CN1957340B - 向独立模块路由图形处理信号的方法和设备 - Google Patents
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Abstract
一种用于一独立图形模块的连接器的一个实施例适合于将一计算装置耦合到所述独立图形模块,所述独立图形模块在所述计算装置外部。所述连接器适合于从所述计算装置接收一PCI express信号,并将所述PCI express信号传递给所述独立图形模块。所述连接器进而适合于从所述独立图形模块接收显示输出信号,并将所述显示输出信号传递给所述计算系统,例如,以供根据耦合到所述计算装置的一个或一个以上输出显示面板来使用。
Description
相关申请案的交叉参考
本申请案是Diamond等人于2004年4月9日申请的美国专利申请案序列号第10/822,015号的部分接续案(标题为“Field Changeable Rendering System for a ComputingDevice”),所述申请案的全文以引用的方式并入本文中。
技术领域
本发明大体上涉及计算机硬件,且更确切地说,涉及一种用于将独立图形模块耦合到计算装置的连接器。
背景技术
当代计算装置通常含有一图形卡,所述图形卡使计算装置可为图形密集应用程序(例如,游戏应用程序)迅速处理与图形相关的数据。图形卡通常包括印刷电路板(PCB),所述印刷电路板上安装有复数个电路组件(例如存储器芯片和类似物)以及图形处理单元(GPU)。在例如膝上型计算机、蜂窝式电话和个人数字助理(PDA)这样的“封闭平台”计算装置中(即,使用处理器且不易被用户改变的装置),图形卡直接并永久地安装到计算装置的主板上。
将图形卡直接安装到主板的一个缺点在于,这种固定的配置妨碍了用户对计算装置的图形系统进行升级的能力。确切地说,为了利用经过改进的图形系统,用户通常必须购买全新的计算装置,这比仅替换现有计算装置中的图形系统要昂贵得多。
另一个缺点在于,妨碍了原本可便利地带给计算装置用户的图形革新速度,因为板上装置的构建通常受到约为九到十二个月的设计周期的限制,且因为波形因数功率传递、热管理和物理尺寸的缘故。
因此,此项技术中需要一种用于将图形处理信号路由给独立模块的方法和设备。
发明内容
一种用于独立图形模块的连接器的一个实施例适用于将计算装置耦合到所述独立图形模块,所述独立图形模块在所述计算装置外部。所述连接器适用于从所述计算装置接收PCI express信号,并将所述PCI express信号传递给所述独立图形模块。所述连接器进而适用于从所述独立图形模块接收显示输出信号,并将所述显示输出信号传递给所述计算系统,例如,以供根据耦合到所述计算装置的一个或一个以上输出显示面板来使用。
用于将图形处理信号从计算装置路由到外部独立模块的方法的一个实施例包含检测计算装置与独立模块之间的连接,并(例如)通过上述连接器将PCI express信号从计算装置输出到独立模块。
附图说明
图1是说明根据本发明的一个实施例的含有独立图形的计算系统的示意图;
图2是介接到计算装置的主板的一部分上的连接器的一个实施例的侧视图;和
图3是一种将图形信号从计算装置路由到外部独立图形模块的方法的一个实施例的流程图。
具体实施方式
图1是说明根据本发明一个实施例的含有独立图形的示范性计算系统100的示意图。如图所示,计算系统100包括计算装置102和独立图形模块104,二者由连接器106耦合。独立图形模块104适合与任何类型的计算装置一起使用,其中包含(但不限于)台式计算机、服务器、膝上型计算机、掌上计算机、个人数字助理、平板计算机、游戏机、蜂窝式电话、基于计算机的模拟器和类似装置。
因此,计算装置102的配置是一个示范性系统,且并不希望其以任何方式暗示对可与本发明实施例一起发挥作用的计算装置的类型的限制。如图所示,计算装置102一般包括复数个内部组件,其中包含(但不限于)中央处理单元(CPU)110、存储器116、一个或一个以上输入/输出(I/O)装置118、北桥芯片组112、南桥芯片组114、标准集成图形处理器(IGP)108(其为北桥芯片组112的子组件),以及包含图形处理单元(GPU)120的离散的固定的渲染(rendering)。通常,北桥芯片组112将PCI express信号输出到IGP 108,后者又会产生用于多种输出显示面板(未图示)的复数个显示输出信号,例如视频图形阵列(VGA)、电视(TV)、低压差分信号传输(LVDS)和数字视频接口(DVI)信号。
独立图形模块104是外部装置(例如,在计算装置102外部),其配置成耦合到计算装置102,以便向计算装置102提供图形处理能力。在一个实施例中,独立图形模块104定位在距计算装置102一用户界定的距离处,且具有其自身的电源、热预算和机械预算。一般来说,独立图形模块104配置成可交换地接纳用于外部介接到计算装置102的一个或一个以上图形卡(未图示)。在一个实施例中,独立图形模块104适合于接纳一个或一个以上现场可更换的图形卡。
系统100的一个优点在于,其使得用户可将现有计算装置(例如计算装置102)的制图能力最大化,而不论计算装置的固有热、波形因数或其它能力限制如何。因此,系统100允许用户升级计算装置102的图形处理能力,同时极少或不修改计算装置102的固定架构。用户只需购买一个或一个以上个别图形卡,将独立图形模块104(例如,通过连接器106J)连接到计算装置102、将图形卡插入独立图形模块104中,从而将计算装置102在外部介接到图形卡。此外,可从独立图形模块104中轻松地去除图形卡,因此,只要购买新的图形卡来补充现有图形卡或替代现有图形卡来使用,就可对图形系统进行进一步升级。
图2是介接到计算装置的主板202的一部分的连接器200的一个实施例的侧视图。与图1中所示的连接器106相似,连接器200适合于将计算装置204耦合到独立图形模块。具体来说,连接器200适合于从计算装置(例如,从北桥芯片组)接收PCI Express信号,并将所述PCI Express信号传递给独立图形模块,用以产生一个或一个以上显示输出信号,以下将对此进行更为详细的描述。因而,连接器200充当从计算装置102到独立图形模块104的桥或总线。
在一个实施例中,连接器200是可移除式卡状连接器,其具有与计算装置的内部机械限制兼容的物理和机械尺寸。在一个实施例中,连接器200具有与xx/xx/xxxx申请的共同待决、共同让渡的美国专利申请案第xx/xxx,xxx号(代理人案号第NVDA/P001196号)中描述的任何现场可更换的图形卡相似的尺寸,所述申请案以引用的方式并入本文。
