claim any one of 1-4, it is characterised in that heat-sink unit region (13) are shaped as Polygon or circle.
- 7. the pcb board as described in claim any one of 1-4, it is characterised in that described positioned at the heat dissipation region edge dissipates The outer peripheral shape and the shape at the edge of the heat dissipation region in hot cell region (13) are consistent.
- 8. the pcb board as described in claim any one of 1-4, it is characterised in that multiple heat-sink unit regions (13) are respectively It is arranged at intervals along vertical and horizontal, forms square heat dissipation region.
- 9. the pcb board as described in claim any one of 1-4, it is characterised in that heat-sink unit region (13) are shaped as The length of side is 1mm square, and the internal diameter of the through hole (14) is 0.4mm.
- 10. a kind of television set, it is characterised in that including the pcb board as described in claim any one of 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720139941.2U CN206650911U (en) | 2017-02-16 | 2017-02-16 | A kind of pcb board and television set with radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720139941.2U CN206650911U (en) | 2017-02-16 | 2017-02-16 | A kind of pcb board and television set with radiator structure |
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| Publication Number | Publication Date |
|---|---|
| CN206650911U true CN206650911U (en) | 2017-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720139941.2U Active CN206650911U (en) | 2017-02-16 | 2017-02-16 | A kind of pcb board and television set with radiator structure |
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| CN (1) | CN206650911U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038585A (en) * | 2023-10-08 | 2023-11-10 | 烟台台芯电子科技有限公司 | Copper-clad ceramic substrate structure |
-
2017
- 2017-02-16 CN CN201720139941.2U patent/CN206650911U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038585A (en) * | 2023-10-08 | 2023-11-10 | 烟台台芯电子科技有限公司 | Copper-clad ceramic substrate structure |
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