CN200965866Y

CN200965866Y - Wafer test heater

Info

Publication number: CN200965866Y
Application number: CN 200620131608
Authority: CN
Inventors: 刘瑞和
Original assignee: MCM EUROPE TRADING Inc
Current assignee: MCM EUROPE TRADING Inc
Priority date: 2006-08-25
Filing date: 2006-08-25
Publication date: 2007-10-24
Anticipated expiration: 2016-08-25

Abstract

The utility model relates to a wafer test heater which is used for heating the testing wafer; besides having the existing heating function, the utility model adds a flow control meter and a temperature control meter in the box, so as to control the temperature and the flow according to the warm wind which is transmitted by the inner pipe, and to make the test for wafer is more precise, thus reaching the various functions; at the same time, the volume of the utility model is decreased and the utility model is light and handy and convenient to carry.

Description

The wafer sort heater

Technical field

The utility model is applied to wafer sort relevant for a kind of heater, particularly a kind of temperature controllable, flow, and the wafer sort heater that lightly is easy to carry about with one of volume.

Background technology

Wafer (Wafer) is to give birth to via the particular processing process with element silicon.The manufacturing process of Silicon Wafer at first with element silicon purifying (99.999%) in addition, is made these pure silicons long silicon crystal bar again, forms the very thin wafer of a slice a slice via the cutting back.Again wafer is divided into little crystal grain, is encapsulated respectively, just become microprocessor, internal memory etc.The silicon wafer diameter of a circle is big more, and needed manufacturing technology is good more, can also allow on the wafer against the size micro with the transistor AND gate lead in addition, makes more silicon crystal grain, reduces whole cost.

Wafer sort (Wafer Probe) is each crystal grain on the chip to be carried out pin survey; load onto with gold thread at detection head and to make carefully probe (probe) as hair; contact with the contact (pad) on the crystal grain; test its electrical characteristic; underproof crystal grain can be put signs on, then when chip be unit when cutting into independently crystal grain with crystal grain, the defective crystal grain that indicates mark can be eliminated by wash one's face; no longer carry out next processing procedure, in order to avoid increase manufacturing cost on foot.

Yet, before wafer sort, must heat at wafer, traditional mode is still air is produced hot blast by so-called heater, and then blow on the wafer, to improve the temperature of wafer, reach the effect of heating, but traditional heater volume is quite huge, the inconvenience that operates, and be difficult to move, make the operator produce greatest inconvenience, and, must be dependent on remaining equipment for temperature controlling, for the test of precision because known heater only possesses the function that heating (blowing out hot blast) arranged, produce suitable inconvenience, identical, it also can't be controlled at the hot blast rate that blows out (flow), makes the test wafer process produce state out of control easily.

The utility model content

Because the problems referred to above, the utility model provides a kind of wafer sort heater, is controlled at temperature, the flow of hot blast, make the test of wafer more accurate, cooperate special design simultaneously, the overall volume size is quite light and handy, be available for users to carry easily convenient the use.

Therefore, according to the disclosed wafer sort heater of the utility model, include casing, the pipeline that has the coiling of connecting in the casing cooperates heater, temp controlled meter, flow control meter, and can be at the air that passes through, carry out the control of temperature, flow, so that the hot blast that provides can be more efficient, accurately wafer is heated, can cooperate the design of timer simultaneously, and can reach regularly, quantitative heating.

Compared with prior art, the utlity model has following advantage: the utility model wafer sort heater compartment volume is very light and handy, perhaps can have additional handle in box top, be available for users to extract and be easy to carry, so, wafer sort heater of the present utility model is quite light and handy, is easy to the user and manipulates.

Description of drawings

Fig. 1 is the stereoscopic figure of wafer sort heater of the embodiment of the utility model wafer sort heater;

Fig. 2 is the internal structure schematic diagram of wafer sort heater of the embodiment of the utility model wafer sort heater;

Fig. 3 is the internal structure schematic diagram of the power supply forward type computer system of the heater that is arranged at diverse location of the embodiment of the utility model wafer sort heater;

Fig. 4 is another schematic diagram of internal structure of the power supply forward type computer system of the heater that is arranged at diverse location of the embodiment of the utility model wafer sort heater.

Among the figure:

10 casings, 11 under casings

12 loam cakes, 20 pipelines

21 air inlets, 22 air outlets

31 heaters, 32 temp controlled meters

41 electromagnetically operated valves, 42 flow control meters

43 flowmeters, 51 timers

61 fans, 70 attaching plugs

71 circuit boards, 72 circuit boards

Embodiment

According to the disclosed wafer sort heater of the utility model, see also Fig. 1, shown in Figure 2, Fig. 1 is the stereoscopic figure of wafer sort heater of the embodiment of the utility model wafer sort heater, and Fig. 2 is the internal structure schematic diagram of wafer sort heater of the embodiment of the utility model wafer sort heater.The wafer sort heater includes casing 10, it is made of loam cake 12 and under casing 11, inside has the pipeline 20 of the winding of connecting, pipeline 20 1 ends are air inlet 21, another end is an air outlet 22, and along pipeline 20 to casing 10 inside, can be earlier by heater 31, it heats in order to the fluid at pipeline 20 inside, fluid temperature (F.T.) is improved, continue by electromagnetically operated valve 41, it can be controlled the amount that fluid passes through and whether open and close, be connected to flow control meter 42 then, it can be controlled at the fluid flow in the pipeline 20, and then, pipeline is connected to flowmeter 43 20 times, it is available for users to (operator) and directly monitors actual fluid flow in the outside, by air outlet 22 hot blast is exported at last.