连接器200一般包括印刷电路板(PCB)208(其上设置有复数个电路组件)、卡连接器210(例如,包括复数个电镀触点)和外部接口212。卡连接器210沿PCB 208的第一边缘201设置,且适合于与安装到计算装置的主板202的边缘连接器介接,以下将对此进行更为详细的描述。外部接口212沿PCB 208的另一边缘(例如,在一个实施例中,与第一边缘201相对的第二边缘203)设置,且适合于耦合到(例如)一将连接器200连接到独立图形模块的串行电缆218。在其它实施例中,可使用其它连接构件将连接器200连接到独立图形模块,其中包含(但不限于)FR4条形连接器(strip connector)或连接器到连接器扩展坞(docking station)。
在一个实施例中,用与美国专利申请案第10/822,015号中描述的边缘连接器类似的方式来配置边缘连接器214。边缘连接器214包含插槽216,其适合于接纳连接器200的卡连接器210。在一个实施例中,插槽216包含与卡连接器210直接接触的复数个连接器插针(未图示),其中包含配置成检测连接器200的存在的至少一个连接器插针。在一个实施例中,如果没有检测到连接器200,计算装置204便以上述标准IGP或板上离散图形模式运行。一旦检测到连接器200(例如,在启动时或热插拔时),便将独立图形模块104映射到系统100和图形子系统中,而绕过IGP或板上离散图形系统。
图3是用于将图形信号从计算装置(例如,计算装置204)路由到外部独立图形模块的方法300的一个实施例的流程图。方法300在步骤302处起始并前进到步骤304,在此步骤中,方法300检测与独立图形模块的连接。在一个实施例中,当边缘连接器214上的所述至少一个连接器插针检测到连接器200的存在时便指示连接。
一旦检测到连接,方法300便前进到步骤306,并将PCI express信号输出到连接器200。在一个实施例中,通过借助边缘连接器214将信号发送到北桥芯片组(例如,图1的北桥芯片组112)指示计算装置204中存在连接器200,借此来完成上述内容。因此,北桥芯片组将PCI express信号输出到连接器200(例如,并非输出到IGP或其它固定的渲染装置),在一个实施例中通过边缘连接器114上的一个或一个以上连接器插针来连接所述PCI express信号。连接器200(例如)通过串行电缆连接来完成PCI express信号与独立图形模块之间的电路路径。方法300在步骤308中结束。因此,连接器200结合边缘连接器214一起使得计算装置用户能够构建一个替代的(例如,非固定的)图形系统,从而无需替换计算装置204。
尽管已在标准、现场可更换的卡的背景下描述了连接器200,但本发明可部署在其它波形因数卡中,例如植入有芯片和邮票大小的整装式装置的信用卡聚合体衬底等等。
在一个实施例中,(例如)根据第10/822,015号申请案,可将显示输出信号(例如,TV、VGA、LVDS、DVI信号和类似信号)从独立图形模块传回计算装置,以便使用集成显示选项。
在另一实施例中,根据本发明的用于将计算装置耦合到外部独立图形模块的连接器是内建到计算装置中的固定的外部端口。所述端口(例如)根据方法300以与可移除式连接器200大致相同的方式起作用。在一个实施例中,所述端口检测与独立图形模块的连接,所述连接是通过借助以下构件的连接进行的:串行电缆、FR4连接器条、连接器到连接器扩展坞、捆绑线缆、印刷有金属(例如铜)丝的柔性Mylar衬底、屏蔽物及保护性塑料涂层或连接到端口的其它串行耦合构件。
尽管已将计算装置描述为通过串行电缆耦合到独立图形模块,但所属领域的技术人员将了解,可部署具有将PCI express信号从计算装置传输到独立图形模块所必需的带宽的任何其它连接构件,其中包含FR4条形连接、捆绑线缆和印刷有金属(例如铜)迹线、屏蔽及保护性塑料涂层的柔性Mylar衬底。在一个实施例中,连接构件是标准的16线道连接件。在另一实施例中,根据对耦合到独立图形模块的特定计算装置平台(例如,膝上型计算机、台式计算机等)的功率优化考虑来调整连接构件的长度和尺寸。
因此,根据本发明的连接器可经配置以使计算装置用户能够以最小的花费和对现有装置架构的最小修改(例如,无论现有装置的固有热、波形因数或其它功率限制如何)对现有装置的图形系统进行升级或最大化。因为连接器适合于将计算装置耦合到外部、独立图形模块(例如,包括一个或一个以上现场可更换的图形卡),所以用户不必为了利用图形革新而购买全新的计算装置。这一优点对于其中图形系统往往难以更改或不可能更改的便携式计算装置(例如,膝上型计算机和PDA)的用户来说特别重要。
所揭示的边缘连接器的另一优点在于,其使得图形革新可以更快的速度传递给最终用户。图形革新的供应商不再需要等待将图形革新并入下一代的计算平台中(所述计算平台的商业可购买性可能并不反映革新速度,例如,板上构建通常需要大约九到十二个月的设计周期),而是可以产品的开发状态商业地发布产品,且用户可将这些产品并入到上述现有平台中。本发明还使得可按单制造、按单库存和现场修理所揭示系统中的任何一种,这对于需要及时制造和存货管理的全球经济来说是一个重大的进步。
此外,虽然已就图形卡来描述本发明,但所属领域的技术人员应了解,本发明可适合与其它通常硬接线到主板的装置(例如音频芯片和类似装置)一起使用。
所属领域的技术人员应了解,虽然是在例如膝上型计算机、蜂窝式电话和PDA的封闭平台计算装置的背景下描述本发明,但本发明可适合与任何使用处理器且不易被用户改变的装置(例如,汽车导航系统、娱乐系统、多合一个人计算机、打印机和类似装置)一起使用。
虽然上文参考特定实施例来描述本发明,但所属领域的技术人员将了解,可在不偏离所附权利要求书中所阐述的本发明的广泛精神和范畴的情况下,对特定实施例进行各种修改和变化。因此,应以说明性而非限制性的意义来看待以上描述和附图。
Claims (9)
1.一种用于将一计算装置耦合到一含有一个或一个以上图形卡的独立模块的连接器,所述连接器包括:
用于接收一PCI express信号的构件;和
一接口,其适合于将所述PCI express信号从所述计算装置传递到所述独立模块,其中所述独立模块在所述计算装置外部且距所述计算装置一用户界定的距离;
其中所述连接器进一步配置成将一个或一个以上显示输出信号从所述独立模块路由到所述计算装置。
2.根据权利要求1所述的连接器,其进一步包括一适合于将所述接口耦合到所述独立模块的串行电缆。
3.根据权利要求1所述的连接器,其进一步包括一适合于将所述接口耦合到所述独立模块的FR4条形连接器。
4.根据权利要求1所述的连接器,其中所述接口通过一16线道连接件耦合到所述独立模块。
