CN104375382A - Graphical manufacturing method for flexible conducting film - Google Patents
Graphical manufacturing method for flexible conducting film Download PDFInfo
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- CN104375382A CN104375382A CN201410124707.3A CN201410124707A CN104375382A CN 104375382 A CN104375382 A CN 104375382A CN 201410124707 A CN201410124707 A CN 201410124707A CN 104375382 A CN104375382 A CN 104375382A
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Abstract
The invention relates to a graphical manufacturing method for a flexible conducting film. In the method, an electric-conduction film (2), that is PI, PET or other materials, is selected as a flexible substrate, the electric-conduction film is low in price, light and portable in mass, good in flexibility and easy to bend. In the method, a roller coating manner is employed for coating the electric-conduction film (2) with a layer of photoresist (6) through roller coating, and the photoresist has the characteristics of thin thickness and strong adhesive force, and thus the lithographic resolution is substantially improved, the production technology complexity of a flexible display is reduced, the production efficiency is improved, and the production cost is reduced.
Description
Technical field
The present invention relates to flexible display technologies field, in particular to the graphical manufacture method of a kind of flexible conductive film.
Background technology
Along with the develop rapidly of infotech, display technique is more and more outstanding in the critical role in market.Along with the display field of traditional TV, computer, portable terminal is ripe day by day.The liquid crystal display applied in the market is that base material is made with glass.First make ITO(tin indium oxide on the glass substrate) figure, then through oriented layer printing and directional process, frame offset printing brush, dust, become the processes such as box, glass-cutting, perfusion liquid crystal, sealing, polarizer sheet sticking, inspection to complete the making of liquid crystal display.The liquid crystal display manufacture craft of glass substrate and technology comparative maturity, but owing to adopting glass substrate, the finished product made cannot bend, and not easily realizes frivolous portable requirement, and easily broken when being impacted or clash into.
ITO electro-conductive glass is on the basis of sodium calcium base or silicon boryl substrate glass, utilizes the multiple methods such as sputtering, evaporation to plate indium oxide layer tin (ITO) film processing and fabricating.Liquid crystal display special I TO electro-conductive glass also before plating ITO layer, will plate layer of silicon dioxide restraining barrier, spreads to prevent the sodion in substrate glass in liquid crystal in box.Prior art medium-to-high grade liquid crystal display special I TO glass substrate glass before sputter ITO layer also will carry out polishing, to obtain uniform display and control, liquid crystal display special I TO glass substrate generally belongs to super float glass, all coated surfaces are the float glass process tin face of glass, therefore, all out-of-flatness ripple situation can be there is regularly along float glass process direction in final liquid crystal display.
And the graphic method of flexible display adopts flexible base, board to attach the mode of photosensitive capillary film at present, not easily improve display resolution; Add flexible display complex manufacturing, reduce production efficiency, increase production cost.
Such as application number is the Chinese invention patent of 200810172655.1, it discloses a kind of ultrathin flexible liquid crystal display and manufacture method thereof, described flexible liquid crystal display comprises: the 1st substrate positioned opposite to each other and the 2nd substrate, and described 1st substrate and the 2nd substrate pass through together with epoxy bond glue laminating; The apparent surface being arranged on the 1st substrate and the 2nd substrate is carved with the 1st required electrode and the 2nd electrode, and described 1st electrode and the 2nd electrode are coated with oriented film; Between described 1st substrate and the 2nd substrate, be also provided with the separating ball at the interval for controlling two substrates, liquid crystal display of the present invention has the advantages such as thickness is thin, flexible, withstand voltage, non-friable, shockproof, but this manufacture method is comparatively complicated; In addition, the present invention rubs at the oriented film of use flannelette to upper/lower electrode, not easily improves display resolution, adds flexible display complex manufacturing.
