CN1941282A - Substrate drying device and method, and substrate producing method - Google Patents
Substrate drying device and method, and substrate producing method Download PDFInfo
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- CN1941282A CN1941282A CN 200610152390 CN200610152390A CN1941282A CN 1941282 A CN1941282 A CN 1941282A CN 200610152390 CN200610152390 CN 200610152390 CN 200610152390 A CN200610152390 A CN 200610152390A CN 1941282 A CN1941282 A CN 1941282A
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Abstract
The present invention can move substrates with high speed, at the same time equably dry substrates. Nozzle (21) supplies cleaning liquid to the surface of the substrate 1, air knives (22a, 22b) eject air to the surface of back of the substrate (1). The air ejected from air knife (22a) makes the cleaning liquid supplied by nozzle (21) move toward the opposite direction of the substrate moving direction on the substrate (1). Adjusting the quantity of the cleaning liquid supplied by nozzle (21) and the quantity and speed of the air ejected from air knife (22a) in order to make the cleaning liquid moving speed slower than the substrate moving speed. Therefore, forming the continuous and thin liquid film of cleaning liquid on the whole surface of the substrate (1) under the air knife (22a). The liquid film forming on the surface of the substrate (1) is vaporized when it through the lower part of the halogen lamp (31), and is wiped off from one end of the substrate (1) continuously.
Description
Technical field
The present invention relates to substrate drying device, drying method for substrate that the display panel substrate (panel substrate) of a kind of dry flat-panel screens (Flat Panel Display) device usefulness waits and the manufacture of substrates that has used these, particularly a kind of substrate drying device, the drying method for substrate of high-speed mobile substrate one side dry substrate and manufacture of substrates that has used these of being suitable on one side.
Background technology
In the manufacturing process of the display panel substrate of using as the type flat panel display apparatus of LCD (liquid crystal Display) device or plasma display (plasma Display) device etc., in order on substrate, to form circuit pattern or colored filter (color filter) etc., develop or soup such as etching is handled.And, before soup is handled or after soup handles, must use cleaning fluid such as pure water that substrate is cleaned, and the substrate after the cleaning is carried out drying.For a series of processing of cleaning that comprises substrate and drying, more is to use drum-type to move mobile device moving substrates such as machine on one side, clean and dried on one side, and generally speaking, the drying of substrate is, use air knife to the substrate injection air, wash out and remove cleaning fluid from substrate surface thus.
Utilize air knife that substrate is carried out drying, the ability of its dry substrate is higher, but then, sometimes can be once more attached on the substrate surface by the water droplet of the cleaning fluid that blows off from substrate surface from the air of air knife, the residual vestige that is known as watermark on substrate surface.To this, in patent documentation 1, disclose to have and do not use air knife that substrate is carried out dry method.
[patent documentation 1] Japanese patent laid-open 10-321583 communique
When one side moving substrate on one side carries out a series of processing to substrate, for shorten the production time (tact time), moving substrate at high speed.Particularly, along with the big pictureization of type flat panel display apparatus, it is big more that substrate becomes in recent years, in order to be controlled at the production time below the known production time, necessary on one side with the speed moving substrate higher than known techniques, on one side substrate is carried out a series of processing.
Formerly, when using air knife that substrate is carried out drying, if the high-speed mobile substrate, then the part of cleaning fluid can't be removed from substrate surface fully, and distribution and residual, therefore residual have the part of cleaning fluid to form spot after drying, thereby produce uneven drying.Particularly, when on substrate surface, forming pattern etc. when concavo-convex, because the moving of the concavo-convex obstruction cleaning fluid of substrate surface, so to produce the possibility of uneven drying higher because of residual cleaning fluid.In order to suppress this kind uneven drying, moving substrate then must be got over and spray a large amount of air at high speed more at high speed.
On the other hand, the technology of being put down in writing in the patent documentation 1 is compared with the occasion of having used air knife, and the ability of dry substrate is lower, therefore is not suitable for moving substrate at high speed.
Summary of the invention
Problem of the present invention is high-speed mobile substrate on one side, Yi Bian dry substrate equably.And problem of the present invention is high-speed mobile substrate on one side, Yi Bian reduce the air use amount of air knife.And problem of the present invention is with the short high substrate of production time quality bills of materials.
