CN201135014Y - 柔性印刷电路板金手指弯折测试装置 - Google Patents
柔性印刷电路板金手指弯折测试装置 Download PDFInfo
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- CN201135014Y CN201135014Y CNU2007200776412U CN200720077641U CN201135014Y CN 201135014 Y CN201135014 Y CN 201135014Y CN U2007200776412 U CNU2007200776412 U CN U2007200776412U CN 200720077641 U CN200720077641 U CN 200720077641U CN 201135014 Y CN201135014 Y CN 201135014Y
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CNU2007200776412U CN201135014Y (zh) | 2007-12-28 | 2007-12-28 | 柔性印刷电路板金手指弯折测试装置 |
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CNU2007200776412U CN201135014Y (zh) | 2007-12-28 | 2007-12-28 | 柔性印刷电路板金手指弯折测试装置 |
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CN201135014Y true CN201135014Y (zh) | 2008-10-15 |
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CNU2007200776412U Expired - Fee Related CN201135014Y (zh) | 2007-12-28 | 2007-12-28 | 柔性印刷电路板金手指弯折测试装置 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102520538A (zh) * | 2011-12-29 | 2012-06-27 | 友达光电(苏州)有限公司 | 焊点测试治具 |
CN102607963A (zh) * | 2012-02-29 | 2012-07-25 | 博罗县精汇电子科技有限公司 | 金手指弯折性能检验方法 |
CN108901128A (zh) * | 2018-08-26 | 2018-11-27 | 陈赵军 | 双面柔性pcb板 |
CN111929563A (zh) * | 2020-08-06 | 2020-11-13 | 珠海景旺柔性电路有限公司 | 新能源产品动态测试工装及动态测试方法 |
-
2007
- 2007-12-28 CN CNU2007200776412U patent/CN201135014Y/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102520538A (zh) * | 2011-12-29 | 2012-06-27 | 友达光电(苏州)有限公司 | 焊点测试治具 |
CN102520538B (zh) * | 2011-12-29 | 2014-07-02 | 友达光电(苏州)有限公司 | 焊点测试治具 |
CN102607963A (zh) * | 2012-02-29 | 2012-07-25 | 博罗县精汇电子科技有限公司 | 金手指弯折性能检验方法 |
CN108901128A (zh) * | 2018-08-26 | 2018-11-27 | 陈赵军 | 双面柔性pcb板 |
CN108901128B (zh) * | 2018-08-26 | 2021-12-28 | 深圳华秋电子有限公司 | 双面柔性pcb板 |
CN111929563A (zh) * | 2020-08-06 | 2020-11-13 | 珠海景旺柔性电路有限公司 | 新能源产品动态测试工装及动态测试方法 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI CHENXING SIM TECHNOLOGY ELECTRONIC TECHNO Free format text: FORMER NAME: SHANGHAI CHENXING ELECTRONICS SCIENCE + TECHNOLOGY CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: No. 888 Shengli Road, Qingpu District, Shanghai: 201700 Patentee after: Shanghai Sunrise Simcom Electronic Technology Co., Ltd. Address before: No. 888 Shengli Road, Qingpu District, Shanghai: 201700 Patentee before: Shanghai Chenxing Electronics Science & Technology Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081015 Termination date: 20141228 |
|
EXPY | Termination of patent right or utility model |