Such as application number is the Chinese invention patent of 200910091255.2 again, it discloses a kind of microstructure film figure and TFT-LCD array substrate manufacture method.Microstructure film figure manufacture method comprises, and substrate forms thin film; Inkjet-printing device is adopted to spray on the membrane or the etching agent that drips with the etched features of setting; Described etching agent corrodes described film; Clean described etching agent, form film pattern on the substrate.The present invention does not need expensive equipment investment, decreases cross contamination risk.But selected material is suspended matter colloid, all can there is out-of-flatness ripple situation along float glass process direction in final product, produce product in addition thicker regularly, easily broken when being impacted or clash into.
Summary of the invention
In order to solve the above-mentioned technological deficiency that prior art exists, the object of the present invention is to provide the graphical manufacture method of a kind of flexible conductive film, selecting the material such as conductive film and PI or PET as flexible substrate, cheap, light quality, pliability is good, flexible; The mode of roller coating roller coating one deck photoresist on conductive film is adopted in the method, photoresist has the advantages that thickness is thin, adhesion is strong, substantially increases photoetching resolution, reduces flexible display complex manufacturing, improve production efficiency, reduce production cost.
According to the graphical manufacture method of flexible conductive film of the present invention, comprise cleaning, exposure, development, etching and demoulding operation, concrete steps are as follows:
The first step, chooses a transparent conductive film, is attached on a rigid substrates and forms composite base plate;
Second step, cleans above-mentioned composite base plate;
3rd step, the composite base plate surface after cleaned is coated with one deck photoresist;
4th step, carries out preliminary drying to the composite base plate scribbling photoresist layer;
5th step, the composite plate after being completed by above-mentioned preliminary drying is sent in exposure machine and is carried out graphical exposure-processed;
6th step, develops to the composite plate after above-mentioned exposure, cleaning treatment;
7th step, etches above-mentioned composite plate, demoulding.
Preferably, in third step, rigid substrates is driven to move by transmission shaft.
In above-mentioned either a program preferably, mutually extruded by coating wheel and squeegee roller in the process of rigidity movement substantially in third step and roller coating photoresist is carried out to composite plate.
In above-mentioned either a program preferably, in the process of described composite plate coating photoresist, coating wheel and squeegee roller just rotate, and are not moved.
In above-mentioned either a program preferably, in third step, coating method is roller coating.
In above-mentioned either a program preferably, described rigid substrates is glass or rigidity plastics or rigid metallic material.
In above-mentioned either a program preferably, the viscosity of described photoresist is 20-60CP.
In above-mentioned either a program preferably, the cleaning environment of the composite base plate in described step 2 is clean 2 minutes in the NaOH solution of 0.5%, and then the deionized water putting into 12-18M Ω cleans 5 minutes.
In above-mentioned either a program preferably, the preliminary drying environment of the composite base plate of photoresist layer is scribbled in described step 4 for continuing 2 minutes at temperature is 90-100 DEG C.
In above-mentioned either a program preferably, in described step 5 preliminary drying complete after the exposure environment of composite plate be expose in the parallel ultraviolet of 365 nanometers at wavelength, its exposure is 50-100mj/cm
2.
In above-mentioned either a program preferably, the development environment of the composite plate in described step 6 after exposure is expose in the NaOH solution of 0.5%, and its time shutter is 90-120 second.
In above-mentioned either a program preferably, the composite plate in described step 6 after exposure is cleaned 5 minutes after development in the deionized water of 12-18M Ω again.
In above-mentioned either a program preferably, the etching environment of the composite plate in described step 7 is be soak 6 minutes in the mixed solution of 45 DEG C containing the hydrochloric acid of 18%, nitric acid, the temperature of 3%, and then 12-18M Ω washed with de-ionized water 3 minutes.
In above-mentioned either a program preferably, first carry out wavelength 365 nano-ultraviolet light after composite plate etching in described step 7 to irradiate, exposure is 50-100mj/cm2, and then soaks 2 minutes in the NaOH solution being placed on 0.5%, finally re-uses the washed with de-ionized water 5 minutes of 12-18M Ω.
In above-mentioned either a program preferably, the thickness of described photoresist layer is 1-3 micron.Photoresist layer when meeting adhesion and being stronger in the present invention is thinner, greatly increases photoetching resolution.
