CN1848405A - Wafer lifting device and lifting method - Google Patents
Wafer lifting device and lifting method Download PDFInfo
- Publication number
- CN1848405A CN1848405A CN 200510126436 CN200510126436A CN1848405A CN 1848405 A CN1848405 A CN 1848405A CN 200510126436 CN200510126436 CN 200510126436 CN 200510126436 A CN200510126436 A CN 200510126436A CN 1848405 A CN1848405 A CN 1848405A
- Authority
- CN
- China
- Prior art keywords
- lifting
- wafer
- electric charge
- thimble
- yoke
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to the field of microelectronic technology. The invented wafer lifting device includes lifting yoke and several lifting pins fixed on the lifting yoke, in which on the lifting yoke is set a discharge circuit electrically-connected with earth, on said circuit a charge detection device is set. Besides, said invention also provides the working principle of said wafer lifting device, and also provides the concrete steps of said lifting method.
Description
Technical field
The present invention relates to the semiconductor processing equipment in the microelectronics technology, particularly after etching technics is finished with semiconductor wafer chip lifting apparatus of lifting upwards in the electrostatic chuck; The invention still further relates to the lifting method that uses this device.
Background technology
In semiconductor fabrication processes, the processing of wafer is normally carried out in process cavity.Wafer is delivered on the electrostatic chuck of chamber by transport sector, there is electrode to insert DC power supply in the chuck, above wafer is fixed in by electrostatic interaction by chuck in the course of processing, after the completion of processing, wafer is discharged earlier, by lifting device wafer is risen then, manipulator enters chamber wafer is taken away, prepares next wafer of processing then.
Fig. 1 is existing a kind of chip lifting apparatus, and its structure comprises lifting yoke 1 and the some thimbles 2 that are fixed on the lifting yoke 1, and the length of these some thimbles 2 is greater than the thickness of electrostatic chuck 6, and it passes the through hole on the electrostatic chuck 6, and top ends contacts with wafer 7.After machining, earlier wafer 7 is discharged, then lifting yoke 1 and some thimbles 2 promote wafer 7 is raised up to proper height from electrostatic chuck 6 by air pressure, are taken away by manipulator then.This chip lifting apparatus is the unipolarity chuck, finishes about time that needs 120 seconds of the discharge of residual charge on the wafer 7, and discharge time is long, is unfavorable for shortening the process-cycle and enhances productivity.And do not have checkout gear that whether wafer is bled off whole electric charges to detect.If wafer 7 not discharge also has enough residual charges fully,, will clash into and cause damage still being adsorbed on wafer on the chuck then when the moment that lifting device lifts wafer; Discharged fully in order to ensure wafer, can only time expand, reduced production efficiency.
Summary of the invention
(1) technical problem that will solve
The objective of the invention is at above-mentioned the deficiencies in the prior art, provide a kind of and can detect electric charge and the high chip lifting apparatus of efficient on the wafer;
Another object of the present invention provides a kind of lifting method that uses this device.
(2) technical scheme
For achieving the above object, the present invention adopts following technical scheme:
Chip lifting apparatus of the present invention comprises lifting yoke and some thimbles that are fixed on the lifting yoke, and wherein lifting yoke is provided with the discharge circuit that is electrically connected with the earth, and this circuit is provided with electric charge detecting apparatus.
Wherein said electric charge detecting apparatus is a transducer.
Wherein said lifting yoke bottom central authorities are connected with insulator, be connected with guide post on the insulator, the guiding rod end is connected with stepping motor, is electrically connected with industrial computer between stepping motor and the electric charge detecting apparatus, and wherein industrial computer is used to receive signal and the control step motor that electric charge detecting apparatus transmits.
Wherein said thimble top end face is hemisphere.
Wherein said thimble is set with bellows outward, and the top ends of described bellows is fixedlyed connected with electrostatic chuck, fixedlys connected with lifting yoke in the bottom.
Wherein said thimble is made by highly elastic material or marmem.
Wafer lifting method of the present invention comprises the steps:
A, stepping motor stop driving when rotating thimble upwards being lifted between wafer bottom face and the electrostatic chuck top end face distance 0.1～0.5mm, and the switch of opening in the discharge circuit carries out discharge process to wafer;
B, after electric charge detecting apparatus monitors the wafer discharge off, send a signal to industrial computer, continue the lifting wafer to the height that needs by industrial computer control step motor then, by manipulator wafer is taken away at last.
Stepping motor rotates when upwards being lifted between wafer bottom face and the electrostatic chuck top end face thimble apart from 0.2mm and stops operating in the wherein said steps A.
