CN1937888A - Method for continuously producing flexible printed circuit board - Google Patents
Method for continuously producing flexible printed circuit board Download PDFInfo
- Publication number
- CN1937888A CN1937888A CN 200510037463 CN200510037463A CN1937888A CN 1937888 A CN1937888 A CN 1937888A CN 200510037463 CN200510037463 CN 200510037463 CN 200510037463 A CN200510037463 A CN 200510037463A CN 1937888 A CN1937888 A CN 1937888A
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- printed circuit
- flexible printed
- circuit board
- continuously producing
- notacoria
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Abstract
The invention relates to a kind of method of continuously producing flexible press circuit board. The step is as follows. There is a base including a conducting layer and a flexible backing layer. The conducting circuit and the back film are set on the base. Multiple flexible press circuit boards are formed and array on the back film interval. It is characterized in that the back film is set on the base to make multiple flexible press circuit boards stick on the base film. They are packed in roll and protected. Furthermore, the back film is sticking to make the wastes forming in manufacturing stick on the base film and not fall down to keep process continuous.
Description
[technical field]
The present invention relates to a kind of manufacture method of flexible printed circuit board, particularly a kind of method of continuously producing flexible printed circuit substrate.
[background technology]
Flexible printed circuit board (Flexible Printed Circuit Board, FPCB), claim flexible print wiring board again, or be called flexible printed wiring board, be meant the printed circuit made from the flexible insulation base material, but free bend, coiling or folding can require to arrange arbitrarily according to space layout, and mobile arbitrarily and flexible in three dimensions, have the not available advantage of many rigid printed circuit boards.COF (Chip On Film, COF) flexible printed wiring board, claim again to cover brilliant film, or claim soft chip direct populated circuit board, be meant a kind of special flexible printed circuit board, it is usually used in mobile phone and mobile computer, the general flexible printed circuit board height of its integrated level, and technology is more advanced, and thinner, flexible better, entered the trial production stage at present.
Traditional handicraft prepares the method for flexible printed circuit board, the blocks of branch of normal employing comes and makes, a piece compacting forms circuit board again, this classical production process, time-consuming, effort, labour intensity is big, production efficiency is low, and dimensional stability is difficult to guarantee, thereby, developed continuous transfer cylinder production technology.Prior art discloses a kind of production method of flexible film, and it carries out a soft insulating tape pressing, etching and form protective layer the linkage type mode of operation of rolling wheel with rolling wheel; Then, punching forms the chain cave and arranges parallel line along the chain cave and cut soft insulating tape, makes it constitute the many flexible circuit adhesive tapes that width is less, and furls in rolling wheel.This manufacture method is enhanced productivity greatly, and still, the flexible circuit required precision is higher, and the flexible circuit adhesive tape that obtains directly furls on rolling wheel, and the frictionally damage situation appears in scrolling process unavoidably, can have influence on the quality and the precision of circuit; In addition, the ear material debris of processing procedure such as punching, cutting formation can influence the continuity of processing procedure.
Therefore, be necessary to provide a kind of method of continuously producing flexible printed circuit board, it can effectively be avoided, and flexible circuit board appearance friction, damage etc. have influence on the quality of circuit and the phenomenon of precision in the production process.
[summary of the invention]
Below, a kind of method of continuously producing flexible printed circuit board will be described with embodiment, it can Effectively avoid flexible circuit board in the production process to occur rubbing, wear hindering etc. having influence on quality and the precision of circuit Phenomenon.
A kind of method of continuously producing flexible printed circuit board, it may further comprise the steps: a substrate is provided, and it comprises a conductive layer and a flexible substrate layer; In this substrate, process the conducting wire; One notacoria is arranged in the above-mentioned substrate; Mold a plurality of flexible printed circuit boards and be spaced on notacoria.
The method of the technical program continuously producing flexible printed circuit board, compared with the prior art, its advantage is: before molding a plurality of flexible printed circuit boards, one notacoria is set in substrate in advance, the a plurality of flexible printed circuit boards that finally obtain are pasted on the notacoria, be convenient to the web-like mode and pack, and can play certain protective role; In addition, notacoria has certain adherence, and the ear material that makes the course of processing form is bonded on the notacoria and can not drops, and keeps the continuity of the course of processing.
[description of drawings]
Fig. 1 is the flow chart that the present embodiment continous way is produced the COF flexible printed circuit board.