Substrate drying device of the present invention comprises: the substrate mobile device of moving substrate; Liquid film forms device, have cleaning solution supplying device and air knife, wherein said cleaning solution supplying device is supplied with cleaning fluid to the substrate surface that is moved by the substrate mobile device, described air knife injection air, by the air that ejects by this air knife, make cleaning fluid, on substrate surface, move to the opposition side of substrate moving direction, on the whole surface of substrate, form continuous liquid film thereafter with the speed that is slower than the substrate translational speed by described cleaning solution supplying unit feeding; And the liquid film removal device, begin to remove continuously successively to form the formed liquid film of device from an end of substrate by liquid film.
In addition, for drying method for substrate of the present invention, one side moving substrate, supply with cleaning fluid and injection air to substrate surface on one side, the air that utilization is ejected makes institute's cleaning liquid supplied on substrate surface, with the speed that is slower than the substrate translational speed after the opposition side of substrate moving direction moves, form continuous liquid film on the whole surface of substrate, the end from substrate begins to remove continuously successively formed liquid film then.
Air knife makes the cleaning fluid of substrate surface move to the opposition side of substrate moving direction by to the substrate surface injection air.At this moment, according to prior art, in order fully to remove cleaning fluid from substrate surface, the flow and the speed of the air that air knife is sprayed are adjusted, so that the translational speed of cleaning fluid identical with the substrate translational speed or faster (translational speed of cleaning fluid 〉=substrate translational speed).Therefore, the substrate translational speed is fast more, then more must be from a large amount of air of air knife high velocity jet.
The present invention makes the translational speed of cleaning fluid be slower than substrate translational speed (translational speed of cleaning fluid＜substrate translational speed) unlike the prior art, forms continuous liquid film on the whole surface of substrate.That is, air knife is formed the part of device as liquid film, and be not only to be used as known cleaning fluid removal device.Because need not fully remove cleaning fluid from substrate surface by air knife, thus also go for the occasion of high-speed mobile substrate, and less the getting final product of air use amount of air knife.And, by the liquid film removal device that except that air knife, is provided with in addition, begin to remove continuously successively formed liquid film, so the part of cleaning fluid can not scattered and remains on the substrate surface from an end of substrate.
And for substrate drying device of the present invention, the thickness that is formed the liquid film that device forms by liquid film is about 7～20 μ m.In addition, drying method for substrate of the present invention forms the liquid film that thickness is about 7～20 μ m.When the thickness of liquid film is about 7～20 μ m, on substrate surface, only there is the fluid molecule of 1 layer or several layers of liquid film, therefore by the light of liquid film surface reflection and light mutual interference mutually by the substrate surface reflection, thereby appearance is corresponding to the interference stripes of thickness of liquid film.If the thickness of liquid film is made as about 7～20 μ m that these interference stripes occur, then the liquid measure of liquid film becomes considerably less, therefore can easily remove liquid film.
And for substrate drying device of the present invention, the liquid film removal device has halogen lamp heater.In addition, drying method for substrate of the present invention is, shines infrared ray from halogen lamp heater to substrate surface, behind the heating liquid film, makes liquid film evaporation.Because of halogen lamp heater can produce from near-infrared to infrared infrared ray, and local shine after the infrared ray that is produced is concentrated, so can only heat the specific region of substrate surface.Therefore, when one side moving substrate, Yi Bian when removing the liquid film of substrate surface successively continuously, can heat necessarily and after institute's desire is removed the peripheral region in zone cleaning fluid is evaporated discontinuously.
Manufacture of substrates of the present invention uses described any substrate drying device or drying method for substrate to come dry substrate.High-speed mobile substrate on one side, dry substrate equably on one side therefore can be with the high substrate of production time quality bills of materials of lacking.
According to substrate drying device of the present invention and drying method for substrate, Yi Bian moving substrate at high speed, Yi Bian dry substrate equably.Particularly, drying be formed with concavo-convex substrates such as pattern from the teeth outwards equably.And high-speed mobile substrate on one side is Yi Bian reduce the air use amount of air knife.
And, according to substrate drying device of the present invention and drying method for substrate,, can make the liquid measure of liquid film considerably less by forming the liquid film that thickness is about 7～20 μ m, therefore can easily remove liquid film.
And, according to substrate drying device of the present invention and drying method for substrate,, can only heat the specific region of substrate surface by using halogen lamp heater, therefore can be easily moving substrate on one side, Yi Bian remove the liquid film of substrate surface successively continuously.
