CN1901777A - 具有改良电源区块的印刷电路板 - Google Patents

具有改良电源区块的印刷电路板 Download PDF

Info

Publication number
CN1901777A
CN1901777A CNA2005100361439A CN200510036143A CN1901777A CN 1901777 A CN1901777 A CN 1901777A CN A2005100361439 A CNA2005100361439 A CN A2005100361439A CN 200510036143 A CN200510036143 A CN 200510036143A CN 1901777 A CN1901777 A CN 1901777A
Authority
CN
China
Prior art keywords
block
circuit board
pcb
printed circuit
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2005100361439A
Other languages
English (en)
Other versions
CN100531515C (zh
Inventor
林有旭
叶尚苍
黄肇振
李传兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNB2005100361439A priority Critical patent/CN100531515C/zh
Priority to US11/488,490 priority patent/US20070017696A1/en
Publication of CN1901777A publication Critical patent/CN1901777A/zh
Application granted granted Critical
Publication of CN100531515C publication Critical patent/CN100531515C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本发明提供一种具有改良电源区块的印刷电路板，所述印刷电路板为多层电路板，其具有若干元件接点、一第一电源区块、一第二电源区块及若干过孔；所述元件接点用来安置一大电流电子元件；所述过孔贯穿所述第一电源区块、第二电源区块并电气连接所述第一电源区块和第二电源区块使两者电压相同，其中所述第一电源区块、第二电源区块形状相同或者相近似。通过上述设计，可以减少所述过孔的数目，从而保证了电源层和接地层更好的完整性，节省了该印刷电路板的制造成本。