Fig. 2 is that substrate that present embodiment provides furls the schematic perspective view in rolling wheel.
Fig. 3 is the schematic diagram of the continuous pressing notacoria of present embodiment.
Fig. 4 is the schematic diagram of a plurality of COF flexible printed circuit boards of finally obtaining of present embodiment.
[embodiment]
Be elaborated below in conjunction with the method for drawings and the embodiments to a kind of continuously producing flexible printed circuit board.
As shown in Figure 1, the method for the continuously producing flexible printed circuit board of embodiment of the present invention may further comprise the steps: a substrate is provided, and it comprises a conductive layer and a flexible substrate layer; In this substrate, process the conducting wire; One notacoria is arranged in this substrate that is processed with the conducting wire; Mold a plurality of flexible printed circuit boards and be spaced on notacoria.
The flexible printed circuit board of embodiment of the present invention comprises common flexible printed circuit board (FPCB) and COF flexible printed circuit board, be called again and cover brilliant film, or being called the direct populated circuit board of soft chip, present embodiment is to produce the method that the COF flexible PCB is an example explanation continuously producing flexible printed circuit board.
Step 1 provides a substrate, and it comprises a conductive layer and a flexible substrate layer.
As shown in Figure 2, provide a substrate 100, it comprises a conductive layer 110 and a flexible substrate layer 120, and this substrate 100 is banded and furls on one first rolling wheel 210.The material of this flexible substrate layer 120 can be selected polyimides (Polyimide for use, PI), PETG (Polyethylene Terephalate, PET), poly-to naphthalenedicarboxylic acid second diester (Polyethylene Naphthalate, PEN), liquid crystal polymer (Liquid Crystal Polymer, LCP), Teflon (Teflon, PTFE) or other available material etc.
The thickness of flexible substrate layer 120 generally is about 10～75 μ m.The material of conductive layer 10 is selected from copper, gold or electrical conductivity alloy, and its thickness is generally 5～50 μ m.In the present embodiment, this flexible substrate layer 20 is the pi material, and its thickness is about 25 μ m, and conductive layer 10 is a Copper Foil, and its thickness is about 18 μ m.
In the present embodiment, conductive layer 110 is a Copper Foil, so the lead road of doing is a copper wire.Because Copper Foil is exposed in the air for a long time, the top layer can be formed with oxide-film and can adhere to some dirt, therefore, makes oxide-film and dirt that the conducting wire will be removed the copper surface before earlier, for example can clean with acid solution or other reagent and remove.
Remove oxide-film and dirt and carry out the making of conducting wire afterwards, its manufacture method adopts exposure dry film method or wet film method to finish usually.The flow process that adopts exposure dry film method to form the conducting wire can be: at first, be formed at a dry film on the conductive layer 110 of substrate 100 with pressing or alternate manner; Secondly, then substrate 100 is rolled out certain-length and position, carry out exposure imaging, make and the dry film patterning utilize chemical etching to remove and be not patterned the position that dry film covers again, make conductive layer 110 form the conducting wire of patternings; At last, adopt alkali cleaning or alternate manner to remove the dry film of patterning, make the conducting wire reveal.
The flow process that adopts exposure wet film method to form the conducting wire can be: at first, with a wet film or be called liquid photoresist and be formed on the conductive layer 110, its formation method comprises centrifugal coating, dip-coating, wire mark or roller coating etc.; Secondly, the wet film on the conductive layer 110 is carried out preliminary drying, promptly make wet film reach dry through heating, drying; Once more, substrate 100 is rolled out certain-length and position, carry out exposure imaging, make the wet film patterning, utilize chemical etching to remove and be not patterned the position that wet film covers, make conductive layer 110 form the conducting wire of patternings; At last, adopt alkali cleaning or alternate manner to remove the wet film of patterning, make the conducting wire reveal.Present embodiment adopts exposure wet film method to form the conducting wire.
Make the substrate 100 of conducting wire and carry out needing to protect processing before the following process, with the protection conducting wire.The mode that protection is handled is many, can the hot pressing unification protect film on circuit, or form a green lacquer protective layer with printing or spraying method on circuit.