5.根据权利要求1所述的连接器,其中所述连接器是一内建到所述计算装置中的外部端口。
6.根据权利要求1所述的连接器,其中所述连接器是一具有与所述计算装置的内部机械限制兼容的物理尺寸的可移除式卡状连接器。
7.根据权利要求6所述的连接器,其中所述用于接收一PCI express信号的构件是复数个电镀触点,其设置在所述连接器上并适合于啮合一固定到所述计算装置的一主板的边缘连接器。
8.根据权利要求7所述的连接器,其中所述边缘连接器适合于将所述PCI express信号从一北桥芯片组路由到所述连接器。
9.根据权利要求1所述的连接器,其进一步包括指示构件,用于指示所述计算装置与所述独立模块之间通过所述连接器的一连接的存在。
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Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10344644B4 (de) * | 2003-09-25 | 2007-08-09 | Fujitsu Siemens Computers Gmbh | Computermainboard |
US7707511B2 (en) * | 2003-11-18 | 2010-04-27 | Gary Edward Peterson | Interactive risk management system and method |
US20090027383A1 (en) * | 2003-11-19 | 2009-01-29 | Lucid Information Technology, Ltd. | Computing system parallelizing the operation of multiple graphics processing pipelines (GPPLs) and supporting depth-less based image recomposition |
EP1687732A4 (en) * | 2003-11-19 | 2008-11-19 | Lucid Information Technology Ltd | METHOD AND SYSTEM FOR A MULTIPLEXED 3D GRAPHIC PIPELINE VIA A PC BUS |
US7961194B2 (en) * | 2003-11-19 | 2011-06-14 | Lucid Information Technology, Ltd. | Method of controlling in real time the switching of modes of parallel operation of a multi-mode parallel graphics processing subsystem embodied within a host computing system |
US20080074428A1 (en) * | 2003-11-19 | 2008-03-27 | Reuven Bakalash | Method of rendering pixel-composited images for a graphics-based application running on a computing system embodying a multi-mode parallel graphics rendering system |
US8497865B2 (en) * | 2006-12-31 | 2013-07-30 | Lucid Information Technology, Ltd. | Parallel graphics system employing multiple graphics processing pipelines with multiple graphics processing units (GPUS) and supporting an object division mode of parallel graphics processing using programmable pixel or vertex processing resources provided with the GPUS |
US7812844B2 (en) | 2004-01-28 | 2010-10-12 | Lucid Information Technology, Ltd. | PC-based computing system employing a silicon chip having a routing unit and a control unit for parallelizing multiple GPU-driven pipeline cores according to the object division mode of parallel operation during the running of a graphics application |
US8085273B2 (en) * | 2003-11-19 | 2011-12-27 | Lucid Information Technology, Ltd | Multi-mode parallel graphics rendering system employing real-time automatic scene profiling and mode control |
US7248264B2 (en) | 2004-04-09 | 2007-07-24 | Nvidia Corporation | Edge connector for field changeable graphics system |
US20050270298A1 (en) * | 2004-05-14 | 2005-12-08 | Mercury Computer Systems, Inc. | Daughter card approach to employing multiple graphics cards within a system |
US20060044582A1 (en) * | 2004-08-27 | 2006-03-02 | Seaman Mark D | Interface device for coupling image-processing modules |
