CN201063344Y - 硅链模块 - Google Patents

硅链模块 Download PDF

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Publication number
CN201063344Y
CN201063344Y CNU2007201105218U CN200720110521U CN201063344Y CN 201063344 Y CN201063344 Y CN 201063344Y CN U2007201105218 U CNU2007201105218 U CN U2007201105218U CN 200720110521 U CN200720110521 U CN 200720110521U CN 201063344 Y CN201063344 Y CN 201063344Y
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China
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rectifier diode
insulation shell
plate
upper cover
diode tube
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CNU2007201105218U
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English (en)
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范涛
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Zhejiang Guchi Electronics Co., Ltd.
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范涛
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

本实用新型涉及一种降压用硅链模块，它包括金属底板、整流二极管管芯、引出电极、绝缘壳体和上盖板；绝缘壳体下接相应金属底板、上接相应上盖板，金属底板设有安装孔；所述绝缘壳体内设有与金属底板连接的铝基覆铜板；多组整流二极管管芯由其上、下两端分别焊接的多个导电衬板串接，并通过其下端导电衬板焊接在铝基覆铜板上；绝缘壳体内灌封环氧树脂；中间引出电极和二个主引出电极分别向外伸出上盖板。它体积小、使用方便，并且价格低、可多个组合使用。

Description

硅链模块
技术领域
本实用新型涉及一种降压硅链，特别是一种降压用的硅链模块。
背景技术
降压硅链是由多只大功率整流二极管管芯串接而成，利用PN结基本恒定的正向压降来产生调整电压，通过改变串入线路的PN结数量来获得适当的压降，达到电压调节的目的。目前，直流屏上应用的普通降压硅链，都是将多个整流二极管管芯和散热片通过连接支架和螺杆挤压串接构成，其结构简单、散热效果好。但该普通结构的降压硅链存在着体积大、使用不方便等缺点。
发明内容
本实用新型针对上述问题，提供一种硅链模块，使其体积小、使用方便。
本实用新型所述的一种硅链模块，包括金属底板、整流二极管管芯、引出电极、绝缘壳体和上盖板；绝缘壳体下接相应金属底板、上接相应上盖板，金属底板设有安装孔；所述绝缘壳体内设有与金属底板连接的铝基覆铜板；多组整流二极管管芯由其上、下两端分别焊接的多个导电衬板串接，并通过其下端导电衬板焊接在铝基覆铜板上；绝缘壳体内灌封环氧树脂；中间引出电极和二个主引出电极分别向外伸出上盖板。
所述整流二极管管芯可为八组，每组整流二极管管芯为二只且并联，整流二极管管芯上端可设有五块导电衬板，下端可设有四块导电衬板。
本实用新型由于采用模块形式，通过环氧树脂将焊接在铝基覆铜板上串接的多组整流二极管管芯封装在绝缘壳体内，其体积较小，使用方便；所用的铝基覆铜板具有电绝缘性能好，导热性能高，价格较低。因此，本实用新型具有体积小和使用方便的优点，并且价格低、可多个组合使用。
附图说明
图1为本实用新型外形结构示意图。
图2为图1中A-A剖视结构示意图。
图3为图1中整流二极管管芯和下端导电衬板联结示意图。
图4为图1中上端导电衬板分布示意图。
图5为图1中内部电联结图。
具体实施方式
如图1、图2、图3、图4、图5所示，一种硅链模块，包括金属底板7、整流二极管管芯8、引出电极1、2和3、绝缘壳体5和上盖板4；绝缘壳体5下接相应金属底板7、上接相应上盖板4，金属底板7四角部各设有一个安装孔11，绝缘壳体5相应安装孔11的外缘上为内凹。
所述绝缘壳体5内设有与金属底板7连接的铝基覆铜板10；八组50A的整流二极管管芯8由其上、下两端分别焊接的导电衬板9构成串联连接，每组整流二极管管芯为二只且并联，整流二极管管芯8上端设有五块导电衬板9，下端设有四块导电衬板9。并通过其下端导电衬板9焊接在铝基覆铜板10刻蚀出的相应面上，并可涂上硅凝胶；绝缘壳体5内灌封环氧树脂11；一中间引出电极3和二个主引出电极1分别向外伸出上盖板4，其上端向内弯折并均设有紧定螺钉6，而且盖板上相应嵌设有连接螺母，引出电极均与金属底板绝缘。
所述金属底板7和导电衬板9分别为铝板和铜板。中间引出电极3相连的导电衬板9与中间二组整流二极管管芯8连接，二个主引出电极1和2相连的两导电衬板9分别与两端组的整流二极管管芯9连接。绝缘壳体5和铝基覆铜板10均可通过多个螺钉与金属底板7连接。本模块体积小、使用方便，绝缘耐压大，散热性好、价格低、可多个组合使用。

Claims (2)

1.一种硅链模块，包括金属底板、整流二极管管芯、引出电极、绝缘壳体和上盖板；绝缘壳体下接相应金属底板、上接相应上盖板，金属底板设有安装孔；其特征是：所述绝缘壳体内设有与金属底板连接的铝基覆铜板；多组整流二极管管芯由其上、下两端分别焊接的多个导电衬板串接，并通过其下端导电衬板焊接在铝基覆铜板上；绝缘壳体内灌封环氧树脂；中间引出电极和二个主引出电极分别向外伸出上盖板。
2.根据权利要求1所述的硅链模块，其特征是：所述整流二极管管芯为八组，每组整流二极管管芯为二只且并联，整流二极管管芯上端设有五块导电衬板，下端设有四块导电衬板。
CNU2007201105218U 2007-06-08 2007-06-08 硅链模块 Expired - Fee Related CN201063344Y (zh)

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CNU2007201105218U CN201063344Y (zh) 2007-06-08 2007-06-08 硅链模块

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103199067A (zh) * 2013-03-08 2013-07-10 程德明 铝基覆铜箔板制作主导热面的低热阻桥式整流器
CN104734499A (zh) * 2015-04-08 2015-06-24 湖南艾德迅电气工业有限公司 一种降压硅链和直流屏以及直流电源控制系统

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103199067A (zh) * 2013-03-08 2013-07-10 程德明 铝基覆铜箔板制作主导热面的低热阻桥式整流器
CN104734499A (zh) * 2015-04-08 2015-06-24 湖南艾德迅电气工业有限公司 一种降压硅链和直流屏以及直流电源控制系统

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Free format text: CORRECT: ADDRESS; FROM: 321402 INSIDE OF JINYUN SILICON COMPONENTS FACTORY, YANGSHAN INDUSTRY ZONE, XINJIAN TOWN, JINYUN COUNTY, ZHEJIANG PROVINCE TO: 321402 ZHEJIANG GUERTE ELECTRONICS CO., LTD., NO.3, JIANXI ROAD, XINJIAN TOWN, JINYUN COUNTY, ZHEJIANG PROVINCE

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Effective date of registration: 20100305

Address after: 321402 Zhejiang County of Jinyun Province Jian Zhen Jian Xi Road No. 3 Zhejiang guerte Electronics Co. Ltd.

Patentee after: Zhejiang Guchi Electronics Co., Ltd.

Address before: 321402 Jinyun silicon component factory in Yangshan Industrial Zone, Xinjian Town, Jinyun County, Zhejiang

Patentee before: Fan Tao

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080521

Termination date: 20160608