CN200981818Y - Glass substrate optical reading infrared sensor - Google Patents
Glass substrate optical reading infrared sensor Download PDFInfo
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- CN200981818Y CN200981818Y CN 200620125934 CN200620125934U CN200981818Y CN 200981818 Y CN200981818 Y CN 200981818Y CN 200620125934 CN200620125934 CN 200620125934 CN 200620125934 U CN200620125934 U CN 200620125934U CN 200981818 Y CN200981818 Y CN 200981818Y
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Abstract
A glass base optical readout infrared sensor is characterized in that the utility model employs the glass base which permeates the visible light and doesn't permeate the infrared ray; the glass base is provided with a mini-beam unit having the lateral supporting planar structure and comprises a hot deformation mechanism and an infrared absorption plate; the hot deformation mechanism has two groups which are symmetrically disposed on the two sides of the infrared absorption plate and compose the turning distribution through a hot insulation beam and a hot deformation beam; the hot deformation mechanism makes the inner side end to connect on the two sides of the infrared absorption plate and makes the outer side final stage beam end to arise and fix on the glass base through an anchor foot; the hot insulation beam is a non-metal film; the hot deformation beam forms a double material beam on an adhesive metal film of the non-metal film; the infrared absorption plate makes a reflecting surface as the surface facing the glass base; and the readout visible light permeates through the glass base and casts on the reflecting surface, and the infrared ray casts on the other surface directly. The utility model eliminates the framework structure, relieves the size contradiction that the hot deformation mechanism and the infrared absorption plate are on the same planar layer, and can effectively advance the infrared detection sensitivity.
Description
Technical field
The utility model relates to a kind of sensing element that is used to obtain and change the object infrared radiation signal, relates in particular to a kind of optical reading type thermal infrared image sensor based on micro-beam array.
Background technology
The peak value wave band of room temperature object infra-red radiation is the 8-14 micron, and the infrared imaging that is directed to this wave band mainly contains quantum type and pattern of fever imaging device.
The quantum type infrared imaging need freeze to the detector target surface, and additional refrigeration plant makes that whole device volume is heavy and costs an arm and a leg, and is unfavorable for civil nature and a large amount of popularizing.
The pattern of fever imaging device does not need refrigerating plant, has reduced volume, has reduced cost, has kept high accuracy, has a wide range of applications.The pattern of fever infreared imaging device of Shi Yonging is read pyroelectric signal on the detector array sensible heat pixel by electrical way in the market, obtains infrared image.Because the pyroelectric signal of being surveyed is very faint, integrated circuit will have quite high signal to noise ratio and very strong gain.Because employed plain conductor is connected the thermal resistance that has reduced the sensible heat pixel between sensible heat pixel and the substrate, thus the temperature rise when having reduced detection, and read current can produce additional heat on detector, and the result has reduced the temperature detectivity of thermal imaging.The design of simultaneously highly difficult reading circuit and the cost that making can make whole sniffer are very high.
And the bi-material microcantilevel array distortion that detects because of absorbing the infra-red radiation generation by optical reading method can not produce additional heat on detector, need not plain conductor and connects, and is easier to realize between probe unit and substrate good heat isolation.The infrared focal plane array that Univ California-Berkeley designs and produces (FPA) is for based on the bi-material microcantilevel of light-mechanical, stands on the nested array that forms on the silicon base by the anchor pin of standing is unsettled.The micro-cantilever unit of FPA (or being called for short micro-joist unit) is the sensing unit of infrared radiation detector, is made up of two kinds of materials that coefficient of thermal expansion is different, and double-material beam temperature after absorbing the incident infra-red radiation raises, and produces the thermic acoplanarity displacement.By optical pickup system, detect the acoplanarity displacement of INFRARED ABSORPTION plate in the micro-joist unit again, just can obtain the thermal radiation information of testee.Owing to kept silicon base in this structure, and visible light can not see through silicon base, thereby can only above micro-joist unit, introducing read light, allow infrared ray see through silicon base.But, when infrared ray through silicon base former and later two surperficial the time, reflex can take place, about 40% infrared ray can't arrive on the sensitive detection parts, this makes ultrared absorptivity seriously descend, and has reduced the sensitivity of sensitive detection parts.