Description

具有改良电源区块的印刷电路板
【技术领域】
本发明涉及一种印刷电路板，特别涉及一种具有改良电源区块的印刷电路板。
【背景技术】
一般而言，印刷电路板已经被普遍地用来辅助各电子元件之间的电连接，以方便各电子元件传递信号。过去，印刷电路板为单层板，其表面仅有一信号层，并利用该信号层上的迹线来连接所有设置于该印刷电路板上的电子元件，亦即透过该迹线来传递该电子元件的输入或输出信号。当该电子元件之间包含有多个不同信号时，该信号层就需要复杂的迹线布局来顺利地于各电子元件之间传递庞大的信号，但是印刷电路板本身有面积限制，而迹线本身有宽度与长度，于是在一有限面积中，其可容纳的线路数量就有一上限值，造成仅有单一信号层的印刷电路板迹线数量有限，无法进一步应用在复杂的电路中，所以业界便发展一多层电路板技术来增加信号层的整体面积。
多层电路板用绝缘层来分开上下两相邻的板层，由于信号层的整体面积增加，所以该信号层上所设置的迹线数量也随之增加，可用来连接更多的电子元件，并适当地设定电子元件间的信号传输路径。举例来说，随着半导体工艺的进步，集成电路的体积也大幅缩小，即一集成电路可包含更多的电路元件来达到多种不同的功能，因此该集成电路输入与输出信号的数量也随其功能的强化而增加，各集成电路之间就必须建立复杂的信号传输路径以达到预期功能，此时便可应用该多层电路板架构来设置需要的迹线。多层电路板包含有多个导体层，其中外部的导体层为设置迹线与元件接点的信号层，如果为六层板和八层板，中间的导体层也可以有信号层。中间的导体层有些为该多层电路板的电源层或接地层，该电源层用来提供多层电路板上电子元件的工作电压，而接地层用来提供一接地电平。请参阅图1至图3，信号层10包含有多个迹线12、多个元件接点14a(14b、14c、14d)以及多个过孔16a(16b、16c、16d)。元件接点14a、14b、14c及14d等用来安置一电子元件18，而迹线12电连接于元件接点14a用来传输信号。过孔16a、16b、16c及16d用来电连接信号层10、接地层20及电源层30。接地层20包含有多个过孔26b、26c及26d，接地层20的上表面22为一导电金属层，用来作为一接地端。电源层30包含有多个电源区块32、36及34，每一电源区块提供不同的电压以供应电子元件18的运行所需，例如电源区块32提供一1伏特电压，电源区块36提供一2伏特电压，电源区块34提供一3伏特电压。信号层10、接地层20及电源层30之间的操作叙述如下：在多层电路板中，所述各层位置关系从上到下为信号层10、接地层20及电源层30，若电子元件18需由元件接点14a提供接地电压，即元件接点14a必须电连接于接地层20，则经由信号层10的导线12与过孔16a，元件接点14a则会电连接于接地层20；如电子元件18需由元件接点14b、14c、14d分别提供3伏特，2伏特，以及1伏特的工作电压，即元件接点14b、14c、14d需分别电连接于电源区块34、36、32，对元件接点14b而言，其经由信号层10的相对应迹线12与过孔16b及接地层20的过孔26b而电连接于电源区块34；对元件接点14c，则经由信号层10的相对应迹线12与过孔16c及接地层20的过孔26c而电连接于电源区块36；同理，对元件接点14d，经由信号层10的相对应迹线12与过孔16d及接地层20的过孔26d而电连接于电源区块32。信号层10中的电子元件18的输入信号可以经由接地层20以及电源层30上的过孔38，而取自电源层30下多层电路板的另一信号层，即现有多层电路板可使用多个信号层10来传输信号，并且电子元件18之间的信号传输路径可设置于不同的信号层10上，降低了迹线设置的复杂度。
如上所述，当电子元件间包含有复杂的信号传输时，现有多层电路板可用多个信号层来设置复杂的迹线布局。目前的电脑系统由多个元件所构成，其中主要的大电流电脑元件如中央处理器、电压调节模块(VRM)、北桥芯片、存储器等都安装在主机板上，为了方便高效的连接这些电脑元件，即可用多层主机板来解决其间的复杂电气连接。
对电脑元件的稳定供电无疑是多层电路板稳定性设计的关键，因此电源层和接地层的完整性在多层电路板设计中尤为重要。而理论和实验都证明，贯穿电源层和接地层的过孔是影响其完整性的重要因素，所以在印刷电路板设计中，我们总是希望过孔越少越好。
对于小电流元件来说，由电源层上相应的电源区块直接为其供电，即可满足小电流元件对工作电压和工作电流的需求。但是对于需要大电流(最大可能会超过100A)供电的电子元件来说，如果只有一条电源走线，大电流就会造成导线高热、导线上的压降过大甚至导通元件被烧毁等问题，即此时单电源层供电方式就不能满足大电流电子元件对工作电流和工作电压的稳定需求，故该类大电流元件需具有双电源区块的多层印刷电路板来供电。所谓双电源区块供电是指位于不同印刷电路板层、具有相同电压的两个电源区块组成并联电路向同一大电流元件提供其所需的工作电压和工作电流。同一电子元件的工作电压若不稳定，就会造成传输信号的高低电平波动从而影响整个电脑系统的稳定性，所以向同一元件供电的两个电源区块电压必须相等。
