CN1933712A - Complex radiating device - Google Patents
Complex radiating device Download PDFInfo
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- CN1933712A CN1933712A CN 200510103207 CN200510103207A CN1933712A CN 1933712 A CN1933712 A CN 1933712A CN 200510103207 CN200510103207 CN 200510103207 CN 200510103207 A CN200510103207 A CN 200510103207A CN 1933712 A CN1933712 A CN 1933712A
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- radiator
- radiating device
- heat pipe
- heat
- complex radiating
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Abstract
A heat radiation device of composite type consists of on heat conductive tube and two heat radiators. It is featured as connecting two heat radiators with each other and setting two heat radiators to be corresponded to each other, holding a containing space at connection position for placing a heat conductive tube there and preparing two heat radiators by one-body forming process separately.
Description
Technical field
The present invention system is about a kind of heat abstractor, particularly about a kind of complex radiating device.
Background technology
Along with development of technology, the number of transistors on the electronic component unit are is more and more, the increase of caloric value when causing its work.On the other hand, the operating frequency of electronic component is also more and more higher, and the heat (switch loss) that ON/OFF (on/off) conversion is caused during transistor work also is the reason that the electronic component caloric value increases.If fail suitably to handle these heats, will cause the reduction of chip arithmetic speed, severe patient even have influence on life-span of chip.Be to strengthen the radiating effect of electronic component, existing way mostly is greatly to be sentenced radiator at thermal source thermal conductance is gone out, and dissipates heat in the environment with nature or forced convertion mode via the fin (fin) of radiator.
Because heat pipe (heat pipe) can be under very little sectional area and temperature difference, a large amount of heat is transmitted one section considerable distance, and do not need the additional power source supply to operate, under the consideration that need not power provides with the space utilization economy, heat pipe has been one of heat transfer element of widely using in the electronic radiation product.See also Fig. 1, it is the schematic diagram of known a kind of heat abstractor.Known heat abstractor 1 is made up of a plurality of radiating fins 11, a heat pipe 12 and a base 13.Each radiating fin 11 is to be socketed on respectively in the heat pipe 12.At this, need particularly point out, clearer in order to make explanation, it is other and remove near the radiating fin 11 at base 13 places that the spy will be positioned at heat pipe 12, the configuration of radiating fin 11, heat pipe 12 and base 13 can be known be shown on the figure.A plurality of radiating fins 11, heat pipe 12 are by welding manner it to be combined into one with base 13, yet, known heat abstractor 1 has following shortcoming, when if the material of radiating fin 11 is aluminium, then after the radiating fin 11 necessary advanced electroplating steps, just can weld, so consume into original consideration with regard to production efficiency with plating institute, this kind assembling mode is not an ideal design.In addition, if when the material of radiating fin 11 is copper, though can save plating step, because the material characteristic and the higher factor of price of copper itself, so when the material of radiating fin is copper, the shortcoming that weight is heavier and cost of material is higher is arranged then.
The assembling mode of another kind of heat abstractor then is to utilize impact style, make each radiating fin 11 can combine by close-fitting with heat pipe 12, then again radiating fin 11, heat pipe 12 are combined with base 13 with welding manner, but this kind assembling mode needs extra cost of stamping.
Therefore, no matter be above-mentioned which kind of assembling mode, all need fix a plurality of radiating fins 11, heat pipe 12 and base 13 and just can assemble with tool.Moreover, owing to must use the mode of welding, if no strict process control easily causes bad results such as employed scolding tin crawling, scolding tin overflow, to such an extent as to cause the integral heat sink usefulness of heat abstractor 1 not good.Therefore, how providing a kind of heat abstractor, can simplify technical process and reduce cost and good heat radiating usefulness can be provided, is exactly one of current important topic.
Summary of the invention
Therefore, for addressing the above problem, the present invention proposes a kind ofly to simplify technical process and reduce cost, and the complex radiating device of good heat radiating usefulness can be provided.
According to purpose of the present invention, a kind of complex radiating device is proposed, comprise a heat pipe and second radiator.Second radiator system is corresponding mutually to be provided with and to interconnect, and has an accommodation space in the junction, in order to ccontaining heat pipe.This second radiator is respectively one-body molded mode and makes, and for example is the aluminium extruded moulding.Wherein, the shape of heat pipe system is U type, C type, long strip type, ㄇ font, M type or other shape, and the cross sectional shape of heat pipe is circle, ellipse, semicircle, rectangle, triangle, quadrangle, trapezoidal, equilateral polygon or inequilateral polygon.Each radiator has a plurality of fins, and the distribution mode of those fins is horizontal interval distribution, perpendicular separation distribution, oblique distribution spaced apart, radial or other similar distribution mode.