(light-mechanical micro-beam array type thermal infrared image sensor, the patent No.: ZL200310112820.1), the bi-material microcantilevel device has been eliminated silicon base to the inventor, adopts the no bill kept on file tunic planar structure of lateral support in before patent of invention.Comprise hot isolation beams, thermal change ellbeam, brace summer and INFRARED ABSORPTION plate in the micro-joist unit, thermal deformation mechanism constitutes the formula of turning back by hot isolation beams and thermal change ellbeam and distributes, and each member all is positioned at same one deck.The thermal-induced deformation amount is the corner distortion of the INFRARED ABSORPTION plate of tested micro-joist unit front end.This version has avoided infrared ray through former and later two surperficial situations generations of silicon base because no silicon base, makes infrared ray can be directly to reach the surface of INFRARED ABSORPTION plate to have overcome the infrared ray loss, has significantly improved the sensitivity of sensitive detection parts.But, be subjected to the MEMS process limitation, require about 2 microns live width when making the micro-joist unit thermal deformation mechanism, promptly beam width and gap all require two microns.Because the planar dimension of sensible heat pixel is limited, particularly the sensible heat pixel of infra-red imaging array requires to arrange that there are contradiction in INFRARED ABSORPTION plate and thermal deformation mechanism less than 100 microns effectively in limited micro-joist unit planar dimension space usually.That is: in order to improve heat absorption efficiency, wish that INFRARED ABSORPTION plate area is big as far as possible; And in order to improve the distortion efficient of unit temperature rise, and increase the temperature rise that thermal resistance improves micro-joist unit, and need to increase the inflection number of thermal deformation mechanism again, improve the length of thermal change ellbeam and hot heat insulation beam.Therefore the micro-joist unit of single layer structure is subjected to the restriction of this contradiction, and its infrared acquisition sensitivity is difficult to further improve.
In addition, (light-mechanical micro-beam array type thermal infrared image sensor, the patent No.: ZL200310112820.1), micro-joist unit is suspended on the film framework in before patent of invention.When the micro-joist unit number increased gradually, integrally-built stability can decrease, and also may cause the shake of little beam reflector, produced optics and read noise, and then reduce the infrared acquisition sensitivity of system.Therefore, the FPA (as 1000 * 1000 even 2000 * 2000 pixels) for making big face battle array may bring new problem.
Summary of the invention
The purpose of this utility model is to provide a kind of more sensitive and effective glass substrate optical display infra-red sensor, eliminates frame structure, alleviates thermal deformation mechanism and the INFRARED ABSORPTION plate dimensional conflict at same plane layer.And by introducing the mode of reading light, can on the INFRARED ABSORPTION plate, make the eaves structure of resonant cavity and raising sensible heat unit dutycycle, further improve its infrared acquisition sensitivity from substrate of glass.
The utility model adopts following technical scheme to solve its technical problem:
Design feature of the present utility model is to adopt saturating visible light and adiathermanous substrate of glass, and the micro-joist unit with lateral support planar structure is set on substrate of glass; Micro-joist unit comprises thermal deformation mechanism and INFRARED ABSORPTION plate; Wherein, thermal deformation mechanism is two groups, is symmetricly set in the both sides of INFRARED ABSORPTION plate, and every group of thermal deformation mechanism constitutes the formula of turning back by at least one hot isolation beams and at least one thermal change ellbeam and distribute; Thermal deformation mechanism is fixed on the substrate of glass with the form of standing by the anchor pin with both sides, its outside final stage beam-ends that its medial extremity is connected the INFRARED ABSORPTION plate; Hot isolation beams is the non-metallic film of homogenous material; The thermal change ellbeam is the film formed double-material beam of adhesion metal on the upper surface of non-metallic film or lower surface; The INFRARED ABSORPTION plate is the one side towards substrate of glass with the reflective surface that it is attached with metal film; The visible light transmissive substrate of glass of reading is projected on the reflective surface, and infrared ray directly is projected on the another side.
