CN201364347Y - 探针卡 - Google Patents
探针卡 Download PDFInfo
- Publication number
- CN201364347Y CN201364347Y CNU2008201583534U CN200820158353U CN201364347Y CN 201364347 Y CN201364347 Y CN 201364347Y CN U2008201583534 U CNU2008201583534 U CN U2008201583534U CN 200820158353 U CN200820158353 U CN 200820158353U CN 201364347 Y CN201364347 Y CN 201364347Y
- Authority
- CN
- China
- Prior art keywords
- probe
- wafer
- probes
- drain region
- gate regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201583534U CN201364347Y (zh) | 2008-12-30 | 2008-12-30 | 探针卡 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201583534U CN201364347Y (zh) | 2008-12-30 | 2008-12-30 | 探针卡 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201364347Y true CN201364347Y (zh) | 2009-12-16 |
Family
ID=41475015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008201583534U Expired - Lifetime CN201364347Y (zh) | 2008-12-30 | 2008-12-30 | 探针卡 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201364347Y (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104459512A (zh) * | 2014-12-31 | 2015-03-25 | 上海华虹宏力半导体制造有限公司 | Mosfet被探测区探针数量计算方法及探针位置设计方法和探针卡生成方法 |
-
2008
- 2008-12-30 CN CNU2008201583534U patent/CN201364347Y/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104459512A (zh) * | 2014-12-31 | 2015-03-25 | 上海华虹宏力半导体制造有限公司 | Mosfet被探测区探针数量计算方法及探针位置设计方法和探针卡生成方法 |
CN104459512B (zh) * | 2014-12-31 | 2017-06-06 | 上海华虹宏力半导体制造有限公司 | Mosfet被探测区探针数量计算方法及探针位置设计方法和探针卡生成方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102944196B (zh) | 一种检测半导体圆形接触孔圆度的方法 | |
CN103163442B (zh) | 一种晶圆测试方法 | |
CN104020407B (zh) | 一种集成电路静电防护性能的测试方法 | |
CN203133171U (zh) | 用于对电子电路的晶片进行测试的测试装置 | |
CN203645321U (zh) | 防呆保护电路 | |
CN103489808B (zh) | 一种可按照离子注入区域分类的电子束缺陷检测方法 | |
CN104900629B (zh) | 一种检测偏移的测试结构 | |
CN103267940B (zh) | 多模块平行测试系统 | |
CN103336239A (zh) | 晶圆测试的方法 | |
CN203849299U (zh) | 一种高温测试探针卡 | |
US7101722B1 (en) | In-line voltage contrast determination of tunnel oxide weakness in integrated circuit technology development | |
CN206312895U (zh) | 一种晶圆可接受测试结构 | |
CN201364347Y (zh) | 探针卡 | |
CN103163435B (zh) | 晶圆可接受性测试之击穿电压测试装置及方法 | |
CN101872002B (zh) | 探针检测装置及其方法 | |
CN108344936B (zh) | 一种功率半导体器件的测试方法 | |
CN102543960A (zh) | 一种测试用集成电路 | |
CN104900552A (zh) | 一种晶圆完整性的侦测方法及晶圆导向器 | |
CN207250460U (zh) | 一种快速定位并测量缺陷的高密度测试芯片 | |
CN104952750A (zh) | 一种硅片电学测试的早期侦测系统及方法 | |
CN104134619B (zh) | 通过刻蚀不足缺陷检测多晶硅与连接孔对准度的方法 | |
CN102339816A (zh) | 晶圆测试键结构及晶圆测试方法 | |
CN203800037U (zh) | 可靠性测试结构 | |
CN104766808A (zh) | 晶圆缺陷密度获得方法、测试方法及半导体装置形成方法 | |
CN203631540U (zh) | 测试结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130115 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130115 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CX01 | Expiry of patent term |
Granted publication date: 20091216 |
|
CX01 | Expiry of patent term |