As above-mentioned complex radiating device, in the junction this to state radiator be that correspondence is provided with a groove respectively, with common formation accommodation space.Perhaps, in the junction, only one of these radiators are provided with a groove, to form accommodation space.The shape of described radiator system is same to each other or different to each other, and the connected mode of described radiator be rivet, be spirally connected, weld, bonding, chimeric or fixing.In accommodation space, be coated with a heat-conducting cream or and can serve as the material of heat conducting interface, and heat pipe can see through a pedestal or directly contact with a thermal source, be directly conducted to radiator in order to the heat that thermal source is dispersed.
According to a further object of the present invention, a kind of complex radiating device is proposed, comprise a plurality of heat pipes and a plurality of radiator.A plurality of radiators are to correspond to each other to be provided with and to interconnect, and respectively have an accommodation space in each junction, and in order to the ccontaining heat pipe of difference, each radiator is respectively one-body molded and makes.
According to another object of the present invention, a kind of complex radiating device is proposed, comprise at least two heat pipes and one first radiator and one second radiator.First radiator is different with the shape of second radiator, but it is each other just can be mutually corresponding and interconnect, and have at least two accommodation spaces in the junction, in order to ccontaining these a little heat pipes respectively, first radiator and second radiator are respectively one-body molded mode and make.
From the above, according to a kind of complex radiating device of the present invention, because radiator is one-body molded making, and heat pipe is arranged in the formed accommodation space of those radiators, and it is combined into one, and do not need additionally to electroplate or step such as punching press.Compare with known technology, complex radiating device of the present invention has the effect of enhancing productivity and reducing production costs.
For above and other objects of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Description of drawings
Fig. 1 is the schematic diagram of known a kind of heat abstractor.
Fig. 2 is the three-dimensional exploded view of a kind of complex radiating device of preferred embodiment of the present invention.
Fig. 3 is the three-dimensional combination figure of Fig. 2.
Fig. 4 is the three-dimensional exploded view of the another kind of complex radiating device of the present invention.
Fig. 5 is the three-dimensional combination figure of Fig. 4.
Fig. 6 is the present invention's three-dimensional exploded view of another complex radiating device of a preferred embodiment again.
Fig. 7 is the three-dimensional combination figure of Fig. 6.
[main element symbol description]
1-heat abstractor 11-radiating fin
12-heat pipe 13-base
2,2 ', 3-complex radiating device
211,21a, 21b, 21c-heat pipe
22a, 22b, 22c, 22d, 22e, 22f-radiator
The 221-junction
222,222a, 222b, 222c, 322-accommodation space
222 ', 322 '-groove
223-screw 23-screw
24-nut 25-pedestal
31a, 31b-heat pipe 32-first radiator
321-junction 322-groove
323,331-screw 33-second radiator
Embodiment
Hereinafter with reference to relevant drawings, a kind of complex radiating device according to preferred embodiment of the present invention is described.
See also Fig. 2 and shown in Figure 3, Fig. 2 is the three-dimensional exploded view of a kind of complex radiating device of preferred embodiment of the present invention, and Fig. 3 is the three-dimensional combination figure of Fig. 2.A kind of complex radiating device 2 cordings of first embodiment of the invention have a heat pipe 21 and second radiator 22a, 22b.Wherein, heat pipe 21 can see through a pedestal 25 and contact with a thermal source (scheming not show), or directly contacts with thermal source, be directly conducted to radiator 22a, 22b in order to the heat that thermal source is dispersed after, make heat dissipation to the elsewhere.At this, thermal source can be the electronic component of a heating, for example be CPU, transistor, server, high-order drafting card, hard disk, power supply unit, running control system, electronic multimedia mechanism, radio communication base station, or high-order game machine (PS3, XBOX, Nintendo) etc.
In addition, a working fluid is contained in heat pipe 21 inside, for the usefulness of heat conduction, and has capillary structure on the inwall of heat pipe 21.The working method of heat pipe 21 is as follows: when the end (being evaporation ends) of heat pipe 21 when being heated, the working fluid of heat pipe 21 inside absorbs heat energy and evaporates gasification, working fluid after the gasification condenses into liquid and emits heat energy in the other end (being condensation end) of heat pipe 21, flow back to evaporation ends by the capillary structure on the inwall this moment again, repetitive cycling like this is to reach the effect of heat radiation.
Modes such as the shape of the capillary structure of present embodiment can be netted (mesh), fibrous (fiber), sintering (sinter) or ditch shape (groove), and it is with sintering, stick together, filling, Shen are long-pending combine with the inwall of heat pipe 21.The material of this capillary structure can be plastics, metal, alloy or porousness nonmetallic materials.Working fluid can be inorganic compound, water, alcohols, liquid metal, ketone, refrigerant or organic compound.