Specify the process that a notacoria 130 is set in conjunction with Fig. 3 in substrate 100, notacoria 130 can be arranged at arbitrarily on the side of substrate 100, in the present embodiment, is example to make single face COF flexible PCB, and notacoria 130 is arranged on the flexible substrate layer 120.Concrete setting up procedure is: for example the substrate 100 that is formed with circuit can be rolled out by first rolling wheel 210, and furl in one second rolling wheel 220, notacoria 130 rolls out from the 3rd rolling wheel 230, utilize a roller bearing 240 with both pressings, after the pressing, notacoria 130 furls on second rolling wheel 220 with substrate 100 continuously.In addition, for two-sided COF flexible printed circuit board, the both sides of flexible substrate all are formed with the conducting wire, and notacoria 130 can be arranged at arbitrarily on the conducting wire of a side wherein.
Notacoria 130 used materials are generally flexible, little adhesion material, for example can select polyimides, PETG, poly-to naphthalenedicarboxylic acid second diester, liquid crystal polymer or Teflon etc. for use.In the present embodiment, notacoria 130 is the PET material, and thickness is about 75 μ m.
As shown in Figure 4, be provided with in the substrate 100 after the notacoria 130, substrate 100 is rolled out a suitable length and positions from second rolling wheel 220, adopt a default mould (figure does not indicate), mold default COF flexible printed circuit board 10, remove the ear material that produces in the processing, obtain being spaced a plurality of COF flexible printed circuit boards 10 on notacoria 130.
In the process of mould molding COF flexible printed circuit board 10, depth of cut will accurately be set, and promptly only cuts off substrate 100, and notacoria 130 is not switched to.Because notacoria 130 has certain viscosity, the ear material that the course of processing forms is bonded on the notacoria 130, can not drop in the course of processing, makes the course of processing keep continuity, so, need after machining the ear material is removed.
The production method of present embodiment can be made the COF flexible printed circuit board of different in width specification, and the width of the used substrate 100 of present embodiment is preset as the lucky arrangement COF of delegation flexible printed circuit board; In addition, also can provide the substrate of a broad, arrange multirow COF flexible printed circuit board on it, wait to finish whole making flow process after, again it is divided into the COF flexible printed circuit board that single file is arranged.
Also applicable to the continuous production of common FPCB plate, the production technology of its production process and COF flexible printed circuit board is basic identical for above-mentioned execution mode, removes the manufacture craft of conducting wire and the technological parameter difference of die molding process.
The method of present embodiment continuously producing flexible printed circuit board, compared with prior art, its advantage is: before molding a plurality of flexible printed circuit boards, one notacoria is set in substrate in advance, the a plurality of flexible printed circuit boards that finally obtain are pasted on the notacoria, be convenient to the web-like mode and pack, and can play certain protective role; In addition, notacoria has certain adherence, and the ear material that makes the course of processing form is bonded on the notacoria and can not drops, and keeps the continuity of the course of processing.
Claims (10)
1. the method for a continuously producing flexible printed circuit board, it may further comprise the steps:
One substrate is provided, and it comprises a conductive layer and a flexible substrate layer;
In this substrate, process the conducting wire;
One notacoria is arranged in this substrate that is processed with the conducting wire;
Mold a plurality of flexible printed circuit boards and be spaced on notacoria.
2. the method for continuously producing flexible printed circuit board as claimed in claim 1 is characterized in that, this flexible substrate layer material is selected from polyimides, PETG, poly-to naphthalenedicarboxylic acid second diester, liquid crystal polymer or Teflon.
3. the method for continuously producing flexible printed circuit board as claimed in claim 1 is characterized in that, the thickness of this flexible substrate layer is 10～75 microns.
4. the method for continuously producing flexible printed circuit board as claimed in claim 1 is characterized in that, the material of this conductive layer is copper, gold or electrical conductivity alloy.
5. the method for continuously producing flexible printed circuit board as claimed in claim 1 is characterized in that, the thickness of this conductive layer is 5～50 microns.
6. the method for continuously producing flexible printed circuit board as claimed in claim 1 is characterized in that, the material of this notacoria is selected from PETG, polyimides, poly-to naphthalenedicarboxylic acid second diester, liquid crystal polymer or Teflon.
7. the method for continuously producing flexible printed circuit board as claimed in claim 1 is characterized in that, the thickness of this notacoria is 75 microns.
8. as the method for 1 described continuously producing flexible printed circuit board of claim the, it is characterized in that, this notacoria is arranged on suprabasil method adopts the pressing method.
9. the method for continuously producing flexible printed circuit board as claimed in claim 1 is characterized in that, the method that molds a plurality of flexible printed circuit boards is to adopt mould forming method.