现有技术多层印刷电路板向大电流电子元件供电时已经采用上述方法，即先由电源供应器根据大电流元件的电压要求同时向位于不同板层的所述双电源区块提供相同的电压。现有技术中向大电流元件供电的双电源区块形状差别较大，故其内阻相差甚远。双电源区块因自身压降不等导致在被供电元件处电压不相等，无法满足所述大电流元件对工作电压的需求。为了保证所述双电源区块电压处处相等，业界通过大量的过孔来提供上下电源区块的电流路径，该类过孔贯穿所述双电源区块。由于所述双电源区块间有电压差，该类过孔自身有阻抗，所以该类过孔就有电流通过，产生压降，达到使双电源区块电压相等的目的。该类过孔有电流通过，导致自身发热，降低了所述印刷电路板的使用寿命，同时由于该类过孔总是贯穿双电源区块和其间的接地层，故大量的该类过孔也严重破坏电源层和接地层的完整性和稳定性。
【发明内容】
鉴于上述内容，有必要提供一种具有改良电源区块的印刷电路板，使得贯穿所述双电源区块的过孔数目减少。
一种具有改良电源区块的印刷电路板，所述印刷电路板为多层电路板，其具有若干元件接点、一第一电源区块、一第二电源区块及若干过孔。所述元件接点用来安置一大电流元件；所述第一电源区块、第二电源区块用来共同给该大电流元件提供工作电压和工作电流；所述过孔贯穿所述第一电源区块、第二电源区块并电气连接所述第一电源区块和第二电源区块使之电压保持相等。其中所述第一电源区块、第二电源区块形状相同或者相近似。
相较现有技术，本发明具有改良电源区块的印刷电路板上所述第一电源区块和第二电源区块形状相同或者相近似，用来电气连接所述第一电源区块和第二电源区块的过孔数目大量减少，节约了印刷电路板的制造成本，改善了电源层和接地层的完整性；同时由于整体发热减少，印刷电路板的质量得以提高，使用寿命得以增长。
【附图说明】
下面结合附图及较佳实施方式对本发明作进一步详细描述：
图1为现有多层电路板信号层的示意图。
图2为现有多层电路板接地层的示意图。
图3为现有多层电路板电源层的示意图。
图4为本发明具有改良电源区块的印刷电路板较佳实施方式示意图。
【具体实施方式】
请参阅图4，本发明较佳实施方式具有改良电源区块的印刷电路板，该印刷电路板为多层电路板，其具有若干元件接点40、一第一电源区块42、一第二电源区块44及若干过孔46。所述元件接点40用来安置一大电流元件(图未标示)；所述第一电源区块42、第二电源区块44用来共同给安装在所述元件接点40上的大电流元件提供工作电压和工作电流；所述过孔46贯穿并电气连接所述第一电源区块42、第二电源区块44使之电压保持相同。所述第一电源区块42、第二电源区块44用途性质均完全相同并分别处于所述印刷电路板的不同板层。当所述多层印刷电路板是图示四层板时，则其包含一第一信号层41、一接地层43、一电源层45及一第二信号层47，该第一信号层41包含迹线与所有元件接点，该第二信号层47包含与第一信号层相关的迹线，该接地层43用来提供一接地电平，该电源层45被分为多个电源区块以给不同的电脑元件提供各自需要的电压。所述第一电源区块42、第二电源区块44可分别位于所述第一信号层41和第二信号层47上，即可在该第一信号层41、第二信号层47上分别设计专门向同一大电流元件供电的电源区块；也可能是所述第一电源区块42在某一信号层41(或47)上，第二电源区块44为印刷电路板中该电源层45上向同一大电流元件供电的对应电源区块；如果为其它多层板，如六层板或者八层板，则除了上面所述情况外，该第一电源区块42、第二电源区块44还可以分别位于该类多层板的两电源层上。本发明较佳实施方式中，所述第一电源区块42、第二电源区块44形状相同或者相近似，当向安装在所述元件接点40上的大电流电子元件提供工作电压和工作电流时，由电源供应器给所述第一电源区块42、第二电源区块44提供相同的工作电压。与现有技术相比，本发明中的第一电源区块42、第二电源区块44形状相同或者相近似，由对过孔电流仿真结果知，其内电阻也相等或者近似相等，这样其内部压降即可达相同或者近似相同。为了满足该情况下所述第一电源区块42、第二电源区块44在被供电的大电流电子元件处的电压相等，与现有技术相比，在内部压降近似相同的情况下，由于其压降相差很小，所以较少的过孔46即可使所述第一电源区块42、第二电源区块44的电压相等。由于过孔46数目减少，所述印刷电路板的电源层45及接地层43就具有更好的完整性；同时由于所述第一电源区块42、第二电源区块44压降相差较小，通过过孔46的电流也变小甚至可减小为零，从而使过孔46的发热量也随之减小，印刷电路板的质量和寿命相应增长，保证了整个印刷电路板的正常稳定工作。
综上所述，本发明具有改良电源区块的印刷电路板电源层和接地层上的过孔数目大量减少，自身温度得以降低，进一步提高了印刷电路板的质量。

