CN201332093Y - Circuit baseboard and circuit board module - Google Patents
Circuit baseboard and circuit board module Download PDFInfo
- Publication number
- CN201332093Y CN201332093Y CNU2008201550507U CN200820155050U CN201332093Y CN 201332093 Y CN201332093 Y CN 201332093Y CN U2008201550507 U CNU2008201550507 U CN U2008201550507U CN 200820155050 U CN200820155050 U CN 200820155050U CN 201332093 Y CN201332093 Y CN 201332093Y
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- pin
- circuit
- concavity
- circuit substrate
- board module
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Abstract
The utility model relates to a circuit baseboard and a circuit board module. The circuit baseboard comprises a top part and a bottom part, wherein, the top part and the bottom part are positioned on two opposite sides of the circuit baseboard; the top part comprises at least one line layer; the bottom part comprises at least one line layer; a plurality of concave pins are formed on at least one side of the bottom part; and conducting lines or electronic elements are distributed in an area where the top part is aligned with the concave pins. The circuit baseboard can improve the effective wiring area and the bonding force between the pins and soldering tin. The utility model also provides the circuit board module comprising the circuit baseboard.
Description
Technical field
The present invention relates to a kind of circuit board, particularly relate to a kind of electronic package substrate, and the circuit board module that is packaged with electronic component.
Background technology
At present, the electronic product structure function is complicated day by day, and it is more and more wider to involve technological layer, and the dealer also can't handle all technological layers separately, so electronic product tends to the modularization direction gradually and develops.Each dealer may only be absorbed in a certain technical field face research and development and produce the corresponding function module, for example wireless communication module, GPS module.And the downstream dealer these functional modules is provided can provide high degree of integration, multi-functional electronic product to the user.
These functional modules are packaged in the electric substrate usually, have a plurality of pins in the circuit substrate, are used for being connected with main circuit board.When assembling, can these functional modules be installed to circuit board group by various encapsulation technologies (for example modal surface mounting technology).For example, be formed with the pin in the sawtooth hole (or title " stamp hole ") of similar around stamp on the side of circuit substrate in early days.This kind pin side can form with scolding tin and be connected, and adhesion is strong therefore and between scolding tin, yet owing to this pin is distributed in around the circuit substrate, takies the wiring area of circuit substrate, is unfavorable for dwindling the circuit substrate area.
For promoting the circuit substrate utilance, people develop the form (being the quad flat formula) that pin is arranged on the circuit substrate bottom surface.This kind pin does not take the circuit board wiring area, and circuit substrate can be made forr a short time.Yet, a little less than the adhesion, may cause signal transmission reliability lower therefore and between the scolding tin because this kind pin side can't eat tin.
This shows that above-mentioned existing circuit substrate obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of circuit substrate and circuit board module of new structure, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing circuit substrate exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of circuit substrate and the circuit board module of founding a kind of new structure, can improve general existing circuit substrate, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
The objective of the invention is to, overcome the defective that existing circuit substrate exists, and a kind of circuit substrate of new structure is provided, technical problem to be solved is to make it can promote effective wiring area, also can promote adhesion between its pin and the scolding tin, be very suitable for practicality.
Another object of the present invention is to, overcome the defective that existing circuit board module exists, and a kind of circuit board module of new structure is provided, technical problem to be solved is to make it can promote effective wiring area, also can promote adhesion between its pin and the scolding tin, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of circuit substrate according to the present invention's proposition, it comprises the top and bottom that lays respectively at relative both sides, this top and this bottom comprise at least one layer of line layer respectively, be formed with at least one concavity pin at least one side of this bottom, the area distribution that this top is aligned in this at least one concavity pin has circuit.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid circuit substrate, align mutually with the side of this bottom in the side at wherein said top.
Aforesaid circuit substrate, wherein said at least one concavity pin is concave arc shape.
Aforesaid circuit substrate, wherein said at least one concavity pin only runs through this bottom and joins with this top.
