CN201358299Y - Vacuum magnetron-sputtering type winding film-coating device - Google Patents
Vacuum magnetron-sputtering type winding film-coating device Download PDFInfo
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- CN201358299Y CN201358299Y CNU2009200512875U CN200920051287U CN201358299Y CN 201358299 Y CN201358299 Y CN 201358299Y CN U2009200512875 U CNU2009200512875 U CN U2009200512875U CN 200920051287 U CN200920051287 U CN 200920051287U CN 201358299 Y CN201358299 Y CN 201358299Y
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- vacuum
- magnetron sputtering
- coating apparatus
- film coating
- vacuum cavity
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Abstract
A vacuum magnetron-sputtering type winding film-coating device comprises a vacuum cavity, a vacuum acquisition system, targets, and winding and unwinding systems. The vacuum acquisition system is arranged on the vacuum cavity and enables the interior of the vacuum cavity to operate in a vacuum state; the targets for the magnetron-sputtering are arranged in two rows in a magnetron-sputtering area of the vacuum cavity; and the winding and unwinding systems are respectively arranged on two sides of the magnetron-sputtering area. The utility model has following advantages: (1) the vacuum cavity has a round shape, so that a dead angle can not be formed during the air extraction, and the vacuum degree is uniform; the vacuum cavity has no returned oil inside; and the working efficiency is improved; (2) the double winding and unwinding systems are adopted, and the functions are so comprehensive that not only the one coil with double coated surfaces and double coils with single coated surface can be realized in full-width of the magnetron-sputtering area, but also double coils with single coated surface and double coated surfaces also can be realized in half-width of the coated area; and (3) the ion bombardment are conducted on the surface of the substrate, so that the surface roughness of the substrate is improved, and the peeling strength between the membrane layer and the substrate is ensured.
Description
Technical field
The utility model relate to a kind of under high vacuum state the filming equipment field at various substrate surface magnetron sputtering continuous film formings, be specially a kind of vacuum magnetron sputtering coil film coating apparatus that can be applied in one or more layers metal of sputter on the web-like base material.
Background technology
Vacuum magnetic-control sputtering equipment can obtain one or more layers uniform settled layer at conductive base and non-conductive substrate, is the visual plant of the acquisition of multiple function film, can be applied to EMI, flexible circuit board, industries such as optical coating.At present, the vacuum magnetic-control sputtering coating equipment of widespread usage is big to being made up of vacuum chamber, vacuum acquiring system, reel system, sputtering target system and automatic control system.Its schedule of operation is as follows: material loading-pass door for vacuum chamber-Kai mechanical pump is taken out black vacuum-Kai diffusion pump and is taken out local vacuum-fill Ar air to open target power supply-explained hereafter-stop mechanical pump (diffusion pump continues heating)-next working cycle.
Above-mentioned vacuum magnetic-control sputtering coating equipment is the required metal level of single face sputter on the web-like base material, have following shortcoming: (one), coating equipment vacuum cavity are selected square cavity usually for use, vacuum acquiring system is selected the oil diffusion pump system for use, be distributed in the both sides of vacuum chamber, this distribution form causes the interior vacuum tightness of vacuum chamber inhomogeneous, thereby causes forming sputtering film thickness also inhomogeneous; Oil diffusion pump often returns oily phenomenon, form oil film on the workpiece base material that can be in vacuum chamber, causes between sputter rete and the base material bonding force poor; The oil diffusion pump power consumption is bigger in addition, because its control mode is switching value control, so even also can only full power output when making the technology pumping speed and diminish, energy consumption be very big.(2), usually only dispose a cover unwinding and rewinding system, so can only roll up inefficiency by sputter one.(3), only supporting sputtering target usually, do not match ion source and handle, when some base material of plating, can cause between rete and the base material stripping strength not enough.
The utility model content
The purpose of this utility model is can twoly roll up sputter in order to overcome the deficiency that above-mentioned vacuum magnetic-control sputtering coating equipment exists, to provide, and sputtered layer directly combines closely with base material, a kind of vacuum magnetron sputtering coil film coating apparatus that improves the quality of products, saves energy and reduce the cost.
The utility model is achieved in that a kind of vacuum magnetron sputtering coil film coating apparatus, comprise vacuum cavity, vacuum acquiring system, the target utmost point and unwinding and rewinding system, vacuum cavity is provided with vacuum acquiring system, vacuum acquiring system makes vacuum cavity inside be vacuum state when work, the intravital magnetron sputtering area of vacuum chamber is provided with the target utmost point of magnetron sputtering, and the target utmost point of magnetron sputtering is provided with two rows, and the magnetron sputtering area both sides are respectively arranged with the unwinding and rewinding system.
Described unwinding and rewinding system by unreeling shaft, Scroll, guide roller, tensioning roller, go up drive roll and following drive roll is formed, base material in the unreeling shaft enters magnetron sputtering area by guide roller, tensioning roller and following drive roll, the base material that magnetron sputtering area is come out through last drive roll, tensioning roller and guide roller rolling in Scroll.
Described vacuum acquiring system can be molecular pump, and having guaranteed does not have the phenomenon of returning oil in the vacuum chamber.