Claims (8)

1.一种具有改良电源区块的印刷电路板，所述印刷电路板为多层电路板，其具有一第一电源区块、一第二电源区块及若干过孔；所述过孔贯穿所述第一电源区块、第二电源区块；其特征在于：所述第一电源区块、第二电源区块形状相同或者相近似。
2.如权利要求1所述的具有改良电源区块的印刷电路板，其特征在于：所述多层电路板包括至少两信号层和至少一电源层。
3.如权利要求2所述的具有改良电源区块的印刷电路板，其特征在于：所述第一电源区块和第二电源区块位于所述多层电路板的不同板层上。
4.如权利要求3所述的具有改良电源区块的印刷电路板，其特征在于：所述第一电源区块、第二电源区块分别位于所述多层电路板的两信号层。
5.如权利要求3所述的具有改良电源区块的印刷电路板，其特征在于：所述第一电源区块、第二电源区块分别位于所述多层电路板的两电源层。
6.如权利要求3所述的具有改良电源区块的印刷电路板，其特征在于：所述第一电源区块、第二电源区块分别位于所述多层电路板的一信号层和一电源层。
7.如权利要求1至6项中任一项所述的具有改良电源区块的印刷电路板，其特征在于：所述过孔电气连接所述第一电源区块、第二电源区块使之电压保持相同。
8.如权利要求1至6项中任一项所述的具有改良电源区块的印刷电路板，其特征在于：所述第一电源区块、第二电源区块用来共同给所述印刷电路板上的大电流电子元件提供工作电压和工作电流。
CNB2005100361439A 2005-07-22 2005-07-22 具有改良电源区块的印刷电路板 Expired - Fee Related CN100531515C (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNB2005100361439A CN100531515C (zh) 2005-07-22 2005-07-22 具有改良电源区块的印刷电路板
US11/488,490 US20070017696A1 (en) 2005-07-22 2006-07-18 Multi-layer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005100361439A CN100531515C (zh) 2005-07-22 2005-07-22 具有改良电源区块的印刷电路板

