CN1943078B - 电信连接器 - Google Patents
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- H01—ELECTRIC ELEMENTS
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
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- H—ELECTRICITY
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
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- H—ELECTRICITY
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- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
- H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
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- H—ELECTRICITY
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
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Abstract
一种用于连接器中的接触元件,所述连接器包括适于容置包括有端子触点的线缆插头的插座,所述接触元件包括:柔性的电介质基板;位于所述基板的第一表面上的第一导电片;以及补偿元件;其中当所述插头插入到所述插座中时,所述端子触点与所述导电片在与所述补偿元件相邻接的区域内相接触。
Description
本发明要求被共同转让的在2004年4月19日申请、并被分配了序列号No.60/562,992的名称为“连接器”的临时申请的权利。在此将上述临时专利申请的全文引入作为参考。
技术领域
本发明涉及一种电信连接器。特别地,本发明涉及一种包括多个接触点的电信连接器,其中,所述接触点在接触位置处具有补偿元件。
背景技术
连接器、或者连接器插座,适于容置插头,用于将电信线缆和装备相互连接起来,一个良好的例子是符合普遍的RJ-45标准的连接器和插头。如现有技术中所公知的,当插头插入到连接器中时,一系列沿插头边缘露出的端子触点与设置在连接器壳体内的一系列的对应接触元件相接触。典型地,每个接触元件都形成刚性尖齿的一部分,所述刚性尖齿例如由镀镍或镀金的钢或者类似的导电材料制造。各个尖齿安装在一个绝缘支撑件中并包括一个可弯曲的部分,从而,当端子触点与接触元件相接触时,接触元件回缩,同时导致接触元件承受反作用力以改进相互连接。
随着数据通讯系统中的传输带宽和传输速率增大,对串话噪音的补偿变得越发重要。当配线和线缆布线的结构和构造得以改进以满足这些数据传输技术的低噪音要求时,端接于这种传输线路的连接器也必须满足相同的要求。
符合公知的RJ-45标准的连接器是受到相邻导体对之间的串话噪音(NEXT:近端串话;FEXT:远端串话)影响的连接器的良好示例,因为位于这种连接器中的导体对(通常4对)并不是对于所有的对组合都是对称地构造的。为了完全地补偿在传输经过这种插头/连接器接口的信号中所出现的共模和差模串话噪音,换句话说,为了使得上述连接器在最佳的平衡模式下工作,则每对的所有导体之间的电抗必须是相等的。目前,在现有技术的插头和连接器中,由销3-6和4-5所限定的对通常被很好地平衡了,为这些对之间的共模和差模噪音提供了足够的补偿。另一方面,对1-2和3-6以及对3-6和7-8之间的电容耦合并不是对于所有的导体都是相等的,尤其是,这导致了对之间的模转换噪音或者串话(例如,差模至共模NEXT,或者反之亦然),这在试图与日益严格的工业标准相适应时是一个显著的问题。
现有技术揭示了各种用于对之间模转换噪音或串话的补偿网络和方法。然而,这些现有技术的网络的一个缺点在于:补偿元件——电感式的或电容式的——远离位于插头的端子触点与连接器的接触元件之间的接触位置。
发明内容
本发明通过提供一种用于连接器中的接触元件而致力于克服上述缺点和其它的缺点,所述连接器包括插座,所述插座适于容置包括有端子触点的线缆插头。接触元件包括:柔性的电介质基板;位于所述基板第一表面上的第一导电片;以及补偿元件。当插头插入到插座中时,端子触点与导电片在与所述补偿元件相邻接的区域内相接触。
