CN206100593U - Multilayer circuit board - Google Patents
Multilayer circuit board Download PDFInfo
- Publication number
- CN206100593U CN206100593U CN201620543732.XU CN201620543732U CN206100593U CN 206100593 U CN206100593 U CN 206100593U CN 201620543732 U CN201620543732 U CN 201620543732U CN 206100593 U CN206100593 U CN 206100593U
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- copper
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- circuit board
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Abstract
The utility model relates to a multilayer circuit board, it includes the several cells layer body, a plurality of these elementary layer bodies are folded each other to establish and are formed this multilayer circuit board together, this elementary layer body of each layer all includes the first layer body and the second floor body, wherein, this first layer body is including first base plate layer and first copper layer, this first copper layer sets up on this first base plate layer top surface, this second floor body is including second base plate layer and second copper layer, this second copper layer sets up on this second base plate layer top surface, be provided with the insulating layer between this first layer body and this second floor body, this first copper layer sets up respectively in these insulating layer both sides with this second copper layer, keep apart this first copper layer with this second copper layer through this insulating layer.
Description
Technical field
The utility model is related to a kind of wiring board, particularly relates to a kind of be folded be located at together many each other by some elementary layer bodies
Sandwich circuit board.
Background technology
Circuit board can be described as printed substrate or printed circuit board (PCB), and wiring board is divided into single sided board if dividing by the number of plies, double
Panel, and three big classification of multilayer circuit board.First single sided board is that on most basic PCB, part concentrates one side wherein,
Wire is then concentrated on another side.Because wire is only present in wherein one side, this PCB is just claimed to be called one-sided circuit board.
Single sided board generally makes simple, low cost, but a disadvantage is that cannot be applied on too complicated product.Dual platen is single sided board
Extend, when individual layer wiring can not meet the needs of electronic product it is necessary to using dual platen.It is two-sided have cover copper and have cabling,
And the circuit between two-layer can be turned on by via, is allowed to form required network connection.Multi-layer sheet refers to have
More than three layers of conductive pattern layer is formed with insulating materials therebetween with being separated by lamination, and therebetween conductive pattern is interconnected on request
Printed board.Multilayer circuit board is electronic information technology to high speed, multi-functional, Large Copacity, small size, slimming, lightweight side
To the product of development.As circuit develops to less more accurate direction, very universal application in present industrial products
Multilayer circuit board, but for the current multilayer circuit board for occurring, its structure is all more complicated, and electrical connection and shakiness
It is fixed, and this is the major defect for conventional art.
Utility model content
Technical solution adopted in the utility model is：A kind of multilayer circuit board, it includes some elementary layer bodies, some to be somebody's turn to do
Elementary layer body is folded each other and is located at and formed together the multilayer circuit board, and each layer elementary layer body all includes ground floor body and second
Layer body, wherein, the ground floor body includes first substrate layer and the first layers of copper, and first layers of copper is arranged on the first substrate layer top
On face, the second layer body includes second substrate layer and the second layers of copper, and second layers of copper is arranged on the second substrate layer top surface.
Insulating barrier is provided between the ground floor body and the second layer body, first layers of copper sets respectively with second layers of copper
Put in the insulating barrier both sides, kept apart first layers of copper with second layers of copper by the insulating barrier, be embodied as when
Wait, the insulating barrier is insulating resin layer.
Some connection holes are provided with the elementary layer body, each connection hole intersects at first layers of copper
One aperture, each connection hole intersects at the second aperture with second layers of copper, in the inwall of each connection hole
On be both provided with the first connection sheet and the second connection sheet, wherein, first connection sheet is by first aperture and first bronze medal
Layer is connected, and second connection sheet is connected by second aperture with second layers of copper, is inserted in each connection hole
Guide pillar is provided with, first connection sheet and second connection sheet are wrapped on the outer surface of the guide pillar simultaneously, by the guide pillar, is somebody's turn to do
First connection sheet and second connection sheet are electrically connected first layers of copper with second layers of copper, be embodied as when
Wait, the guide pillar is hollow cylinder, when being embodied as, on the guide pillar outer surface some fins is convexly equipped with, with the fin phase
Correspondence, in first connection sheet and second connection sheet some grooves are provided with, and the fin is plugged in the groove.
The beneficial effects of the utility model are：The utility model is folded to be located at and formed together each other by some elementary layer bodies
The multilayer circuit board, and for each layer elementary layer body its pass through the guide pillar, first connection sheet and this second connect
Contact pin is electrically connected first layers of copper with second layers of copper, its simple structure, while can significantly be carried by the guide pillar
Rise the structural strength of wiring board.
Description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of the utility model guide pillar.
Specific embodiment
As shown in Fig. 1 to 2, a kind of multilayer circuit board, it includes some elementary layer bodies 10, and some elementary layer bodies 10 are each other
Folded being located at formed together the multilayer circuit board.
