CN1866415A - Chip resistor - Google Patents
Chip resistor Download PDFInfo
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- CN1866415A CN1866415A CN 200610080266 CN200610080266A CN1866415A CN 1866415 A CN1866415 A CN 1866415A CN 200610080266 CN200610080266 CN 200610080266 CN 200610080266 A CN200610080266 A CN 200610080266A CN 1866415 A CN1866415 A CN 1866415A
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Abstract
The provided high-reliable chip resistor (11) comprises: a ceramic base (12) with a resistance body (13) and a couple of surface electrodes (14) and protective film (15, 16); under (12), a virtual electrode (17) independently to electrode (18), and a couple of back electrodes (18); along the length direction of (12), a bridge surface electrode (14) and a couple end electrodes (19); and a dual-layer coated layer (20, 21) to cover electrodes (14, 17, 18, 19).
Description
Technical field
The present invention relates to chip resister, particularly in the reflow soldering operation of using solder(ing) paste, be assembled in the square chip resister on the circuit substrate.
Background technology
Fig. 7 is the cutaway view of the square chip resister known to general in the past, and this chip resister 1 comprises: the insulated substrate 2 that is made of ceramic substrate etc.; Be arranged on the top resistive element 3 and a pair of surface electrode 4 of this insulated substrate 2; The glass coating 5 and the cover layer 6 that work as the diaphragm of resistive element 3; Be arranged on the following a pair of backplate 7 of insulated substrate 2; Be arranged on a pair of end electrode 8 of side of the length direction both end sides of insulated substrate 2; Coating 9,10 (is for example opened flat 9-246006 communique (the 2nd page, Fig. 5)) with reference to patent documentation 1-spy.A pair of surface electrode 4 is formed on the both ends position overlapped with resistive element 3, is formed with backplate 7 with the roughly corresponding position of each surface electrode 4 below insulated substrate 2.Surface electrode 4 and backplate 7 be by end electrode 8 bridge joints, is made of the underlayer electrode layer of chip resister these surface electrodes 4 and backplate 7 and end electrode 8.This underlayer electrode layer is covered by the coating of the double-layer structure of nickel coating 9 and scolding tin (or tin) coating 10 through electroplating processes.And these coating 9,10 can prevent electrode damage or improve the reliability of welding.
The assembling sequence of such chip resister 1 is as follows, at first, applies solder(ing) paste on the pad that is located on the circuit substrate, by place the backplate 7 of chip resister 1, temporary fixed chip resister 1 on the assigned position of circuit substrate on this solder(ing) paste.Secondly, this circuit substrate is transported to reflow ovens melts solder(ing) paste, again with the solder(ing) paste cooling curing, thereby weld corresponding bonding pad and backplate 7, thereby chip resister 1 is assembled on the circuit substrate.
Yet, above-mentioned chip resister 1 in the past takes place easily, the solder(ing) paste of molten condition in the reflow soldering operation in when assembling because surface tension becomes that solder splashes breaks away from pad, this solder splashes the flux of self attached on the side of the length direction of insulated substrate 2 and residual phenomenon, such solder splashes is also referred to as the side solder splashes, might bad influence be arranged to the wiring figure of circuit substrate.Promptly, if carry out the assembling of goods under attached to the state on the side of insulated substrate 2 at solder splashes, then, small vibration and impact make risk of short-circuits increasing between the wiring figure adjacent on the circuit substrate owing to coming off solder splashes, thereby on the narrow High Density Packaging in recent years of the spacing between the wiring figure, reliability will be obviously impaired.And the main cause that produces of solder splashes relates to many aspects such as the printing condition, counterflow condition of size, the solder(ing) paste of pad or backplate, the therefore generation that is not easy to eradicate solder splashes.Also have,, can reduce the quantity of residual solder splashes, make the numerous and diverse removal operation of chip resister needs that does not have residual solder splashes, thereby total cost will increase substantially though wait processing by behind the assembling chip resistor, cleaning.
Have again, when above-mentioned chip resister 1 in the past mounts on the circuit substrate by automatic placement machine, the down maneuver at the length direction both ends of insulated substrate 2 by the restriction of backplate or pad after, the length direction central portion of insulated substrate 2 towards below circuit substrate between the gap be pressed into forcefully, thereby the big shear stress of effect on this insulated substrate 2, when therefore insulated substrate 2 uses general ceramic substrate, the danger that side cracks below insulated substrate 2 is arranged.