In above-mentioned either a program preferably, described conductive film selects PET or PN or FRP or PES or PC material.These materials have light, inexpensive, pliable and tough, flexible feature above, eventually reduce cost, are convenient to widespread use.
In above-mentioned either a program preferably, in the 5th step, exposure adopts proximity printing.
Another aspect of the present invention is to provide the device that a kind of flexible conductive film graphically manufactures, and it comprises conductive film, rigid substrates, and conductive film is laid on the rigid substrate.
In above-mentioned either a program preferably, be provided with transmission shaft below described rigid substrates, rigid substrates moves forward under the drive of transmission shaft.
In above-mentioned either a program preferably, carry out above substrate photoresist drip attached, photoresist instillation rigid substrates before drop onto on coating wheel.
In above-mentioned either a program preferably, described coating wheel contacts with squeegee roller, in the process that conductive film figureization manufactures, is mutually extruded carry out roller coating photoresist to composite plate and form photoresist layer by coating wheel and squeegee roller.Adopt the fashion of extrusion of coating wheel and squeegee roller to make the thickness of photoresist layer thinner, and the thickness of photoresist layer is even, and the situation that thickness thin and thick is irregular can not occur.
In above-mentioned either a program preferably, in the process of described composite plate coating photoresist, coating wheel and squeegee roller just rotate, and are not moved.In roller coating process, added by the photoresist dripped in top in the rotation process of coating wheel and squeegee roller and be pressed into the uniform photoresist layer of thickness, photoresist layer is finally laid on the rigid substrate equably.
In above-mentioned either a program preferably, in described third step, coating method is roller coating.The photoresist layer thickness adopting the mode of roller coating to be coated with is thin, adhesion strong, substantially increases photoetching resolution, reduces flexible display complex manufacturing, increases production efficiency, reduces production cost.
In above-mentioned either a program preferably, described rigid substrates is glass or rigidity plastics or rigid metallic material.In order to ensure the homogeneity of the planarization that photoresist layer is laid and thickness, therefore select ganoid glass or rigidity plastics or rigid metallic material.
In the present embodiment, the viscosity of described photoresist is 20-60CP.The model of that photoresist is AZREP-230K2 in the present embodiment, certainly meet there is the condition of enough adhesions under can select the photoresist of other model as required.
In sum, feature of the present invention is: select conductive film to select the material such as PET or PN or FRP or PES or PC material as flexible substrate, cheap, light quality, and pliability is good, flexible; Adopt the mode of roller coating roller coating one deck photoresist on conductive film in the method, photoresist has the advantages that thickness is thin, adhesion is strong; In roller coating process, added by the photoresist dripped in top in the rotation process of coating wheel and squeegee roller and be pressed into the uniform photoresist layer of thickness, photoresist layer is finally laid on the rigid substrate equably, ensure that the thickness of photoresist layer is even.
Accompanying drawing explanation
Fig. 1 is the structural representation of the preferred embodiment according to the graphical manufacture method of flexible conductive film of the present invention.
Attached number in the figure:
Rigid substrates 1, conductive film 2, photoresist layer 3, coating wheel 4, squeegee roller 5, photoresist 6, transmission shaft 7.
Embodiment
The following description is only exemplary and be not to limit the disclosure, application or purposes in essence.Be further described below in conjunction with the embodiment of Figure of description to the graphical manufacture method of flexible conductive film of the present invention.
Consult shown in Fig. 1, according to the structural representation of a preferred embodiment of the graphical manufacture method of flexible conductive film of the present invention.According to the graphical manufacture method of flexible conductive film of the present invention, comprise cleaning, exposure, development, etching and demoulding operation, it is characterized in that specifically comprising the steps:
The first step, chooses a transparent conductive film 2, is attached on a rigid substrates 1 and forms composite base plate;
Second step, cleans above-mentioned composite base plate;
3rd step, the composite base plate surface after cleaned is coated with one deck photoresist 6;
4th step, carries out preliminary drying to the composite base plate scribbling photoresist layer 3;
5th step, the composite plate after being completed by above-mentioned preliminary drying is sent in exposure machine and is carried out graphical exposure-processed;
6th step, develops to the composite plate after above-mentioned exposure, cleaning treatment;
7th step, etches above-mentioned composite plate, demoulding.