Design feature of the present utility model also is:
In that hot isolation beams and at least one thermal change ellbeam formula of turning back distributes in the thermal deformation mechanism that is constituted with at least one, be to be provided with single hot isolation beams and single thermal change ellbeam space, the metal film in each thermal change ellbeam is on the surface of the same side of non-metallic film.
In that hot isolation beams and at least one thermal change ellbeam formula of turning back distributes in the thermal deformation mechanism that is constituted with at least one, turn back with at least two thermal change ellbeams and to constitute thermal change ellbeam group, in same thermal change ellbeam group on adjacent two thermal change ellbeams, metal film is on the surface of not homonymy of non-metallic film.
The INFRARED ABSORPTION plate is to be material to absorb infrared non-metallic film in the micro-joist unit, and the thickness of INFRARED ABSORPTION plate is 0.3～3um, and the thickness of hot isolation beams and thermal change ellbeam is 0.2～3um, and the distance of micro-joist unit and substrate of glass is 2～7um.
The INFRARED ABSORPTION plate constitutes the heat absorption resonant cavity by lower floor's reflector and upper strata heat absorption sounding board, is connected by reinforcement between the sounding board with absorbing heat at reflector, and distance therebetween is
N λ, wherein λ is the peak value that is detected infrared wavelength, n is a positive integer.
The thickness of lower floor's reflector and upper strata heat absorption sounding board is that the thickness of 0.3～3um, hot isolation beams and thermal change ellbeam is 0.2～3um, and the distance of micro-joist unit and substrate of glass is 2～7um.
In the both sides of upper strata heat absorption sounding board, extend the eaves structure that raising sensible heat unit dutycycle is set.
The mode forming array that the micro-joist unit employing is tiled in proper order forms infrared image sensor.
Compared with prior art, the utility model adopts in concrete design that micro-joist unit stand on the substrate of glass, the structure of lateral support, and can make resonant cavity and extend eaves structure on the INFRARED ABSORPTION plate, thereby the utlity model has following beneficial effect:
1, the utility model adopts visible light and adiathermanous substrate of glass, thereby the visible light of reading can be projected on the reflective surface through substrate of glass, infrared ray directly is projected on the another side, makes infrared energy directly arrive probe unit, has avoided the infrared energy loss.
2. the utility model is eliminated frame structure, and in the micro-joist unit planar dimension of setting, the total length of hot isolation beams and thermal change ellbeam or the area of INFRARED ABSORPTION plate can increase, thereby detectivity is improved.
3. the utility model can be by in two adjacent thermal change ellbeams, metal film is on the surface of not homonymy of non-metallic film, form " convertible " thermal change ellbeam, in the micro-joist unit planar dimension of setting, the total length of thermal change ellbeam can further increase, thereby the heat distortion amount of micro-joist unit unit's temperature rise and detectivity are also further improved.
4. the heat of the utility model micro-joist unit absorption directly passes to substrate of glass by the anchor pin, has eliminated because the heat between the untimely micro-joist unit that may cause of frame structure heat radiation is crosstalked.
5. each micro-joist unit of the utility model is standing directly on the substrate of glass, and the structural stability of each micro-joist unit is relatively independent and do not influence each other like this, and the optics of system is read noise and can be effectively suppressed, and helps making the FPA of big face battle array.
6. in order to improve the thermal deformation sensitivity of micro-joist unit, need to reduce the thickness of thermal change ellbeam, descend owing to the processing technology reason also can cause the thickness of INFRARED ABSORPTION plate like this, reduced the efficient that infra-red radiation is absorbed.And the double-deck INFRARED ABSORPTION plate structure of resonant cavity that the utility model proposed makes incident infrared at heat absorption sounding board place (promptly
N λ place) antinode of formation standing wave, the heat absorption sounding board reaches best endothermic effect, can further improve ultrared absorption efficiency, thereby improves the final temperature rise of micro-joist unit, causes the further raising of detectivity.
7. in order to improve the dutycycle of sensible heat unit, the utility model can adopt the heat absorption sounding board and extend eaves structure.Eaves are the zone of cover heating deformation mechanism just in time, and the dutycycle of sensible heat unit can reach more than 90% like this.
