CN1889808A - 印刷电路板重叠焊盘的布线结构 - Google Patents

印刷电路板重叠焊盘的布线结构 Download PDF

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Publication number
CN1889808A
CN1889808A CNA2005100356163A CN200510035616A CN1889808A CN 1889808 A CN1889808 A CN 1889808A CN A2005100356163 A CNA2005100356163 A CN A2005100356163A CN 200510035616 A CN200510035616 A CN 200510035616A CN 1889808 A CN1889808 A CN 1889808A
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Prior art keywords
pad
printed circuit
circuit board
pins
overlapping
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CNA2005100356163A
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Inventor
戴詹辉
黄亚玲
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNA2005100356163A priority Critical patent/CN1889808A/zh
Priority to US11/472,975 priority patent/US7448016B2/en
Publication of CN1889808A publication Critical patent/CN1889808A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明揭露了一种印刷电路板重叠焊盘布线结构，该印刷电路板包括多个重叠焊盘。其中每一重叠焊盘可用于组装具有两管脚之第一零件或第二零件，所述重叠焊盘包括一主体部分及一凸出部分，该主体部分及该凸出部分均为长方形，该主体部分的长为第二零件两管脚的外间距与其内间距之差的一半，宽与第二零件实体宽度相当，该凸出部分的长为第二零件两管脚内间距与第一零件两管脚内间距之差的一半，宽与第一零件实体宽度相当。利用本发明，可使零件更容易组装，且能够限制焊盘较小的零件使其不会上下偏移，从而提高零件组装的效率及质量，同时也为SMT段工作减少了很多负担。

Description

印刷电路板重叠焊盘的布线结构
【技术领域】
本发明关于一种印刷电路板(Printed Circuit Board，PCB)的布线结构，尤其是关于一种印刷电路板中重叠的表面贴焊盘的布线结构。
【背景技术】
在电路板的设计过程中，由于特殊的设计要求，经常需要将两种或多种系列的表面贴零件焊盘重叠。在布线过程中时，工程师通常的做法是直接将两颗零件重叠。如图1所示，为方便说明，在此以0805及0603两系列零件(电阻、电容或电感)为例，0603零件边框1与0805零件边框2重叠；0805零件的实体3的长为L3、宽为L1，其内有两个与其相切的焊盘8，两焊盘8的内间距为L5、外间距为L4(即0805零件两管脚的内间距为L5、外间距为L4)；0603零件的实体5宽为L2，其内有两个与其相切的焊盘6，两焊盘6的内间距为L6(即0603零件两管脚的内间距为L6)。其中0805零件的实体3的尺寸大于0603零件的实体5，且焊盘8的尺寸也大于焊盘6，即L4＞L5＞L6、L1＞L2。
此种做法存在着以下缺点：在印刷电路板的布线过程中会出现很多如图1中所示的警示4，这样影响布线工程师的视觉并且增加了检查的时间；此外，当大焊盘8上盖有文字框时会影响PCB厂和生产线表面贴装技术(Surface Mounted Technology，SMT)段的制程。
为解决以上问题，人们开始尝试在布线时建立两个大焊盘，如图2所示，这样就可以随便组装需共用重叠焊盘中的任一种零件。图2中以0805零件焊盘为基准，结合0603零件两管脚的内间距，建立了两个大的方形焊盘7，两方形焊盘7的内间距为L6、外间距为L4。每个焊盘的长为(L4-L6)/2、宽为L1。因此可以在该焊盘上随意组装0805或0603零件。
但是它又存在另一缺点：由于焊盘过大，若放置0603零件，在过锡炉时因焊锡面太宽而使零件上下偏移，从而影响电路板的美观甚至导致短路。
【发明内容】
鉴于以上内容，本发明较佳实施例提供一印刷电路板重叠焊盘布线结构，其可使需使用重叠焊盘的两系列零件容易组装，且能够限制焊盘较小的零件使其不会上下偏移。
本发明揭露了一种印刷电路板重叠焊盘布线结构，该印刷电路板包括多个重叠焊盘。其中每一重叠焊盘可用于组装具有两管脚之第一零件或第二零件，所述重叠焊盘包括一主体部分及一凸出部分，该主体部分及该凸出部分均为长方形，该主体部分的长为第二零件两管脚的外间距与其内间距之差的一半，宽与第二零件实体宽度相当，该凸出部分的长为第二零件两管脚内间距与第一零件两管脚内间距之差的一半，宽与第一零件实体宽度相当。其中所述的第二零件两管脚的内间距大于第一零件两管脚的内间距，且第二零件实体宽度大于第一零件实体宽度。
利用本发明，可使零件更容易组装，且能够限制焊盘较小的零件使其不会上下偏移，从而提高零件组装的效率及质量，也为SMT段工作减少了很多负担。
【附图说明】
图1是现有的印刷电路板重叠焊盘的结构示意图。
图2是图1经改进后的重叠焊盘的结构示意图。
图3是本发明印刷电路板重叠焊盘布线结构较佳实施例的结构示意图。
【具体实施方式】
如图3所示，是本发明印刷电路板重叠焊盘布线结构较佳实施例的结构示意图。为方便说明，在此仍以0805及0603系列零件为例。其中，该结构示意图包括：0805零件边框2、0805零件的实体3及两个焊盘9。两焊盘9也是以0805零件焊盘为基准、结合0603零件两管脚内间距L6来建立的焊盘。0805零件的实体3长为L3、宽为L1；两个焊盘9的内间距为L6，外间距为L4(0805零件两管脚的外间距也为L4)；每个焊盘9包括一主体部分及一凸出部分，凸出部分为一长为L8、宽为L2的长方形；其主体部分为一长L7、宽为L1的长方形。其中，L7＝(L4-L5)/2，L8＝(L5-L6)/2这样，0805零件及0603零件均容易组装，且凸出部分限制0603零件，使它不能上下偏移从而起到固定作用。本发明之重叠焊盘还可以是弧形的。
本发明不仅适用于0805及0603系列零件，其还可适用于其它在布线时需要用到重叠焊盘的表面贴零件。

Claims (2)

1.一种印刷电路板重叠焊盘的布线结构，所述印刷电路板包括多个重叠焊盘，每一重叠焊盘可用于组装具有两管脚之第一零件或第二零件，其特征在于：所述重叠焊盘包括一主体部分及一凸出部分，该主体部分及该凸出部分均为长方形，其中：
该主体部分的长为第二零件两管脚的外间距与其内间距之差的一半，宽与第二零件实体宽度相当；
该凸出部分的长为第二零件两管脚内间距与第一零件两管脚内间距之差的一半，宽与第一零件实体宽度相当。
2.如权利要求1所述印刷电路板重叠焊盘的布线结构，其特征在于，其中所述的第二零件两管脚的内间距大于第一零件两管脚的内间距，且第二零件实体宽度大于第一零件实体宽度。
CNA2005100356163A 2005-06-28 2005-06-28 印刷电路板重叠焊盘的布线结构 Pending CN1889808A (zh)

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Application Number Priority Date Filing Date Title
CNA2005100356163A CN1889808A (zh) 2005-06-28 2005-06-28 印刷电路板重叠焊盘的布线结构
US11/472,975 US7448016B2 (en) 2005-06-28 2006-06-21 Pad layouts of a printed circuit board

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CNA2005100356163A CN1889808A (zh) 2005-06-28 2005-06-28 印刷电路板重叠焊盘的布线结构

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