CN1938448A - 真空沉积硫化物薄膜期间吸收氧气和水的方法 - Google Patents

真空沉积硫化物薄膜期间吸收氧气和水的方法 Download PDF

Info

Publication number
CN1938448A
CN1938448A CNA200580008280XA CN200580008280A CN1938448A CN 1938448 A CN1938448 A CN 1938448A CN A200580008280X A CNA200580008280X A CN A200580008280XA CN 200580008280 A CN200580008280 A CN 200580008280A CN 1938448 A CN1938448 A CN 1938448A
Authority
CN
China
Prior art keywords
species
getter
deposition
phosphor
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200580008280XA
Other languages
English (en)
Chinese (zh)
Inventor
郑大元
保罗·巴里·德·贝尔·贝卢兹
斯蒂芬·查尔斯·库
阿卜杜勒·M·那夸
詹姆士·亚历山大·罗伯特·斯泰尔斯
李容先
特里·亨特
文森特·约瑟夫·阿尔佛雷德·普列塞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
iFire Technology Corp
Original Assignee
iFire Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by iFire Technology Inc filed Critical iFire Technology Inc
Publication of CN1938448A publication Critical patent/CN1938448A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0623—Sulfides, selenides or tellurides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CNA200580008280XA 2004-03-15 2005-03-15 真空沉积硫化物薄膜期间吸收氧气和水的方法 Pending CN1938448A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55271704P 2004-03-15 2004-03-15
US60/552,717 2004-03-15

Publications (1)

Publication Number Publication Date
CN1938448A true CN1938448A (zh) 2007-03-28

Family

ID=34975608

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200580008280XA Pending CN1938448A (zh) 2004-03-15 2005-03-15 真空沉积硫化物薄膜期间吸收氧气和水的方法

Country Status (6)

Country Link
US (1) US8057856B2 (https=)
JP (1) JP2007529623A (https=)
CN (1) CN1938448A (https=)
CA (1) CA2554817A1 (https=)
TW (1) TW200602505A (https=)
WO (1) WO2005087971A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106256926A (zh) * 2015-06-17 2016-12-28 动力专家有限公司 涂覆制品的设备、装置和方法
CN117535632A (zh) * 2020-04-01 2024-02-09 佳能安内华股份有限公司 成膜设备、控制设备以及成膜方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007526602A (ja) 2004-03-04 2007-09-13 アイファイアー・テクノロジー・コープ チオアルミネート発光体に対する反応性金属供給源及び堆積方法
CN100581309C (zh) * 2004-04-27 2010-01-13 富士胶片株式会社 有机电致发光元件及其制造方法
US20060269656A1 (en) * 2005-05-26 2006-11-30 Eastman Kodak Company Reducing contamination in OLED processing systems
DE202009003677U1 (de) * 2009-03-17 2010-04-29 Porextherm-Dämmstoffe Gmbh Indikator zum Nachweis des Eindringens von Luft- und/oder Feuchte in eine Vakuum-, Druck- oder Schutzgasverpackung
EP2360289A1 (de) * 2010-02-23 2011-08-24 Saint-Gobain Glass France Vorrichtung und Verfahren zum Abscheiden einer aus mindestens zwei Komponenten bestehenden Schicht auf einem Gegenstand
US11519095B2 (en) * 2019-04-22 2022-12-06 Peng DU MBE system with direct evaporation pump to cold panel