According to manufacture of substrates of the present invention, because high-speed mobile substrate on one side, so dry substrate equably on one side is can be with the high substrate of production time quality bills of materials of lacking.
Description of drawings
Fig. 1 is the figure of schematic configuration of the substrate drying device of expression the present invention one example.
Fig. 2 is the figure of the substrate surface behind the expression formation liquid film.
The figure of the substrate surface when Fig. 3 is expression removal liquid film.
Fig. 4 is the flow chart of an example of manufacturing process of the TFT substrate of expression liquid crystal indicator.
Fig. 5 is the flow chart of an example of manufacturing process of the colored filter substrate of expression liquid crystal indicator.
1: substrate 2: liquid film
10: cylinder 20: liquid film forms the chamber
21: nozzle 22a, 22b: air knife
30: liquid film is removed chamber 31: Halogen lamp LED
32a, 32b: reflecting plate 33: shadow shield
34: coldplate 101～106,201～204: operation
Embodiment
Fig. 1 is the figure of schematic configuration of the substrate drying device of expression the present invention one example.Substrate drying device comprises that liquid film forms chamber 20 and removes chamber 30 with liquid film.Form in chamber 20 and the liquid film removal chamber 30 at liquid film, with predetermined a plurality of cylinders 10 that are arranged at intervals with, the substrate 1 of lift-launch on cylinder 10 moves to the substrate moving direction shown in the arrow by the rotation of cylinder 10.
Moreover in this example, moving substrate 1 under level, but the present invention is not limited to this, also can be with respect to horizontal direction, with the direction of substrate moving direction orthogonal on, perhaps becoming under the state of predetermined angle incline moving substrate 1 with the substrate moving direction.
Leading portion in liquid film formation chamber 20 for example disposes the purge chamber, and the substrate 1 through cleaning in the purge chamber is moved into liquid film and formed chamber 20 by cylinder 10.In liquid film forms chamber 20, be equipped on substrate 1 on the cylinder 10 above, with direction (graphic depth direction (depth the direction)) width of the substrate moving direction orthogonal of substrate 1 in, with substrate 1 nozzle 21 is set abreast.Nozzle 21 is for example with predetermined interval jet hole to be set in longer pipe, perhaps is set to slit-shaped in the longitudinal direction.Never cleaning fluids such as pure water are supplied with in illustrated cleaning solution supplying source to nozzle 21.Nozzle 21 is supplied with cleaning fluid from jet hole to the surface of substrate 1 in the longitudinal direction equably.
And, in liquid film forms chamber 20, be equipped on substrate 1 on the cylinder 10 above and below, with direction (graphic depth direction) width of the substrate moving direction orthogonal of substrate 1 in, with substrate 1 air knife 22a, 22b are set abreast.Air knife 22a, 22b for example form the compression chamber in long enclosure, and the air flue that communicates with the compression chamber in the longitudinal direction is set to slit-shaped.Never illustrated air supply source is to air knife 22a, 22b air supply.Air knife 22a, 22b from the front end of air flue towards with the direction of tossing about of substrate moving direction, with predetermined incident angle in the longitudinal direction, to the surface of substrate 1 or back side injection air equably.
Moreover, in this example, in liquid film formation chamber 20,1 nozzle 21 and air knife 22a, 22b only are set respectively, but also can be at the nozzle 21 or air knife 22a, the 22b that are provided with on the substrate moving direction more than 2 or 2.
By the air that ejects from air knife 22a, on the surface of substrate 1, move to the opposition side of substrate moving direction from nozzle 21 cleaning liquid supplied.In the present invention, adjust the flow and the speed of the air that ejects from the amount of nozzle 21 cleaning liquid supplied and from air knife 22a, so that the translational speed of cleaning fluid is slower than substrate translational speed (translational speed of cleaning fluid＜substrate translational speed).Thus, on whole surface, form the continuous of cleaning fluid and thin liquid film by the substrate 1 below the air knife 22a.
Fig. 2 represents to form the figure of the substrate surface behind the liquid film.Fig. 2 is the figure that amplifies the laggard line display of a part of substrate 1 near surface, on the whole surface of substrate 1, is formed with continuously and thin liquid film 2.