(3) beneficial effect
The advantage and the good effect of chip lifting apparatus of the present invention are: among the present invention, since with discharge circuit that the earth is connected in be provided with electric charge detecting apparatus, whether its electric charge that can detect on the wafer discharges fully, therefore in the time of can guaranteeing that wafer carried out lifting, wafer is not charged fully, avoided therefore damaging wafer, improved functional reliability; Can also when discharge is complete, carry out the lifting action at once simultaneously, improve production efficiency.
The advantage and the good effect of wafer lifting method of the present invention are: among the present invention, take the mode of substep lifting wafer: the first step little height that rises, and thimble fully discharges to wafer; Second step rose to wafer and fetches height.In this process, can guarantee wafer discharge fully, and electronic action relaxes, can not cause the mistake bump and damage wafer.
Description of drawings
Fig. 1 is the structural representation of existing chip lifting apparatus;
The structural representation of Fig. 2 chip lifting apparatus of the present invention.
Among the figure: 1. lifting yoke; 2. thimble; 3. guide post; 4. electric charge detecting apparatus; 5. bellows; 6. electrostatic chuck; 7. wafer.
Embodiment
Below in conjunction with accompanying drawing, further describe the embodiment of chip lifting apparatus of the present invention, but be not used for limiting protection scope of the present invention.
Referring to Fig. 2.Chip lifting apparatus of the present invention comprises lifting yoke 1 and the some thimbles 2 that are fixed on the lifting yoke 1, and thimble 2 top end faces are hemisphere, damage wafers when this kind top end face can prevent the jack-up wafer.Wherein lifting yoke 1 is provided with the discharge circuit that is electrically connected with the earth, and this circuit is provided with transducer 4.Lifting yoke 1 bottom central authorities are connected with insulator, be connected with guide post 3 on the insulator, guide post 3 ends are connected with stepping motor, are electrically connected with industrial computer between stepping motor and the electric charge detecting apparatus 4, wherein industrial computer is used to receive the signal that electric charge detecting apparatus 4 transmits, and the control step motor.Insulator is isolated discharge circuit and other parts.Be set with bellows 5 outside the thimble 2, the top ends of bellows 5 is fixedlyed connected with electrostatic chuck, and fixedlying connected with lifting yoke 1 in the bottom, has so just guaranteed the isolation of vacuum process cavity and atmosphere, and bellows can stretch with the mobile of lifting yoke.Thimble 2 is made by highly elastic material or marmem.When the lifting wafer, can bear sizable bending force like this and not produce permanent deformation, and marmem can become straight with it by heating.
Transducer 4 also can be replaced by the electric charge detecting apparatus of other types.Industrial computer has CPU, mainboard, AO integrated circuit board in it.
Wafer lifting method of the present invention comprises the steps:
A, thimble 2 is extend in the hole of electrostatic chuck;
B, stepping motor rotate when upwards being lifted between wafer bottom face and the electrostatic chuck top end face thimble 2 apart from 0.2mm and stop driving, and the switch of opening in the discharge circuit carries out discharge process to wafer; Wherein said distance all is feasible at 0.1～0.5mm, in principle can be as far as possible little, and be prerequisite to guarantee not damage wafers and fully to contact with wafer;
C, lifting yoke are electrically connected with the earth, with thimble with after wafer contacts, by thimble and lifting yoke it is discharged, after transducer 4 monitors the wafer discharge off, send a signal to industrial computer, industrial computer CPU carries out computing and obtains required voltage numerical value according to voltage, thimble move distance, motor speed equal proportion relation, and the AO integrated circuit board exports this voltage value to stepping motor, the control step motor to the height that needs, is taken by manipulator wafer lift away at last with wafer.
More than be preferred forms of the present invention, according to content disclosed by the invention, some identical, replacement schemes that those of ordinary skill in the art can expect apparently all should fall into the scope of protection of the invention.
Claims (8)
1. chip lifting apparatus comprises lifting yoke (1) and is fixed on some thimbles (2) on the lifting yoke (1) that it is characterized in that lifting yoke (1) is provided with the discharge circuit that is electrically connected with the earth, this circuit is provided with electric charge detecting apparatus (4).
2. chip lifting apparatus according to claim 1 is characterized in that described electric charge detecting apparatus (4) is a transducer.
3. chip lifting apparatus according to claim 1, it is characterized in that described lifting yoke (1) bottom central authorities are connected with insulator, be connected with guide post (3) on the insulator, guide post (3) end is connected with stepping motor, stepping motor and electric charge detecting apparatus are electrically connected with industrial computer between (4), and wherein industrial computer is used to receive signal and the control step motor that electric charge detecting apparatus (4) transmits.