Moreover radiator 22a, 22b more are provided with a plurality of screws 223, interconnect fixing by a plurality of screws 23 with nut 24 in order to radiator 22a and radiator 22b.It is noted that the connected mode of second radiator 22a, 22b is not limited in the mode that is spirally connected shown in Fig. 2 and Fig. 3, its connected mode also can be modes such as riveted joint, welding, bonding, chimeric or fixing.
Though the heat pipe 21 among Fig. 2 is respectively one and two with the quantity of radiator 22, the present invention is not limited thereto, and its quantity can be selected according to actual demand.Please consult Fig. 4 and Fig. 5 simultaneously, Fig. 4 is the three-dimensional exploded view of the another kind of complex radiating device of the present invention, and Fig. 5 is the three-dimensional combination figure of Fig. 4.Complex radiating device 2 ' comprises a plurality of heat pipe 21a, 21b, 21c and radiator 22c, 22d, 22e, 22f.Wherein, the per two adjacent mutual correspondences of radiator system are provided with and interconnect, and respectively have an accommodation space 222a, 222b, 222c in each junction, in order to the ccontaining heat pipe 21a of difference, 21b, 21c.Complex radiating device 2 ' can directly be placed on the thermal source (figure do not show), and heat pipe 21a, 21b, 21c are directly contacted with thermal source, be directly conducted to radiator 22c, 22d, 22e, 22f in order to the heat that thermal source is dispersed after, make heat dissipation to the elsewhere.Similar to the complex radiating device 2 of Fig. 2, radiator 22c, 22d, 22e, 22f can be identical or different radiators each other, and heat pipe 21a, 21b, 21c can be identical or different heat pipes each other.Complex radiating device 2 ' the assembling mode of present embodiment is as follows, respectively heat pipe 21a being positioned over accommodation space 222a, heat pipe 21b between radiator 22c and the radiator 22d is positioned over accommodation space 222b, heat pipe 21c between radiator 22d and the radiator 22e and is positioned over accommodation space 222c between radiator 22e and the radiator 22f, exert pressure relatively by a high pressure machine (figure does not show) again, make each heat pipe fit tightly with being wrapped in its outer second radiator respectively, in order to form complex radiating device 2 ' (as shown in Figure 5).In addition, in these radiators 22c, 22d, 22e, the formed accommodation space 222a of 22f, 222b, 222c, also can be coated with heat-conducting cream or other Heat Conduction Material, can promote radiating efficiency.
See also Fig. 6 and shown in Figure 7, Fig. 6 is the three-dimensional exploded view of another complex radiating device of the present invention, and Fig. 7 is the three-dimensional combination figure of Fig. 6.Complex radiating device 3 has two heat pipe 31a, 31b, and first radiator 32 and one second radiator 33.At this, the shape system of heat pipe 31 is the U type, but be not limited to this, the shape of heat pipe 31 can be designed to different aspects according to the different system demand, for example C type, long strip type, ㄇ font, M type or other arbitrary shape, its effect, structure are not given unnecessary details at this as above-mentioned heat pipe 21.
In sum, complex radiating device of the present invention, because radiator system makes so that the aluminium extruded molding mode is one-body molded, in today of aluminium extruded forming technique maturation, its price is cheap than general technology (assembling one by one as impact style or with indivedual one chip fins), and heat pipe is arranged in the two adjacent formed accommodation spaces of radiator, does not need additionally to electroplate or step such as punching press, can easily heat pipe and radiator be combined into one.Compare with known technology, complex radiating device of the present invention is to adopt aluminium extruded molding mode integral production, and not only production method is cheap, and because of adopting aluminium as raw material, can make that the overall weight of heat abstractor is lighter, has the advantage of lighting.Moreover, the formed accommodation space of radiator system is big or small corresponding with heat pipe, therefore, radiator and heat pipe can fit tightly fully, can increase heat transfer area, add the high conduction characteristic that heat pipe itself has, compared with good with the radiating effect of the general fin that does not comprise heat pipe under the homalographic.In addition, when the production method of aluminium extruded moulding, radiator can be made various appearances and handle, and beautifies easily.Therefore, complex radiating device of the present invention can reach the simplification technical process, enhance productivity, reduces cost, and the effect of good heat radiating usefulness can be provided.
Though the present invention discloses as above with a preferred embodiment; right its is not in order to limit the present invention; the those skilled in the art; without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking the appending claims person of defining.
Claims (21)
1, a kind of complex radiating device comprises:
One heat pipe; And
Second radiator is that mutual correspondence is provided with and interconnects, and has an accommodation space in the junction that in order to ccontaining this heat pipe, those radiators are respectively one-body molded mode and make.