此外,本发明提供了一种用于和线缆插头相互连接的补偿连接器,所述插头包括有多个端子触点。该连接器包括适于容置插头的插座;多个设置在该插座中的接触元件,每个接触元件都包括有导电接触片;以及由多个补偿元件组成的补偿网络,其中,每个补偿元件都位于一个接触元件的附近。当所述插头插入到插座中时,端子触点中预定的一个与所述导电接触片相接触。
同时,本发明提供了一种用于补偿连接器中的接触元件,所述连接器包括适于容置包括有多个端子触点的线缆插头的插座。所述接触元件包括电介质支撑件、以及补偿元件,所述补偿元件包括有位于支撑件的表面上的导电片。当插头插入到插座中时,端子触点与所述导电片相接触。
另外,本发明提供了一种用于和端接于电信线缆的线缆插头相互连接的补偿连接器,所述线缆包括有多个成对设置的导体,所述插头包括多个端接于一个预定的导体的端子触点。该连接器包括适于容置所述插头的插座;多个设置在该插座中的接触元件,每个接触元件包括有导电片;以及由多个补偿元件组成的补偿网络,其中,每个补偿元件位于一个接触元件的附近。当所述插头插入到所述插座中时,每个端子触点与一个预定的导电片相接触。
附图说明
图1为依据本发明一个示意性实施方式的RJ-45插座和插头组件的立体图;
图2提供了依据本发明一个示意性实施方式的连接器的分解视图;
图3提供了依据本发明一个示意性实施方式的支撑结构的竖立的(raised)、从前方观察的立体图,其中支撑结构附连有柔性PCB;
图4A提供了柔性PCB的俯视图,其详细描述了依据本发明一个示意性实施方式的PCB顶面上的迹线;
图4B提供了图4A中的柔性PCB的俯视图,其详细描述了依据本发明一个示意性实施方式的在PCB底面上的迹线;
图4C为沿图4A中的4C的剖视图;
图5提供了依据本发明一个示意性实施方式的插头和补偿网络的示意图;
图6提供了依据本发明一个示意性实施方式的柔性PCB的竖立的、从前方观察的立体图;
图7提供了依据本发明一个可选示意性实施方式的支撑结构的竖立的、从前方观察的立体图,其中支撑结构附连有柔性PCB;
图8提供了依据本发明第二可选示意性实施方式的接触组件和补偿网络的(从下方观察的)侧视立体图;
图9提供了依据本发明第三示意性实施方式的连接器的竖立的、从后方观察的立体图。
具体实施方式
现在参照图1,现在将对整体用参考标号10指代的连接器的一个示意性实施方式进行描述。如本领域中所公知的那样,12所示的用户装备通常通过网络线缆14而接到局域网(LAN)或类似设备(未示出)上,所述网络线缆14包括多个双绞线导体(未示出)。网络线缆14端接于一个插头16处,该插头16适于被插入到连接器10中(以及从连接器移除)。连接器10端接于一个通讯线缆18,而该通讯线缆的另一端端接于另一网络装备,例如开关、网络集线器、路由器、转发器和类似设备(都没有示出)。网络线缆14和通讯线缆18通常由相同数量的如20所示的双绞线导体组成。
仍然参照图1,连接器10——其通常安装成与通讯线缆18隐藏于其后的墙壁或类似设备(未示出)齐平——插入到一个面板22中并通过一对以模制或者其它方式形成在连接器10外表面上的薄片24而牢固地保持在面板22中,所述薄片24与模制在面板22中的类似互锁部分26配合。对于符合RJ-45标准的插座和插头而言,在连接器10内设置有一系列八个连接器接触片(未示出),所述各个接触片各自端接于通讯线缆18的双绞线导体20。类似地,八个位于线缆14中的导体由如28所示的一系列八个端子触点分别地端接,所述八个端子触点沿插头14的前表面30露出。当插头16插入到连接器10中时,连接器10的连接器接触片与插头16的端子触点28相接触,从而在插头16和连接器10之间提供导电通路,并且由此将线缆14的导体与通讯线缆18的导体相互连接起来。
现在参照图2,如10所示的连接器通常是模块化的并设计成卡合到面板(或嵌板)22中,所述面板22设置有一个或多个如32所示的切口式连接器容座,或者可选地设计成用于直接地安装在印刷电路板或类似设备(未示出)上,以作为较大电路组件的一个部分。示意性地,连接器10包括一个两部分式的壳体,该两部分式的壳体包括均由适当的刚性不导电材料——例如塑料——制造的前部34和后部36。一系列由接触片40组成的接触元件38设置在所述壳体内,并且在前部34被组装到后部36上时被封装在该壳体中。接触片40系列如图所例示地蚀刻在印刷电路板(PCB)44的第一表面42上,所述印刷电路板44由不导电(介电)并且如图所例示地是柔性的材料——例如聚酰胺、等——制造,并且涂覆以铜或铝之类的导电材料,以形成一个接触组件。如现有技术中所公知的,平版印刷技术可用于选择性地将导电材料表面层从PCB上移除,留下由不导电基板支撑的导电迹线。暴露出的系列接触片40通常覆盖有高氧化势的导电材料——例如金。