US20090096798A1 (en) * | 2005-01-25 | 2009-04-16 | Reuven Bakalash | Graphics Processing and Display System Employing Multiple Graphics Cores on a Silicon Chip of Monolithic Construction |
US7730336B2 (en) * | 2006-05-30 | 2010-06-01 | Ati Technologies Ulc | Device having multiple graphics subsystems and reduced power consumption mode, software and methods |
US20080143731A1 (en) * | 2005-05-24 | 2008-06-19 | Jeffrey Cheng | Video rendering across a high speed peripheral interconnect bus |
US7768507B2 (en) * | 2005-11-17 | 2010-08-03 | Ati Technologies Ulc | Methods and apparatus for driving a display device |
US20070162632A1 (en) * | 2005-12-28 | 2007-07-12 | Ng Kay M | Apparatus and method for detecting and enabling video devices |
US8555099B2 (en) * | 2006-05-30 | 2013-10-08 | Ati Technologies Ulc | Device having multiple graphics subsystems and reduced power consumption mode, software and methods |
TW200802175A (en) * | 2006-06-28 | 2008-01-01 | Giga Byte Tech Co Ltd | Hot-pluggable video display card and computer system using the same |
US20080001955A1 (en) * | 2006-06-29 | 2008-01-03 | Inventec Corporation | Video output system with co-layout structure |
TW200841182A (en) * | 2007-04-11 | 2008-10-16 | Asustek Comp Inc | Multimedia extendable module and computer device thereof |
US20080259556A1 (en) * | 2007-04-20 | 2008-10-23 | Tracy Mark S | Modular graphics expansion system |
US8019905B2 (en) * | 2008-02-11 | 2011-09-13 | Dell Products, Lp | Video/graphics port adapter and method thereof |
CN102126374B (zh) * | 2010-01-14 | 2013-10-30 | 国际文具制造厂有限公司 | 具有双时间缓冲的致动器的环形活页夹机构 |
US20150220293A1 (en) * | 2014-01-31 | 2015-08-06 | LEAP Computing, Inc. | Systems and methods for performing graphics processing |
TWI582604B (zh) * | 2015-12-22 | 2017-05-11 | 華碩電腦股份有限公司 | 外接裝置、電子裝置及電子系統 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4857002A (en) * | 1984-01-18 | 1989-08-15 | Methode Electronics, Inc. | Terminator assembly for interconnecting computer devices |
US5493542A (en) * | 1991-06-28 | 1996-02-20 | Login Europe Ab | Arrangement for portable computers |
US6380616B1 (en) * | 1998-01-15 | 2002-04-30 | Infineon Technologies Ag | Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component |
CN1452743A (zh) * | 2000-07-06 | 2003-10-29 | 昂斯拜克电子公司 | 利用pc或无需pc即可读取几类闪速存储卡的闪速设备 |
EP1372069A2 (en) * | 2002-06-12 | 2003-12-17 | ATI Technologies Inc. | Method system and software for configuring a graphics processing communication mode |
Family Cites Families (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4200900A (en) | 1978-06-30 | 1980-04-29 | Robertshaw Controls Company | Circuit board arrangement |
US4602316A (en) | 1985-03-29 | 1986-07-22 | Rca Corporation | Structure and method for interconnecting printed circuit boards |
