CN201181439Y - Heat radiating device of micro-computer main unit - Google Patents
Heat radiating device of micro-computer main unit Download PDFInfo
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- CN201181439Y CN201181439Y CNU2008200078913U CN200820007891U CN201181439Y CN 201181439 Y CN201181439 Y CN 201181439Y CN U2008200078913 U CNU2008200078913 U CN U2008200078913U CN 200820007891 U CN200820007891 U CN 200820007891U CN 201181439 Y CN201181439 Y CN 201181439Y
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- micro
- heat abstractor
- lid
- mainframe computer
- cover body
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- 230000000694 effects Effects 0.000 claims abstract description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000003032 molecular docking Methods 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 13
- 230000000994 depressogenic effect Effects 0.000 claims description 6
- 238000001816 cooling Methods 0.000 abstract 4
- 230000005855 radiation Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a cooling device of a microcomputer host, which comprises a base body, a cover body and a host unit, wherein the base body is provided with a bottom plate and two straight plates, and a caulking groove is arranged at one end of each straight plate respectively; the cover body is moveably combined with the base body, the two sides of the cover body extend downwards and correspond to the butting part arranged in the caulking groove in a sliding manner, and a plurality of cooling fins are arranged on the top surface of the cover body; and the host unit is arranged on the bottom surface of the cover body, and is provided with a circuit board; a heat-emitting electronic component which is in contact with the bottom surface of the cover body is arranged on one side of the circuit board; a storage unit, a connection interface, an electronic component and a key part are arranged on the other side of the circuit board. Therefore, the cooling device allows the heat source of the heat-emitting electronic device to be directly conducted to the cover body, and the heat source can be rapidly dissipated by utilizing the large-area contact formed by the cover body and the external environment, thereby achieving better cooling effect.
Description
Technical field
The utility model relates to a kind of heat abstractor of micro-mainframe computer, particularly relating to a kind of thermal source of heating electronic package that can allow directly conducts on lid, and utilize lid and external environment condition to form large-area the contact, and thermal source can be carried out quick dissipation, can reach the heat abstractor of the micro-mainframe computer of preferable heat radiation function.
Background technology
The radiator structure of general microcomputer, be on the main heating electronic package (central processing unit) of motherboard, to dispose a heat radiator, this heat radiator is to be covered on the main heating electronic package (central processing unit), and assembling is provided with a fan on this heat radiator in addition; The mode of its heat radiation is to draw the hot gas expansion heat source region that main heating electronic package (central processing unit) is produced by heat radiator, produce air-flow by assembling the fan blowing that is provided with on the heat radiator again, the hot-fluid of heat radiator is flowed, by this to reach the effect of heat radiation to the four directions.
But, because the enclosure interior of main frame is to belong to an enclosure space, and on this motherboard except main heating electronic package (central processing unit), remaining each spare part also can produce thermal source when operation, and in the enclosure space of this main frame housing inside, also can't directly fully hot gas be discharged outside the host shell, and make that hot gas can be in the inner loop of host shell, make that the radiating effect that is produced is not good, and can't reach the function of heat radiation fully, the frequent main heating electronic package (central processing unit) that produces has operational paradigm to reduce or work as the situation of machine because temperature is too high.Therefore, if the thermal source of the electronic package (central processing unit) that can will mainly generate heat directly dispels the heat, then certainly will be able to improve the relatively poor defective of radiating effect of the heat abstractor existence of the existing micro-mainframe computer of commonly using.
This shows that the heat abstractor of above-mentioned existing micro-mainframe computer obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of heat abstractor of micro-mainframe computer of new structure, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that the heat abstractor of above-mentioned existing micro-mainframe computer exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, heat abstractor in the hope of the micro-mainframe computer of founding a kind of new structure, can improve the heat abstractor of general existing micro-mainframe computer, make it have more practicality.Through constantly research, design, and, create the utility model that has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Fundamental purpose of the present utility model is, overcome the defective of the heat abstractor existence of existing micro-mainframe computer, and provide a kind of heat abstractor of micro-mainframe computer of new structure, technical matters to be solved is to make it can allow the thermal source of heating electronic package directly conduct on lid, and utilize lid and external environment condition to form large-area the contact, and thermal source is carried out quick dissipation, and can reach preferable heat radiation function, be very suitable for practicality.