Publications (2)

Publication Number Publication Date
CN1901777A true CN1901777A (zh) 2007-01-24
CN100531515C CN100531515C (zh) 2009-08-19

Family

ID=37657461

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100361439A Expired - Fee Related CN100531515C (zh) 2005-07-22 2005-07-22 具有改良电源区块的印刷电路板

Country Status (2)

Country Link
US (1) US20070017696A1 (zh)
CN (1) CN100531515C (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103037621A (zh) * 2012-10-10 2013-04-10 共青城赛龙通信技术有限责任公司 一种pcb芯片布局结构及应用该结构的电子终端
CN103499997A (zh) * 2013-09-13 2014-01-08 中国科学院近代物理研究所 用于nim机箱的背板及其制造方法
CN111352494A (zh) * 2020-02-22 2020-06-30 苏州浪潮智能科技有限公司 一种54v输入pcie交换板供电架构及电源布线方法

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8512718B2 (en) 2000-07-03 2013-08-20 Foamix Ltd. Pharmaceutical composition for topical application
IL152486A0 (en) 2002-10-25 2003-05-29 Meir Eini Alcohol-free cosmetic and pharmaceutical foam carrier
US9668972B2 (en) 2002-10-25 2017-06-06 Foamix Pharmaceuticals Ltd. Nonsteroidal immunomodulating kit and composition and uses thereof
US20060233721A1 (en) * 2002-10-25 2006-10-19 Foamix Ltd. Foam containing unique oil globules
US20050186142A1 (en) * 2002-10-25 2005-08-25 Foamix Ltd. Kit and composition of imidazole with enhanced bioavailability
US20050205086A1 (en) * 2002-10-25 2005-09-22 Foamix Ltd. Retinoid immunomodulating kit and composition and uses thereof
US20080206161A1 (en) * 2002-10-25 2008-08-28 Dov Tamarkin Quiescent foamable compositions, steroids, kits and uses thereof
US8900554B2 (en) 2002-10-25 2014-12-02 Foamix Pharmaceuticals Ltd. Foamable composition and uses thereof
US20070292461A1 (en) * 2003-08-04 2007-12-20 Foamix Ltd. Oleaginous pharmaceutical and cosmetic foam
US20050271596A1 (en) * 2002-10-25 2005-12-08 Foamix Ltd. Vasoactive kit and composition and uses thereof
US20070292355A1 (en) * 2002-10-25 2007-12-20 Foamix Ltd. Anti-infection augmentation foamable compositions and kit and uses thereof
US9211259B2 (en) * 2002-11-29 2015-12-15 Foamix Pharmaceuticals Ltd. Antibiotic kit and composition and uses thereof
US7704518B2 (en) * 2003-08-04 2010-04-27 Foamix, Ltd. Foamable vehicle and pharmaceutical compositions thereof
US20060193789A1 (en) * 2002-10-25 2006-08-31 Foamix Ltd. Film forming foamable composition
US7700076B2 (en) * 2002-10-25 2010-04-20 Foamix, Ltd. Penetrating pharmaceutical foam
US20060018937A1 (en) * 2002-10-25 2006-01-26 Foamix Ltd. Steroid kit and foamable composition and uses thereof
US20080031907A1 (en) * 2002-10-25 2008-02-07 Foamix Ltd. Cosmetic and pharmaceutical foam
US20070292359A1 (en) * 2002-10-25 2007-12-20 Foamix Ltd. Polypropylene glycol foamable vehicle and pharmaceutical compositions thereof
US9265725B2 (en) * 2002-10-25 2016-02-23 Foamix Pharmaceuticals Ltd. Dicarboxylic acid foamable vehicle and pharmaceutical compositions thereof
CA2502986C (en) 2002-10-25 2011-08-23 Foamix Ltd. Cosmetic and pharmaceutical foam
US8486376B2 (en) * 2002-10-25 2013-07-16 Foamix Ltd. Moisturizing foam containing lanolin
US10117812B2 (en) * 2002-10-25 2018-11-06 Foamix Pharmaceuticals Ltd. Foamable composition combining a polar solvent and a hydrophobic carrier
US7820145B2 (en) 2003-08-04 2010-10-26 Foamix Ltd. Oleaginous pharmaceutical and cosmetic foam
US20080138296A1 (en) 2002-10-25 2008-06-12 Foamix Ltd. Foam prepared from nanoemulsions and uses
US7575739B2 (en) 2003-04-28 2009-08-18 Foamix Ltd. Foamable iodine composition
US20080069779A1 (en) * 2003-08-04 2008-03-20 Foamix Ltd. Foamable vehicle and vitamin and flavonoid pharmaceutical compositions thereof
WO2005011567A2 (en) * 2003-08-04 2005-02-10 Foamix Ltd. Foam carrier containing amphiphilic copolymeric gelling agent
US8795693B2 (en) 2003-08-04 2014-08-05 Foamix Ltd. Compositions with modulating agents
US8486374B2 (en) * 2003-08-04 2013-07-16 Foamix Ltd. Hydrophilic, non-aqueous pharmaceutical carriers and compositions and uses
CN1856294A (zh) * 2003-08-25 2006-11-01 弗米克斯有限公司 渗透性药物泡沫
JP2005310310A (ja) * 2004-04-23 2005-11-04 Sanyo Electric Co Ltd トラッキングバランス調整装置
US20080166303A1 (en) * 2006-09-08 2008-07-10 Dov Tamarkin Colored or colorable foamable composition and foam
AU2007356328A1 (en) * 2006-11-14 2009-01-15 Tal Berman Stable non-alcoholic foamable pharmaceutical emulsion compositions with an unctuous emollient and their uses
US20080260655A1 (en) * 2006-11-14 2008-10-23 Dov Tamarkin Substantially non-aqueous foamable petrolatum based pharmaceutical and cosmetic compositions and their uses
US20080292560A1 (en) * 2007-01-12 2008-11-27 Dov Tamarkin Silicone in glycol pharmaceutical and cosmetic compositions with accommodating agent
US8636982B2 (en) 2007-08-07 2014-01-28 Foamix Ltd. Wax foamable vehicle and pharmaceutical compositions thereof
US20090130029A1 (en) * 2007-11-21 2009-05-21 Foamix Ltd. Glycerol ethers vehicle and pharmaceutical compositions thereof
US9439857B2 (en) 2007-11-30 2016-09-13 Foamix Pharmaceuticals Ltd. Foam containing benzoyl peroxide
WO2010041141A2 (en) 2008-10-07 2010-04-15 Foamix Ltd. Oil-based foamable carriers and formulations
WO2009072007A2 (en) 2007-12-07 2009-06-11 Foamix Ltd. Carriers, formulations, methods for formulating unstable active agents for external application and uses thereof
AU2009205314A1 (en) 2008-01-14 2009-07-23 Foamix Ltd. Poloxamer foamable pharmaceutical compositions with active agents and/or therapeutic cells and uses
WO2010125470A2 (en) 2009-04-28 2010-11-04 Foamix Ltd. Foamable vehicle and pharmaceutical compositions comprising aprotic polar solvents and uses thereof
CA2769677A1 (en) 2009-07-29 2011-02-03 Foamix Ltd. Non surface active agent non polymeric agent hydro-alcoholic foamable compositions, breakable foams and their uses
CA2769625C (en) 2009-07-29 2017-04-11 Foamix Ltd. Non surfactant hydro-alcoholic foamable compositions, breakable foams and their uses
US9849142B2 (en) 2009-10-02 2017-12-26 Foamix Pharmaceuticals Ltd. Methods for accelerated return of skin integrity and for the treatment of impetigo
WO2011039637A2 (en) 2009-10-02 2011-04-07 Foamix Ltd. Surfactant-free water-free foamable compositions, breakable foams and gels and their uses
MX2020012139A (es) 2016-09-08 2021-01-29 Vyne Pharmaceuticals Inc Composiciones y metodos para tratar rosacea y acne.