8. the formula of turning back of hot isolation beams of the utility model and thermal change ellbeam design helps the INFRARED ABSORPTION plate and forms long narrow rectangular configuration, also the INFRARED ABSORPTION plate is in because on the maximum direction of the angular deflection due to the deformation angle stack, and the mode that each micro-joist unit can employing tiles in proper order constitutes detection array, large-area free time and waste can not occur, thereby avoid employing multilevel-cell nested configuration.
Description of drawings
Fig. 1 reads principle schematic for the utility model infrared image passes device optics.
Fig. 2 is one of the utility model embodiment micro-joist unit structural representation.
Fig. 3 is the cutaway view of Fig. 2 on the A-A face.
Fig. 4 is the cutaway view of Fig. 2 on the B-B face.
Fig. 5 is the left view of Fig. 2.
Fig. 6-1,6-2 are many folding thermal change ellbeam distortion amplification principle figure.
Fig. 7 is the array tiling schematic diagram of Fig. 2.
Fig. 8-1,8-2 are many folding " convertible " thermal change ellbeam distortion amplification principle figure.
Fig. 9 is another embodiment structural representation of the utility model micro-joist unit.
Figure 10 is the cutaway view of Fig. 9 on the A-A face.
Figure 11 is the left view of Fig. 9.
Figure 12 is two micro-joist unit structural representations of the utility model embodiment.
Figure 13 is the cutaway view of Figure 12 on the A-A face.
Figure 14 is the left view of Figure 12.
Figure 15 is three micro-joist unit structural representations of the utility model embodiment.
Figure 16 is the cutaway view of Figure 15 on the A-A face.
Figure 17 is the left view of Figure 15.
Number in the figure: 1 hot isolation beams, 2 thermal change ellbeams, 3 INFRARED ABSORPTION plates, 4 anchor pin, 5 substrate of glass, 6 non-metallic films, 7 metal films, 8 upper stratas heat absorption sounding board, 9 reinforcements, 10 have heat absorption sounding board, 11 Infrared Lens, 12 micro-joist units of eaves.
Below pass through the specific embodiment, and in conjunction with the accompanying drawings the utility model be further described:
The specific embodiment:
Embodiment 1:
Referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5, adopt visible light and adiathermanous substrate of glass 5, the micro-joist unit 12 with lateral support planar structure is set on substrate of glass 5; Micro-joist unit 12 comprises thermal deformation mechanism and INFRARED ABSORPTION plate 3.
Shown in Figure 2, thermal deformation mechanism is two groups, is symmetricly set in the both sides of INFRARED ABSORPTION plate 3, and every group of thermal deformation mechanism constitutes the formula of turning back by at least one hot isolation beams 1 and at least one thermal change ellbeam 2 and distribute.
Shown in Figure 3, thermal deformation mechanism is fixed on the substrate of glass 5 with the form of standing by anchor pin 4 with both sides, its outside final stage beam-ends that its medial extremity is connected INFRARED ABSORPTION plate 3.
Fig. 3, Fig. 4 and shown in Figure 5, hot isolation beams 1 is the non-metallic film 6 of homogenous material; Thermal change ellbeam 2 is to be attached with the double-material beam that metal film 7 forms on the upper surface of non-metallic film or lower surface.
Referring to Fig. 7, the mode forming array that micro-joist unit 12 employings are tiled in proper order, thus form infrared image sensor.Resulting array is tight, regular, consistent, non-nesting.
Shown in Figure 1, INFRARED ABSORPTION plate 3 in the micro-joist unit 12 is the one side towards substrate of glass 5 with the reflective surface that it is attached with metal film, reading light transmission substrate of glass 5 is projected on the reflective surface, infrared ray directly is projected on the another side, micro-joist unit 12 produces thermal deformation after absorbing and seeing through the infra-red radiation of Infrared Lens 11, and optical pickup system detects the thermal deformation of the array that is made of micro-joist unit and obtains infrared thermal imagery.