如同现在对于本领域内的普通技术人员而言是明显的那样,当线缆插头(未示出)插入到插头开口46中时,线缆插头中的每个接触件都将压紧在系列接触片40中的一个互补件上。由于PCB 44是柔性的,接触片40系列易于从线缆插头偏转开。为了确保在设置于插头中的接触件和接触片40系列之间可以保持良好的接触,设置一个刚性的支撑结构48——例如由例如塑料的不导电材料制造,柔性PCB 44绕该支撑结构翘曲。如50中具有有限柔度的的一系列不导电的支撑刃片在第一端52处安装至支撑结构48上,每个如50所示的刃片都位于系列接触片40之一的下方。刃片50提供了一个独立的反作用力,其试图将系列接触片40偏置向线缆插头的接触件,从而当线缆插头插入到组件10中时确保可靠的接触。另外地,为了增加系列接触片40彼此之间的柔度,在制造PCB 44时移除了相邻接触片40之间的材料。
现在参照图3,系列接触片40中的每一个都与一个如54所示的特殊的绝缘层位移连接器(IDC)端子接触。如现有技术中所公知的,当如56所示的小直径的绝缘电线被插入到IDC端子54的分叉导电刃片58、60之间时,在电线56的绝缘层62中形成了一个切口,使得导电刃片58、60可以与电线56的导体64接触。
注意,虽然当前的示意性实施方式公开了IDC端子的使用,可选地,IDC端子能够由其它类型的端子替代——例如刚性的接触销,从而使得连接器10可以直接地焊接到PCB或类似设备上(未示出)。
现在参照图4A和图4B,现在将对一个柔性的接触组件66进行描述。所述系列接触片40通过一系列的如70所示的迹线与IDC端子(图3中的54)的如68所示的接触垫相互连接,所述迹线蚀刻在PCB 44的第一表面72和第二表面74上。另外,设置有一个包括有一系列选择性地互连的电容性补偿元件的补偿网络76。
在图4A和图4B之外再次参照图1,通过调节在如14和18所示的线缆内的双绞线导体的设置方式,并且在某些情形中在双绞线导体之间提供屏蔽,优化了如14和18所示的线缆的设计,以使得导体之间的串话最小化。然而,如现有技术中所公知的,例如连接器10、线缆14、18和插头16之类的元件通过将寄生电抗引入到信号传送通路中而干扰了这个最优化,从而导致了关于串话、抗扰度等的未平衡的性能,其不利地影响由这些元件组成的通讯系统的性能。另外,双绞线的解扭以及在连接器10/插头14的边界处存在金属触点也影响了这个优化并且引入了杂散或寄生电抗,如果需要保持高的数据传输速率,则必须对这些杂散或寄生电抗进行处理(或者补偿)。而且,相邻的导体在一定程度上彼此耦合,并且以此方式串话被引入到通讯信号中。补偿网络76通过引入对这些寄生电抗进行补偿的感抗和容抗而选择地耦合双绞线导体(图1中的附图标记20),从而改善性能,尤其是在高频率时改善在减少串话、减少噪音等方面的性能。如现有技术中所公知的那样,这种补偿网络可通过将电容性补偿元件和/或电感性补偿元件结合在一起而形成。
现在参照图4C,每个电容性补偿元件78包括有第一接触板和第二接触板82,所述第一接触板通过蚀刻到PCB 44内的接触片40的第一表面72而提供,而第二接触板82蚀刻在PCB 44的第二表面74上。如同现在本领域内的普通技术人员所理解的那样,PCB 44的夹在接触片40和第二接触板82之间的介电材料的组合提供了一个电容性补偿元件78。这个构造的一个很大的优点在于如78所示的补偿元件位于连接器10和插头(未示出)之间的接触位置处,这大大地改善了补偿网络76的高频性能。
再次参照图4A和图4B,为了提供电感性补偿元件,必须设置重叠的感应回路。如同本领域内的普通技术人员所知道的那样,电感耦合的量将部分地取决于重叠的感应回路之间的重叠面积。另外,电感耦合可以是正向或者是逆向的,取决于在两个回路中流动的电流的方向。在图4A和图4B之外参照图1,当插头16被插入到连接器10内时,端子触点28将在接触区域84中与接触片40中的预定的片相接触。特别地,将通过通孔接触86和迹线703在接触片(或销)3(附图标记403)和其相关的接触垫683之间形成一个通路。注意,迹线703的通路位于接触片(或销)5(图4A中的附图标记的405)的上方。类似的,将通过通孔接触88和迹线706在接触片(或销)6(附图标记406)和其相关的接触垫686之间形成通路。注意,迹线706的通路位于接触片(或销)4(附图标记图4A上的404)的上方。由此,一对重叠的感应回路形成于对3-6和对4-5之间,导致了与销4(附图标记404)和销5(附图标记405)之间的间距成比例的电感耦合。在由虚线框所示的PC板44上的区域90中,在销对4-5(附图标记404和405)的迹线704、705和销对3-6(附图标记403和406)的迹线703、706之间形成有类似的电感耦合。然而,在此第二情形中,感应回路是反向的。
