CN201142329Y

CN201142329Y - Plastic package type commutation module

Info

Publication number: CN201142329Y
Application number: CN 200820061778
Authority: CN
Inventors: 邓华鲜
Original assignee: LESHAN SHARE ELECTRONIC CO Ltd
Current assignee: Leshan Share Electronic Co.,Ltd.
Priority date: 2008-01-14
Filing date: 2008-01-14
Publication date: 2008-10-29
Anticipated expiration: 2018-01-14

Abstract

The utility model discloses a plastic encapsulated rectifier module with high power, and the rectifier module comprises a lead frame and pins connected with the lead frame into a whole body, wherein, the lead frame is arranged on a radiating fin which is encapsulated with an insulating molding compound layer on the surface, and the lead frame and the radiating fin integrally form the rectifier module through plastic encapsulation. The utility model adopts the integral formation through plastic encapsulation to coat the radiating fin and the lead frame in the insulating molding compound layer, thus, the epoxy molding compound layer is ensured to have even and identical smoothness and good material consistency, the compactness and the air tightness of the utility model are enabled to be better, the plastic encapsulation mode is adopted to encapsulate the insulating molding compound layer on the surface, the insulating molding compound layer is used for insulating and heat transferring, the thickness is less than that of the prior ceramic insulating strip, the smoothness is superior to that of the ceramic insulating strip in the prior rectifier module, and the radiating performance of the bottom is better, thereby reducing the surface temperature of a chip in the rectifier module, and prolonging the working life of the whole device.

Description

Plastic packaging type rectification module

Technical field

The utility model relates to a kind of semiconductor rectifier device, relates in particular to a kind of powerful plastic packaging type rectification module.

Background technology

Existing power rectifier module generally adopts the mode of embedding to utilize manual operation to carry out single production, during encapsulated moulding, the shell that framework is put into a finished product profile pours into liquid epoxy and promptly utilizes shell that epoxy and framework are wrapped up the formation finished product, having sticked with glue one deck potsherd on the outer casing bottom fin insulate and conducts heat, the encapsulating material of embedding bridge is two kinds of different liquid epoxy A, B material, needs proportionally to carry out the pairing that A, B expect after the heating.Adopt the rectification module of said method encapsulation mainly to have the following disadvantages: 1, technology falls behind: traditional pouring material mainly is epoxy resin and filler and curing agent, by the heating cure under normal pressure of artificial batching, make products air tightness and uniformity not good enough, directly influence the stability and the reliability of product; 2, quality control difficulty: because of tradition pouring encapsulation is by a plurality of artificial control operations such as artificial batching, manual waterings, product quality and employee's working experience, the qualification of level of skill are closely related, quality stability can fluctuate with operative employee's difference, and quality control is increased difficulty; 3, production cost height: because the pouring product is that the shell that the semi-finished product that sinter are put into a finished form is carried out embedding, and the shell cost accounts for 30% of entire product cost---and 40%, the material cost height; 4, poor stability: because of embedding power rectifier module bottom fin adopts the ceramic insulation sheet, the pottery good insulation preformance but heat transfer rate is slow, prolongation with the device operating time will cause the directly temperature of the inner GPP chip of influence of poor radiation temperature rising, directly cause chip failure after internal temperature is because of the PN junction junction temperature that is elevated to chip slowly of dispelling the heat.Owing to be to adopt manual watering's product, labor productivity is low, electric power energy consumption is high contradicts with the present national national policies such as automatic and mechanical production and energy savings of advocating.

Summary of the invention

The purpose of this utility model is to overcome the problems referred to above that existing rectification module exists, and a kind of powerful plastic packaging type rectification module is provided.The utility model adopts plastic packaging one-body molded, and stability and dielectric voltage withstand effect are better, and area of dissipation is big, and heat radiation is even, and thermal diffusivity is better, the mechanical strength height.

For achieving the above object, the technical solution adopted in the utility model is as follows:

A kind of plastic packaging type rectification module, comprise lead frame and with lead frame pin in aggregates, it is characterized in that: described lead frame is arranged on the fin, and described fin surface plastic packaging has the insulation plastic packaging bed of material, and described lead frame and fin are through plastic packaging integral molding rectification module.

Described fin and lead frame are wrapped in the insulation plastic packaging bed of material.

Also be provided with the plastic packaging epoxy partition between pin and pin on the described rectification module.

Described fin is a copper sheet.