In the present embodiment, the mode of roller coating roller coating one deck photoresist layer 3 on conductive film 2 is adopted in method of the present invention, photoresist layer 3 has the advantages that thickness is thin, adhesion is strong, substantially increase photoetching resolution, reduce flexible display complex manufacturing, improve production efficiency, reduce production cost.
In the present embodiment, in third step, drive rigid substrates 1 to move by transmission shaft 7, rigid substrates 1 moves according to the direction shown in Fig. 1.Transmission shaft 7 is positioned at the bottom of rigid substrates 1, drives the rigid substrates 1 having laid photoresist layer 3 to run in transmitter shaft 7 rotation process to the right.In order to make rigid substrates 1 at the uniform velocity, smoothly move under the drive of transmission shaft 7, the coarse process such as embossed can be carried out in the bottom surface of rigid substrates 1, to increase the roughness of rigid substrates 1; In addition, also the coarse process such as embossing can be carried out on the positive camber of transmission shaft 7.Certainly under inscribing before the movement of guarantee rigid substrates 1 horizontal homogeneous, also all coarse process can be carried out on the surface of rigid substrates 1 and transmission shaft 7, to increase the roughening of rigid substrates 1 and transmission shaft 7, and then ensure that rigid substrates 1 moves evenly under the drive of transmission shaft 7.
In the present embodiment, mutually to be extruded with squeegee roller 5 by coating wheel 4 in the process of basic 1 movement of rigidity in third step and roller coating photoresist 6 is carried out to composite plate.Adopt coating wheel 4 to make the thickness of photoresist layer 3 thinner with the fashion of extrusion of squeegee roller 5, and the thickness of photoresist layer 3 is even, and the situation that thickness thin and thick is irregular can not occur.
In the present embodiment, in the process of described composite plate coating photoresist 6, coating wheel 4 and squeegee roller 5 just rotate, and are not moved.In roller coating process, the photoresist 6 dripped top in the rotation process of coating wheel 4 and squeegee roller 5 adds and is pressed into the uniform photoresist layer 3 of thickness, and photoresist layer 3 is finally laid on the rigid substrate 1 equably.
In the present embodiment, in third step, coating method is roller coating.The photoresist layer thickness adopting the mode of roller coating to be coated with is thin, adhesion strong, substantially increases photoetching resolution, reduces flexible display complex manufacturing, increases production efficiency, reduces production cost.
In the present embodiment, described rigid substrates 1 is glass or rigidity plastics or rigid metallic material.In order to ensure the homogeneity of the planarization that photoresist layer is laid and thickness, therefore select ganoid glass or rigidity plastics or rigid metallic material.
In the present embodiment, the viscosity of described photoresist 6 is 20-60CP.The model of that photoresist is AZREP-230K2 in the present embodiment, certainly meet there is the condition of enough adhesions under can select the photoresist of other model as required.
In the present embodiment, the cleaning environment of the composite base plate in described step 2 is clean 2 minutes in the NaOH solution of 0.5%, and then the deionized water putting into 12M Ω cleans 5 minutes.
In the present embodiment, the cleaning environment of the composite base plate in described step 2 is clean 2 minutes in the NaOH solution of 0.5%, and then the deionized water putting into 14M Ω cleans 5 minutes.
In the present embodiment, the cleaning environment of the composite base plate in described step 2 is clean 2 minutes in the NaOH solution of 0.5%, and then the deionized water putting into 16M Ω cleans 5 minutes.
In the present embodiment, the cleaning environment of the composite base plate in described step 2 is clean 2 minutes in the NaOH solution of 0.5%, and then the deionized water putting into 18M Ω cleans 5 minutes.
In the present embodiment, the preliminary drying environment of the composite base plate of photoresist layer 3 is scribbled in described step 4 for continuing 2 minutes at temperature is 90 DEG C.