In the present embodiment, INFRARED ABSORPTION plate 3 is an individual layer, and lower surface is to be used for the reflective surface that optics is read detection, and upper surface is the INFRARED ABSORPTION face towards the source of infrared radiation.It is that hot isolation beams 1 and thermal change ellbeam 2 are turned back back and forth at the dual-side of INFRARED ABSORPTION plate 3 that the formula of turning back of thermal deformation mechanism distributes, also isometric with it with the parallel longitudinal of INFRARED ABSORPTION plate 3, forms compact, well-behaved planar structure.The corresponding structure form also can increase a pair of or more hot isolation beams 1 and thermal change ellbeam 2 and be spaced between hot isolation beams 1 and thermal change ellbeam 2, promptly form thermal deformation mechanism by two or more hot isolation beams 1 and thermal change ellbeam 2.
In concrete the enforcement, the thermal deformation mechanism of being made up of one or how hot isolation beams 1 and thermal change ellbeam 2 can have following two kinds of versions:
One, shown in Fig. 6-1 and Fig. 6-2, in that hot isolation beams 1 and at least one thermal change ellbeam 2 formula of turning back distributes in the thermal deformation mechanism that is constituted with at least one, be to be provided with single hot isolation beams 1 and single thermal change ellbeam 2 spaces, the metal film among each thermal change ellbeam 2-1,2-1 is on the surface of the same side of described non-metallic film.When thermal deformation takes place when, hot isolation beams 1-1 is not crooked, it is θ 1 that thermal change ellbeam 2-1 bending obtains corner endways, the corner of instant heating variable shaped beam 2-1 self bending, because hot isolation beams 1-1 is not crooked, remain θ 1 at its terminal corner, the rotational angle theta 2 of thermal change ellbeam 2-2 self bending is that θ 1 superposes with the corner of thermal change ellbeam 2-1, is θ 1+ θ 2 in the terminal size of thermal change ellbeam 2-2; So the corner that obtains on baffle is θ 1+ θ 2.
They are two years old, shown in Fig. 8-1 and Fig. 8-2, in that hot isolation beams 1 and at least one thermal change ellbeam 2 formula of turning back distributes in the thermal deformation mechanism that is constituted with at least one, turn back with at least two thermal change ellbeam 2-1,2-2 and to constitute thermal change ellbeam group, in same thermal change ellbeam group on adjacent two thermal change ellbeam 2-1, the 2-2, metal film is on the surface of not homonymy of described non-metallic film, forms " convertible " structure.When thermal deformation takes place when, hot isolation beams 1 is not crooked, it is θ 1 that thermal change ellbeam 2-1 bending obtains corner endways, the corner of instant heating variable shaped beam 2-1 self bending, because the bending of thermal change ellbeam 2-2, obtaining corner endways is θ 2, and the rotational angle theta 2 of thermal change ellbeam 2-2 self bending is that θ 1 superposes with the corner of thermal change ellbeam 2-1, corner size at thermal change ellbeam 2-2 end is θ 1+ θ 2, and therefore the corner that obtains on baffle is θ 1+ θ 2.Fig. 9, Figure 10 and Figure 11 are the structural representation of this version specific embodiment.
Above-mentioned because the stack of deformation angle can make the angular deflection of INFRARED ABSORPTION plate 3 further improve by setting and employing " convertible " the formula structure that increases the thermal change ellbeam, thus sensitivity improved.
In concrete the enforcement, INFRARED ABSORPTION plate 3 is to be material to absorb infrared non-metallic film in the micro-joist unit, the thickness of INFRARED ABSORPTION plate 3 is 0.3～3um, and the thickness of hot isolation beams 1 and thermal change ellbeam 2 is 0.2～3um, and the distance of micro-joist unit 12 and substrate of glass 5 is 2～7um.
In this structure, because the employing micro-joist unit stand in the mechanism on the substrate of glass, eliminated the frame structure in the disclosed technical scheme of existing patent documentation, in the micro-joist unit planar dimension of setting, the area of the total length of hot isolation beams and thermal change ellbeam or INFRARED ABSORPTION plate can increase, thereby detectivity is improved.The heat of micro-joist unit absorption simultaneously can directly pass to substrate of glass by the anchor pin, thereby has eliminated because the heat between the untimely micro-joist unit that may cause of frame structure heat radiation is crosstalked.Each micro-joist unit is standing directly on the substrate of glass by the anchor pin in addition, and each micro-joist unit is relatively independent and do not influence each other like this, and the array overall structure is stable, and the optics of system is read noise and is effectively suppressed, and helps making the FPA of big face battle array.