The purpose of this utility model and to solve its technical matters be to adopt following technical scheme to realize.According to the heat abstractor of a kind of micro-mainframe computer that the utility model proposes, it comprises: a pedestal has a base plate at least, reaches the straight plate that vertically extends base plate two ends respectively; One lid is to combine with this pedestal activity, and can be provided with several dissipation fins on the end face of this lid; And a main computer unit, being arranged on the bottom surface of lid, this main computer unit has a circuit board at least, and the one side of this circuit board is provided with the heating electronic package that contacts with the lid bottom surface.
The purpose of this utility model and solve its technical matters and also can adopt following technical measures further to realize.
The heat abstractor of aforesaid micro-mainframe computer, the front and rear end of wherein said pedestal is respectively arranged with a panel.
The heat abstractor of aforesaid micro-mainframe computer, wherein said main computer unit are to cooperate most fixation kits and be fixed on the bottom surface of lid.
The heat abstractor of aforesaid micro-mainframe computer, the straight plate of wherein said base plate two the ends wherein lateral border of two straight plate one ends are respectively arranged with a caulking groove, and two sides of this lid are extended downwards respectively and are provided with corresponding the slip and are arranged at docking section in the caulking groove.
The heat abstractor of aforesaid micro-mainframe computer, the bottom of wherein said each caulking groove has the depressed part of an arc surfaced.
The heat abstractor of aforesaid micro-mainframe computer, wherein said each bottom, docking section is to have a cambered surface convex body.
The heat abstractor of aforesaid micro-mainframe computer, the another side of wherein said circuit board are provided with storage element, connectivity port, electronic package and button portion.
The heat abstractor of aforesaid micro-mainframe computer, wherein said heating electronic package is a central processing unit.
The utility model compared with prior art has tangible advantage and beneficial effect.Via as can be known above, in order to achieve the above object, the utility model provides a kind of heat abstractor of micro-mainframe computer, comprises a pedestal with base plate and two straight plates, and the lateral border of each straight plate one end is respectively arranged with a caulking groove; One lid that combines with the pedestal activity, its two side extend downwards respectively and are provided with corresponding the slip and are arranged at docking section in the caulking groove, and the end face of lid is provided with several dissipation fins; And a main computer unit that is arranged at the lid bottom surface, it has a circuit board, and this circuit board simultaneously is provided with the heating electronic package that contacts with the lid bottom surface, and the another side of circuit board is provided with storage element, connectivity port, electronic package and button portion.
By technique scheme, the heat abstractor of the utility model micro-mainframe computer has following advantage and beneficial effect at least: the utility model can effectively improve the various shortcoming of the heat abstractor existence of the existing micro-mainframe computer of commonly using, can allow the thermal source of central processing unit directly conduct on lid, and utilize lid and external environment condition to form large-area the contact, and thermal source can be carried out dissipation fast, can reach preferable heat radiation function, so make the technology of the utlity model has more progressive, more practical, more meet the required effect of user.
In sum, the utlity model has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and the heat abstractor of more existing micro-mainframe computer has the outstanding effect of enhancement, thereby is suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the exploded perspective synoptic diagram of the heat abstractor preferred embodiment of the utility model micro-mainframe computer.
Fig. 2 is the package assembly synoptic diagram of the heat abstractor preferred embodiment of the utility model micro-mainframe computer.
Fig. 3 is the diagrammatic cross-section of A-A section among the utility model Fig. 2.