In the present embodiment, the preliminary drying environment of the composite base plate of photoresist layer 3 is scribbled in described step 4 for continuing 2 minutes at temperature is 95 DEG C.
In the present embodiment, the preliminary drying environment of the composite base plate of photoresist layer 3 is scribbled in described step 4 for continuing 2 minutes at temperature is 98 DEG C.
In the present embodiment, the preliminary drying environment of the composite base plate of photoresist layer 3 is scribbled in described step 4 for continuing 2 minutes at temperature is 100 DEG C.
In the present embodiment, in described step 5 preliminary drying complete after the exposure environment of composite plate be expose in the parallel ultraviolet of 365 nanometers at wavelength, its exposure is 50mj/cm
2.
In the present embodiment, in described step 5 preliminary drying complete after the exposure environment of composite plate be expose in the parallel ultraviolet of 365 nanometers at wavelength, its exposure is 60mj/cm
2.
In the present embodiment, in described step 5 preliminary drying complete after the exposure environment of composite plate be expose in the parallel ultraviolet of 365 nanometers at wavelength, its exposure is 70mj/cm
2.
In the present embodiment, in described step 5 preliminary drying complete after the exposure environment of composite plate be expose in the parallel ultraviolet of 365 nanometers at wavelength, its exposure is 80mj/cm
2.
In the present embodiment, in described step 5 preliminary drying complete after the exposure environment of composite plate be expose in the parallel ultraviolet of 365 nanometers at wavelength, its exposure is 100mj/cm
2.
In the present embodiment, the development environment of the composite plate in described step 6 after exposure is expose in the NaOH solution of 0.5%, and its time shutter is 90 seconds.
In the present embodiment, the development environment of the composite plate in described step 6 after exposure is expose in the NaOH solution of 0.5%, and its time shutter is 100 seconds.
In the present embodiment, the development environment of the composite plate in described step 6 after exposure is expose in the NaOH solution of 0.5%, and its time shutter is 110 seconds.
In the present embodiment, the development environment of the composite plate in described step 6 after exposure is expose in the NaOH solution of 0.5%, and its time shutter is 120 seconds.
In the present embodiment, the etching environment of the composite plate in described step 7 is be soak 6 minutes in the mixed solution of 45 DEG C containing the hydrochloric acid of 18%, nitric acid, the temperature of 3%, and then 12-18M Ω washed with de-ionized water 3 minutes.The deionized water object of carrying out cleaning is used to be that to remove composite plate be soak the negative ion that can adhere to rear surface in the mixed solution of 45 DEG C containing the hydrochloric acid of 18%, nitric acid, the temperature of 3%.
In the present embodiment, first carry out wavelength 365 nano-ultraviolet light after the etching of composite plate in described step 7 and irradiate, exposure is 50mj/cm2, and then soaks 2 minutes in the NaOH solution being placed on 0.5%, finally re-uses the washed with de-ionized water 5 minutes of 12M Ω.
In the present embodiment, first carry out wavelength 365 nano-ultraviolet light after the etching of composite plate in described step 7 and irradiate, exposure is 60mj/cm2, and then soaks 2 minutes in the NaOH solution being placed on 0.5%, finally re-uses the washed with de-ionized water 5 minutes of 14M Ω.
In the present embodiment, first carry out wavelength 365 nano-ultraviolet light after the etching of composite plate in described step 7 and irradiate, exposure is 80mj/cm2, and then soaks 2 minutes in the NaOH solution being placed on 0.5%, finally re-uses the washed with de-ionized water 5 minutes of 16M Ω.
In the present embodiment, first carry out wavelength 365 nano-ultraviolet light after the etching of composite plate in described step 7 and irradiate, exposure is 100mj/cm2, and then soaks 2 minutes in the NaOH solution being placed on 0.5%, finally re-uses the washed with de-ionized water 5 minutes of 18M Ω.