In this example, specifically, adjust the flow and the speed of the air that ejects from the amount of nozzle 21 cleaning liquid supplied and from air knife 22a, so that the thickness of formed liquid film is about 7～20 μ m.When the thickness of liquid film 2 is about 7～20 μ m, the fluid molecule that on the surface of substrate 1, only has 1 layer or several layers liquid film 2, therefore by the light of the surface reflection of liquid film 2 and light mutual interference mutually by the surface reflection of substrate 1, thereby appearance is corresponding to the interference stripes (interference fringe) of the thickness of liquid film 2.If the thickness of liquid film 2 is made as about 7～20 μ m that these interference stripes occur, then the liquid measure of liquid film 2 becomes considerably less, therefore can easily remove the liquid film 2 in the following liquid film removal chamber 30.
After forming liquid film,, substrate 1 is sent into liquid film remove chamber 30 by cylinder 10.In liquid film removal chamber 30, be provided with halogen lamp heater.Halogen lamp heater comprises Halogen lamp LED 31, reflecting plate 32a, 32b, shadow shield 33, and coldplate 34.Above substrate 1, with direction (graphic depth direction) width of the substrate moving direction orthogonal of substrate 1 in, dispose Halogen lamp LED 31, reflecting plate 32a and shadow shield 33 abreast with substrate 1.In the same way, configuration reflecting plate 32b below substrate 1.Coldplate 34 is installed in respectively on reflecting plate 32a, the 32b.
Moreover, in this example, in liquid film removal chamber 30, only be provided with 1 halogen lamp heater, but also can be in the halogen lamp heater that is provided with on the substrate moving direction more than 2 or 2.
Halogen lamp LED 31 is with the lamp of halogen hermetic seal in columned elongated tubular, and produce equably in the longitudinal direction from near-infrared to infrared infrared ray.Reflecting plate 32a has the reflecting surface of having represented its section in Fig. 1, and reflects the infrared ray that is produced by Halogen lamp LED 31 in the longitudinal direction equably.By the infrared ray of Halogen lamp LED 31 generations and the surface that is irradiated to substrate 1 by the infrared ray of reflecting plate 32a reflection.
Shadow shield 33 stops from the infrared ray of Halogen lamp LED 31 and from the ultrared part of reflecting plate 32a, prevents that infrared ray from spreading to the substrate moving direction.Thus, infrared ray only is irradiated to the presumptive area on the lip-deep substrate moving direction of substrate 1.Reflecting plate 32b is the structure same with reflecting plate 32a, in the longitudinal direction the infrared ray of reflecting ﹠ transmitting substrate 1 equably.Coldplate 34 portion within it has the path of cooling water, in conducting heat to cooling water after, cooling reflecting plate 32a, 32b.
Substrate 1 moves to the substrate moving direction in liquid film is removed chamber 30, and thereupon, by the below of Halogen lamp LED 31, infrared ray is since the end surface of Continuous irradiation substrate 1 successively successively on the surface of substrate 1.Thus, be formed on substrate 1 lip-deep liquid film, be heated back evaporation in the time of below by Halogen lamp LED 31, begin to be removed continuously successively from an end of substrate 1.
The figure of the substrate surface when Fig. 3 represents to remove liquid film.Fig. 3 and Fig. 2 are the figure that amplifies the laggard line display of a part of substrate 1 near surface equally, and are formed on substrate 1 lip-deep liquid film 2 and are begun to remove continuously successively by the end from substrate 1.
On the whole surface of substrate 1, after removal is formed on substrate 1 lip-deep liquid film, by cylinder 10 substrate 1 is taken out of liquid film and remove chamber 30.
In example discussed above, because of need not cleaning fluid to be removed fully from substrate surface by air knife, thus also can be useful in the occasion of high-speed mobile substrate, and less the getting final product of air use amount of air knife.And, because of the end from substrate begins to remove continuously successively established liquid film,, the part of cleaning fluid do not remain on the substrate surface so can not scattering.Therefore, according to example discussed above, Yi Bian moving substrate at high speed, Yi Bian dry substrate equably.Particularly, drying be formed with concavo-convex substrates such as pattern from the teeth outwards equably.And, Yi Bian moving substrate at high speed, Yi Bian reduce the air use amount of air knife.
And, according to example discussed above, can be by using halogen lamp heater, and the lip-deep specific region of heated substrates only.Therefore, when one side moving substrate,, after institute's desire is removed the peripheral region in zone cleaning fluid is evaporated discontinuously and can heat necessarily Yi Bian when removing the liquid film of substrate surface successively continuously, can easily remove the liquid film of substrate surface successively continuously.