Summary of the invention
The present invention its objective is the chip resister of the high reliability of the crackle that a kind of insulated substrate that does not have residual solder splashes and can prevent from might produce after the reflow soldering operation is provided in view of the actual conditions of such conventional art and the scheme that proposes when mounting.
In order to achieve the above object, chip resister of the present invention has: square insulated substrate; Be arranged on the lip-deep resistive element of this insulated substrate; The a pair of surface electrode that on the both ends position overlapped of the surface of above-mentioned insulated substrate and above-mentioned resistive element, is provided with; The a pair of backplate that on the back side of above-mentioned insulated substrate and the roughly corresponding position of above-mentioned surface electrode, is provided with; The above-mentioned surface electrode of bridge joint that on the side of the length direction both end sides of above-mentioned insulated substrate, is provided with and a pair of end electrode of above-mentioned backplate; And the coating that covers above-mentioned surface electrode and above-mentioned backplate and above-mentioned end electrode, be provided with on the back side of above-mentioned insulated substrate between above-mentioned two backplates and with this backplate dummy electrodes independently on electric, this dummy electrodes covers with above-mentioned coating.
According to such structure, if the solder splashes that produces in the reflow soldering operation during assembling is suspended near the side of the length direction of insulated substrate, then its solder splashes is adsorbed onto on the dummy electrodes that is located at the insulated substrate back side, thereby the solder splashes residual possibility after assembling that is adsorbed on the insulated substrate will disappear.So this chip resister can not cause short trouble by solder splashes.And, because dummy electrodes is located between a pair of backplate, thereby when the down maneuver at the length direction both ends of insulated substrate was limited by backplate or pad when mounting, the down maneuver of the length direction central portion of insulated substrate was limited by dummy electrodes.Therefore, this chip resister is mounting the Shi Buhui shear stress big to the insulated substrate effect, even insulated substrate is general ceramic substrate, it is also little that risk of crack takes place.
In said structure, preferably the material and the thickness of dummy electrodes are identical with backplate, and dummy electrodes and backplate can form together and can not increase operation quantity thus, therefore can avoid the raising of cost.
And, in said structure, preferably dummy electrodes is located at on the two sides position adjacent of the length direction of insulated substrate, then easily solder splashes is adsorbed onto on the dummy electrodes.In this case, when if dummy electrodes is positioned at the length direction central portion of insulated substrate, this dummy electrodes forms insulated substrate along the transversal band shape of Width, then dummy electrodes will be positioned at from the equidistant position of a pair of backplate, when therefore adsorbing solder splashes easily, can reduce the shear stress when mounting.
The present invention has following effect.
Chip resister of the present invention can adsorb the solder splashes that produces in the reflow soldering operation with dummy electrodes, thus can not exist solder splashes to be adsorbed onto on the insulated substrate and after assembling residual phenomenon, so can not cause short trouble by solder splashes.And, the dummy electrodes of this chip resister is located between a pair of backplate, when mounting, act on shear stress on the insulated substrate because the existence of dummy electrodes and reducing significantly, even thereby insulated substrate be ceramic substrate, it is also little that risk of crack takes place when mounting.
Description of drawings
Fig. 1 is the cutaway view of the chip resister of embodiments of the present invention example.
Fig. 2 is the upward view of chip resister shown in Figure 1.
Fig. 3 is the manufacturing procedure picture of chip resister shown in Figure 1.
Fig. 4 is the manufacturing procedure picture of chip resister shown in Figure 1.
Fig. 5 is the cutaway view that expression is mounted on chip resister shown in Figure 1 state on the circuit substrate.
Fig. 6 is the upward view of the chip resister of other execution mode example of the present invention.
Fig. 7 is the cutaway view of chip resister of example in the past.
Among the figure:
11,22-chip resister; 12-ceramic substrate (insulated substrate); The 12a-side; The 13-resistive element; The 14-surface electrode; The 15-glass coating; The 16-cover layer; 17,17a, 17b-dummy electrodes; The 18-backplate; The 19-end electrode; 20,21-coating; The 30-circuit substrate; The 31-pad; The 32-solder(ing) paste; The 33-protective layer.