Be provided with the deep cooling water trap in the described vacuum cavity,, thereby improved working efficiency with the pumping speed of raising to base material venting in the continuous coating process.
Described deep cooling water trap can cryopump.
Be provided with the ion source treatment unit between described drive roll down and the magnetron sputtering area inlet,, improve the substrate surface roughness, guarantee the stripping strength between rete and the base material substrate surface is carried out ion bombardment.
Have in the described vacuum cavity and be circular vacuum chamber.
Compared with prior art, the advantage that the utlity model has is: (1) vacuum cavity can not form the dead angle of bleeding for circular, and vacuum tightness is even; Vacuum acquiring system is that molecular pump does not have oil system, has guaranteed not have in the vacuum chamber and has returned oil; The cryopump of configuration improves the pumping speed to base material venting in the continuous coating process, thereby has improved working efficiency.(2) adopt two unwinding and rewinding system, can satisfy wide two-sided plating of volume of magnetron sputtering area full width and two volume single faces platings; Also can satisfy two wide volume plating single face and two-sided platings of plating district half range, complete function.(3) establish the ion source treatment unit entering the magnetron sputtering area place, substrate surface is carried out ion bombardment, improve the substrate surface roughness, guarantee the stripping strength between rete and the base material.
Description of drawings
Fig. 1 is a kind of vacuum magnetron sputtering coil film coating apparatus structural representation of the utility model;
Fig. 2 is structural representation Fig. 1 of unwinding and rewinding system;
Fig. 3 is structural representation Fig. 2 of unwinding and rewinding system;
Fig. 4 is structural representation Fig. 3 of unwinding and rewinding system;
Fig. 5 is structural representation Fig. 4 of unwinding and rewinding system;
Fig. 6 is structural representation Fig. 5 of unwinding and rewinding system;
Fig. 7 is the structural texture synoptic diagram between the target utmost point, unwinding and rewinding system and the vacuum cavity;
Fig. 8 is the vacuum cavity structural representation.
Embodiment
Below in conjunction with the drawings and specific embodiments a kind of vacuum magnetron sputtering coil film coating apparatus of the utility model is described in detail.
A kind of vacuum magnetron sputtering coil film coating apparatus, as Fig. 1, Fig. 7 and shown in Figure 8, comprise vacuum cavity 16, vacuum acquiring system 1, the target utmost point 7, the target utmost point 7 and unwinding and rewinding system 15, vacuum cavity 16 is provided with vacuum acquiring system 1, vacuum acquiring system 1 makes vacuum cavity 16 inside be vacuum state when work, and the magnetron sputtering area in the vacuum cavity 16 is provided with the target utmost point 7 of magnetron sputtering.The target utmost point 7 of magnetron sputtering is provided with two rows, and two row's target utmost points 7 can also can be the alternative form setting for form setting relatively.The magnetron sputtering area both sides are respectively arranged with unwinding and rewinding system 15.The target utmost point 7 is arranged in the target utmost point car 14, and target utmost point car 14 is connected with rear flange 13 movable sealings of vacuum cavity 16.Unwinding and rewinding system 15 vacuum cavities 16 also are that movable sealing connects.In order to make unwinding and rewinding system 15 and target utmost point car 14 aspect the unlatching, be arranged with guide rail 17 at vacuum cavity 16 in vacuum cavity 16, unwinding and rewinding system 15 and target utmost point car 14 are installed on the guide rail 17.Unwinding and rewinding system 15 is made up of unreeling shaft 2, Scroll 4, guide roller 5, tensioning roller 6, last drive roll 8 and following drive roll 9, base material in the unreeling shaft 2 enters magnetron sputtering area by guide roller 5, tensioning roller 6 and following drive roll 9, the base material that magnetron sputtering area is come out through last drive roll 8, tensioning roller 6 and guide roller 5 rollings in Scroll 4.Have circular vacuum chamber in the vacuum cavity 16, install around it at least 2 can arbitrarily angled installation vacuum acquiring system 1.Vacuum acquiring system 1 can be selected molecular pump for use.Deep cooling water trap 12 has been installed in the vacuum cavity 16, and deep cooling water trap 12 can cryopump.Cryopump has improved the pumping speed to base material venting in the continuous coating process, thereby has improved working efficiency.Be provided with ion source treatment unit 3 between drive roll 9 and the magnetron sputtering area inlet down,, improving the substrate surface roughness, guaranteeing the stripping strength between rete and the base material substrate surface is carried out ion bombardment.