DE8808743U1 (de) | 1988-07-07 | 1988-09-01 | Siemens AG, 1000 Berlin und 8000 München | Elektronik-Baugruppe |
JPH04112410A (ja) | 1990-08-31 | 1992-04-14 | Showa Denko Kk | 厚膜導体組成物 |
US5200917A (en) | 1991-11-27 | 1993-04-06 | Micron Technology, Inc. | Stacked printed circuit board device |
US5575686A (en) | 1993-04-14 | 1996-11-19 | Burndy Corporation | Stacked printed circuit boards connected in series |
US7137011B1 (en) * | 1993-09-01 | 2006-11-14 | Sandisk Corporation | Removable mother/daughter peripheral card |
JP2624215B2 (ja) | 1995-02-08 | 1997-06-25 | 日本電気株式会社 | オプションボード識別装置 |
US5783870A (en) | 1995-03-16 | 1998-07-21 | National Semiconductor Corporation | Method for connecting packages of a stacked ball grid array structure |
JPH11505323A (ja) | 1995-04-18 | 1999-05-18 | カーティス インスツルメンツ インコーポレイテッド | 小型低価格半導体機器 |
US6570561B1 (en) * | 1996-06-14 | 2003-05-27 | Texas Instruments Incorporated | Portable computer with low voltage differential signaling adapter |
KR100294266B1 (ko) | 1996-10-29 | 2001-07-12 | 윤종용 | 아날로그 신호 레벨에 의한 자동감지기능을 갖는 컴퓨터 및 주변장치 |
US6152213A (en) | 1997-03-27 | 2000-11-28 | Fujitsu Limited | Cooling system for electronic packages |
US5930496A (en) | 1997-09-26 | 1999-07-27 | Compaq Computer Corporation | Computer expansion slot and associated logic for automatically detecting compatibility with an expansion card |
US6141021A (en) | 1997-12-12 | 2000-10-31 | Intel Corporation | Method and apparatus for eliminating contention on an accelerated graphics port |
US6222739B1 (en) | 1998-01-20 | 2001-04-24 | Viking Components | High-density computer module with stacked parallel-plane packaging |
US6848499B1 (en) | 1998-02-23 | 2005-02-01 | Intel Corporation | Heat exchanger for a portable computing device utilizing active and passive heat dissipation mechanisms |
US6072233A (en) | 1998-05-04 | 2000-06-06 | Micron Technology, Inc. | Stackable ball grid array package |
US6324071B2 (en) | 1999-01-14 | 2001-11-27 | Micron Technology, Inc. | Stacked printed circuit board memory module |
US6199625B1 (en) | 1999-06-11 | 2001-03-13 | Psc Computer Products, Inc. | Stackable heat sink for electronic components |
US6704879B1 (en) * | 1999-08-26 | 2004-03-09 | Micron Technology, Inc. | Dynamically controlling a power state of a graphics adapter |
US6313984B1 (en) | 2000-01-07 | 2001-11-06 | Mobile Storage Technology, Inc. | Low profile hard disk drive assembly mounting to computer motherboard |
US7102892B2 (en) | 2000-03-13 | 2006-09-05 | Legacy Electronics, Inc. | Modular integrated circuit chip carrier |
US6789154B1 (en) | 2000-05-26 | 2004-09-07 | Ati International, Srl | Apparatus and method for transmitting data |
US6670958B1 (en) | 2000-05-26 | 2003-12-30 | Ati International, Srl | Method and apparatus for routing data to multiple graphics devices |
