CN1983544A - 半导体装置的制造方法 - Google Patents

半导体装置的制造方法 Download PDF

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Publication number
CN1983544A
CN1983544A CNA2007100017248A CN200710001724A CN1983544A CN 1983544 A CN1983544 A CN 1983544A CN A2007100017248 A CNA2007100017248 A CN A2007100017248A CN 200710001724 A CN200710001724 A CN 200710001724A CN 1983544 A CN1983544 A CN 1983544A
Authority
CN
China
Prior art keywords
metal bump
chip
semiconductor substrate
sub
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007100017248A
Other languages
English (en)
Chinese (zh)
Inventor
柴田和孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN1983544A publication Critical patent/CN1983544A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]

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  • Wire Bonding (AREA)
CNA2007100017248A 2002-08-01 2003-08-01 半导体装置的制造方法 Pending CN1983544A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002225097A JP3850352B2 (ja) 2002-08-01 2002-08-01 半導体装置の製造方法
JP2002225097 2002-08-01
JP2002236036 2002-08-13

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB031525091A Division CN100356530C (zh) 2002-08-01 2003-08-01 半导体装置的制造方法

Publications (1)

Publication Number Publication Date
CN1983544A true CN1983544A (zh) 2007-06-20

Family

ID=32012868

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007100017248A Pending CN1983544A (zh) 2002-08-01 2003-08-01 半导体装置的制造方法

Country Status (2)

Country Link
JP (1) JP3850352B2 (ja)
CN (1) CN1983544A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4782177B2 (ja) * 2008-08-29 2011-09-28 キヤノンマシナリー株式会社 チップ積層体の製造装置
US7854365B2 (en) * 2008-10-27 2010-12-21 Asm Assembly Automation Ltd Direct die attach utilizing heated bond head
JP5187341B2 (ja) * 2010-04-14 2013-04-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8349116B1 (en) * 2011-11-18 2013-01-08 LuxVue Technology Corporation Micro device transfer head heater assembly and method of transferring a micro device
KR102190382B1 (ko) 2012-12-20 2020-12-11 삼성전자주식회사 반도체 패키지

Also Published As

Publication number Publication date
JP3850352B2 (ja) 2006-11-29
JP2004071648A (ja) 2004-03-04

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication