CN107305858B - Thimble mechanism and precleaning cavity - Google Patents
Thimble mechanism and precleaning cavity Download PDFInfo
- Publication number
- CN107305858B CN107305858B CN201610246302.6A CN201610246302A CN107305858B CN 107305858 B CN107305858 B CN 107305858B CN 201610246302 A CN201610246302 A CN 201610246302A CN 107305858 B CN107305858 B CN 107305858B
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- base
- chamber
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- mounting flange
- mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a thimble mechanism and a pre-cleaning cavity, which are applied to the pre-cleaning cavity and comprise at least three thimbles, an installation frame, an installation flange, an insulating cushion block and an insulating screw, wherein the installation frame is positioned in the pre-cleaning cavity and is fixedly connected with the wall of the cavity at the bottom of the pre-cleaning cavity through the installation flange; at least three thimbles are vertically installed on the mounting rack and are used for supporting the wafer. The insulating cushion block is arranged between the mounting frame and the mounting flange and used for electrically insulating the mounting frame and the mounting flange. And the insulating screw is used for fixedly connecting the insulating cushion block, the mounting frame and the mounting flange. The thimble mechanism provided by the invention can electrically insulate the thimble from the mounting flange, so that the ignition phenomenon can be avoided.
Description
Technical Field
The invention relates to the technical field of microelectronics, in particular to an ejector pin mechanism and a pre-cleaning cavity.
Background
In PVD process equipment, particularly for IC (integrated circuit), TSV (through silicon via), and Packaging processes, a Preclean chamber is usually required, which can perform chemical reaction and physical bombardment on the wafer surface by exciting process gas such as Ar (argon), He (helium), H2 (hydrogen) and the like into plasma, so as to remove impurities on the wafer surface.
Fig. 1 is a schematic structural diagram of a conventional pre-cleaning chamber. Referring to fig. 1, the precleaning chamber is an inductively coupled plasma generator, which includes a grounded top cover 1, an inductive coil 2 surrounding the top cover 1, an upper rf power source 3, a lower electrode 4, and a lower rf power source 5. The inductive coil 2 is electrically connected with the upper radio frequency power supply 3 and is used for exciting the process gas in the cavity to form plasma. The lower electrode 4 is used for carrying the wafer and is electrically connected with a lower radio frequency power supply 5(13.56MHz) with high frequency, so that the plasma can etch the surface of the wafer, and impurities on the surface of the wafer can be removed.
Further, above-mentioned bottom electrode 4 is liftable, and includes base, cooling water tray and the roof that sets gradually from bottom to top, and wherein, the base passes through the ground connection piece and is connected with the bottom cavity wall of wasing the chamber in advance, and all is in ground connection state. The lower radio frequency power supply 5 is directly connected to the cooling water tray, and the base, the cooling water tray and the top plate are at equal potentials to form a high-frequency electrode. In addition, the pre-cleaning chamber further includes an ejector pin (not shown), which can penetrate through the lower electrode 4 when the lower electrode 4 is lifted and lowered until the top end of the ejector pin is higher or lower than the upper surface of the top plate, so as to cooperate with a robot to perform a wafer picking and placing operation.
In the process, the thimble is in a grounding state, and the radio frequency voltage of the cooling water disc is higher, so that the ceramic protection layer at the top end of the thimble is broken down, and the thimble is easy to strike fire with the cooling water disc when moving to the vicinity of the cooling water disc.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a thimble mechanism and a pre-cleaning cavity, which can electrically insulate a thimble from a mounting flange, so that the occurrence of a sparking phenomenon can be avoided.
The ejector pin mechanism is applied to a pre-cleaning cavity and comprises at least three ejector pins, a mounting frame and a mounting flange, wherein the mounting frame is positioned in the pre-cleaning cavity and is fixedly connected with the wall of the bottom of the pre-cleaning cavity through the mounting flange; the at least three thimbles are vertically arranged on the mounting rack and used for supporting a wafer, and the thimble structure further comprises an insulating cushion block and insulating screws, wherein the insulating cushion block is arranged between the mounting rack and the mounting flange and used for electrically insulating the mounting rack from the mounting flange; and the insulating screw is used for fixedly connecting the insulating cushion block, the mounting frame and the mounting flange.
Preferably, the insulating cushion block is made of polyetherimide plastics.
Preferably, the insulating screw is made of polyetherimide plastics.
Preferably, the mounting flange comprises a base, a pillar and a support seat, wherein the base is fixedly connected with a chamber wall at the bottom of the pre-cleaning chamber; the supporting column is vertically arranged, the lower end of the supporting column is fixedly connected with the base, and the upper end of the supporting column is fixedly connected with the supporting seat; the insulating cushion block is arranged on the supporting seat.
As another technical solution, the present invention provides a precleaning chamber, comprising a pedestal and an ejector pin mechanism disposed therein, wherein the pedestal is liftable and used for carrying a wafer; the thimble mechanism comprises at least three thimbles, a mounting rack and a mounting flange, wherein the mounting rack is positioned in the pre-cleaning cavity and below the base and is fixedly connected with the wall of the cavity at the bottom of the pre-cleaning cavity through the mounting flange; the at least three thimbles are vertically arranged on the mounting rack and are uniformly distributed along the circumferential direction of the base; the ejector pin mechanism provided by the invention is adopted.
Preferably, the pre-cleaning chamber further comprises an induction coil, an upper radio frequency power supply and a lower radio frequency power supply, wherein the induction coil surrounds the pre-cleaning chamber and is electrically connected with the upper radio frequency power supply; the base is electrically connected with the lower radio frequency power supply.
Preferably, the base comprises a top plate, a cooling water tray and a base which are sequentially stacked from top to bottom, wherein the upper surface of the top plate is used for bearing a wafer; the cooling water tray is electrically connected with the lower radio frequency power supply; the base is connected with the bottom chamber wall of the pre-cleaning chamber through a grounding piece; the bottom chamber wall of the pre-cleaning chamber is grounded.
Preferably, the pre-cleaning chamber further comprises a base lifting device, the base lifting device comprises a lifting shaft and a driving mechanism, the lifting shaft is vertically arranged, the upper end of the lifting shaft is fixedly connected with the base, and the lower end of the lifting shaft is connected with the driving mechanism; the driving mechanism is used for driving the lifting shaft to ascend or descend.
Preferably, an insulating component is arranged around the top plate, the cooling water plate and the base.
Preferably, a top cover is arranged at the top of the pre-cleaning chamber, and the top cover is grounded; the induction coil is wound around the top cover.
The invention has the following beneficial effects:
according to the thimble mechanism provided by the invention, the insulating cushion block is arranged between the mounting frame and the mounting flange, and the insulating cushion block, the mounting frame and the mounting flange are fixedly connected through the insulating screw, so that the mounting frame and the mounting flange can be electrically insulated, the thimble arranged on the mounting frame and the mounting flange can be electrically insulated, and the occurrence of a sparking phenomenon can be further avoided.
According to the pre-cleaning chamber provided by the invention, the thimble and the mounting flange can be electrically insulated by adopting the thimble mechanism provided by the invention, so that the phenomenon of sparking can be avoided.
Drawings
FIG. 1 is a schematic structural diagram of a conventional pre-cleaning chamber;
FIG. 2 is a perspective view of a thimble mechanism provided in the embodiments of the present invention;
FIG. 3 is a cross-sectional view of a thimble mechanism provided in an embodiment of the present invention;
FIG. 4 is a cross-sectional view of a pre-clean chamber provided in accordance with an embodiment of the present invention; and
fig. 5 is an enlarged view of the region I in fig. 4.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the thimble mechanism and the pre-cleaning chamber in detail with reference to the attached drawings.
Fig. 2 is a perspective view of the ejector pin mechanism according to the embodiment of the present invention. Fig. 3 is a cross-sectional view of the ejector pin mechanism according to the embodiment of the present invention. Referring to fig. 2 and 3, the ejector pin mechanism is applied to a pre-cleaning chamber, a liftable base is disposed in the pre-cleaning chamber, and the ejector pin mechanism can penetrate through the base when the base is lifted until the top end of the ejector pin mechanism is higher than or lower than the upper surface of the base, so that the ejector pin mechanism can cooperate with a robot to realize a wafer picking and placing operation.
The thimble mechanism comprises three thimbles 10, a mounting frame 12, a mounting flange 14, an insulating cushion block 13 and insulating screws 11. The mounting frame 12 is located in the pre-cleaning chamber and is fixedly connected with a chamber wall 15 at the bottom of the pre-cleaning chamber through a mounting flange 14. Three pins 10 are vertically mounted on a mounting frame 12 for supporting a wafer. An insulating spacer 13 is provided between the mounting frame 12 and the mounting flange 14 to electrically isolate the two. The insulating screw 11 is used for fixedly connecting the insulating cushion block 13, the mounting frame 12 and the mounting flange 14.
Through set up insulating cushion 13 between mounting bracket 12 and mounting flange 14, and realize three's fixed connection through insulating screw 11, can be with mounting bracket 12 and mounting flange 14 electrical insulation to can make electrical insulation between thimble 10 and the mounting flange 14 of installing on mounting bracket 12, this thimble 10 no longer is in the ground connection state, even the voltage is too high can not puncture the insulating protective layer of thimble 10 yet, and then can be in the cleaning process in advance, avoid the emergence of phenomenon of striking sparks.
The insulating cushion block 13 and the insulating screw 11 can be preferably made of polyetherimide plastics, and the materials have the characteristics of good high temperature resistance and high strength, can be used for a long time in a high-temperature environment, and are convenient to process. Of course, the insulating block 13 and the insulating screw 11 may be made of any other insulating material as long as the mounting frame 12 is electrically insulated from the mounting flange 14.
In this embodiment, as shown in fig. 3, the mounting flange 14 comprises a base 143, a support 142 and a support base 141, wherein the base 143 is fixedly connected to the chamber wall 15 at the bottom of the pre-cleaning chamber. The supporting column 142 is vertically arranged, the lower end of the supporting column 142 is fixedly connected with the base 143, and the upper end of the supporting column 142 is fixedly connected with the supporting seat 141. The insulating pad 13 is disposed on the support base 141.
In this embodiment, three thimbles 10 are provided, but the present invention is not limited to this, and in practical application, four or more thimbles 10 may be provided.
As another technical solution, fig. 4 is a cross-sectional view of a pre-cleaning chamber provided in an embodiment of the present invention. Fig. 5 is an enlarged view of the region I in fig. 4. Referring to fig. 4 and 5, the embodiment of the invention further provides a precleaning chamber, which is composed of a chamber wall 31 and a top cover 32 located on the top of the chamber wall 31, wherein the top cover 32 is grounded. The precleaning chamber includes a susceptor 34, a susceptor lift mechanism and a pin mechanism disposed therein, wherein the susceptor 34 is liftable for carrying the wafer 33. The thimble mechanism comprises at least three thimbles 35, a mounting frame 36 and a mounting flange 37, wherein the mounting frame 36 is located in the pre-cleaning chamber and below the base 34, and is fixedly connected with a chamber wall at the bottom of the pre-cleaning chamber through the mounting flange 37. At least three thimbles 35 are vertically installed on the mounting frame 36 and are uniformly distributed along the circumferential direction of the base 34. When the susceptor 34 is lifted, each of the ejector pins 35 may penetrate through the susceptor 34 until its top end is higher or lower than the upper surface of the susceptor 34, so as to cooperate with a robot to perform a wafer picking and placing operation. The ejector pin mechanism provided by the embodiment of the invention is adopted.
The pre-clean chamber may be excited to form a plasma in an inductively coupled manner. In this case, the pre-clean chamber further includes an induction coil, an upper RF power supply and a lower RF power supply, all not shown, wherein the induction coil surrounds the top lid 32 and is electrically connected to the upper RF power supply for exciting the process gases in the chamber to form a plasma. The susceptor 34 is electrically connected to a lower rf power source for causing the plasma to etch the surface of the wafer so that impurities on the surface of the wafer may be removed.
In the present embodiment, as shown in fig. 5, the susceptor 34 includes a top plate 341, a cooling water tray 342, and a base 343, which are stacked in this order from top to bottom, wherein an upper surface of the top plate 341 is used for carrying the wafer 33. The cooling water tray 342 is electrically connected to the lower RF power source, and the base 343 is connected to the bottom chamber wall of the pre-cleaning chamber through a grounding member (not shown). Preferably, an insulating assembly is disposed around the top plate 341, the cooling water tray 342 and the base 343, that is: a focus ring 344, a ground ring 345 and an insulating ring 346. Wherein focus ring 344 is used to form a boundary within which plasma can be confined. Base ring 345 is used to support focus ring 344. The insulating ring 346 serves to protect the susceptor 34 from plasma etching.
The bottom chamber wall of the pre-cleaning chamber is grounded so that the base 343, the cooling water pan 342 and the ceiling 341 are at equal potential, forming a high frequency electrode. However, in the thimble mechanism provided in the embodiment of the present invention, the insulating pad is disposed between the mounting frame 36 and the mounting flange 37, and the mounting frame 36 and the mounting flange 37 are fixedly connected by the insulating screws, so that the mounting frame 36 and the mounting flange 37 are electrically insulated from each other, the thimble 35 mounted on the mounting frame 36 is electrically insulated from the mounting flange 37, the thimble 35 is no longer in a grounded state, and the insulating protective layer of the thimble 35 is not broken through even if the voltage is too high, so that the occurrence of the sparking phenomenon can be avoided in the pre-cleaning process.
In this embodiment, the pre-cleaning chamber further comprises a base lifting device, which comprises a lifting shaft 38 and a driving mechanism (not shown in the figure) for driving the lifting shaft 38 to ascend or descend, wherein the lifting shaft 38 is vertically disposed, an upper end of the lifting shaft 38 is fixedly connected to the base 343, and a lower end of the lifting shaft 38 is connected to the driving mechanism. The lifting shaft 38 drives the base 34 to ascend or descend under the driving of the driving mechanism.
It should be noted that, in practical applications, the pre-cleaning chamber may also adopt any other mechanism, and the present invention is not particularly limited thereto.
According to the pre-cleaning chamber provided by the embodiment of the invention, the thimble mechanism provided by the embodiment of the invention is adopted, so that the thimble and the mounting flange are electrically insulated, and the phenomenon of sparking can be avoided.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A thimble mechanism is applied to a pre-cleaning cavity and comprises at least three thimbles, a mounting rack and a mounting flange, wherein the mounting rack is positioned in the pre-cleaning cavity and is fixedly connected with the wall of the bottom of the pre-cleaning cavity through the mounting flange; the at least three thimbles are vertically arranged on the mounting rack and used for supporting wafers, and the thimble structure is characterized by also comprising an insulating cushion block and insulating screws, wherein,
the insulating cushion block is arranged between the mounting frame and the mounting flange and used for electrically insulating the mounting frame and the mounting flange, so that the thimble is not in a grounding state any more;
and the insulating screw is used for fixedly connecting the insulating cushion block, the mounting frame and the mounting flange.
2. The ejector pin mechanism of claim 1, wherein the insulating pad block is made of polyetherimide plastic.
3. The ejector pin mechanism of claim 1, wherein the insulating screw is made of polyetherimide plastic.
4. The ejector pin mechanism of any one of claims 1 to 3, wherein said mounting flange comprises a base, a post and a support base, wherein,
the base is fixedly connected with the wall of the chamber at the bottom of the pre-cleaning chamber;
the supporting column is vertically arranged, the lower end of the supporting column is fixedly connected with the base, and the upper end of the supporting column is fixedly connected with the supporting seat;
the insulating cushion block is arranged on the supporting seat.
