CN210781545U - Prevent high reliability individual layer circuit board of rosin joint - Google Patents
Prevent high reliability individual layer circuit board of rosin joint Download PDFInfo
- Publication number
- CN210781545U CN210781545U CN201922036514.3U CN201922036514U CN210781545U CN 210781545 U CN210781545 U CN 210781545U CN 201922036514 U CN201922036514 U CN 201922036514U CN 210781545 U CN210781545 U CN 210781545U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- base
- components
- board body
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 title claims abstract description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 title claims abstract description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 title claims abstract description 8
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 239000002356 single layer Substances 0.000 claims abstract description 14
- 239000004519 grease Substances 0.000 claims abstract description 12
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-reliability single-layer circuit board for preventing rosin joint, which comprises a circuit board body and a supporting moisture-proof mechanism, wherein components are fixed at the top of the circuit board body, and the supporting moisture-proof mechanism comprises a supporting plate, a heat dissipation hole and heat-conducting silicone grease; the utility model has the advantages that: the support damp-proof mechanism is beneficial to fixing the circuit board body through the support plate, so that the circuit board body is prevented from directly contacting with a contact surface, the arrangement of the heat dissipation holes and the heat conduction silicone grease accelerates air circulation and fast heat dissipation, and the damp-proof effect of the support plate and the circuit board body is increased; through the fixed protection machanism in the top four corners of the circuit board body, usable rubber head supports on the box body, has avoided components and parts to support on the box body, ensures the normal operation of components and parts, supports on the box body with traditional components and parts, increases the load that components and parts received and compares, the utility model provides the high life of components and parts.
Description
Technical Field
The utility model belongs to the technical field of the individual layer circuit board, concretely relates to prevent rosin joint high reliability individual layer circuit board.
Background
The PCB is manufactured by different components and parts and various complex process technologies, wherein the PCB has a single-layer structure, a double-layer structure and a multi-layer structure, and different hierarchical structures and different manufacturing modes.
A single-layer circuit board is a circuit board with only one side coated with copper and the other side not coated with copper. Typically, the components are placed on the side that is not copper-clad, the copper-clad side being used primarily for wiring and soldering.
The circuit board is not firmly welded, a false welding scene occurs, and the condition of poor contact may occur after the circuit board is connected with electricity. The solderability of the circuit board designed for accepting the Pcb directly influences the final quality of the circuit board soldering. The circuit board is soldered by various methods, and the soldering method needs to be selected according to specific situations when soldering, mainly according to the difference of melting points of the solder. The choice of circuit board solder in the general case we will choose to use white rosin and isopropyl alcohol solvents, flux through thermal conduction, the corrosion of the circuit board is removed and the wetted surface is soldered to the circuit board. In the layout of Pcb circuit board design factories, when the size of a circuit board is too large, although welding is easy to control, the printed line is long, impedance is increased, noise resistance is reduced, and cost is increased; when the time is too small, the heat dissipation is reduced, the welding is not easy to control, and the mutual interference of adjacent lines, such as the electromagnetic interference of a circuit board, is easy to occur. The wire width is not abrupt to avoid wiring discontinuities. When the circuit board is heated for a long time, the copper foil is easy to expand and fall off, so that the use of large-area copper foil is avoided.
The existing anti-cold-welding high-reliability single-layer circuit board has the following defects when in use:
1. when the device is installed, the bottom is directly contacted with the contact surface, so that the contact surface is wetted;
2. the components are arranged on the circuit board body, and when the single-layer circuit board is arranged in the box body, the components are abutted against the box body, so that the load of the components is increased, and the service life of the components is shortened.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a single-layer circuit board with high reliability and cold joint prevention, which solves the problem that the bottom is directly contacted with the contact surface when the single-layer circuit board is installed in the prior art, and increases the moisture of the contact surface; the components are arranged on the circuit board body, and when the single-layer circuit board is arranged in the box body, the components are abutted against the box body, so that the load of the components is increased, and the service life of the components is shortened.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a prevent high reliability individual layer circuit board of rosin joint, includes the circuit board plate body and supports dampproofing mechanism, the top of circuit board plate body is fixed with components and parts, it includes backup pad, louvre and heat conduction silicone grease to support dampproofing mechanism, the bottom of circuit board plate body is followed the length direction of circuit board plate body is fixed with the backup pad of symmetric distribution, and the backup pad extends the circuit board plate body, and the surface of this backup pad link up the louvre of having seted up a plurality of interval distribution, and the surface of this louvre scribbles heat conduction silicone grease.
Preferably, the supporting plate is of a cuboid structure, and the surface of the supporting plate is provided with symmetrically distributed screw holes in a penetrating manner.
Preferably, the side surface of the circuit board body is fixed with symmetrically distributed extension parts.
Preferably, the top four corners of the circuit board body are fixed with a protection mechanism, the protection mechanism comprises a rubber head, a convex block and a base, the rubber head is arranged at the top of the base, the top of the convex block is arranged in the base, and the vertical height of the convex block and the vertical height of the base are not less than the height of the component.