注意:虽然本示例性的实施方式描述了具有两个由介电基板分开的导电层的柔性PCB 44基板,但是,本领域内的普通技术人员将会理解也可以使用多层的PCB,其中多个导电层由多个介电基板分开。
在依据RJ-45标准的连接器、线缆和插头组件中,八个连接器成对地设置,其扭曲在一起而形成被广泛用于电信系统中的双绞线。现在参照图5,RJ-45插头可以被模型化成一系列如92所示的端子触点,这些端子触点端接于一系列导体94并且其间引入了一系列如96所示的寄生电容。当插头16插入到连接器10中时,如92所示的一系列端子触点与如40所示的接触片相接触,所述接触片还形成了电容性补偿元件78的第一接触板。如本文所述,补偿元件78设置成一补偿网络76,该补偿网络设计成对由寄生电容96引起的不利影响进行补偿或平衡。在这个方面,并且仍然参照图5,示意性的,标号为781的系列电容性补偿元件对微分寄生电容96进行补偿。另外,可选地增加另一系列电容性补偿元件(标号为782、783、和784)以对由寄生电容96和补偿元件781的组合产生的共模噪音信号进行补偿。注意,其它构造的电容性补偿元件也是可能的。另外,如上述的那些电感性补偿元件可与如上所述的电容性补偿元件结合使用——对补偿网络76进行适当的修正。
为了平衡连接器10/插头16接口,补偿(平衡)元件可集成到连接器10中而形成补偿网络76,该补偿网络将抵消所引起的寄生电容96。这种补偿网络76可以通过如78所示的补偿元件组合而制造,例如所述补偿元件组合包括有一个或多个电容元件。在一个示例性的实施方式中,所有的补偿元件78的电容值都位于(360±15)×10-15法拉之间。必须的,通过将如78所示的补偿元件放置成靠近引入上述寄生电容96的位置(即位于的端子触点92和连接器接触片40之间的接触位置处),可以改善补偿(因为对所传输信号的时移校正必须从其必须点延迟,从而在纠正过的信号中产生不期望的扰动)。
现在在图2之外还参照图6,在组装中,PCB 44形成为与支撑结构48配合。现在参照图7,然而,在支撑结构48的一个可选的构造中,可以组装一个类似的连接器10而不用明显地弯曲PCB 44。这使得例如可以使用更硬构造的PCB,例如那些由FR4环氧树脂层的薄板所制造的PCB。图7的PCB 44还具有这样的优点:位于系列接触片40和如54所示的IDC端子中间的互连迹线(未示出)被稍微缩短了。
参照图8,在第二可选实施方式中,如图2中的50所示的不导电支撑刃片可由一系列金属齿98替代。齿98可用来支撑图4A和4B的PCB 44,同时在齿98和PCB 44之间提供适当的绝缘电介质。可选地,如78所示意性示出的补偿元件可通过适当的不导电粘合剂(未示出)而直接地形成在齿98上。在这个方面,齿98提供了补偿元件78的第一接触板,同时在第二接触板82和齿98之间提供适当的电介质(例如,一片介电材料设置在第二接触板82和齿98的表面之间)。示意性地,补偿元件78的第二接触板82与由齿98形成的第一接触板通过一系列如100所示的小直径电线互连,以形成一个补偿网络。
现在参照图9,柔性PCB 44的使用允许以下的变化:设置如54所示的IDC端子,而PCB 44无明显的修改。这使得例如可以通过减少双绞线的各个电线56在插入之前所必须解扭的量而改善线缆102的端接端子,其中电线56的插入是指插入到IDC端子54的分叉导电刃片58、60之间。线缆102和连接器10之间互连的改善又使得性能改善。
虽然在上文中通过示意性的实施方式对本发明进行了描述,但是可以对这些实施方式进行修改而不会偏离本发明的精神和本质。
Claims (21)
1.一种用于连接器中的接触元件,所述连接器包括适于容置包括有端子触点的线缆插头的插座,所述接触元件包括:
柔性的电介质基板;
位于所述基板的第一表面上的第一导电片;以及
补偿元件;
其中当所述插头插入到所述插座中时,所述端子触点与所述第一导电片在与所述补偿元件相邻接的区域内相接触。
2.如权利要求1所述的接触元件,其中所述补偿元件包括电容器和电感回路,所述第一导电片用作所述电容器的接触板,且所述电感回路的至少一部分包括所述第一导电片。
3.如权利要求1所述的接触元件,其中所述补偿元件包括电容器,并且其中所述第一导电片用作所述电容器的接触板。
4.如权利要求1所述的接触元件,其中所述补偿元件包括电感回路,并且其中所述电感回路的至少一部分包括所述第一导电片。