Embodiment
With reference to accompanying drawing the invention execution mode is described, Fig. 1 is the cutaway view of the chip resister of embodiments of the present invention, Fig. 2 is the upward view of this chip resister, Fig. 3 and Fig. 4 are the manufacturing procedure pictures of this chip resister, and Fig. 5 is the cutaway view that expression is mounted on this chip resister the state on the circuit substrate.
The chip resister 11 of Figure 1 and Figure 2 comprises: square ceramic substrate 12; Be located at the top resistive element 13 and a pair of surface electrode 14 of this ceramic substrate 12; The glass coating 15 and the cover layer 16 that work as the diaphragm of resistive element 13; Be located at the following dummy electrodes 17 and a pair of backplate 18 of ceramic substrate 12; Be located at a pair of end electrode 19 of side of the length direction both end sides of ceramic substrate 12; Nickel coating 20 and tin coating 21.
Below the structure of the each several part of chip resister 11 is elaborated, resistive element 13 is made of ruthenium-oxide etc., after these resistance 13 usefulness glass coatings 15 are covered, is formed for adjusting as required the adjustment groove of resistance value.Cover layer 16 is that resin etc. constitutes by epoxy.Surface electrode 14 and backplate 18 and end electrode 19 constitute the underlayer electrode layer of chip resister 11, on ceramic substrate 12 and on the both ends position overlapped of resistance 13, be formed with a pair of surface electrode 14, below ceramic substrate 12 with on the roughly corresponding position of two surface electrodes 14, be formed with backplate 18 simultaneously.After this underlayer electrode layer and dummy electrodes 17 electroplating processes, covered by the coating of the double-layer structure of nickel coating 20 and tin coating 21.These coating 20,21 can prevent electrode damage or improve the reliability of welding, scolding tin coating also can be set replace tin coating 21.
The chip resister 11 of this structure is made in the following order.And in the manufacturing procedure picture of Fig. 3 and Fig. 4, only illustrate a chip area, but in fact a plurality of chip resisters are made together, therefore (not shown) is provided with a plurality of chip areas on significantly substrate described later, with this significantly substrate be divided on the short palisade substrate (not shown) of short palisade and also be provided with a plurality of chip areas.
At first, shown in Fig. 3 (a), preparation can obtain the significantly substrate of a plurality of ceramic substrates 12.Then, shown in Fig. 3 (b), by this significantly above the substrate and below printing Ag cream (or Ag-Pd cream) and heat hardening, form surface electrode 14 and dummy electrodes 17 and backplate 18 at each chip area.Here, which forming earlier in the surface electrode 14 of upper face side and the dummy electrodes 17 of following side and the backplate 18 can, surface electrode 14 by rectangular be arranged in substrate significantly above, dummy electrodes 17 and backplate 18 also by rectangular be arranged in substrate significantly below.
Then, shown in Fig. 3 (c), upper face side printing ruthenium-oxide constant resistance cream and heat hardening by at above-mentioned significantly substrate form resistive element 13 at each chip area.In addition, in present embodiment example illustrated forming the situations that surface electrode 14 backs form resistive elements 13, but in contrast form resistive element 13 backs form backplates 14 also can, the both ends of resistive element 13 are connected on the adjacent surface electrode 14 just passable in a word.
Then, shown in Fig. 3 (d), form glass coating 15 by printed glass cream and heat hardening in order to cover each resistance 13.Afterwards, adjust the resistance value of resistance 13 by carrying out laser trimming as required.And, shown in Fig. 3 (e),,, form cover layer 16 by resin plaster and heat hardenings such as coating epoxies for cover glass coating 15.
Operation so far is the processing together to the significantly substrate of getting a plurality of usefulness, by the square cut-out or the significantly short palisade of substrate division processing one-tenth that ruptures, obtains being provided with the short palisade substrate of a plurality of chip areas in next operation.Then, shown in Fig. 4 (a), by as this weak point palisade substrate of the non-individual body of a plurality of ceramic substrates 12 expose on the end face coating Ag cream (or Ag-Pd cream) and heat hardening forms end electrode 19, by this end electrode 19 bridge surface electrodes 14 and backplate 18.