Fig. 4 is the flow chart of an example of manufacturing process of the TFT substrate of expression liquid crystal indicator.Form in the operation (step 101) at film, by reactive sputtering (sputterng) or plasma chemical vapor deposition (CVD, Chemical-Vapor-Deposition) etc., on glass substrate, form films such as the electric conductor film of the transparency electrode of using as liquid crystal drive or insulator film.In resist-coating operation (step 102), behind coating photosensitive resin materials (photoresist) such as cylinder rubbing method, form photoresist film on the film that in film formation operation (step 101), forms.In exposure process (step 103), use proximity printing device or projection aligner etc., with the pattern transfer of mask to photoresist film.In developing procedure (step 104), by spraying development method etc., developer solution is supplied on the photoresist film, remove the redundance of photoresist film thereafter.In etching work procedure (step 105), remove in the film that in film formation operation (step 101), forms by Wet-type etching, not the part that is covered by photoresist film.In stripping process (step 106), peel off the photoresist film that in etching work procedure (step 105), works by stripper as mask.Can be as required, before these operations or implement the matting and the drying process of substrate afterwards.After for several times repeating these operations, on glass substrate, form tft array.
And Fig. 5 is the flow chart of an example of manufacturing process of the colored filter substrate of expression liquid crystal indicator.Form in the operation (step 201) at black matrix" (black matrix), by painting erosion resistant agent (resist), exposure, development (development), etching, processing such as peel off, on glass substrate, form black matrix".Form in the operation (step 202) at painted (tinting) pattern, by decoration method (Dyeing Method), pigment dispersing method (Pigment Dispersed Method), print process (Printering Method), electricity method (Electrodeposition Method) etc., on glass substrate, form colored pattern.Carry out described colored pattern repeatedly and form operation, to form the colored pattern of R, G, B.Form in the operation (step 203) at diaphragm, on colored pattern, form diaphragm, form in the operation (step 204), on diaphragm, form ELD in ELD.Can be as required, before these operations, implement the matting/drying process of substrate midway or afterwards.
Use substrate drying device of the present invention or drying method for substrate to come dry substrate, Yi Bian moving substrate at high speed thus, Yi Bian dry substrate equably.Therefore, can be with the short high substrate of production time quality bills of materials.
Claims (8)
1. substrate drying device is characterized in that comprising:
The substrate mobile device of moving substrate;
Liquid film forms device, have cleaning solution supplying device and air knife, wherein said cleaning solution supplying device is supplied with cleaning fluid to the surface of the substrate that is moved by described substrate mobile device, described air knife injection air, by the air that ejects by this air knife, make cleaning fluid, on the surface of substrate by described cleaning solution supplying unit feeding, move to the opposition side of substrate moving direction with the speed that is slower than the substrate translational speed, on the whole surface of substrate, form continuous liquid film thereafter; And
The liquid film removal device begins to remove continuously successively to form the formed liquid film of device by described liquid film from an end of substrate.
2. substrate drying device as claimed in claim 1 is characterized in that: the thickness that is formed the liquid film that device forms by described liquid film is about 7～20 μ m.
3. substrate drying device as claimed in claim 1 or 2 is characterized in that: described liquid film removal device has halogen lamp heater.
4. drying method for substrate is characterized in that:
One side moving substrate,
Supply with cleaning fluid and injection air to the surface of substrate on one side, utilize the air that is ejected, make institute's cleaning liquid supplied on the surface of substrate, to be slower than the speed of substrate translational speed, opposition side to the substrate moving direction moves, and forms continuous liquid film thereafter on the whole surface of substrate
End from substrate begins to remove continuously successively formed liquid film then.
5. drying method for substrate as claimed in claim 4 is characterized in that: form the liquid film that thickness is about 7～20 μ m.
6. as claim 4 or 5 described drying method for substrate, it is characterized in that:, after liquid film heated, make described liquid film evaporation from the surface irradiation infrared ray of halogen lamp heater to substrate.
7. a manufacture of substrates is characterized in that: use and come dry substrate as each described substrate drying device in the claim 1 to 3.