Adopt advantage of the present utility model to be:

One, the utility model adopts the plastic packaging integral molding, and fin and lead frame are placed in the mould, adopts the plastic packaging press disposable with the epoxy-plastic packaging material compression molding, technology advanced person, labor productivity and the product quality of greatly having improved simple to operate.

Two, adopt the mode integral molding of plastic packaging, make the utility model air-tightness, compactness splendid, the dielectric voltage withstand effect is comparatively desirable, and the high/low-temperature impact performance is more stable.

Three, the fin surface plastic packaging has the insulation plastic packaging bed of material in the utility model, insulating radiation layer integral smoothness uniformity and thickness are lower than the thickness of existing rectification module ceramic insulation sheet, the radiating rate and the heat radiation uniformity of bottom fin have been improved, reduce the working temperature of radiating surface more rapidly and effectively, improve the reliability and stability of rectification module, prolonged the working life of device.

Four, also be provided with partition between pin and pin on the rectification module, when connection line or test, prevent the phenomenon that is short-circuited of collision mutually, and, increased the area of dissipation and the mechanical strength of rectification module because the area of partition is bigger.

Five, the utility model can bear the dielectric voltage withstand of 3000V, and the rectification module of producing than traditional handicraft bears and withstand voltagely improved 20%;

Six, the utility model adopts the plastic packaging mode, has saved an embedding shell than traditional handicraft, reduces about 30-40% on the whole product cost.

Description of drawings

Fig. 1 is the utility model structural representation

Fig. 2 is the utility model perspective view

Specific embodiment

A kind of powerful plastic packaging type rectification module, comprise lead frame and with lead frame pin 1 in aggregates, lead frame is arranged on the fin 2, at first at the surperficial plastic packagings insulation of the fin 2 plastic packaging bed of materials, again with lead frame and fin 2 through plastic packaging integral molding rectification module.Fin 2 and lead frame are wrapped in the insulation plastic packaging bed of material, also are provided with the plastic packaging heat radiation partition 3 between pin 1 and pin in the rectification module upper end.The utility model concrete structure is as follows: the bottom is a fin 2, it on the fin insulation plastic packaging bed of material, on the insulation plastic packaging bed of material is the semi-finished product lead frame of sintering, and epoxy-plastic packaging material promptly utilizes epoxy-plastic packaging material with fin 2, the lead frame moulding rectification module that fuses on semi-finished product lead frame and bottom fin plastic packaging.

By directly forming finished product behind the plastic packaging, the finished product front comprises five pins 1, is provided with partition 3 between pin and the pin, prevents to collide mutually the phenomenon that is short-circuited when connection line or test, because the area of partition 3 is bigger, increased the area of dissipation and the mechanical strength of entire device.

The utility model adopts the plastic packaging integral molding, fin 2 and lead frame are wrapped in the insulation plastic packaging bed of material, have guaranteed epoxy-plastic packaging bed of material evenness uniformity, internal density is even, make the utility model air-tightness, compactness splendid, the dielectric voltage withstand effect is comparatively desirable.Fin 2 and lead frame are wrapped in the insulation plastic packaging bed of material, fin 2 surfaces, bottom have one deck insulation plastic packaging bed of material evenness uniformity and thickness to be lower than the thickness of potsherd, improved the bottom heat dispersion, surface temperature when having reduced inner GPP chip operation prolongs the device working life; The utility model can bear the dielectric voltage withstand of 3000V, and the high/low-temperature impact performance is more stable.

Obviously; those of ordinary skill in the art is according to technological know-how of being grasped and customary means; according to above said content, can also make the various ways that does not break away from the utility model basic fundamental thought, these pro forma conversion are all within protection range of the present utility model.

Claims

1, a kind of plastic packaging type rectification module, comprise lead frame and with lead frame pin (1) in aggregates, it is characterized in that: described lead frame is arranged on the fin (2), the surperficial plastic packaging of described fin (2) has the insulation plastic packaging bed of material, and described lead frame and fin (2) are through plastic packaging integral molding rectification module.

2, plastic packaging type rectification module according to claim 1 is characterized in that: described fin (2) and lead frame are wrapped in the insulation plastic packaging bed of material.

3, plastic packaging type rectification module according to claim 1 is characterized in that: also be provided with the plastic packaging epoxy partition between pin and pin on the described rectification module.

4, according to claim 1,2 or 3 described plastic packaging type rectification modules, it is characterized in that: described fin (2) is a copper sheet.