Afterwards, above-mentioned short palisade substrate by square processing or fracture and division processing becomes each chip monomer (ceramic substrate 12), is formed two- layer coating 20,21 by applying to electroplate on each chip monomer.That is, at first shown in Fig. 4 (b), behind surface electrode 14, end electrode 19, dummy electrodes 17 and backplate 18 adhesion nickel coatings 20, this nickel coating 20 is adhered to tin (or scolding tin) coating 21, finish chip resister 11 as shown in Figure 1 thus.
The chip resister 11 of manufacturing as shown in Figure 5, after passing through automatic placement machine (not shown) pasting chip resistor 11 on the assigned position on the circuit substrate 30, is transported to reflow ovens (not shown) with this circuit substrate 30 and welds when assembling like this.That is, at first on the pad on the assembling face that is arranged on circuit substrate 30 31, apply solder(ing) paste 32, by on this solder(ing) paste 32, placing the backplate 18 of chip resister 11, the temporary fixed chip resister 11 of the assigned position on circuit substrate 30.At this moment, the dummy electrodes 17 of chip resister 11 is relative with protective layer 33 on the assembling face that is located at circuit substrate 30, covers the coating 20,21 and the gap between the protective layer 33 and small of dummy electrodes 17.Then, by this circuit substrate 30 being transported to reflow ovens fusion weld tin cream 32 and cooling curing fusion scolding tin, weld corresponding bonding pad 31 and backplate 18, thereby chip resister 11 is assembled on the circuit substrate 30.
Like this, in the chip resister 11 of present embodiment example, below ceramic substrate 12, be provided with and backplate 18 dummy electrodes 17 independently on electric, this dummy electrodes 17 is adjacent with the lower end along the side 12a of the length direction of ceramic substrate 12, therefore the solder splashes that produces in the reflow soldering operation when assembling is if swim near the 12a of the side of ceramic substrate 12, and then this solder splashes is adsorbed by dummy electrodes 17.In other words, can be not residual after assembling attached to the solder splashes on the side 12a of ceramic substrate 12 (side solder splashes), so this chip resister 11 can not cause short trouble by solder splashes, even promote miniaturization also can guarantee high reliability.
And; the dummy electrodes 17 of this chip resister 11 is located between a pair of backplate 18; so the down maneuver at the length direction both ends of ceramic substrate 12 is limited by backplate 18 or pad 31 when mounting; simultaneously, the down maneuver of the length direction central portion of ceramic substrate 12 is limited by dummy electrodes 17 or protective layer 33.In other words, can be when mounting circuit substrate 30 on by automatic placement machine this chip resister 11 to the big shear stress of ceramic substrate 12 effect, so that ceramic substrate 12 cracks when mounting is dangerous little, also can improve reliability in this.
In addition, in the present embodiment example, dummy electrodes 17 and backplate 18 are formed together, compare the different dummy electrodes of material and thickness with backplate but also can form separately.Just,, then need not increase operation quantity if dummy electrodes 17 and backplate 18 are formed together as the present embodiment example, thereby the raising of avoidable cost.
Also have, as present embodiment, dummy electrodes 17 preferably is located at the length direction central portion of ceramic substrate 12, and dummy electrodes 17 will be positioned at from a pair of backplate 18 equidistant positions thus, so when dummy electrodes 17 adsorbs solder splashes easily, when mounting, reduce shear stress easily.
Have, as the present embodiment example, preferably dummy electrodes 17 forms along the transversal band shape of the Width of ceramic substrate 12 again, even form dummy electrodes 17 because also print easily under the situation of chip resister 11 miniaturizations.But chip resister as shown in Figure 6 22, also can from the position that backplate 18 is isolated a pair of dummy electrodes 17a, 17b be set at the length direction central portion below the ceramic substrate 12, make dummy electrodes 17a and a side 12a adjacent, make dummy electrodes 17b adjacent with another side 12a along the length direction of ceramic substrate 12.