US6633484B1 (en) | 2000-11-20 | 2003-10-14 | Intel Corporation | Heat-dissipating devices, systems, and methods with small footprint |
US7042459B2 (en) | 2001-01-23 | 2006-05-09 | Dell Products L.P. | System for providing a video signal to a display device in a scalable platform |
EP1235471A1 (en) | 2001-02-27 | 2002-08-28 | STMicroelectronics Limited | A stackable module |
US6724389B1 (en) * | 2001-03-30 | 2004-04-20 | Intel Corporation | Multiplexing digital video out on an accelerated graphics port interface |
US6731515B2 (en) | 2001-03-30 | 2004-05-04 | Intel Corporation | Riser assembly and method for coupling peripheral cards to a motherboard |
US7045890B2 (en) | 2001-09-28 | 2006-05-16 | Intel Corporation | Heat spreader and stiffener having a stiffener extension |
US6555745B1 (en) * | 2001-10-19 | 2003-04-29 | Medtronic, Inc. | Electrical interconnect between an articulating display and a PC based planar board |
US20030205363A1 (en) | 2001-11-09 | 2003-11-06 | International Business Machines Corporation | Enhanced air cooling of electronic devices using fluid phase change heat transfer |
GB2383137B (en) | 2001-12-17 | 2005-06-29 | Micron Technology Inc | DVI link with circuit and method for test |
US20030131172A1 (en) * | 2002-01-09 | 2003-07-10 | Johnson Lin | Method for switching a control source of a computer display automatically and a main board using the method |
US7065651B2 (en) | 2002-01-16 | 2006-06-20 | Microsoft Corporation | Secure video card methods and systems |
AU2003234227A1 (en) | 2002-04-25 | 2003-11-10 | August Technology Corporation | Sensor with switched fabric interface |
US7007159B2 (en) * | 2002-05-10 | 2006-02-28 | Intel Corporation | System and method for loading and integrating a firmware extension onto executable base system firmware during initialization |
JP2004013687A (ja) | 2002-06-10 | 2004-01-15 | Sharp Corp | データ処理装置 |
JP2004013689A (ja) | 2002-06-10 | 2004-01-15 | Sharp Corp | データ処理装置 |
US6830098B1 (en) | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
US20040003154A1 (en) | 2002-06-28 | 2004-01-01 | Harris Jeffrey M. | Computer system and method of communicating |
US6797998B2 (en) | 2002-07-16 | 2004-09-28 | Nvidia Corporation | Multi-configuration GPU interface device |
CA2498578C (en) | 2002-09-13 | 2011-11-22 | Karl Storz Imaging, Inc. | Video recording and image capture device |
KR100480437B1 (ko) | 2002-10-24 | 2005-04-07 | 삼성전자주식회사 | 반도체 칩 패키지 적층 모듈 |
US6671177B1 (en) | 2002-10-25 | 2003-12-30 | Evga.Com Corporation | Graphics card apparatus with improved heat dissipation |
US7044196B2 (en) | 2003-01-31 | 2006-05-16 | Cooligy,Inc | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US6924437B1 (en) | 2003-04-10 | 2005-08-02 | Cisco Technology, Inc. | Techniques for coupling an object to a circuit board using a surface mount coupling device |
