CN1868073B - 电致发光显示面板 - Google Patents
电致发光显示面板 Download PDFInfo
- Publication number
- CN1868073B CN1868073B CN2004800299164A CN200480029916A CN1868073B CN 1868073 B CN1868073 B CN 1868073B CN 2004800299164 A CN2004800299164 A CN 2004800299164A CN 200480029916 A CN200480029916 A CN 200480029916A CN 1868073 B CN1868073 B CN 1868073B
- Authority
- CN
- China
- Prior art keywords
- layer
- micro
- substrate
- contact printing
- hydrophobic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000010410 layer Substances 0.000 claims description 71
- 238000000813 microcontact printing Methods 0.000 claims description 44
- 239000011241 protective layer Substances 0.000 claims description 21
- 239000004793 Polystyrene Substances 0.000 claims description 10
- 229920002125 Sokalan® Polymers 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- 239000004584 polyacrylic acid Substances 0.000 claims description 9
- 229920002223 polystyrene Polymers 0.000 claims description 9
- 238000005401 electroluminescence Methods 0.000 claims description 8
- 239000013047 polymeric layer Substances 0.000 claims description 7
- 239000000976 ink Substances 0.000 claims description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 229920000867 polyelectrolyte Polymers 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 235000014655 lactic acid Nutrition 0.000 claims description 3
- 239000004310 lactic acid Substances 0.000 claims description 3
- 229920000768 polyamine Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 238000007704 wet chemistry method Methods 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- FQFILJKFZCVHNH-UHFFFAOYSA-N tert-butyl n-[3-[(5-bromo-2-chloropyrimidin-4-yl)amino]propyl]carbamate Chemical compound CC(C)(C)OC(=O)NCCCNC1=NC(Cl)=NC=C1Br FQFILJKFZCVHNH-UHFFFAOYSA-N 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 17
- 239000007788 liquid Substances 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000004888 barrier function Effects 0.000 abstract description 2
- 208000034699 Vitreous floaters Diseases 0.000 description 32
- 239000011159 matrix material Substances 0.000 description 20
- 238000009736 wetting Methods 0.000 description 12
- 238000007639 printing Methods 0.000 description 10
- 238000013459 approach Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical compound CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003682 fluorination reaction Methods 0.000 description 3
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 239000002094 self assembled monolayer Substances 0.000 description 3
- 239000013545 self-assembled monolayer Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- PYJJCSYBSYXGQQ-UHFFFAOYSA-N trichloro(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](Cl)(Cl)Cl PYJJCSYBSYXGQQ-UHFFFAOYSA-N 0.000 description 2
- DBVGLIZLQMRBMY-UHFFFAOYSA-N 2-oxo-2-thiophen-2-ylacetaldehyde Chemical compound O=CC(=O)C1=CC=CS1 DBVGLIZLQMRBMY-UHFFFAOYSA-N 0.000 description 1
- IOVFHLJNAMPRHI-UHFFFAOYSA-N 2-oxo-2-thiophen-3-ylacetaldehyde Chemical compound O=CC(=O)C=1C=CSC=1 IOVFHLJNAMPRHI-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000003195 fascia Anatomy 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000001540 jet deposition Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03103773 | 2003-10-13 | ||
EP03103773.2 | 2003-10-13 | ||
PCT/IB2004/051993 WO2005036509A2 (en) | 2003-10-13 | 2004-10-06 | Electroluminescent display panel |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1868073A CN1868073A (zh) | 2006-11-22 |
CN1868073B true CN1868073B (zh) | 2012-05-30 |
Family
ID=34429477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800299164A Expired - Fee Related CN1868073B (zh) | 2003-10-13 | 2004-10-06 | 电致发光显示面板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070063640A1 (zh) |
EP (1) | EP1676329A2 (zh) |
JP (1) | JP2007508674A (zh) |
KR (1) | KR20070004527A (zh) |
CN (1) | CN1868073B (zh) |
TW (1) | TWI380489B (zh) |
WO (1) | WO2005036509A2 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006116584A2 (en) * | 2005-04-27 | 2006-11-02 | Dynamic Organic Light, Inc. | Light emitting polymer devices using self-assembled monolayer structures |
EP1729358B1 (en) * | 2005-06-02 | 2016-03-02 | Samsung SDI Germany GmbH | Substrate for inkjet printing |
JP4745062B2 (ja) | 2005-06-02 | 2011-08-10 | 三星モバイルディスプレイ株式會社 | 平板表示装置及びその製造方法 |
GB2430547A (en) * | 2005-09-20 | 2007-03-28 | Seiko Epson Corp | A method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface |
GB2437328A (en) * | 2006-04-10 | 2007-10-24 | Cambridge Display Tech Ltd | Electric devices and methods of manufacture |
KR100848339B1 (ko) * | 2007-01-10 | 2008-07-25 | 삼성에스디아이 주식회사 | 도너기판 및 그를 이용한 유기전계발광표시장치의 제조방법 |
KR101326127B1 (ko) | 2007-09-05 | 2013-11-06 | 재단법인서울대학교산학협력재단 | 패턴 어레이 형성 방법 및 이를 사용하여 형성된 패턴어레이를 포함하는 유기 소자 |
KR101107160B1 (ko) | 2009-07-10 | 2012-01-25 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
JP2012238753A (ja) * | 2011-05-12 | 2012-12-06 | Sony Corp | 薄膜素子組立体 |