Preferably, the top wall of the lug is provided with an external thread, the inner wall of the base is provided with an internal thread, and the lug and the base are screwed and fixed.
Preferably, the rubber head and the base are both cylindrical structures, and the outer diameter of the rubber head is larger than that of the base.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the support damp-proof mechanism is beneficial to fixing the circuit board body through the support plate, so that the circuit board body is prevented from directly contacting with a contact surface, the arrangement of the heat dissipation holes and the heat conduction silicone grease accelerates air circulation and fast heat dissipation, and the damp-proof effect of the support plate and the circuit board body is increased;
(2) through the fixed protection machanism in the top four corners of the circuit board body, usable rubber head supports on the box body, has avoided components and parts to support on the box body, ensures the normal operation of components and parts, supports on the box body with traditional components and parts, increases the load that components and parts received and compares, the utility model provides the high life of components and parts.
Drawings
Fig. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic view of the three-dimensional structure of the supporting plate of the present invention;
FIG. 3 is a schematic view of the connection structure of the bump and the rubber head of the present invention;
in the figure: 1. a circuit board body; 2. an extension portion; 3. a rubber head; 4. a component; 5. a screw hole; 6. a support plate; 7. heat dissipation holes; 8. heat-conducting silicone grease; 9. a bump; 10. an external thread; 11. a base.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: a high-reliability single-layer circuit board for preventing cold joint comprises a circuit board body 1 and a supporting damp-proof mechanism, wherein components 4 are welded at the top of the circuit board body 1, so that the components 4 are fixed stably, white rosin and isopropanol solvents are selected as welding fluxes during welding, the supporting damp-proof mechanism is beneficial to increasing the cold joint prevention effect and comprises a supporting plate 6, radiating holes 7 and heat-conducting silicone grease 8, the bottom of the circuit board body 1 is fixedly provided with the symmetrically-distributed supporting plate 6 along the length direction of the circuit board body 1, the supporting plate 6 extends out of the circuit board body 1, the surface of the supporting plate 6 is provided with the plurality of radiating holes 7 which are distributed at intervals in a through mode, the surface of each radiating hole 7 is coated with the heat-conducting silicone grease 8, after the supporting plate 6 is fixed, the circuit board body 1 is fixed through the supporting plate 6 during installation, the direct contact with a contact surface of, the quick heat dissipation helps to increase the moisture-proof effect of the supporting plate 6 and the circuit board body 1.
In this embodiment, preferably, the supporting plate 6 is a rectangular parallelepiped structure, and the screw holes 5 symmetrically distributed are formed through the surface of the supporting plate 6, so that the supporting plate 6 can be fixed by passing screws through the screw holes 5, thereby fastening the circuit board body 1.
In this embodiment, preferably, the side surfaces of the circuit board body 1 are fixed with the symmetrically distributed extending portions 2, so that the circuit board body 1 is more convenient to use.
In this embodiment, preferably, the four corners of the top of the circuit board body 1 are fixed with a protection mechanism, the protection mechanism includes a rubber head 3, a bump 9 and a base 11, the top of the base 11 is provided with the rubber head 3, the base 11 is disposed on the top of the bump 9, the vertical height between the bump 9 and the base 11 is not less than the height of the device 4, the top wall of the bump 9 is provided with an external thread 10, the inner wall of the base 11 is provided with an internal thread, the bump 9 and the base 11 are screwed and fixed, the rubber head 3 and the base 11 are both cylindrical structures, the outer diameter of the rubber head 3 is larger than that of the base 11, when in use, the bump 9 is fixed on the four corners of the top of the circuit board body 1, the base 11 fixed with the rubber head 3 is picked up, the internal thread provided on the inner wall of the base 11 and the external thread 10 provided on the top wall of the bump 9, avoided components and parts 4 to support on the box body, ensured components and parts 4's normal operation, supported on the box body with traditional components and parts 4, increased the load that components and parts 4 received and compared, this embodiment has improved components and parts 4's life.