Fig. 4 is the local enlarged diagram among the utility model Fig. 3.
1: pedestal 11: base plate
12: straight plate 13: caulking groove
131: depressed part 14: radiating fin
15: panel 151: fixation kit
2: lid 21: docking section
211: cambered surface convex body 22: radiating fin
3: main computer unit 31: circuit board
311: fixation kit 32: central processing unit
33: storage element 34: Port
35: electronic package 36: button portion
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of heat abstractor, structure, feature and effect thereof according to the micro-mainframe computer that the utility model proposes, describe in detail as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present utility model can clearly present in the following detailed description that cooperates with reference to graphic preferred embodiment.Explanation by embodiment, when can being to reach technological means that predetermined purpose takes and effect to get one more deeply and concrete understanding to the utility model, yet appended graphic only provide with reference to the usefulness of explanation, be not to be used for the utility model is limited.
See also Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4, Fig. 1 is the exploded perspective synoptic diagram of the heat abstractor preferred embodiment of the utility model micro-mainframe computer, Fig. 2 is the package assembly synoptic diagram, and Fig. 3 is the diagrammatic cross-section of A-A section among Fig. 2, and Fig. 4 is the local enlarged diagram among Fig. 3.The heat abstractor of the micro-mainframe computer of the utility model preferred embodiment comprises a pedestal, a lid and a main computer unit, wherein:
Above-mentioned pedestal 1, at least have a base plate 11 and the vertical respectively straight plate 12 that is arranged at base plate 11 2 ends that extends, and the lateral border of each straight plate 12 1 end is respectively arranged with a caulking groove 13 (as Fig. 1 and shown in Figure 3), and the bottom of each caulking groove 13 is provided with the depressed part 131 (as shown in Figure 4) of an arc surfaced.
Above-mentioned lid 2, be and pedestal 1 movable the combination, two sides of this lid 2 are extended downwards respectively and are provided with corresponding the slip and are arranged at docking section 21 in the caulking groove 13, and the bottom of each docking section 21 is provided with a cambered surface convex body 211, and can be provided with most radiating fins 22 on the end face of this lid 2.
Above-mentioned main computer unit 3, be arranged on the bottom surface of lid 2, this main computer unit 3 has a circuit board 31 at least, the one side of this circuit board 31 is provided with the main heating electronic package (as central processing unit 32) that contacts with lid 2 bottom surfaces, and the another side of this circuit board 31 is provided with storage element 33, connectivity port 34, electronic package 35 and button portion 36.
Combined by said structure, the heat abstractor of the micro-mainframe computer of formation the utility model one brand new.
When the utility model in when assembling, can cooperate most fixation kits 311 to be fixed on the bottom surface of lid 2 circuit board 31 of this main computer unit 3, and corresponding slip the in the docking section 21 of lid 2 two sides be arranged in each caulking groove 13 of pedestal 1, make the cambered surface convex body 211 of each 21 bottom, docking section and depressed part 131 tablings of caulking groove 13 bottoms, cooperate fixation kit 151 to be provided with a panel 15 respectively in the front and rear end of pedestal 1 more afterwards, make the panel 15 can lid 2 is spacing in addition, so, can be assembled into a micro-mainframe computer.
Certainly, fundamental purpose of the present utility model is to be, can allow the thermal source of heating electronic package directly conduct on casing, and utilize casing and external environment condition to form large-area the contact, and thermal source is carried out quick dissipation, be provided with most radiating fins so can also be designed to the side of pedestal 1, and main computer unit 3 is fixed on the base plate 11 of pedestal 1, and corresponding slip the in the docking section 21 of lid 2 two sides be arranged in each caulking groove 13 of pedestal 1, make the cambered surface convex body 211 of each 21 bottom, docking section and depressed part 131 tablings of caulking groove 13 bottoms, afterwards again before pedestal 1, rear end face cooperates fixation kit 151 to be provided with a panel 15 respectively, make the panel 15 can lid 2 is spacing in addition, so, also can be assembled into a micro-mainframe computer.