5.如权利要求1所述的接触元件,其中所述基板为柔性的印刷电路板,且所述第一导电片蚀刻在所述第一表面上。
6.如权利要求1所述的接触元件,进一步包括位于所述基板的第二表面上的第二导电片。
7.如权利要求1所述的接触元件,进一步包括用于将所述第一导电片朝着所述端子触点偏置的柔性支撑件。
8.如权利要求7所述的接触元件,其中所述柔性支撑件与所述基板的第二表面相接触。
9.一种用于和线缆插头相互连接的补偿连接器,所述插头包括多个端子触点,所述连接器包括:
适于容置插头的插座;
多个设置在所述插座中的接触元件,每个所述接触元件包括导电接触片,其中当所述插头插入到所述插座中时,所述端子触点中预定的一个与所述导电接触片在接触区域中相互连接;以及
包括多个补偿元件的补偿网络,其中,每个所述补偿元件与所述接触区域之一相邻接。
10.如权利要求9所述的连接器,其中所述补偿元件中的至少一个是电容器。
11.如权利要求9所述的连接器,其中所述补偿元件中的至少一个是电感器。
12.如权利要求10所述的连接器,其中对于每个所述电容器,其中一个所述导电接触片用作接触板。
13.如权利要求9所述的连接器,其中各所述多个接触元件中进一步包括电介质基板,并且其中所述导电接触片位于所述电介质基板的第一表面上。
14.如权利要求13所述的连接器,其中所述电介质基板是柔性的印刷电路板,且所述导电接触片中的每一个蚀刻在所述第一表面上。
15.一种用于补偿连接器中的接触元件,所述连接器包括插座,所述插座适于容置包括端子触点的线缆插头,所述接触元件包括:
电介质支撑件;以及
包括位于所述支撑件的表面上的导电片的补偿元件;
其中,当所述插头插入到所述插座中时,所述端子触点与所述导电片相接触。
16.如权利要求15所述的接触元件,其中所述补偿元件包括电容器和电感回路,所述电容器的接触板包括所述导电片的至少一部分,且所述电感回路的至少一部分包括所述导电片。
17.如权利要求15所述的接触元件,其中所述补偿元件包括电容器,并且其中所述电容器的接触板包括所述导电片的至少一部分。
18.如权利要求15所述的接触元件,其中所述补偿元件包括电感回路,并且其中所述电感回路的至少一部分包括所述导电片。
19.如权利要求15所述的接触元件,其中所述电介质支撑件是柔性的。
20.如权利要求19所述的接触元件,其中所述柔性支撑件是柔性的印刷电路板,且所述导电片蚀刻在所述第一表面上。
21.一种用于和端接电信线缆的线缆插头相互连接的补偿连接器,所述电信线缆包括多个成对设置的导体,所述插头包括多个端子触点,每个端子触点端接所述导体中预定的一个,所述连接器包括:
适于容置所述插头的插座;
多个设置在所述插座中的接触元件,每个所述接触元件包括导电片,其中,当所述插头插入到所述插座中时,每个所述端子触点在接触区域内与所述导电片中预定的一个相接触;以及
由多个补偿元件组成的补偿网络,其中,每个所述补偿元件与所述接触区域之一相邻接。
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Also Published As
Publication number | Publication date |
---|---|
EP1738438A1 (en) | 2007-01-03 |
EP1738438B1 (en) | 2012-10-10 |
CA2464834A1 (en) | 2005-10-19 |
CA2563655A1 (en) | 2005-10-27 |
AU2005234099B2 (en) | 2010-03-18 |
JP2007533110A (ja) | 2007-11-15 |
CA2563655C (en) | 2012-11-13 |
MXPA06012021A (es) | 2007-08-14 |
WO2005101579A1 (en) | 2005-10-27 |
US7837513B2 (en) | 2010-11-23 |
AU2005234099A1 (en) | 2005-10-27 |
US8021197B2 (en) | 2011-09-20 |
CN1943078A (zh) | 2007-04-04 |
US20080132123A1 (en) | 2008-06-05 |
EP1738438A4 (en) | 2008-04-09 |
US20110065322A1 (en) | 2011-03-17 |
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