US7733915B2 (en) * | 2003-05-01 | 2010-06-08 | Genesis Microchip Inc. | Minimizing buffer requirements in a digital video system |
JP2004362156A (ja) * | 2003-06-03 | 2004-12-24 | Toshiba Corp | 電子機器及び表示装置電源管理方法 |
US6979784B1 (en) | 2003-10-17 | 2005-12-27 | Advanced Micro Devices, Inc. | Component power interface board |
US20050190536A1 (en) * | 2004-02-26 | 2005-09-01 | Microsoft Corporation | Method for expanding PC functionality while maintaining reliability and stability |
US7908623B2 (en) * | 2004-05-12 | 2011-03-15 | Matrox Electronic Systems Ltd. | Set top box for PC/HDTV multimedia center |
US20050270298A1 (en) | 2004-05-14 | 2005-12-08 | Mercury Computer Systems, Inc. | Daughter card approach to employing multiple graphics cards within a system |
US7274572B2 (en) | 2005-04-26 | 2007-09-25 | Inventec Corporation | Supporting plate |
US7340557B2 (en) | 2005-12-15 | 2008-03-04 | Via Technologies, Inc. | Switching method and system for multiple GPU support |
TW200737034A (en) | 2006-03-23 | 2007-10-01 | Micro Star Int Co Ltd | Connector module of graphic card and the device of motherboard thereof |
US7412554B2 (en) | 2006-06-15 | 2008-08-12 | Nvidia Corporation | Bus interface controller for cost-effective high performance graphics system with two or more graphics processing units |
-
2004
- 2004-04-09 US US10/822,015 patent/US7265759B2/en not_active Expired - Lifetime
- 2004-06-28 US US10/879,877 patent/US7324111B2/en not_active Expired - Fee Related
-
2005
- 2005-04-08 CN CN2005800163991A patent/CN1957340B/zh not_active Expired - Fee Related
- 2005-04-11 TW TW094111347A patent/TW200612333A/zh unknown
-
2007
- 2007-07-17 US US11/779,231 patent/US8643657B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4857002A (en) * | 1984-01-18 | 1989-08-15 | Methode Electronics, Inc. | Terminator assembly for interconnecting computer devices |
US5493542A (en) * | 1991-06-28 | 1996-02-20 | Login Europe Ab | Arrangement for portable computers |
US6380616B1 (en) * | 1998-01-15 | 2002-04-30 | Infineon Technologies Ag | Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component |
CN1452743A (zh) * | 2000-07-06 | 2003-10-29 | 昂斯拜克电子公司 | 利用pc或无需pc即可读取几类闪速存储卡的闪速设备 |
EP1372069A2 (en) * | 2002-06-12 | 2003-12-17 | ATI Technologies Inc. | Method system and software for configuring a graphics processing communication mode |
Non-Patent Citations (2)
Title |
---|
US 2004/0003154 A1,全文. |
同上. |
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CN1957340A (zh) | 2007-05-02 |
US8643657B2 (en) | 2014-02-04 |
US7265759B2 (en) | 2007-09-04 |
US20080007552A1 (en) | 2008-01-10 |
US7324111B2 (en) | 2008-01-29 |
US20050228928A1 (en) | 2005-10-13 |
TW200612333A (en) | 2006-04-16 |
US20050225549A1 (en) | 2005-10-13 |
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