KR101737757B1 (ko) * | 2016-03-04 | 2017-05-18 | 주식회사 소프스톤 | 투습방지를 위한 기능성 하이브리드 코팅막의 형성방법 및 이를 이용한 유기 전자소자의 제조방법 |
CN108075045A (zh) * | 2016-11-16 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | 用于印刷oled像素的限定结构及其制备方法 |
CN110767681B (zh) * | 2018-10-31 | 2022-12-13 | 昆山国显光电有限公司 | 显示屏及显示终端 |
CN109994532B (zh) * | 2019-04-08 | 2021-04-27 | 京东方科技集团股份有限公司 | 像素界定层及其制备方法和包含它的显示基板和显示装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1425204A (zh) * | 1999-12-21 | 2003-06-18 | 造型逻辑有限公司 | 喷墨制作的集成电路 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6586763B2 (en) * | 1996-06-25 | 2003-07-01 | Northwestern University | Organic light-emitting diodes and methods for assembly and emission control |
US6166439A (en) * | 1997-12-30 | 2000-12-26 | Advanced Micro Devices, Inc. | Low dielectric constant material and method of application to isolate conductive lines |
BR0016643A (pt) * | 1999-12-21 | 2003-01-07 | Plastic Logic Ltd | Método para formar sobre um substrativo um dispositivo eletrônico, e, circuito lógico e dispositivo de exibição ou de memória. |
US7163712B2 (en) * | 2000-03-03 | 2007-01-16 | Duke University | Microstamping activated polymer surfaces |
GB0024294D0 (en) * | 2000-10-04 | 2000-11-15 | Univ Cambridge Tech | Solid state embossing of polymer devices |
US7524528B2 (en) * | 2001-10-05 | 2009-04-28 | Cabot Corporation | Precursor compositions and methods for the deposition of passive electrical components on a substrate |
AU2003217184A1 (en) * | 2002-01-11 | 2003-09-02 | Massachusetts Institute Of Technology | Microcontact printing |
GB0207134D0 (en) * | 2002-03-27 | 2002-05-08 | Cambridge Display Tech Ltd | Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained |
KR100437533B1 (ko) * | 2002-05-29 | 2004-06-30 | 엘지.필립스 엘시디 주식회사 | 액티브 매트릭스형 유기전계발광 소자 및 그의 제조방법 |
GB0218202D0 (en) * | 2002-08-06 | 2002-09-11 | Avecia Ltd | Organic light emitting diodes |
AU2003260959A1 (en) * | 2002-09-11 | 2004-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting apparatus and fabrication method of the same |
JP3966252B2 (ja) * | 2003-08-08 | 2007-08-29 | セイコーエプソン株式会社 | 有機el装置とその製造方法、及び電子機器 |
KR20050068860A (ko) * | 2003-12-30 | 2005-07-05 | 엘지.필립스 엘시디 주식회사 | 듀얼 플레이트 유기전계 발광소자용 상부기판 및 그의제조방법 |
-
2004
- 2004-10-06 KR KR1020067006862A patent/KR20070004527A/ko not_active Application Discontinuation
- 2004-10-06 JP JP2006534868A patent/JP2007508674A/ja not_active Withdrawn
- 2004-10-06 US US10/575,430 patent/US20070063640A1/en not_active Abandoned
- 2004-10-06 CN CN2004800299164A patent/CN1868073B/zh not_active Expired - Fee Related
- 2004-10-06 EP EP04770184A patent/EP1676329A2/en not_active Withdrawn
- 2004-10-06 WO PCT/IB2004/051993 patent/WO2005036509A2/en not_active Application Discontinuation
- 2004-10-08 TW TW093130614A patent/TWI380489B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1425204A (zh) * | 1999-12-21 | 2003-06-18 | 造型逻辑有限公司 | 喷墨制作的集成电路 |
Also Published As
Publication number | Publication date |
---|---|
US20070063640A1 (en) | 2007-03-22 |
CN1868073A (zh) | 2006-11-22 |
JP2007508674A (ja) | 2007-04-05 |
EP1676329A2 (en) | 2006-07-05 |
TW200532958A (en) | 2005-10-01 |
WO2005036509A3 (en) | 2005-07-14 |
TWI380489B (en) | 2012-12-21 |
WO2005036509A2 (en) | 2005-04-21 |
KR20070004527A (ko) | 2007-01-09 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: TPO DISPLAYS CORP. Free format text: FORMER OWNER: KONINKLIJKE PHILIPS ELECTRONICS N.V. Effective date: 20080704 |
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Effective date of registration: 20080704 Address after: Science Park, Taiwan, China Miaoli County, Hsinchu Province town, No. 12 Middle Road Applicant after: Tongbao Optoelectronics Co., Ltd. Address before: Holland Ian Deho Finn Applicant before: Koninklijke Philips Electronics N.V. |
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Open date: 20061122 |
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Correction item: Rejection of patent application Correct: Dismiss False: Reject Number: 32 Volume: 26 |
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Free format text: CORRECT: PATENT APPLICATION REJECTION AFTER THE ANNOUNCEMENT; FROM: REJECTION TO: CANCEL REJECTION |
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Owner name: QIMEI ELECTRONIC CO LTD Free format text: FORMER OWNER: TONGBAO OPTOELECTRONICS CO., LTD. Effective date: 20110418 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: NO. 12, KEZHONG ROAD, ZHU'NAN TOWN, MIAOLI COUNTY, HSINCHU SCIENCE PARK, TAIWAN, CHINA TO: MIAOLI COUNTY, HSINCHU SCIENCE AND INDUSTRIAL PARK, TAIWAN PROVINCE |
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Effective date of registration: 20110418 Address after: Hsinchu science industry zone, Taiwan, Miaoli Province Applicant after: Chimei Optoelectronics Co., Ltd. Address before: Science Park, Taiwan, China Miaoli County, Hsinchu Province town, No. 12 Middle Road Applicant before: Tongbao Optoelectronics Co., Ltd. |
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