In the present embodiment, the thickness of described photoresist layer 3 is 1-3 micron.Photoresist layer when meeting adhesion and being stronger in the present invention is thinner, greatly increases photoetching resolution.The photoresist layer 3 of different-thickness can be produced by the direct distance of adjustment squeegee roller 5 and coating wheel 4 in production run.
In the present embodiment, described conductive film 2 selects PET or PN or FRP or PES or PC material.Conductive film is selected to select the material such as PET or PN or FRP or PES or PC material as flexible substrate, have cheap, light quality, pliability is good, flexible, volume to volume industrialization continuous seepage mode can be adopted to be conducive to raising the efficiency, being convenient to the advantages such as transport.
In addition, in order to effectively improve the properties of flexible conductive film, before base material makes conductive layer, need first to do pre-service to base material.The preparation method of preprocess method and conductive layer and technique close relation, as current flexible and transparent oxide conductive film to the preprocess method of base material mainly at deposited on substrates cushion, its barrier is improved, is beneficial to conductive layer growth, thus reduces the resistivity of conductive film.Above-mentioned cushion selects Al2O3, SiO2, ZnO and PI etc.
In the present embodiment, in the 5th step, exposure adopts proximity printing, can avoid directly contacting with photoresist and the mask plate that causes damages.
Another aspect of the present invention is to provide the device that a kind of flexible conductive film graphically manufactures, and it comprises conductive film 2, rigid substrates 1, and conductive film 2 is laid on the rigid substrate 1.Be provided with transmission shaft 7 below described rigid substrates 1, rigid substrates 1 moves forward under the drive of transmission shaft 7.Above substrate 1, carry out dripping of photoresist 6 attached, photoresist 6 dropped onto on coating wheel 4 before instillation rigid substrates 1.Described coating wheel 4 contacts with squeegee roller 5, in the process that conductive film figureization manufactures, is mutually extruded carry out roller coating photoresist 6 to composite plate and form photoresist layer 3 by coating wheel 4 and squeegee roller 5.Adopt coating wheel 4 to make the thickness of photoresist layer 3 thinner with the fashion of extrusion of squeegee roller 5, and the thickness of photoresist layer 3 is even, and the situation that thickness thin and thick is irregular can not occur.
In the present embodiment, in the process of described composite plate coating photoresist 6, coating wheel 4 and squeegee roller 5 just rotate, and are not moved.In roller coating process, the photoresist 6 dripped top in the rotation process of coating wheel 4 and squeegee roller 5 adds and is pressed into the uniform photoresist layer 3 of thickness, and photoresist layer 3 is finally laid on the rigid substrate 1 equably.
In the present embodiment, in third step, coating method is roller coating.The photoresist layer thickness adopting the mode of roller coating to be coated with is thin, adhesion strong, substantially increases photoetching resolution, reduces flexible display complex manufacturing, increases production efficiency, reduces production cost.
In the present embodiment, described rigid substrates 1 is glass or rigidity plastics or rigid metallic material.In order to ensure the homogeneity of the planarization that photoresist layer is laid and thickness, therefore select ganoid glass or rigidity plastics or rigid metallic material, described rigid substrates 1 has a smooth surface, for pasting conductive film 1.
In the present embodiment, the viscosity of described photoresist 6 is 20-60CP.The model of that photoresist is AZREP-230K2 in the present embodiment, certainly meet there is the condition of enough adhesions under, the photoresist of other model can be selected as required.
In the present embodiment, the thickness of described photoresist layer 3 is 1-3 micron.Photoresist layer when meeting adhesion and being stronger in the present invention is thinner, and the photoetching resolution of photoresist layer 3 can be made higher.
In the present embodiment, described conductive film 2 selects PET or PN or FRP or PES or PC material.Conductive film is selected to select the material such as PET or PN or FRP or PES or PC material as flexible substrate, have cheap, light quality, pliability is good, flexible, volume to volume industrialization continuous seepage mode can be adopted to be conducive to raising the efficiency, being convenient to the advantages such as transport.
