CN1976077A - 新结构贴片二极管及其制造方法 - Google Patents
新结构贴片二极管及其制造方法 Download PDFInfo
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- CN1976077A CN1976077A CNA2006101614186A CN200610161418A CN1976077A CN 1976077 A CN1976077 A CN 1976077A CN A2006101614186 A CNA2006101614186 A CN A2006101614186A CN 200610161418 A CN200610161418 A CN 200610161418A CN 1976077 A CN1976077 A CN 1976077A
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- copper sheet
- copper
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- diode
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2006101614186A CN100490198C (zh) | 2006-12-06 | 2006-12-06 | 贴片二极管的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2006101614186A CN100490198C (zh) | 2006-12-06 | 2006-12-06 | 贴片二极管的制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN1976077A true CN1976077A (zh) | 2007-06-06 |
CN100490198C CN100490198C (zh) | 2009-05-20 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2006101614186A Expired - Fee Related CN100490198C (zh) | 2006-12-06 | 2006-12-06 | 贴片二极管的制造方法 |
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CN (1) | CN100490198C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105489488A (zh) * | 2015-11-26 | 2016-04-13 | 钟运辉 | 一种贴片式二极管以胶道为本体的制造方法 |
CN105514058A (zh) * | 2016-02-03 | 2016-04-20 | 泰州优宾晶圆科技有限公司 | 一种开放性贴片二极管 |
EP3174088A1 (en) * | 2015-11-26 | 2017-05-31 | Siyang Grande Electronics Co., Ltd. | Plastic packaged smd diode and manufacturing method thereof |
-
2006
- 2006-12-06 CN CNB2006101614186A patent/CN100490198C/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105489488A (zh) * | 2015-11-26 | 2016-04-13 | 钟运辉 | 一种贴片式二极管以胶道为本体的制造方法 |
EP3174088A1 (en) * | 2015-11-26 | 2017-05-31 | Siyang Grande Electronics Co., Ltd. | Plastic packaged smd diode and manufacturing method thereof |
CN105514058A (zh) * | 2016-02-03 | 2016-04-20 | 泰州优宾晶圆科技有限公司 | 一种开放性贴片二极管 |
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Publication number | Publication date |
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CN100490198C (zh) | 2009-05-20 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20070606 Assignee: Suzhou Qunxin Electronics Co., Ltd. Assignor: Lin Haihu Contract record no.: 2010990000140 Denomination of invention: Novel method for manufacturing chip diode Granted publication date: 20090520 License type: Exclusive License Record date: 20100324 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090520 Termination date: 20171206 |
|
CF01 | Termination of patent right due to non-payment of annual fee |