Aforesaid circuit substrate, wherein said at least one concavity pin is when being provided with when a plurality of, and these a plurality of concavity pins are arranged in parallel.
Aforesaid circuit substrate, wherein said bottom comprises a groove, is provided with circuit in this groove.
Aforesaid circuit substrate, there is at least one recess face the side around the wherein said groove, and this at least one concavity pin more comprises the conductive layer that is formed at this at least one recess face.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of circuit board module according to the present invention's proposition, it comprises a circuit substrate, this circuit substrate comprises the top and bottom that lays respectively at relative both sides, this top and bottom comprises at least one layer of line layer respectively, be formed with at least one concavity pin at least one side of this bottom, the area distribution that this top is aligned in this at least one concavity pin has circuit.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid circuit board module, align mutually with the side of this bottom in the side at wherein said top.
Aforesaid circuit board module, wherein said at least one concavity pin is concave arc shape.
Aforesaid circuit board module, wherein said at least one concavity pin only run through this bottom and join with this top.
Aforesaid circuit board module, wherein said at least one concavity pin is when being provided with when a plurality of, and these a plurality of concavity pins are arranged in parallel.
Aforesaid circuit board module, wherein said bottom comprises a groove, is provided with circuit in this groove.
Aforesaid circuit board module, there is at least one recess face the side around the wherein said groove, and this at least one concavity pin more comprises the conductive layer that is formed at this at least one recess face.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, for achieving the above object, the invention provides a kind of circuit substrate, it comprises the top and bottom of its relative both sides, position respectively, this top and bottom comprises at least one layer of line layer respectively, be formed with a plurality of concavity pins at least one side of this bottom, the zone that this top is aligned in those concavity pins is feasible can distribute conducting wire or an electronic component of configuration.
In preferred embodiment of the present invention, above-mentioned pin is concave arc shape.
In preferred embodiment of the present invention, above-mentioned pin two ends can be respectively join with the end face and the bottom surface of this bottom, or join with one or more layers circuit in the bottom, or only join with the output pin layer of bottom surface.
In preferred embodiment of the present invention, be formed with a plurality of recess faces in the side of above-mentioned bottom, this pin comprises the conductive layer that is formed at this recess face.
The present invention also proposes a kind of circuit board module, it comprises a circuit substrate, this circuit substrate comprises the top and bottom of its relative both sides, position respectively, this top and bottom comprises at least one layer of line layer respectively, be formed with a plurality of concavity pins at least one side of this bottom, the area distribution that this top is aligned in those concavity pins has conducting wire or electronic component.
By technique scheme, circuit substrate of the present invention and circuit board module have following advantage and beneficial effect at least:
The present invention forms the concavity pin at the place, side of circuit substrate bottom, and at first, concavity pin side helps adhesion between raising and the scolding tin; Secondly, the top is aligned in the zone of this concavity pin still can lay conducting wire or electronic component, and the circuit substrate area that effectively connects up increases.
In sum, the invention relates to a kind of circuit substrate and circuit board module.This circuit substrate, it comprises the top and bottom that lays respectively at the relative both sides of circuit substrate, top and bottom comprises at least one layer of line layer respectively, is formed with a plurality of concavity pins at least one side of bottom.The zone that the top is aligned in a plurality of concavity pins is feasible can distribute conducting wire or an electronic component of configuration.This circuit substrate can promote adhesion between effective wiring area and pin and the scolding tin.The present invention also provides a kind of circuit board module that comprises the foregoing circuit substrate.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing circuit substrate has the outstanding effect of enhancement, thereby being suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
The circuit substrate side schematic diagram that Fig. 1 provides for present embodiment.
Fig. 2 is the circuit substrate vertical view of Fig. 1.
Fig. 3 is the circuit substrate decomposing schematic representation of Fig. 1.
The circuit board module vertical view of Fig. 4 for providing according to one embodiment of the invention.