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761051A (en) * 1994-12-29 1998-06-02 Compaq Computer Corporation Multi-layer circuit board having a supply bus and discrete voltage supply planes
US5708400A (en) * 1996-10-30 1998-01-13 Hewlett-Packard Company AC coupled termination of a printed circuit board power plane in its characteristic impedance
US5898576A (en) * 1996-11-12 1999-04-27 Bay Networks Inc. Printed circuit board including a terminated power plane and method of manufacturing the same
US5912809A (en) * 1997-01-21 1999-06-15 Dell Usa, L.P. Printed circuit board (PCB) including channeled capacitive plane structure
US6104258A (en) * 1998-05-19 2000-08-15 Sun Microsystems, Inc. System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus
US6288906B1 (en) * 1998-12-18 2001-09-11 Intel Corporation Multiple layer printed circuit board having power planes on outer layers
CN1173611C (zh) * 2000-01-10 2004-10-27 神达电脑股份有限公司 多层印刷电路板
US6489570B2 (en) * 2001-03-06 2002-12-03 Mitac International Corp. Multi-layer circuit board
CN2508283Y (zh) * 2001-09-27 2002-08-28 威盛电子股份有限公司 稳定电源与加强接地的电路子板及电路板结构
KR100455890B1 (ko) * 2002-12-24 2004-11-06 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
US7016198B2 (en) * 2003-04-08 2006-03-21 Lexmark International, Inc. Printed circuit board having outer power planes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103037621A (zh) * 2012-10-10 2013-04-10 共青城赛龙通信技术有限责任公司 一种pcb芯片布局结构及应用该结构的电子终端
CN103499997A (zh) * 2013-09-13 2014-01-08 中国科学院近代物理研究所 用于nim机箱的背板及其制造方法
CN111352494A (zh) * 2020-02-22 2020-06-30 苏州浪潮智能科技有限公司 一种54v输入pcie交换板供电架构及电源布线方法

Also Published As

Publication number Publication date
CN100531515C (zh) 2009-08-19
US20070017696A1 (en) 2007-01-25

Similar Documents

Publication Publication Date Title
CN100531515C (zh) 具有改良电源区块的印刷电路板
US7530167B2 (en) Method of making a printed circuit board with low cross-talk noise
US9549467B1 (en) Printed circuit board assembly for use in space missions
US5428499A (en) Printed circuit board having integrated decoupling capacitive core with discrete elements
US6426879B1 (en) Load adjustment board and data processing apparatus
KR20010043335A (ko) 컴퓨터 메모리 속도 및 용량을 향상시키기 위한 장치 및방법
US7873933B2 (en) Computer program for balancing power plane pin currents in a printed wiring board
US7154761B1 (en) Techniques for distributing current in a backplane assembly and methods for making the same
US5841074A (en) Backplane power distribution system having impedance variations in the form of spaced voids
US11564317B2 (en) Integrated power delivery board for delivering power to an ASIC with bypass of signal vias in a printed circuit board
WO2023065745A1 (zh) 驱动芯片、驱动芯片组件及显示装置
US7625214B2 (en) High density power connector with impedance control
JPH0870163A (ja) 第１および第２の予め定められる電圧レベルで作動可能なプリント基板、プリント基板が第２の予め定められる電圧で作動する際に第１の複数の信号ピンを減結合するための方法およびシステム、ならびにパーソナルコンピュータにおいて用いるための拡張ボード
US20080099231A1 (en) Printed circuit board able to suppress simultaneous switching noise
CN1171516C (zh) 印刷电路板结构
US6477060B1 (en) Dual channel bus routing using asymmetric striplines
CN109951951B (zh) 印刷电路板及显示装置
US10470308B1 (en) Printed circuit board assembly and electronic device using the same
US6727435B1 (en) Backplane power distribution system
TWI286914B (en) Printed circuit board having improved power regions
US7180752B2 (en) Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications
CN2549687Y (zh) 一种包含有平滑弧状边界的电源区块的电源层
US20070249209A1 (en) Circuit Arrangement for Coupling a Voltage Supply to a Semiconductor Component, Method for Producing the Circuit Arrangement, and Data Processing Device Comprising the Circuit Arrangement
CN221531272U (zh) 电源转接板、供电装置和供电系统
CN1215394C (zh) 多层电路板的电源层和电脑系统的电路结构

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090819

Termination date: 20140722

EXPY Termination of patent right or utility model