CN201283688Y - Jig for stacking multilayer boards - Google Patents
Jig for stacking multilayer boards Download PDFInfo
- Publication number
- CN201283688Y CN201283688Y CNU2009201513790U CN200920151379U CN201283688Y CN 201283688 Y CN201283688 Y CN 201283688Y CN U2009201513790 U CNU2009201513790 U CN U2009201513790U CN 200920151379 U CN200920151379 U CN 200920151379U CN 201283688 Y CN201283688 Y CN 201283688Y
- Authority
- CN
- China
- Prior art keywords
- tool
- pin
- layer sheet
- superimposed
- tool plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009201513790U CN201283688Y (en) | 2009-04-20 | 2009-04-20 | Jig for stacking multilayer boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009201513790U CN201283688Y (en) | 2009-04-20 | 2009-04-20 | Jig for stacking multilayer boards |
Publications (1)
Publication Number | Publication Date |
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CN201283688Y true CN201283688Y (en) | 2009-08-05 |
Family
ID=40948673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2009201513790U Expired - Lifetime CN201283688Y (en) | 2009-04-20 | 2009-04-20 | Jig for stacking multilayer boards |
Country Status (1)
Country | Link |
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CN (1) | CN201283688Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105208804A (en) * | 2015-10-23 | 2015-12-30 | 北大方正集团有限公司 | Lamination positioning lower mold and upper mold, and positioning lamination method using molds |
CN105458628A (en) * | 2015-12-14 | 2016-04-06 | 谢兴龙 | Hole-drilling and automatic-adhesive-tape-wrapping production method of circuit board |
-
2009
- 2009-04-20 CN CNU2009201513790U patent/CN201283688Y/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105208804A (en) * | 2015-10-23 | 2015-12-30 | 北大方正集团有限公司 | Lamination positioning lower mold and upper mold, and positioning lamination method using molds |
CN105458628A (en) * | 2015-12-14 | 2016-04-06 | 谢兴龙 | Hole-drilling and automatic-adhesive-tape-wrapping production method of circuit board |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
DD01 | Delivery of document by public notice |
Addressee: Li Tonglin Document name: Notification to Pay the Fees |
|
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN KINWONG ELECTRONIC CO., LTD. Free format text: FORMER NAME: KINGWONG ELECTRONICS (SHENZHEN) CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 518126, No. 166, Reservoir Road, iron Gang village, West Village, Shenzhen, Guangdong, Baoan District Patentee after: Shenzhen Kinwong Electronic Co., Ltd. Address before: 518126, No. 166, Reservoir Road, iron Gang village, West Village, Shenzhen, Guangdong, Baoan District Patentee before: Kinwong Electronic (Shenzhen) Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20090805 |
|
CX01 | Expiry of patent term |