The circuit board module vertical view of Fig. 5 for providing according to another embodiment of the present invention.
Fig. 6 A is the upward view of circuit board module according to an embodiment of the invention.
Fig. 6 B is the side sectional view of the hatching DD ' gained in Fig. 6 A.
Fig. 7 A is the upward view of circuit board module according to another embodiment of the present invention.
Fig. 7 B is the side sectional view of the hatching EE ' gained in Fig. 7 A.
100: circuit substrate
10,670: the top
12,600: the bottom
62,120: the side of bottom
111: the end face at top
112: the bottom surface at top
110: the side at top
121: the end face of bottom
122: the bottom surface of bottom
130: the recess face
132: pin
200,300: circuit board module
201,620,672,674: circuit
612,614: I/O pin position
612a, 614a, 720a: bottom conductive part
612b, 614b, 720b: the conductive layer on the recess face
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to circuit substrate and its embodiment of circuit board module, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can be known to present in the following detailed description that cooperates with reference to graphic preferred embodiment.By the explanation of embodiment, when can being to reach technological means that predetermined purpose takes and effect to get one more deeply and concrete understanding to the present invention, yet appended graphic only provide with reference to the usefulness of explanation, be not to be used for the present invention is limited.
Consult Fig. 1, Fig. 2 and shown in Figure 3, it is respectively circuit substrate side figure, vertical view and decomposing schematic representation according to one embodiment of the invention.As seen from the figure, the circuit substrate 100 that provides of present embodiment comprises top 10 and the bottom 12 that is superimposed with each other.Top 10 lays respectively at circuit substrate 100 end faces and bottom surface with bottom 12.Top 10 is rectangular substantially with bottom 12.Top 10 has four sides 110, end face 111 and bottom surface 112, and bottom 12 has four sides 120, end face 121 and bottom surface 122.Top 10 is rough identical with bottom 12 outer contour shapes size, and aligns mutually with the side of bottom 12 in top 10.That is four sides 120 of bottom 12 are positioned at the same side of circuit substrate 100 respectively with 10 corresponding sides 110, top.Top 10 can comprise one or more layers line layer or functional layer (for example output pin layer of screen, power supply accommodating layer, ground plane layer, circuit articulamentum or module or the like) respectively with bottom 12.The line layer that comprises in top 10 and the bottom 12 or the number of plies of functional layer can be identical, also can be different.For example, bottom 12 also can only comprise one deck line layer, and top 10 comprises multilayer line layer and functional layer.
In the present embodiment, the end face 121 of bottom 12 fits in the bottom surface 112 at top 10.Four sides 120 are vertical with end face 121 and bottom surface 122.Be formed with a plurality of recess faces 130 in each side 120, recess face 130 extends to bottom surface 122 from end face 121, that is recess face 130 two ends join with the end face 121 and the bottom surface 122 of bottom 12 respectively.
Be formed with pin 132 on each recess face 130.Pin 132 is formed by the conductive layer (for example copper coating) that is deposited on the recess face 130.Pin 132 can be used for the transmission of all kinds of electronic signals, for example provides power supply, input or output signal etc. to circuit substrate 100.Because top 10 setting of aliging with bottom 12, so recess face 130 and pin 132 edges fall in the bottom surface 112 at top 10 perpendicular to the projection meeting on the direction of the end face 121 of bottom 12.Be understandable that recess face 130 and pin 132 also can only be formed on the part side 120 of bottom 12, but not recess face 130 and pin 132 all need be provided on whole side 120.
In the circuit substrate 100 that present embodiment provided, the bottom has a plurality of recess faces 130 in 12 the side 120, is formed with concavity pin 132 in it, be with, when circuit substrate 100 and other circuit boards are assembled in the mode of scolding tin, this concavity pin 132 can provide better scolding tin adhesion.On the other hand because the side at top 110 does not form the recess face, so in the top 110 near the part at 110 places, side, still can lay various circuit corresponding to the part of pin 132 in other words, for example conducting wire, electronic component or integrated circuit etc.The design of " stamp hole " in the prior art, the area of circuit substrate 100 is fully utilized, so circuit substrate 100 can be made forr a short time.The circuit substrate of same area adopts the designer of present embodiment that more function can be provided in other words.