Embodiment 2:
Referring to Figure 12, Figure 13 and Figure 14, with the foregoing description 1 different be, in the present embodiment, the INFRARED ABSORPTION plate adopts double-decker, constitute the heat absorption resonant cavity by lower floor's reflector and upper strata heat absorption sounding board 8, be connected by reinforcement 9 between the sounding board with absorbing heat at reflector, distance therebetween is
N λ, wherein λ is the peak value that is detected infrared wavelength, n is a positive integer.
In concrete the enforcement, the thickness of lower floor's reflector and upper strata heat absorption sounding board 8 is that the thickness of 0.3～3um, hot isolation beams 1 and thermal change ellbeam 2 is 0.2～3um, and the distance of micro-joist unit 12 and substrate of glass 5 is 2～7um.
In this version, the lower surface of lower floor's reflector is to be used for the reflective surface that optics is read detection, and incident infrared is at heat absorption sounding board place, promptly
N λ place forms the antinode of standing wave, makes heat absorption sounding board 8 reach best endothermic effect, can further improve ultrared absorption efficiency, thereby improve the final temperature rise of micro-joist unit, further improves detectivity.
Embodiment 3:
Referring to Figure 15, Figure 16 and Figure 17, with the foregoing description 2 different be, in the present embodiment,, extend the eaves structure that improves sensible heat unit dutycycle be set in the both sides of upper strata heat absorption sounding board 8, eaves are the region of cover heating deformation mechanism just in time.The eaves structure of heat absorption sounding board 8 can improve the unit dutycycle, thereby improves ultrared absorption efficiency, improves detectivity.
In the various embodiments described above, INFRARED ABSORPTION plate 3 is by the thin-film material that infrared ray is had the strong absorption effect, as SiN
x, SiO
2, polysilicons etc. are made, and absorption area should be big as much as possible, to increase the heat that absorbs.And, on the sensitive direction of angular deflection, the length of optical detection sensitivity and INFRARED ABSORPTION plate be directly proportional (or be inversely proportional to the diffraction spectra width of the length of INFRARED ABSORPTION plate), so in limited zone, long narrow rectangular configuration (the utility model just in time helps this) should be designed to as much as possible, higher optical detection sensitivity can be obtained.With SiN
xBe example, infrared ray is approximately 1um to its penetration depth, and the system thermal capacity of considering crosses conference and slow down system to infrared thermal response speed, so the film optimum thickness should be between 0.3～3um, make infrared ray fully to be absorbed, have higher thermal response speed simultaneously.But this thickness is not enough to absorb whole incident infrareds, in order to reach best assimilation effect, can utilize the metallic film that adheres on the optical detection face of INFRARED ABSORPTION plate as reflecting surface, makes incident infrared pass SiN
xAfter, unabsorbed part reflects after arriving metal level, passes through SiN for the second time along the opposite direction of incident direction
xFilm, be absorbed once more.
Hot isolation beams 2 is by the little material of thermal conductivity factor, as SiN
x, SiO
2, polysilicon, formations such as high polymer for simplified processing process, can adopt the material same with INFRARED ABSORPTION plate 3.Be generally the film beam of square-section, satisfying under the prerequisite of support strength, littler cross-sectional area and longer beam length can obtain better effect of heat insulation.Thermal change ellbeam 2 is a double-material beam, and the selection of two kinds of materials should consider that thermal coefficient of expansion differs as far as possible big and Young's modulus differs as far as possible little.Generally can adopt metal and nonmetallic combination, such as metal is attached on the nonmetal film by modes such as spraying, sputter, plated films, specifically can be Au, Al, Ag, Pt, Ti etc. and SiN
x, SiO
2Deng combination.Select at the thickness of two kinds of materials of thermal change ellbeam, thereby obtain maximum sensitivity in order to make beam reach maximum distortion, two kinds of material thickness ratio should be near the inverse ratio square root of corresponding young modulus of material, and the gross thickness of beam should be as far as possible little under the prerequisite that satisfies process conditions and supporting condition.The thickness of hot isolation beams and thermal change ellbeam is between 0.2～3um.Whole micro-joist unit is generally square or rectangle, and length of side size is in the scope of 20～200um.Each micro-joist unit is standing directly on the substrate of glass by the anchor pin, the distance of micro-joist unit and substrate of glass, and promptly the height of anchor pin 4 is 2～7um.