Moreover, the utility model also can also be set to cooperate most fixation kits 311 to be fixed on the bottom surface of lid 2 circuit board 31 of this main computer unit 3, and the docking section of lid 2 two sides is to be tabular surface, direct then fixation kit with majority, lid 2 is locked in base plate 11 2 ends to be set on the straight plate 12 of tabular surface equally, cooperate fixation kit 151 to be provided with a panel 15 respectively in the front and rear end of pedestal 1 more afterwards, make the panel 15 can lid 2 is spacing in addition, can be assembled into a micro-mainframe computer equally.
When main computer unit 3 starts, the thermal source that the main heating electronic package (as central processing unit 32) that is provided with on it then can produce, at this moment, mainly the thermal source on the heating electronic package (as central processing unit 32) then can be conducted to by the bottom surface of lid 2 on the end face, this thermal source is formed by lid 2 and set each several dissipation fins 22 thereof and external environment condition large-arealy directly to be contacted, and can fast thermal source be carried out dissipation, can reach preferable heat radiation function by this.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art are not in breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (8)
1, a kind of heat abstractor of micro-mainframe computer is characterized in that it comprises:
One pedestal has a base plate at least, reaches the straight plate that vertically extends base plate two ends respectively;
One lid is to combine with the pedestal activity, and can be provided with several dissipation fins on the end face of this lid; And
One main computer unit is arranged on the bottom surface of lid, and this main computer unit has a circuit board at least, and the one side of this circuit board is provided with the heating electronic package that contacts with the lid bottom surface.
2, the heat abstractor of micro-mainframe computer according to claim 1 is characterized in that the front and rear end of wherein said pedestal is respectively arranged with a panel.
3, the heat abstractor of micro-mainframe computer according to claim 1 is characterized in that wherein said main computer unit is to cooperate most fixation kits and be fixed on the bottom surface of lid.
4, the heat abstractor of micro-mainframe computer according to claim 1, the straight plate that the it is characterized in that wherein said base plate two ends wherein lateral border of two straight plate one ends is respectively arranged with a caulking groove, and two sides of this lid are extended downwards respectively and are provided with corresponding the slip and are arranged at docking section in the caulking groove.
5, the heat abstractor of micro-mainframe computer according to claim 4 is characterized in that the bottom of wherein said each caulking groove has the depressed part of an arc surfaced.
6, the heat abstractor of micro-mainframe computer according to claim 4 is characterized in that wherein said each bottom, docking section is to have a cambered surface convex body.
7, the heat abstractor of micro-mainframe computer according to claim 1 is characterized in that the another side of wherein said circuit board is provided with storage element, connectivity port, electronic package and button portion.
8, the heat abstractor of micro-mainframe computer according to claim 1 is characterized in that wherein said heating electronic package is a central processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200078913U CN201181439Y (en) | 2008-04-07 | 2008-04-07 | Heat radiating device of micro-computer main unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200078913U CN201181439Y (en) | 2008-04-07 | 2008-04-07 | Heat radiating device of micro-computer main unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201181439Y true CN201181439Y (en) | 2009-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200078913U Expired - Fee Related CN201181439Y (en) | 2008-04-07 | 2008-04-07 | Heat radiating device of micro-computer main unit |
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| Country | Link |
|---|---|
| CN (1) | CN201181439Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103809715A (en) * | 2012-11-15 | 2014-05-21 | 技嘉科技股份有限公司 | Electronic device |
-
2008
- 2008-04-07 CN CNU2008200078913U patent/CN201181439Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103809715A (en) * | 2012-11-15 | 2014-05-21 | 技嘉科技股份有限公司 | Electronic device |
| CN103809715B (en) * | 2012-11-15 | 2017-09-29 | 技嘉科技股份有限公司 | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090114 Termination date: 20120407 |