Each layer elementary layer body 10 all includes ground floor body 20 and second layer body 30, wherein, the ground floor body 20 is wrapped
The layers of copper 22 of first substrate layer 21 and first is included, first layers of copper 22 is arranged on the top surface of first substrate layer 21.
The second layer body 30 includes the layers of copper 32 of second substrate layer 31 and second, and second layers of copper 32 is arranged on second base
On the top surface of flaggy 31.
Insulating barrier 40 is provided between the ground floor body 20 and the second layer body 30.
First layers of copper 22 is separately positioned on the both sides of insulating barrier 40 with second layers of copper 32, should by the insulating barrier 40
First layers of copper 22 is kept apart with second layers of copper 32.
When being embodied as, the insulating barrier 40 is insulating resin layer.
Some connection holes 51 are provided with the elementary layer body 10.
Each connection hole 51 intersects at the first aperture 52 with first layers of copper 22, each connection hole 51
All intersect at the second aperture 53 with second layers of copper 32.
The first connection sheet 61 and the second connection sheet 62 are both provided with the inwall of each connection hole 51.Its
In, first connection sheet 61 is connected by first aperture 52 with first layers of copper 22, second connection sheet 62 by this
Two apertures 53 are connected with second layers of copper 32, and in each connection hole 51 guide pillar 70 is inserted with.
First connection sheet 61 and second connection sheet 62 are wrapped on the outer surface of the guide pillar 70 simultaneously.
By the guide pillar 70, first connection sheet 61 and second connection sheet 62 by first layers of copper 22 and second bronze medal
Layer 32 is electrically connected.
When being embodied as, the guide pillar 70 is hollow cylinder.
When being embodied as, some fins 71 are convexly equipped with the outer surface of guide pillar 70, it is corresponding with the fin 71,
Some grooves 72 are provided with first connection sheet 61 and second connection sheet 62, the fin 71 is plugged in the groove 72.
The utility model is folded to be located at and formed together the multilayer circuit board each other by some elementary layer bodies 10, and for every
It passes through the guide pillar 70, first connection sheet 61 and second connection sheet 62 by first bronze medal for one layer of elementary layer body 10
Layer 22 is electrically connected with second layers of copper 32, its simple structure, while can be obviously improved wiring board by the guide pillar 70
Structural strength.
Claims (4)
1. a kind of multilayer circuit board, it is characterised in that：Including some elementary layer bodies, some elementary layer bodies are folded be located at together each other
Form the multilayer circuit board, each layer elementary layer body all includes ground floor body and second layer body, wherein, the ground floor body bag
First substrate layer and the first layers of copper are included, first layers of copper is arranged on the first substrate layer top surface, the second layer body includes the
Two substrate layers and the second layers of copper, second layers of copper is arranged on the second substrate layer top surface, the ground floor body and this second
Insulating barrier is provided between layer body,
First layers of copper is separately positioned on the insulating barrier both sides with second layers of copper, by the way that the insulating barrier is by first layers of copper and is somebody's turn to do
Second layers of copper is kept apart,
Some connection holes are provided with the elementary layer body, each connection hole intersects at the first hole with first layers of copper
Mouthful, each connection hole intersects at the second aperture with second layers of copper, on the inwall of each connection hole
The first connection sheet and the second connection sheet are provided with, wherein, first connection sheet is by first aperture and the first layers of copper phase
Connection, second connection sheet is connected with second layers of copper by second aperture, is inserted with each connection hole
Guide pillar, first connection sheet and second connection sheet are wrapped on the outer surface of the guide pillar simultaneously.
2. a kind of multilayer circuit board as claimed in claim 1, it is characterised in that：The guide pillar is hollow cylinder.
3. a kind of multilayer circuit board as claimed in claim 1, it is characterised in that：It is convexly equipped with the guide pillar outer surface some convex
Rib, it is corresponding with the fin, some grooves are provided with first connection sheet and second connection sheet, the fin is plugged in
In the groove.
4. a kind of multilayer circuit board as claimed in claim 1, it is characterised in that：The insulating barrier is insulating resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620543732.XU CN206100593U (en) | 2016-06-07 | 2016-06-07 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620543732.XU CN206100593U (en) | 2016-06-07 | 2016-06-07 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206100593U true CN206100593U (en) | 2017-04-12 |
Family
ID=58471164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620543732.XU Active CN206100593U (en) | 2016-06-07 | 2016-06-07 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206100593U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022141586A1 (en) * | 2020-12-31 | 2022-07-07 | 华为技术有限公司 | Signal switching structure and hardware-in-loop simulation testing system |
-
2016
- 2016-06-07 CN CN201620543732.XU patent/CN206100593U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022141586A1 (en) * | 2020-12-31 | 2022-07-07 | 华为技术有限公司 | Signal switching structure and hardware-in-loop simulation testing system |
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