The utility model discloses a theory of operation and use flow: the supporting plate 6 is fixed by a screw penetrating through the screw hole 5, so that the circuit board body 1 is fastened, the circuit board body 1 is prevented from directly contacting with a contact surface, the surface of the supporting plate 6 is provided with a plurality of heat dissipation holes 7 which are distributed at intervals in a penetrating manner, the surface of each heat dissipation hole 7 is coated with heat conduction silicone grease 8, the arrangement of the heat dissipation holes 7 and the heat conduction silicone grease 8 accelerates air circulation, heat dissipation is rapid, and the moisture-proof effect of the supporting plate 6 and the circuit board body 1 is increased;
during the use, fix lug 9 in the top four corners of circuit board plate body 1, take up the base 11 that is fixed with rubber head 3, close soon with the internal thread that 11 inner walls of base seted up and the external screw thread 10 that the 9 roof of lug set up, realize the fastening of base 11, when the individual layer circuit board is installed in the box body, usable rubber head 3 supports on the box body, avoided components and parts 4 to on the box body, ensure components and parts 4's normal operating, support on the box body with traditional components and parts 4, increase the load that components and parts 4 received and compare, this embodiment has improved components and parts 4's life.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a prevent rosin joint high reliability individual layer circuit board, includes circuit board plate body (1) and supports dampproofing mechanism, the top of circuit board plate body (1) is fixed with components and parts (4), its characterized in that: support dampproofing mechanism and include backup pad (6), louvre (7) and heat conduction silicone grease (8), the bottom of circuit board body (1) is followed the length direction of circuit board body (1) is fixed with symmetric distribution's backup pad (6), and backup pad (6) extend circuit board body (1), and the surface of this backup pad (6) link up louvre (7) of having seted up a plurality of interval distribution, and the surface of this louvre (7) scribbles heat conduction silicone grease (8).
2. The anti-cold-solder-joint high-reliability single-layer circuit board as claimed in claim 1, wherein: the support plate (6) is of a cuboid structure, and the surface of the support plate (6) is provided with symmetrically distributed screw holes (5) in a penetrating manner.
3. The anti-cold-solder-joint high-reliability single-layer circuit board as claimed in claim 1, wherein: the side surface of the circuit board body (1) is fixed with symmetrically distributed extension parts (2).
4. The anti-cold-solder-joint high-reliability single-layer circuit board as claimed in claim 1, wherein: the protection mechanism is fixed at four corners of the top of the circuit board body (1) and comprises a rubber head (3), a convex block (9) and a base (11), the rubber head (3) is arranged at the top of the base (11), the top of the convex block (9) is arranged in the base (11), and the vertical height of the convex block (9) and the vertical height of the base (11) are not less than the height of the component (4).
5. The anti-cold-solder-joint high-reliability single-layer circuit board as claimed in claim 4, wherein: the top wall of the convex block (9) is provided with an external thread (10), the inner wall of the base (11) is provided with an internal thread, and the convex block (9) and the base (11) are screwed and fixed.
6. The anti-cold-solder-joint high-reliability single-layer circuit board as claimed in claim 4, wherein: the rubber head (3) and the base (11) are both of a cylindrical structure, and the outer diameter of the rubber head (3) is larger than that of the base (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922036514.3U CN210781545U (en) | 2019-11-22 | 2019-11-22 | Prevent high reliability individual layer circuit board of rosin joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922036514.3U CN210781545U (en) | 2019-11-22 | 2019-11-22 | Prevent high reliability individual layer circuit board of rosin joint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210781545U true CN210781545U (en) | 2020-06-16 |
Family
ID=71038373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922036514.3U Expired - Fee Related CN210781545U (en) | 2019-11-22 | 2019-11-22 | Prevent high reliability individual layer circuit board of rosin joint |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210781545U (en) |
-
2019
- 2019-11-22 CN CN201922036514.3U patent/CN210781545U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI565017B (en) | Vertically connected power module and stacked and connected pins thereof | |
| CN103179781A (en) | Method for improving thermal conduction capability of printed board of surface-mounted device | |
| CN111447755A (en) | Manufacturing and assembling method of controller | |
| JP2013521639A (en) | Configuration of electrical contacts | |
| CN103369828A (en) | Circuit board system | |
| CN210781545U (en) | Prevent high reliability individual layer circuit board of rosin joint | |
| CN108112168B (en) | Design adding method for inner layer non-functional bonding pad of thick copper plate | |
| CN110868796B (en) | PCB heat dissipation device | |
| CA2378252A1 (en) | A printed circuit board | |
| CN210042369U (en) | Multilayer circuit board with good stability | |
| CN212367615U (en) | Power tube heat radiation structure | |
| US11342734B2 (en) | Circuit assembly and electrical junction box | |
| CN203446168U (en) | Power element heat dissipation structure | |
| CN206365156U (en) | A kind of printed circuit board (PCB) for being easy to surface mount elements wiring | |
| CN111970824A (en) | PCB and pad structure suitable for BGA chip thereof | |
| CN214558084U (en) | Novel PCB composite welding structure | |
| CN214507475U (en) | Lead-free tin spraying circuit board | |
| US20240080981A1 (en) | Circuit Board Assembly and Radio Unit Comprising the Same | |
| CN219287820U (en) | Mounting structure of composite circuit board and electronic component | |
| CN216391500U (en) | Double-layer PCB with high heat dissipation performance | |
| CN213718306U (en) | Dedicated printed circuit board structure of high-speed heat dissipation of 5G | |
| CN114126200B (en) | PCB bonding pad open pore structure, method and electric appliance | |
| CN204481721U (en) | A kind of electronic controller controlled for brushless electric machine | |
| JP2013179011A (en) | Circuit board | |
| CN210694670U (en) | Power module bilayer structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200616 |