Claims (4)
1. a chip resister has: square insulated substrate; Be arranged on the lip-deep resistive element of this insulated substrate; The a pair of surface electrode that on the both ends position overlapped of the surface of above-mentioned insulated substrate and above-mentioned resistive element, is provided with; The a pair of backplate that on the back side of above-mentioned insulated substrate and the roughly corresponding position of above-mentioned surface electrode, is provided with; The above-mentioned surface electrode of bridge joint that on the side of the length direction both end sides of above-mentioned insulated substrate, is provided with and a pair of end electrode of above-mentioned backplate; And, cover the coating of above-mentioned surface electrode and above-mentioned backplate and above-mentioned end electrode, it is characterized in that:
Be provided with at the back side of above-mentioned insulated substrate between above-mentioned two backplates with this backplate dummy electrodes independently on electric, this dummy electrodes covers with above-mentioned coating.
2. chip resister according to claim 1 is characterized in that: the material of above-mentioned dummy electrodes and thickness are identical with above-mentioned backplate.
3. chip resister according to claim 1 and 2 is characterized in that: above-mentioned dummy electrodes is arranged on and two sides position adjacent along the length direction of above-mentioned insulated substrate.
4. chip resister according to claim 3 is characterized in that: when above-mentioned dummy electrodes was positioned at the length direction central portion of above-mentioned insulated substrate, this dummy electrodes formed above-mentioned insulated substrate along the transversal band shape of Width.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005142802 | 2005-05-16 | ||
| JP2005142802A JP2006319260A (en) | 2005-05-16 | 2005-05-16 | Chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1866415A true CN1866415A (en) | 2006-11-22 |
Family
ID=37425405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610080266 Pending CN1866415A (en) | 2005-05-16 | 2006-05-15 | Chip resistor |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006319260A (en) |
| CN (1) | CN1866415A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990689B (en) * | 2008-04-18 | 2013-01-02 | E.I.内穆尔杜邦公司 | Surface-modified ruthenium oxide conductive material, lead-free glass(es), thick film resistor paste(s), and devices made therefrom |
| CN102869196A (en) * | 2012-09-24 | 2013-01-09 | 广东威创视讯科技股份有限公司 | Method for preventing solder ball of PCB (printed circuit board) heat radiation pad and PCB heat radiation device with function of solder ball prevention |
| US8519277B2 (en) | 2009-08-25 | 2013-08-27 | Cyntec Co., Ltd. | Surface mounted electronic component |
| CN106898444A (en) * | 2015-12-18 | 2017-06-27 | 三星电机株式会社 | Resistor element and the plate with the resistor element |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552566Y2 (en) * | 1972-12-04 | 1980-01-23 | ||
| JPH0239401A (en) * | 1988-07-28 | 1990-02-08 | Fujitsu Ltd | Chip resistor |
| JPH02309602A (en) * | 1989-05-24 | 1990-12-25 | Matsushita Electric Ind Co Ltd | Rectangular chip resistor |
| JP4828710B2 (en) * | 2001-03-21 | 2011-11-30 | 釜屋電機株式会社 | Chip resistor and manufacturing method thereof |
-
2005
- 2005-05-16 JP JP2005142802A patent/JP2006319260A/en active Pending
-
2006
- 2006-05-15 CN CN 200610080266 patent/CN1866415A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990689B (en) * | 2008-04-18 | 2013-01-02 | E.I.内穆尔杜邦公司 | Surface-modified ruthenium oxide conductive material, lead-free glass(es), thick film resistor paste(s), and devices made therefrom |
| US8519277B2 (en) | 2009-08-25 | 2013-08-27 | Cyntec Co., Ltd. | Surface mounted electronic component |
| TWI417016B (en) * | 2009-08-25 | 2013-11-21 | Cyntec Co Ltd | Surface mounted electronic component |
| CN102869196A (en) * | 2012-09-24 | 2013-01-09 | 广东威创视讯科技股份有限公司 | Method for preventing solder ball of PCB (printed circuit board) heat radiation pad and PCB heat radiation device with function of solder ball prevention |
| CN102869196B (en) * | 2012-09-24 | 2016-04-13 | 广东威创视讯科技股份有限公司 | The method of the anti-tin sweat(ing) of PCB thermal pad and the PCB heat abstractor of anti-tin sweat(ing) |
| CN106898444A (en) * | 2015-12-18 | 2017-06-27 | 三星电机株式会社 | Resistor element and the plate with the resistor element |
| CN106898444B (en) * | 2015-12-18 | 2020-09-04 | 三星电机株式会社 | Resistor element and board having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006319260A (en) | 2006-11-24 |
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Open date: 20061122 |