Can be set at the foregoing description 1: the INFRARED ABSORPTION plate is the SiN of 2um by thickness
xConstitute with the Au laminated film of 0.1um, the thermal change ellbeam is the SiN of 2um by thickness
xConstitute with the Au laminated film of 0.4um; Hot isolation beams is the SiN of 2um by thickness
xSingle film constitutes; The distance of micro-joist unit and substrate of glass is about 2um.
Also can be set at the foregoing description 1: the INFRARED ABSORPTION plate is the SiO of 1um by thickness
2Constitute with the Al laminated film of 0.05um, the thermal change ellbeam is the SiO of 1um by thickness
2Constitute with the Al laminated film of 0.1um; Hot isolation beams is the SiO of 1um by thickness
2Single film constitutes; The distance of micro-joist unit and substrate of glass is about 2um.
Can also be set at the foregoing description 1: the INFRARED ABSORPTION plate is the SiN of 1um by thickness
xConstitute with the Al laminated film of 0.1um, the thermal change ellbeam is the SiN of 0.5um by thickness
xConstitute with the Al laminated film of 0.2um; Hot isolation beams is the SiN of 0.5um by thickness
xSingle film constitutes; The distance of micro-joist unit and substrate of glass is about 2um.
Can be set at the foregoing description 2: adopting thickness is the reinforcement of 2um, and lower floor's reflector is the SiN of 0.5um by thickness
xConstitute with the Au laminated film of 0.05um, the heat absorption sounding board on upper strata is by the SiN of 0.3um
xFilm constitutes, and the thermal change ellbeam is the SiN of 0.5um by thickness
xConstitute with the Au laminated film of 0.2um; Hot isolation beams is the SiN of 0.5um by thickness
xSingle film constitutes; The distance of micro-joist unit and substrate of glass is about 2um.
Can be set at the foregoing description 3: adopt the reinforcement of thickness 2um, lower floor's reflector is the SiN of 0.5um by thickness
xConstitute with the Au laminated film of 0.05um, the heat absorption sounding board of epipelagic zone eaves is by the SiN of 0.3um
xFilm constitutes, and the thermal change ellbeam is the SiN of 0.5um by thickness
xConstitute with the Au laminated film of 0.2um; Hot isolation beams is the SiN of 0.5um by thickness
xSingle film constitutes; The distance of micro-joist unit and substrate of glass is about 2um.
Production process is exemplified below:
Growth one deck sacrifice layer on substrate of glass at first, and etching anchor pin (perhaps on substrate of glass, etch earlier the anchor pin, and growth one deck sacrifice layer) on the sacrifice layer.Plate metallic film then thereon, and use the method for lift-off to remove unwanted metal level.The required lower floor's nonmetal film of device architecture is made in growth then, utilize the pattern etching legal system to make the infrared absorption layer of the thermal change ellbeam of device, hot isolation beams and lower floor's reflector, and can thin thermal change ellbeam, hot isolation beams (for thermal change ellbeam employing " convertible " structure, plate metallic film more thereon, and use the method for lift-off to remove unwanted metal level).The second layer sacrifice layer of growing thereon then, and in the dowel part that is etching on the sacrifice layer between heat absorption sounding board and the reflector.Direct growth is made the required upper strata nonmetal film of device architecture on the good sacrifice layer of etching, and etching is made the heat absorption sounding board structure of INFRARED ABSORPTION plate.Sacrifice layer is fallen in final etching, discharges micro girder construction and finishes making.
In addition, it is existing open to be in the patent No. that ZL03132259.X, name are called in the patent of invention of " infrared thermal image imager " about the operation principle of optics sensing element shown in Figure 1 and version.