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL132102C (https=) 1965-02-25 1900-01-01
US4022939A (en) 1975-12-18 1977-05-10 Western Electric Company, Inc. Synchronous shielding in vacuum deposition system
US4118542A (en) 1977-01-17 1978-10-03 Wall Colmonoy Corporation Controlled atmosphere and vacuum processes
US5432015A (en) 1992-05-08 1995-07-11 Westaim Technologies, Inc. Electroluminescent laminate with thick film dielectric
US5508586A (en) 1993-06-17 1996-04-16 Saes Getters S.P.A. Integrated getter device suitable for flat displays
EP0656430B2 (en) 1993-11-09 2000-01-12 Galileo Vacuum Systems S.R.L. Process and apparatus for the codeposition of metallic oxides on plastic films.
JPH07138739A (ja) * 1993-11-11 1995-05-30 Sony Corp 真空蒸着装置
BR9707403A (pt) 1996-02-09 1999-04-06 Getters Spa Combinação de materiais para a partida em baixa temperatura da ativação de materiais absorventes metálicos e dispositivos absorventes metálicos que contêm os mesmos
US5976900A (en) 1997-12-08 1999-11-02 Cypress Semiconductor Corp. Method of reducing impurity contamination in semiconductor process chambers
IT1297013B1 (it) 1997-12-23 1999-08-03 Getters Spa Sistema getter per la purificazione dell'atmosfera di lavoro nei processi di deposizione fisica da vapore
US6077404A (en) 1998-02-17 2000-06-20 Applied Material, Inc. Reflow chamber and process
US6241477B1 (en) * 1999-08-25 2001-06-05 Applied Materials, Inc. In-situ getter in process cavity of processing chamber
US6586878B1 (en) 1999-12-16 2003-07-01 Koninklijke Philips Electronics N.V. Metal halide lamp with improved getter orientation
US20020122895A1 (en) 2000-09-14 2002-09-05 Cheong Dan Daeweon Magnesium barium thioaluminate and related phosphor materials
US6610352B2 (en) * 2000-12-22 2003-08-26 Ifire Technology, Inc. Multiple source deposition process
US6447654B1 (en) 2001-05-29 2002-09-10 Ifire Technology Inc. Single source sputtering of thioaluminate phosphor films
CN1561405A (zh) * 2001-09-27 2005-01-05 纳幕尔杜邦公司 用于溅射淀积的双源单腔的方法和设备
US6897474B2 (en) * 2002-04-12 2005-05-24 Universal Display Corporation Protected organic electronic devices and methods for making the same
TW200420740A (en) * 2003-01-30 2004-10-16 Ifire Technology Inc Controlled sulfur species deposition process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106256926A (zh) * 2015-06-17 2016-12-28 动力专家有限公司 涂覆制品的设备、装置和方法
CN117535632A (zh) * 2020-04-01 2024-02-09 佳能安内华股份有限公司 成膜设备、控制设备以及成膜方法
US12606904B2 (en) 2020-04-01 2026-04-21 Canon Anelva Corporation Film forming apparatus, control apparatus for film forming appartus, and film forming method

Also Published As

Publication number Publication date
US20050227005A1 (en) 2005-10-13
JP2007529623A (ja) 2007-10-25
CA2554817A1 (en) 2005-09-22
US8057856B2 (en) 2011-11-15
TW200602505A (en) 2006-01-16
WO2005087971A1 (en) 2005-09-22

Similar Documents

Publication Publication Date Title
CN1726299A (zh) 复合溅射靶和磷光体淀积的方法
CN1938448A (zh) 真空沉积硫化物薄膜期间吸收氧气和水的方法
CA2447626A1 (en) Single source sputtering of thioaluminate phosphor films
EP1587894B1 (en) Controlled sulfur species deposition process
CN1926259B (zh) 活性金属源和沉积硫代铝酸盐无机发光材料的方法
CN100529155C (zh) 用于无机发光材料沉积的硫化氢注射方法
US7597969B2 (en) Oxygen substituted barium thioaluminate phosphor materials
CN1863938B (zh) 用于硫化物薄膜沉积的聚硫化物热蒸汽源
US7556721B2 (en) Thiosilicate phosphor compositions and deposition methods using barium-silicon vacuum deposition sources for deposition of thiosilicate phosphor films
KR20070018908A (ko) 설파이드 필름을 진공 증착하는 동안 산소와 물을게터링하는 방법
US20050077478A1 (en) Process for manufacturing radiation image storage panel
JPH0850992A (ja) 薄膜電場発光素子の製造方法
JPH0817574A (ja) 薄膜電場発光素子の製造方法
JPH08330069A (ja) 薄膜電場発光素子の製造方法
JPH1050476A (ja) 薄膜ｅｌ素子の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: YIFEILEI INTELLECTUAL PROPERTY CO.,LTD.

Free format text: FORMER OWNER: IFIRE TECHNOLOGY INC.

Effective date: 20071109

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20071109

Address after: alberta canada

Applicant after: Ifire Technology Corp.

Address before: alberta canada

Applicant before: Ifire Technology Inc.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20070328