4. chip lifting apparatus according to claim 1 is characterized in that described thimble (2) top end face is hemisphere.
5. chip lifting apparatus according to claim 1 is characterized in that being set with bellows (5) outside the described thimble (2), and the top ends of described bellows (5) is fixedlyed connected with electrostatic chuck, fixedlys connected with lifting yoke (1) in the bottom.
6. according to the arbitrary described chip lifting apparatus of claim 1～5, it is characterized in that described thimble (2) made by highly elastic material or marmem.
7. a wafer lifting method that uses chip lifting apparatus as claimed in claim 3 is characterized in that comprising the steps:
A, stepping motor stop driving when rotating thimble (2) upwards being lifted between wafer bottom face and the electrostatic chuck top end face distance 0.1～0.5mm, and the switch of opening in the discharge circuit carries out discharge process to wafer;
B, after electric charge detecting apparatus (4) monitors the wafer discharge off, send a signal to industrial computer, continue the lifting wafer to the height that needs by industrial computer control step motor then, by manipulator wafer is taken away at last.
8. wafer lifting method according to claim 7 is characterized in that in the described steps A that stepping motor rotates when upwards being lifted between wafer bottom face and the electrostatic chuck top end face thimble (2) apart from 0.2mm to stop operating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101264366A CN100423224C (en) | 2005-12-09 | 2005-12-09 | Wafer lifting device and lifting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101264366A CN100423224C (en) | 2005-12-09 | 2005-12-09 | Wafer lifting device and lifting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1848405A true CN1848405A (en) | 2006-10-18 |
| CN100423224C CN100423224C (en) | 2008-10-01 |
Family
ID=37077897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101264366A Active CN100423224C (en) | 2005-12-09 | 2005-12-09 | Wafer lifting device and lifting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100423224C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101916739A (en) * | 2010-07-13 | 2010-12-15 | 上海技美电子科技有限公司 | Wafer carrying device |
| CN102299090A (en) * | 2010-06-25 | 2011-12-28 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Thimble and plasma etching device with thimble |
| CN104347358A (en) * | 2014-09-15 | 2015-02-11 | 上海华力微电子有限公司 | Method for improving plasma damage to device |
| CN107305858A (en) * | 2016-04-20 | 2017-10-31 | 北京北方华创微电子装备有限公司 | Ejector pin mechanism and pre-cleaning cavity |
| CN108155094A (en) * | 2016-12-05 | 2018-06-12 | 东京毅力科创株式会社 | Plasma processing apparatus |
| CN108962794A (en) * | 2018-07-20 | 2018-12-07 | 北京北方华创微电子装备有限公司 | A kind of liter of needle method and the thimble lifting device for applying it |
| CN109072422A (en) * | 2016-05-12 | 2018-12-21 | 康宁股份有限公司 | The electrostatic clamp of cover-plate glass with irregular surface flatness |
| CN112309889A (en) * | 2019-08-02 | 2021-02-02 | 合肥晶合集成电路股份有限公司 | Substrate detection device and detection method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06112303A (en) * | 1992-09-29 | 1994-04-22 | Sony Corp | Wafer processing apparatus and wafer processing |
| JPH11233601A (en) * | 1998-02-10 | 1999-08-27 | Hitachi Ltd | Electrostatic chucking apparatus and apparatus for processing sample using the same |
| US6646857B2 (en) * | 2001-03-30 | 2003-11-11 | Lam Research Corporation | Semiconductor wafer lifting device and methods for implementing the same |
| US6665168B2 (en) * | 2001-03-30 | 2003-12-16 | Taiwan Semiconductor Manufacturing Co. Ltd | Electrostatic chuck apparatus and method for efficiently dechucking a substrate therefrom |
| US7107667B2 (en) * | 2001-11-01 | 2006-09-19 | Tdk Corporation | Method for fabricating thin film magnetic head |
| JP2003347395A (en) * | 2002-05-28 | 2003-12-05 | Tokyo Electron Ltd | Method of releasing electrostatic chuck and processing apparatus |
| KR20050018063A (en) * | 2003-08-13 | 2005-02-23 | 삼성전자주식회사 | An apparatus for wafer chucking/dechucking of semiconductor manufacturing equipment and methode at the same |
-
2005
- 2005-12-09 CN CNB2005101264366A patent/CN100423224C/en active Active