And wherein, be timer 51 and temp controlled meter 32 adjacent to flow control meter 42 in the casing 10, timer 51 in order to set, currency of control fluid, cooperate the subsequent wafer heating, can reach accurately and heat.32 of temp controlled meters are to cooperate heater 31 to use, it is available for users to (operator) and controls the temperature of setting fluid, in case fluid temperature (F.T.) arrives set point, then heater 31 cuts out, or fluid temperature (F.T.) is lower than a certain predetermined value, then heater 31 is started.Simultaneously, an other side of casing 10 then has attaching plug 70, in order to supply with the needed electric power of casing 10 inner all components.

During practical operation, air is entered pipeline 20 by air inlet 21 guidings, enter casing 10 along pipeline 20 then, then by heater 31, is high-temperature gas by heater 31 with air heat, this part heater 31 cooperates temp controlled meter 32 to be acted on, the user comes the in addition temperature of control gaseous heating by temp controlled meter 32, it can be set at lowest temperature pattern or highest temperature pattern, be lower than lowest temperature and then start heater 31, or being higher than the highest temperature then closes heater 31, in the reality, generally mostly be set 50 degree (℃).Then gas can pass through electromagnetically operated valve 41, this part electromagnetically operated valve 41 can cooperate flow control meter 42 to be controlled the flow of fluid, the user can be controlled by flow control meter 42 and want flow that fluid is passed through, just cooperates flow, temperature, and can make the accuracy of subsequent wafer heating.Simultaneously, electromagnetically operated valve 41 also can be used as the switch that pipeline 20 is closed, opened, on the other hand, the design of timer 51, be available for users to control the time (being generally 1200 seconds) of supplying with hot blast, cooperate the closing function of electromagnetically operated valve 41, and the time intercropping of hot blast feeding can be controlled the most accurately.

Flowmeter 43 then is arranged at the outside, is available for users to directly show the flow of observing this moment by the outside, and identical, temp controlled meter 32, timer 51 equally also have the function of displays temperature, time.At last, hot blast can be blown to wafer by air outlet 22 along pipeline 20, and wafer is heated.Wherein, the carrying out of everything controlled by two

circuit boards

71,72 in the casing 10, and it utilizes relay to reach the multitask exchange, controls the multitask exchange of the heating of heater with each assembly.

And be provided with fan 61 near the air outlet 22, and can be dispelled the heat in casing 10 inside, avoid temperature too high and make the intraware misoperation.Simultaneously, casing 10 outer (being generally top side or both sides) can be equiped with handle, cooperates the volume of whole wafer sort heater exquisiteness, is available for users to direct portable, the convenient use.On the other hand, can cooperate the use of siren, produce warning function in the time of can reaching predetermined state in the fluid in the casing 10, in general, can be temperature, pressure (flow) or time when arriving, utilize modes such as sound, image, light to point out the user, certainly, also design under abnormality and warn, this partial function then must cooperate remaining component together can produce best effect.

In addition, in the practical application, the heater 31 of present embodiment can be adjusted the position with demand.As shown in Figure 3, heater 31 is arranged at pipeline 20 ends, can avoid hot blast dissipated heat in pipeline 20 transmission courses, can improve the efficiency of heating surface; Perhaps,, can reach pipeline 20 heating equally and prevent that the heat of hot blast scatters and disappears midway can as shown in Figure 4 heater 31 being arranged at casing 10 outsides, and, more can avoid the heat of hot blast to produce harmful effect for other assemblies in the casing 10.

Comprehensively above-mentioned, the utility model proposes a kind of wafer sort heater, can be controlled at temperature, the flow of hot blast, make the test of wafer more accurate, cooperate special design simultaneously, the overall volume size is quite light and handy, cooperate the design of handle, be available for users to extract and carry, the convenient use.

The above is preferred embodiment of the present utility model only, is not to be used for limiting the scope that the utility model is implemented.Event is all according to impartial for it variation of the described shape of the utility model claim, structure, feature and spirit institute or modification, all should be included in the protection range of the present utility model.

Claims

1, a kind of wafer sort heater, in order to a wafer to be measured is heated, it includes the pipeline that a casing and connects this casing, enter by this pipeline guiding air, and pass this casing and pass through a heater heats, and blow on this wafer with the hot blast form, it is characterized in that:

This casing more includes a flow control table and a temp controlled meter, controls the flow of this hot blast by this flow control meter, and by this temp controlled meter, controls the temperature of this hot blast.

2, wafer sort heater according to claim 1 is characterized in that this heater is arranged at this box inside or the outside.

3, wafer sort heater according to claim 1 is characterized in that this flow control meter cooperates the flow of this hot blast of solenoid control.

4, wafer sort heater according to claim 1 is characterized in that this casing more includes a timer, in order to control the heating time of this wafer to be measured.

5, wafer sort heater according to claim 1 is characterized in that this casing more includes a flowmeter, in order to measure the flow of this hot blast.

6, wafer sort heater according to claim 1 is characterized in that, more includes a siren, acts on when this casing arrives a predetermined state.

7, wafer sort heater according to claim 1 is characterized in that this casing more includes the leader, is positioned at this casing top.