Consult shown in Figure 4, the circuit board module 200 that present embodiment provides be on the circuit substrate 100 of the foregoing description the encapsulation a plurality of circuit 201 form.Because recess face 130 only is formed at the bottom 12 of circuit substrate 100, so circuit 201 still can be laid in the zone that the end face 111 at circuit substrate 100 tops 10 is aligned in recess face 130.Be appreciated that in the internal layer circuit at top 10 and can lay circuit equally corresponding to the zone of recess face 130.Circuit 201 is to can be lead, resistance, electric capacity, inductance, integrated circuit, oscillating element or other active or passive component or the like.
Please refer to shown in Figure 5ly, it is the vertical view of the circuit board module that another embodiment of the present invention provided.Be with the different persons of embodiment shown in Figure 4, the circuit board module 300 in the present embodiment only therein a side be provided with aforesaid recess face 130, and utilize recess face 130 that pin is set; Relative, the mode of before having mentioned in existing known techniques place can be adopted in other sides of circuit board module 300, that is, pin is arranged on the form of circuit substrate bottom surface, relative pin is set.
Next please refer to shown in Fig. 6 A and Fig. 6 B, wherein, Fig. 6 A is the upward view of circuit board module according to an embodiment of the invention, and Fig. 6 B then is the side sectional view of the hatching DD ' gained in Fig. 6 A.Circuit board module 60 has bottom 600 and top 670.600 side 62 is provided with a plurality of I/ O pin position 612 or 614 in the bottom.Wherein, I/O pin position 612 has comprised the concavity pin of being made up of the conductive layer 612b that is coated with on bottom conductive part 612a and the recess face; Similarly, I/O pin position 614 has comprised the concavity pin of being made up of the conductive layer 614b that is coated with on bottom conductive part 614a and the recess face.On top 670, can be provided with a plurality of circuit 672 and 674.600 then comprise a groove 610 in the bottom.In groove 610, can be provided with circuit 620 and control terminal 630.Generally speaking, circuit 620,672 and 674 can be any or its combination of integrated circuit, electronic component or lead.
Though shown in Fig. 6 B, side 650 is smooth around the groove 610, in another embodiment, the side also can use the concavity pin as I/O pin position around the groove.See also shown in Fig. 7 A and Fig. 7 B, wherein, Fig. 7 A is the upward view of circuit substrate according to an embodiment of the invention, and Fig. 7 B then is the side sectional view of the hatching EE ' gained in Fig. 7 A.Present embodiment framework haply is identical with the embodiment shown in figure A and the B, does not repeat them here.Its difference be in, around groove 610, on the side 650, comprised at least more than one concavity pin, this concavity pin has comprised the conductive layer 720b that is coated with on bottom conductive part 720a and the recess face.In other words, also can use the project organization of similar stamp hole to form I/O pin position on the side 650 around the groove 610.
As mentioned above, in circuit board module of the present invention, by only one or more layers place, one or more side forms the concavity pin in the circuit substrate bottom, can between pin and scolding tin, provide good combination power when making the assembling of circuit board module and other circuit boards, still can be laid with electronic component or conducting wire and the circuit substrate top is aligned in the zone at pin place, make circuit board module can make forr a short time.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (14)
1, a kind of circuit substrate, it comprises the top and bottom that lays respectively at relative both sides, this top and this bottom comprise at least one layer of line layer respectively, it is characterized in that, be formed with at least one concavity pin at least one side of this bottom, the area distribution that this top is aligned in this at least one concavity pin has circuit.