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299090A (en) * | 2010-06-25 | 2011-12-28 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Thimble and plasma etching device with thimble |
| CN102299090B (en) * | 2010-06-25 | 2014-03-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Thimble and plasma etching device with thimble |
| CN101916739B (en) * | 2010-07-13 | 2012-08-01 | 上海技美电子科技有限公司 | Wafer carrying device |
| CN101916739A (en) * | 2010-07-13 | 2010-12-15 | 上海技美电子科技有限公司 | Wafer carrying device |
| CN104347358A (en) * | 2014-09-15 | 2015-02-11 | 上海华力微电子有限公司 | Method for improving plasma damage to device |
| CN107305858A (en) * | 2016-04-20 | 2017-10-31 | 北京北方华创微电子装备有限公司 | Ejector pin mechanism and pre-cleaning cavity |
| CN107305858B (en) * | 2016-04-20 | 2020-11-10 | 北京北方华创微电子装备有限公司 | Thimble mechanism and precleaning cavity |
| CN109072422A (en) * | 2016-05-12 | 2018-12-21 | 康宁股份有限公司 | The electrostatic clamp of cover-plate glass with irregular surface flatness |
| CN108155094A (en) * | 2016-12-05 | 2018-06-12 | 东京毅力科创株式会社 | Plasma processing apparatus |
| CN108155094B (en) * | 2016-12-05 | 2022-02-15 | 东京毅力科创株式会社 | Plasma processing apparatus |
| CN108962794B (en) * | 2018-07-20 | 2020-08-21 | 北京北方华创微电子装备有限公司 | Needle lifting method and thimble lifting device applying same |
| CN108962794A (en) * | 2018-07-20 | 2018-12-07 | 北京北方华创微电子装备有限公司 | A kind of liter of needle method and the thimble lifting device for applying it |
| CN112309889A (en) * | 2019-08-02 | 2021-02-02 | 合肥晶合集成电路股份有限公司 | Substrate detection device and detection method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100423224C (en) | 2008-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1848405A (en) | Wafer lifting device and lifting method | |
| CN101189772B (en) | Electrostatic chuck with smart lift-pin mechanism for a plasma reactor | |
| CN1067177C (en) | Electrostatic chuck | |
| CN105575863B (en) | Plasma processing apparatus, substrate discharge mechanism and method | |
| CN101174548B (en) | Apparatus and method for measuring chuck attachment force | |
| CN1851898A (en) | Thimble device | |
| JP5449382B2 (en) | Tactile wafer lift and operation method thereof | |
| CN2847524Y (en) | Wafter jack-up device | |
| CN111446199A (en) | Reaction chamber of semiconductor equipment and semiconductor equipment | |
| CN113903688A (en) | Semiconductor process equipment and wafer state monitoring method | |
| KR20070101978A (en) | Glass treatment apparatus | |
| CN1851892A (en) | Vacuum mechanical-arm | |
| TW202123287A (en) | Method, apparatus, and system for wafer grounding | |
| JP2011054762A (en) | Device and method for monitoring static eliminator, and monitoring program for static eliminator | |
| JPH11233601A (en) | Electrostatic chucking apparatus and apparatus for processing sample using the same | |
| CN112514047B (en) | Substrate lifting device and substrate transportation method | |
| CN111293058A (en) | Control system and control method of electrostatic chuck | |
| CN101221893B (en) | Method for promoting electrostatic charge dissipation on semiconductor chip | |
| CN111223808A (en) | Electrostatic discharge method and device for electrostatic chuck | |
| JP2010201557A (en) | Workpiece pickup device and method | |
| CN111341720A (en) | Wafer unloading and pressing device | |
| CN114355244A (en) | Pedestal grounding detection device and method | |
| CN211125590U (en) | Wafer drying device | |
| CN117352454A (en) | Detection device and detection method for electrostatic chuck | |
| KR20060130966A (en) | A lift pin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIFANG MICROELECTRONIC BASE EQUIPMENT PROCES RESE Free format text: FORMER OWNER: BEIJING YUANHE ELECTRONIC TECHNOLOGY CO., LTD. Effective date: 20110311 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100016 NO. 1, JIUXIANQIAO EAST ROAD, CHAOYANG DISTRICT, BEIJING TO: 100015 NO. 1, JIUXIANQIAO EAST ROAD, CHAOYANG DISTRICT, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110311 Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Patentee before: Beijing Yuanhe Electronic Technology Co., Ltd. |
|
| CP03 | Change of name, title or address |
Address after: 100176 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100015 Jiuxianqiao East Road, Chaoyang District, Chaoyang District, Beijing Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
|
| CP03 | Change of name, title or address |