Claims (8)
1, a kind of glass substrate optical display infra-red sensor is characterized in that adopting visible light and adiathermanous substrate of glass (5), goes up in described substrate of glass (5) micro-joist unit (12) with lateral support planar structure is set; Described micro-joist unit (12) comprises thermal deformation mechanism and INFRARED ABSORPTION plate (3); Wherein, thermal deformation mechanism is two groups, is symmetricly set in the both sides of INFRARED ABSORPTION plate (3), and every group of thermal deformation mechanism constitutes the formula of turning back by at least one hot isolation beams (1) and at least one thermal change ellbeam (2) and distribute; Described thermal deformation mechanism is fixed on the substrate of glass (5) with the form of standing by anchor pin (4) with both sides, its outside final stage beam-ends that its medial extremity is connected INFRARED ABSORPTION plate (3); Described hot isolation beams (1) is the non-metallic film of homogenous material; Described thermal change ellbeam (2) is the film formed double-material beam of adhesion metal on the upper surface of non-metallic film or lower surface; Described INFRARED ABSORPTION plate (3) is the one side towards substrate of glass (5) with the reflective surface that it is attached with metal film; The visible light transmissive substrate of glass (5) of reading is projected on the reflective surface, and infrared ray directly is projected on the another side.
2, sensor according to claim 1, it is characterized in that hot isolation beams (1) and at least one thermal change ellbeam (2) formula of turning back distributes in the thermal deformation mechanism that is constituted with at least one described, be to be provided with single hot isolation beams (1) and single thermal change ellbeam (2) space, the metal film in each thermal change ellbeam (2) is on the surface of the same side of described non-metallic film.
3, sensor according to claim 1, it is characterized in that hot isolation beams (1) and at least one thermal change ellbeam (2) formula of turning back distributes in the thermal deformation mechanism that is constituted with at least one described, turn back with at least two thermal change ellbeams (2) and to constitute thermal change ellbeam group, in same thermal change ellbeam group on adjacent two thermal change ellbeams (2), metal film is on the surface of not homonymy of described non-metallic film.
4, sensor according to claim 1, it is characterized in that in the described micro-joist unit that INFRARED ABSORPTION plate (3) is is material to absorb infrared non-metallic film, the thickness of INFRARED ABSORPTION plate (3) is 0.3～3um, the thickness of hot isolation beams (1) and thermal change ellbeam (2) is 0.2～3um, and the distance of micro-joist unit (12) and substrate of glass (5) is 2～7um.
5, sensor according to claim 1 is characterized in that described INFRARED ABSORPTION plate constitutes the heat absorption resonant cavity by lower floor's reflector and upper strata heat absorption sounding board (8), is connected by reinforcement (9) between the sounding board with absorbing heat at described reflector, and distance therebetween is
Wherein λ is the peak value that is detected infrared wavelength, and n is a positive integer.
6, sensor according to claim 5, the thickness that it is characterized in that described lower floor reflector and upper strata heat absorption sounding board (8) is that the thickness of 0.3～3um, hot isolation beams (1) and thermal change ellbeam (2) is 0.2～3um, and the distance of micro-joist unit (12) and substrate of glass (5) is 2～7um.
7, sensor according to claim 6 is characterized in that in the both sides of described upper strata heat absorption sounding board (8), extends the eaves structure that improves sensible heat unit dutycycle is set.
8, sensor according to claim 1 is characterized in that the mode forming array that described micro-joist unit (12) employing is tiled in proper order, forms infrared image sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620125934 CN200981818Y (en) | 2006-12-01 | 2006-12-01 | Glass substrate optical reading infrared sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620125934 CN200981818Y (en) | 2006-12-01 | 2006-12-01 | Glass substrate optical reading infrared sensor |
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|---|---|
| CN200981818Y true CN200981818Y (en) | 2007-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100453443C (en) * | 2006-12-01 | 2009-01-21 | 中国科学技术大学 | Glass substrate optical display infra-red sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100453443C (en) * | 2006-12-01 | 2009-01-21 | 中国科学技术大学 | Glass substrate optical display infra-red sensor |
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