The two cover unwinding and rewinding systems that are provided with can satisfy wide two-sided plating of volume of plating district full width and two volume single face platings.The plating district can be designed to 200～2300mm as required, promptly can carry out single face or double-faced sputter to the wide base material of 200～2300mm.The rolls line that detours has as Fig. 3～embodiment shown in Figure 6.Generally speaking, when single face or two-sided plating, unreeling shaft 2 unreels base material through guide roller 5, tensioning roller 6, guide roller 5 and following drive roll 9, after the ion source of ion source treatment unit 3 is handled, enter in the magnetron sputtering area through sputtering target 7 sputters, then just through last drive roll 8, guide roller 5, tensioning roller 6 and guide roller 5 rollings in Scroll 4.Unreeling shaft 2 and Scroll 4 can be provided with two respectively, the setting of can arranging in pairs or groups arbitrarily of unreeling shaft 2 and Scroll 4.Also can carry out single face plating to two volume base materials, the circuit of specifically reeling is referring to as shown in Figure 2, and promptly two unwinding and rewinding are opened simultaneously, and wherein unreeling shaft 2 is put a volume, and another unreeling shaft 2 is put a volume.Also can be used for width distinguishes the two volume base materials plating single faces of half or plates two-sided for plating.Two unwinding and rewinding system makes the vacuum plating pattern of base material have multiple choices, has strengthened the function of this vacuum magnetron sputtering coil film coating apparatus, satisfies the different requirements of various plating pieces.
Claims (8)
1, a kind of vacuum magnetron sputtering coil film coating apparatus, comprise vacuum cavity, vacuum acquiring system, the target utmost point and unwinding and rewinding system, it is characterized in that: vacuum cavity is provided with vacuum acquiring system, the intravital magnetron sputtering area of vacuum chamber is provided with the target utmost point of magnetron sputtering, the target utmost point of magnetron sputtering is provided with two rows, is respectively arranged with the unwinding and rewinding system in the magnetron sputtering area both sides.
2, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1, it is characterized in that: described unwinding and rewinding system by unreeling shaft, Scroll, guide roller, tensioning roller, go up drive roll and following drive roll is formed, base material in the unreeling shaft enters magnetron sputtering area by guide roller, tensioning roller and following drive roll, the base material that magnetron sputtering area is come out through last drive roll, tensioning roller and guide roller rolling in Scroll.
3, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: described vacuum acquiring system is a molecular pump.
4, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: be provided with the deep cooling water trap in the described vacuum cavity.
5, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 4 is characterized in that: described deep cooling water trap is a cryopump.
6, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: be provided with the ion source treatment unit between described drive roll down and the magnetron sputtering area inlet.
7, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: described vacuum cavity is for circular.
8, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: the described target utmost point is provided with two rows, two very alternative form settings of row's target.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200512875U CN201358299Y (en) | 2009-02-17 | 2009-02-17 | Vacuum magnetron-sputtering type winding film-coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200512875U CN201358299Y (en) | 2009-02-17 | 2009-02-17 | Vacuum magnetron-sputtering type winding film-coating device |
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| Publication Number | Publication Date |
|---|---|
| CN201358299Y true CN201358299Y (en) | 2009-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNU2009200512875U Expired - Lifetime CN201358299Y (en) | 2009-02-17 | 2009-02-17 | Vacuum magnetron-sputtering type winding film-coating device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101492809B (en) * | 2009-02-17 | 2012-02-01 | 广州力加电子有限公司 | Vacuum magnetron sputtering coil film coating apparatus |
| CN103741109A (en) * | 2013-12-31 | 2014-04-23 | 北京工业大学 | Device and method for continuously coating fiber with metallic conductive function film through magnetron sputtering |
| CN107841723A (en) * | 2017-10-30 | 2018-03-27 | 深圳市西陆光电技术有限公司 | One kind is without glue flexible double copper-clad plate processing DC sputtering device |
| CN107841718A (en) * | 2017-10-30 | 2018-03-27 | 深圳市西陆光电技术有限公司 | One kind is without glue double side flexible copper coated board production equipment |
-
2009
- 2009-02-17 CN CNU2009200512875U patent/CN201358299Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101492809B (en) * | 2009-02-17 | 2012-02-01 | 广州力加电子有限公司 | Vacuum magnetron sputtering coil film coating apparatus |
| CN103741109A (en) * | 2013-12-31 | 2014-04-23 | 北京工业大学 | Device and method for continuously coating fiber with metallic conductive function film through magnetron sputtering |
| CN107841723A (en) * | 2017-10-30 | 2018-03-27 | 深圳市西陆光电技术有限公司 | One kind is without glue flexible double copper-clad plate processing DC sputtering device |
| CN107841718A (en) * | 2017-10-30 | 2018-03-27 | 深圳市西陆光电技术有限公司 | One kind is without glue double side flexible copper coated board production equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGZHOU FANGBANG ELECTRONICS CO., LTD. Free format text: FORMER OWNER: GUANGZHOU LIJIA ELECTRONIC CO., LTD. Effective date: 20141231 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510000 GUANGZHOU, GUANGDONG PROVINCE TO: 510660 GUANGZHOU, GUANGDONG PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20141231 Address after: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou, Sixth Patentee after: Guangzhou Fangbang Electronic Co., Ltd. Address before: 510000, room second, floor 182, Innovation Zone, No. 204 science Avenue, Guangzhou Science Town, Guangdong, Guangzhou, Patentee before: Guangzhou Lijia Electronic Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou, Sixth Patentee after: GUANGZHOU FANGBANG ELECTRONICS CO., LTD. Address before: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou, Sixth Patentee before: Guangzhou Fangbang Electronic Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20091209 |
|
| CX01 | Expiry of patent term |