10. the method for continuously producing flexible printed circuit board as claimed in claim 1 is characterized in that, this method also further comprises to be removed the bait that residues on the notacoria.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100374636A CN100556237C (en) | 2005-09-21 | 2005-09-21 | The method of continuously producing flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100374636A CN100556237C (en) | 2005-09-21 | 2005-09-21 | The method of continuously producing flexible printed circuit board |
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| Publication Number | Publication Date |
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| CN1937888A true CN1937888A (en) | 2007-03-28 |
| CN100556237C CN100556237C (en) | 2009-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100374636A Expired - Fee Related CN100556237C (en) | 2005-09-21 | 2005-09-21 | The method of continuously producing flexible printed circuit board |
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| CN (1) | CN100556237C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431863B (en) * | 2007-11-05 | 2010-12-08 | 富葵精密组件(深圳)有限公司 | Back glue attaching method for flexible printed circuit board |
| CN102207792A (en) * | 2011-06-07 | 2011-10-05 | 南京福莱克斯光电科技有限公司 | Manufacturing method of touch sensor structure based on charge transfer |
| CN102869192A (en) * | 2011-07-08 | 2013-01-09 | 佳胜科技股份有限公司 | Method for manufacturing flexible substrate |
| CN102883537A (en) * | 2012-10-16 | 2013-01-16 | 田茂福 | Automatic forming machine of flexible printed circuit board (FPC) |
| CN103742533A (en) * | 2013-12-30 | 2014-04-23 | 武汉理工大学 | Cylindrical flexible circuit board conducting loop used for electric bearing |
| CN104375382A (en) * | 2014-03-31 | 2015-02-25 | 中能柔性光电（滁州）有限公司 | Graphical manufacturing method for flexible conducting film |
| CN109361050A (en) * | 2018-10-09 | 2019-02-19 | 合肥联宝信息技术有限公司 | The production method of composite substrate, shell and composite substrate |
| CN110660952A (en) * | 2018-06-28 | 2020-01-07 | 通力股份公司 | Battery pack, frequency converter and transportation system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103997859B (en) * | 2014-06-03 | 2017-02-15 | 深圳市华大电路科技有限公司 | Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof |
-
2005
- 2005-09-21 CN CNB2005100374636A patent/CN100556237C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431863B (en) * | 2007-11-05 | 2010-12-08 | 富葵精密组件(深圳)有限公司 | Back glue attaching method for flexible printed circuit board |
| CN102207792A (en) * | 2011-06-07 | 2011-10-05 | 南京福莱克斯光电科技有限公司 | Manufacturing method of touch sensor structure based on charge transfer |
| CN102207792B (en) * | 2011-06-07 | 2012-10-03 | 南京福莱克斯光电科技有限公司 | Manufacturing method of touch sensor structure based on charge transfer |
| CN102869192A (en) * | 2011-07-08 | 2013-01-09 | 佳胜科技股份有限公司 | Method for manufacturing flexible substrate |
| CN102883537A (en) * | 2012-10-16 | 2013-01-16 | 田茂福 | Automatic forming machine of flexible printed circuit board (FPC) |
| CN103742533A (en) * | 2013-12-30 | 2014-04-23 | 武汉理工大学 | Cylindrical flexible circuit board conducting loop used for electric bearing |
| CN103742533B (en) * | 2013-12-30 | 2016-08-17 | 武汉理工大学 | A kind of cylindrical pliable circuit board conductive loop for electronic bearing |
| CN104375382A (en) * | 2014-03-31 | 2015-02-25 | 中能柔性光电（滁州）有限公司 | Graphical manufacturing method for flexible conducting film |
| CN110660952A (en) * | 2018-06-28 | 2020-01-07 | 通力股份公司 | Battery pack, frequency converter and transportation system |
| CN109361050A (en) * | 2018-10-09 | 2019-02-19 | 合肥联宝信息技术有限公司 | The production method of composite substrate, shell and composite substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100556237C (en) | 2009-10-28 |
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Owner name: ZHENDING TECHNOLOGY HOLDING LIMITED Free format text: FORMER OWNER: FOXCONN ADVANCED TECHNOLOGY, INC. Effective date: 20120116 |
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Effective date of registration: 20120116 Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091028 Termination date: 20150921 |
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| EXPY | Termination of patent right or utility model |