In sum, feature of the present invention is: described conductive film 2 selects the material such as PET or PN or FRP or PES or PC material as flexible substrate, cheap, light quality, and pliability is good, flexible; Adopt the mode of roller coating roller coating one deck photoresist 6 on conductive film 2 in the method, photoresist has the advantages that thickness is thin, adhesion is strong; In roller coating process, the photoresist 6 dripped top in the rotation process of coating wheel 4 and squeegee roller 5 adds and is pressed into the uniform photoresist layer 3 of thickness, and photoresist layer 3 is finally laid on the rigid substrate 1 equably, ensure that the thickness of photoresist layer 3 is even.
It will be apparent to those skilled in the art that the graphical manufacture method of flexible conductive film of the present invention comprises the combination in any of each several part in this instructions.As space is limited and in order to make instructions simple and clear, these combinations are not introduced one by one in detail at this, but after having seen this instructions, the scope of the present invention that the combination in any of each several part be made up of this instructions is formed is self-evident.
Claims (10)
1. the graphical manufacture method of flexible conductive film, comprises cleaning, exposure, development, etching and demoulding operation, it is characterized in that specifically comprising the steps:
The first step, chooses a transparent conductive film (2), is attached on a rigid substrates (1) and forms composite base plate;
Second step, cleans above-mentioned composite base plate;
3rd step, the composite base plate surface after cleaned is coated with one deck photoresist (6);
4th step, carries out preliminary drying to the composite base plate scribbling photoresist layer (3);
5th step, the composite plate after being completed by above-mentioned preliminary drying is sent in exposure machine and is carried out graphical exposure-processed;
6th step, develops to the composite plate after above-mentioned exposure, cleaning treatment;
7th step, etches above-mentioned composite plate, demoulding.
2. the graphical manufacture method of flexible conductive film as claimed in claim 1, is characterized in that: in third step, drives rigid substrates (1) mobile by transmission shaft (7).
3. the graphical manufacture method of flexible conductive film as claimed in claim 1, is characterized in that: in third step, carries out roller coating photoresist (6) in the process of basic (1) movement of rigidity by mutual extruding of coating wheel (4) and squeegee roller (5) to composite plate.
4. the graphical manufacture method of the flexible conductive film as described in claim 1 or 3, is characterized in that: in the process of described composite plate coating photoresist (6), coating wheel (4) and squeegee roller (5) just rotate, and are not moved.
5. the graphical manufacture method of flexible conductive film as claimed in claim 1, is characterized in that: in third step, coating method is roller coating.
6. the graphical manufacture method of the flexible conductive film according to any one of claim 1-3, is characterized in that: described rigid substrates (1) is glass or rigidity plastics or rigid metallic material.
7. the graphical manufacture method of flexible conductive film as claimed in claim 1, is characterized in that: the viscosity of described photoresist (6) is 20-60CP.
8. the graphical manufacture method of flexible conductive film as claimed in claim 1, is characterized in that: the cleaning environment of the composite base plate in described step 2 is clean 2 minutes in the NaOH solution of 0.5%, and then the deionized water putting into 12-18M Ω cleans 5 minutes.
9. the graphical manufacture method of flexible conductive film as claimed in claim 1, is characterized in that: scribble the preliminary drying environment of the composite base plate of photoresist layer (3) in described step 4 for continuing 2 minutes at temperature is 90-100 DEG C.
10. the graphical manufacture method of flexible conductive film as claimed in claim 1, is characterized in that: in described step 5 preliminary drying complete after the exposure environment of composite plate be expose in the parallel ultraviolet of 365 nanometers at wavelength, its exposure is 50-100mj/cm
2.
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| CN107058952A (en) * | 2017-05-23 | 2017-08-18 | 中丰田光电科技(珠海)有限公司 | A kind of technique of the holographic registration pattern medium paper of novel laser |
| CN110412832A (en) * | 2019-08-23 | 2019-11-05 | 江苏上达电子有限公司 | A kind of bidirectional screw COF coating roller |
| CN110581062A (en) * | 2019-09-25 | 2019-12-17 | 江苏上达电子有限公司 | Manufacturing method of packaging substrate for improving residual copper in edge curling |
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