2, complex radiating device as claimed in claim 1, wherein the shape of this heat pipe system is U type, C type, long strip type, ㄇ font, M type or other shape.
3, complex radiating device as claimed in claim 1, wherein in this junction, described radiator is that correspondence is provided with a groove respectively, with this accommodation space of common formation.
4, complex radiating device as claimed in claim 1, wherein in this junction, only one of described radiator is provided with a groove, to form this accommodation space.
5, complex radiating device as claimed in claim 1, the connected mode of wherein said radiator be rivet, be spirally connected, weld, bonding, chimeric or fix.
6, complex radiating device as claimed in claim 1 is by a high pressure machine described radiator to be exerted pressure relatively, makes this heat pipe and described radiator fit tightly.
7, complex radiating device as claimed in claim 1, the shape system of wherein said radiator is same to each other or different to each other.
8, complex radiating device as claimed in claim 1, the one-body molded mode of wherein said radiator is the aluminium extruded moulding.
9, complex radiating device as claimed in claim 1 wherein is coated with the material that heat-conducting cream or can serve as thermally-conductive interface in this accommodation space.
10, complex radiating device as claimed in claim 1, wherein this heat pipe can see through a pedestal or directly contact with a thermal source, is directly conducted to described radiator in order to the heat that this thermal source is dispersed.
11, a kind of complex radiating device comprises:
A plurality of heat pipes; And
A plurality of radiators are to correspond to each other to be provided with and to interconnect, and respectively have an accommodation space in each junction that in order to ccontaining those heat pipes of difference, described radiator is respectively one-body molded and makes.
12, complex radiating device as claimed in claim 11, the shape system of wherein said heat pipe is U type, C type, long strip type, ㄇ font, M type or other shape.
13, complex radiating device as claimed in claim 11, wherein in each described junction, described radiator is that correspondence is provided with a groove respectively, with the described accommodation space of common formation.
14, complex radiating device as claimed in claim 11, wherein in each described junction, one of this only adjacent second radiator is provided with a groove, to form this accommodation space.
15, complex radiating device as claimed in claim 11, the connected mode of wherein said radiator be rivet, be spirally connected, weld, bonding, chimeric or fix.
16, complex radiating device as claimed in claim 11 is by a high pressure machine described radiator to be exerted pressure relatively, makes described heat pipe and described radiator fit tightly.
17, complex radiating device as claimed in claim 11, the shape system of wherein said radiator is same to each other or different to each other.
18, complex radiating device as claimed in claim 11, the one-body molded mode of wherein said radiator is the aluminium extruded moulding.
19, complex radiating device as claimed in claim 11 wherein is coated with the material that heat-conducting cream or can serve as thermally-conductive interface in described accommodation space.
20, complex radiating device as claimed in claim 11, wherein said heat pipe can see through a pedestal or directly contact with a thermal source, is directly conducted to described radiator in order to the heat that this thermal source is dispersed.
21, a kind of complex radiating device comprises:
At least two heat pipes; And
One first radiator and one second radiator, this first radiator is different with the shape of this second radiator, but it is each other just can be mutually corresponding and interconnect, and have at least two accommodation spaces in the junction, in order to the ccontaining described heat pipe of difference, this first radiator and this second radiator are respectively one-body molded mode and make.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200510103207 CN1933712A (en) | 2005-09-16 | 2005-09-16 | Complex radiating device |
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CN 200510103207 CN1933712A (en) | 2005-09-16 | 2005-09-16 | Complex radiating device |
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CN1933712A true CN1933712A (en) | 2007-03-21 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI397665B (en) * | 2010-01-12 | 2013-06-01 | Pegatron Corp | Thermal dissipating assembly and manufacturing method thereof |
CN104066301A (en) * | 2013-03-22 | 2014-09-24 | 技嘉科技股份有限公司 | Heat pipe type radiator |
CN106896883A (en) * | 2017-02-28 | 2017-06-27 | 郑州云海信息技术有限公司 | A kind of electronic equipment cooling system |
-
2005
- 2005-09-16 CN CN 200510103207 patent/CN1933712A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI397665B (en) * | 2010-01-12 | 2013-06-01 | Pegatron Corp | Thermal dissipating assembly and manufacturing method thereof |
CN104066301A (en) * | 2013-03-22 | 2014-09-24 | 技嘉科技股份有限公司 | Heat pipe type radiator |
CN106896883A (en) * | 2017-02-28 | 2017-06-27 | 郑州云海信息技术有限公司 | A kind of electronic equipment cooling system |
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Open date: 20070321 |