2, circuit substrate according to claim 1 is characterized in that the side at wherein said top aligns mutually with the side of this bottom.
3, circuit substrate according to claim 1 is characterized in that wherein said at least one concavity pin is concave arc shape.
4, circuit substrate according to claim 1 is characterized in that wherein said at least one concavity pin only runs through this bottom and joins with this top.
5, circuit substrate according to claim 1 is characterized in that wherein said at least one concavity pin when being provided with when a plurality of, and these a plurality of concavity pins are arranged in parallel.
6, circuit substrate according to claim 1 is characterized in that wherein said bottom comprises a groove, is provided with circuit in this groove.
7, circuit substrate according to claim 6 is characterized in that there is at least one recess face the side all around of wherein said groove, and this at least one concavity pin more comprises the conductive layer that is formed at this at least one recess face.
8, a kind of circuit board module, it is characterized in that it comprises a circuit substrate, this circuit substrate comprises the top and bottom that lays respectively at relative both sides, this top and bottom comprises at least one layer of line layer respectively, be formed with at least one concavity pin at least one side of this bottom, the area distribution that this top is aligned in this at least one concavity pin has circuit.
9, circuit board module according to claim 8 is characterized in that the side at wherein said top aligns mutually with the side of this bottom.
10, circuit board module according to claim 8 is characterized in that wherein said at least one concavity pin is concave arc shape.
11, circuit board module according to claim 8 is characterized in that wherein said at least one concavity pin only runs through this bottom and joins with this top.
12, circuit board module according to claim 8 is characterized in that wherein said at least one concavity pin when being provided with when a plurality of, and these a plurality of concavity pins are arranged in parallel.
13, circuit board module according to claim 8 is characterized in that wherein said bottom comprises a groove, is provided with circuit in this groove.
14, circuit board module according to claim 13 is characterized in that there is at least one recess face the side all around of wherein said groove, and this at least one concavity pin more comprises the conductive layer that is formed at this at least one recess face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201550507U CN201332093Y (en) | 2008-11-04 | 2008-11-04 | Circuit baseboard and circuit board module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201550507U CN201332093Y (en) | 2008-11-04 | 2008-11-04 | Circuit baseboard and circuit board module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201332093Y true CN201332093Y (en) | 2009-10-21 |
Family
ID=41225475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201550507U Expired - Lifetime CN201332093Y (en) | 2008-11-04 | 2008-11-04 | Circuit baseboard and circuit board module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201332093Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103426845A (en) * | 2013-07-30 | 2013-12-04 | 陕西华经微电子股份有限公司 | Two-sided independent multi-pin self-locking circuit terminals |
| CN114034117A (en) * | 2021-10-29 | 2022-02-11 | 广东汇芯半导体有限公司 | Semiconductor circuit |
| US11317531B2 (en) | 2019-01-09 | 2022-04-26 | Altek Biotechnology Corporation | Microelectronic device and circuit board thereof |
-
2008
- 2008-11-04 CN CNU2008201550507U patent/CN201332093Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103426845A (en) * | 2013-07-30 | 2013-12-04 | 陕西华经微电子股份有限公司 | Two-sided independent multi-pin self-locking circuit terminals |
| US11317531B2 (en) | 2019-01-09 | 2022-04-26 | Altek Biotechnology Corporation | Microelectronic device and circuit board thereof |
| CN114034117A (en) * | 2021-10-29 | 2022-02-11 | 广东汇芯半导体有限公司 | Semiconductor circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: UNIVERSAL SCIENTIFIC INDUSTRIAL CO. TD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20100622 Address after: Zhangjiang hi tech park integrated circuit industry Zhang Road 201203 Shanghai City No. 1558 Patentee after: Huanxu Electronics Co., Ltd. Address before: Zhangjiang hi tech park integrated circuit industry Zhang Road 201203 Shanghai City No. 1558 Co-patentee before: Huanlong Electric Co., Ltd. Patentee before: Huanxu Electronics Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091021 |