5. A precleaning chamber comprises a base and an ejector pin mechanism which are arranged in the precleaning chamber, wherein the base is liftable and used for bearing a wafer; the thimble mechanism comprises at least three thimbles, a mounting rack and a mounting flange, wherein the mounting rack is positioned in the pre-cleaning cavity and below the base and is fixedly connected with the wall of the cavity at the bottom of the pre-cleaning cavity through the mounting flange; the at least three thimbles are vertically arranged on the mounting rack and are uniformly distributed along the circumferential direction of the base; the ejector pin mechanism is characterized by adopting the ejector pin mechanism in any one of claims 1 to 4.
6. The pre-clean chamber of claim 5, further comprising an induction coil, an upper RF power supply, and a lower RF power supply, wherein,
the induction coil surrounds the periphery of the pre-cleaning chamber and is electrically connected with the upper radio frequency power supply;
the base is electrically connected with the lower radio frequency power supply.
7. The pre-clean chamber of claim 6, wherein the pedestal comprises a top plate, a cooling water tray and a base, which are stacked in sequence from top to bottom,
the upper surface of the top plate is used for bearing a wafer;
the cooling water tray is electrically connected with the lower radio frequency power supply;
the base is connected with the bottom chamber wall of the pre-cleaning chamber through a grounding piece; the bottom chamber wall of the pre-cleaning chamber is grounded.
8. The pre-wash chamber of claim 7, further comprising a pedestal lift comprising a lift shaft and a drive mechanism, wherein the pre-wash chamber further comprises a pedestal lift device, wherein the pedestal lift device comprises a lift shaft and a drive mechanism
The lifting shaft is vertically arranged, the upper end of the lifting shaft is fixedly connected with the base, and the lower end of the lifting shaft is connected with the driving mechanism;
the driving mechanism is used for driving the lifting shaft to ascend or descend.
9. The pre-clean chamber of claim 7, wherein an insulating assembly is disposed around the top plate, the cooling water pan, and the base.
10. The pre-wash chamber of claim 6, wherein a top cover is provided at the top of the pre-wash chamber, the top cover being grounded;
the induction coil is wound around the top cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610246302.6A CN107305858B (en) | 2016-04-20 | 2016-04-20 | Thimble mechanism and precleaning cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610246302.6A CN107305858B (en) | 2016-04-20 | 2016-04-20 | Thimble mechanism and precleaning cavity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107305858A CN107305858A (en) | 2017-10-31 |
| CN107305858B true CN107305858B (en) | 2020-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610246302.6A Active CN107305858B (en) | 2016-04-20 | 2016-04-20 | Thimble mechanism and precleaning cavity |
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| Country | Link |
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| CN (1) | CN107305858B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244021B (en) * | 2020-01-16 | 2022-12-09 | 北京北方华创微电子装备有限公司 | Chuck base and semiconductor processing equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197721A (en) * | 2001-12-26 | 2003-07-11 | Ulvac Japan Ltd | Elevating/lowering pin for supporting substrate and multichamber film deposition device using it |
| CN1848405A (en) * | 2005-12-09 | 2006-10-18 | 北京圆合电子技术有限责任公司 | Wafer lifting device and lifting method |
| CN101047143A (en) * | 2006-03-31 | 2007-10-03 | 东京毅力科创株式会社 | Basal plate carrying table and basal plate processing device |
| CN101944498A (en) * | 2009-07-10 | 2011-01-12 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate processing equipment and thimble lifting device thereof |
-
2016
- 2016-04-20 CN CN201610246302.6A patent/CN107305858B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197721A (en) * | 2001-12-26 | 2003-07-11 | Ulvac Japan Ltd | Elevating/lowering pin for supporting substrate and multichamber film deposition device using it |
| CN1848405A (en) * | 2005-12-09 | 2006-10-18 | 北京圆合电子技术有限责任公司 | Wafer lifting device and lifting method |
| CN101047143A (en) * | 2006-03-31 | 2007-10-03 | 东京毅力科创株式会社 | Basal plate carrying table and basal plate processing device |
| CN101944498A (en) * | 2009-07-10 | 2011-01-12 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate processing equipment and thimble lifting device thereof |
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| Publication number | Publication date |
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| CN107305858A (en) | 2017-10-31 |
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