8. a manufacture of substrates is characterized in that: use and come dry substrate as each described drying method for substrate in the claim 4 to 6.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005288710 | 2005-09-30 | ||
| JP2005288710 | 2005-09-30 |
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| Publication Number | Publication Date |
|---|---|
| CN1941282A true CN1941282A (en) | 2007-04-04 |
| CN100505154C CN100505154C (en) | 2009-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610152390XA Expired - Fee Related CN100505154C (en) | 2005-09-30 | 2006-09-28 | Substrate drying device and method, and substrate producing method |
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Cited By (8)
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| CN102026428A (en) * | 2009-09-22 | 2011-04-20 | 三星Sdi株式会社 | Lamp heater and drying apparatus including the same |
| CN101768711B (en) * | 2008-12-29 | 2011-09-28 | 襄樊博亚精工机器有限公司 | Automatic cleaning device for lip of air knife |
| CN101551602B (en) * | 2008-04-03 | 2012-07-04 | 东京毅力科创株式会社 | Substrate cleaning method and substrate cleaning apparatus |
| CN103090653A (en) * | 2011-11-07 | 2013-05-08 | 纳恩科技有限公司 | The apparatus for drying the flat display panel |
| CN103472610A (en) * | 2013-08-23 | 2013-12-25 | 京东方科技集团股份有限公司 | Substrate drying device and substrate cleaning system |
| CN105799326A (en) * | 2014-12-30 | 2016-07-27 | 深圳Tcl工业研究院有限公司 | Ink-jet printing machine and ink-jet method for ink-jet printing machine |
| CN108198748A (en) * | 2014-02-27 | 2018-06-22 | 斯克林集团公司 | Substrate board treatment |
| CN110332765A (en) * | 2019-06-29 | 2019-10-15 | 汕尾市索思电子封装材料有限公司 | A kind of drying means and drying device of electroplated product |
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- 2006-09-28 CN CNB200610152390XA patent/CN100505154C/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101551602B (en) * | 2008-04-03 | 2012-07-04 | 东京毅力科创株式会社 | Substrate cleaning method and substrate cleaning apparatus |
| CN101768711B (en) * | 2008-12-29 | 2011-09-28 | 襄樊博亚精工机器有限公司 | Automatic cleaning device for lip of air knife |
| US8893401B2 (en) | 2009-09-22 | 2014-11-25 | Samsund Sdi Co., Ltd. | Lamp heater and drying apparatus including the same |
| CN102026428B (en) * | 2009-09-22 | 2013-04-17 | 三星Sdi株式会社 | Lamp heater and drying apparatus including the same |
| CN102026428A (en) * | 2009-09-22 | 2011-04-20 | 三星Sdi株式会社 | Lamp heater and drying apparatus including the same |
| CN103090653B (en) * | 2011-11-07 | 2015-09-23 | 纳恩科技有限公司 | Panel display board drying device |
| CN103090653A (en) * | 2011-11-07 | 2013-05-08 | 纳恩科技有限公司 | The apparatus for drying the flat display panel |
| CN103472610A (en) * | 2013-08-23 | 2013-12-25 | 京东方科技集团股份有限公司 | Substrate drying device and substrate cleaning system |
| WO2015024339A1 (en) * | 2013-08-23 | 2015-02-26 | 京东方科技集团股份有限公司 | Substrate drying device and substrate cleaning system |
| CN103472610B (en) * | 2013-08-23 | 2016-03-09 | 京东方科技集团股份有限公司 | A kind of substrate drying device and basal plate cleaning system |
| CN108198748A (en) * | 2014-02-27 | 2018-06-22 | 斯克林集团公司 | Substrate board treatment |
| CN108198748B (en) * | 2014-02-27 | 2022-04-29 | 斯克林集团公司 | Substrate processing apparatus |
| CN105799326A (en) * | 2014-12-30 | 2016-07-27 | 深圳Tcl工业研究院有限公司 | Ink-jet printing machine and ink-jet method for ink-jet printing machine |
| CN105799326B (en) * | 2014-12-30 | 2018-11-20 | 深圳Tcl工业研究院有限公司 | The ink ejecting method of ink-jet printer and ink-jet printer |
| CN110332765A (en) * | 2019-06-29 | 2019-10-15 | 汕尾市索思电子封装材料有限公司 | A kind of drying means and drying device of electroplated product |
| CN110332765B (en) * | 2019-06-29 | 2021-06-18 | 汕尾市索思电子封装材料有限公司 | Drying method and drying device for electroplating product |
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