CN1842616A - 化学镀金液 - Google Patents
化学镀金液 Download PDFInfo
- Publication number
- CN1842616A CN1842616A CNA2005800009024A CN200580000902A CN1842616A CN 1842616 A CN1842616 A CN 1842616A CN A2005800009024 A CNA2005800009024 A CN A2005800009024A CN 200580000902 A CN200580000902 A CN 200580000902A CN 1842616 A CN1842616 A CN 1842616A
- Authority
- CN
- China
- Prior art keywords
- gold
- plating liquid
- compound
- sodium
- gold plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000007747 plating Methods 0.000 title claims abstract description 81
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 239000010931 gold Substances 0.000 title claims abstract description 50
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 50
- 239000000126 substance Substances 0.000 title claims abstract description 45
- 239000007788 liquid Substances 0.000 title claims description 41
- -1 pyrosulfurous acid compound Chemical class 0.000 claims abstract description 42
- 150000002344 gold compounds Chemical class 0.000 claims abstract description 13
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical class N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 9
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 6
- RWSOTUBLDIXVET-UHFFFAOYSA-M hydrosulfide Chemical compound [SH-] RWSOTUBLDIXVET-UHFFFAOYSA-M 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 abstract description 11
- 229910052783 alkali metal Inorganic materials 0.000 abstract description 9
- 229910052784 alkaline earth metal Inorganic materials 0.000 abstract description 9
- 150000003863 ammonium salts Chemical class 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- WBZKQQHYRPRKNJ-UHFFFAOYSA-N disulfurous acid Chemical compound OS(=O)S(O)(=O)=O WBZKQQHYRPRKNJ-UHFFFAOYSA-N 0.000 abstract 1
- 231100001231 less toxic Toxicity 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 23
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 20
- 239000000243 solution Substances 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 230000007797 corrosion Effects 0.000 description 11
- 238000005260 corrosion Methods 0.000 description 11
- 235000010265 sodium sulphite Nutrition 0.000 description 10
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 10
- 235000019345 sodium thiosulphate Nutrition 0.000 description 10
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910052708 sodium Inorganic materials 0.000 description 8
- 239000011734 sodium Substances 0.000 description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 7
- 229960001484 edetic acid Drugs 0.000 description 7
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 7
- JEOOVNWNJKBHRG-UHFFFAOYSA-N [Na+].[S--].[S--].[Au+3] Chemical compound [Na+].[S--].[S--].[Au+3] JEOOVNWNJKBHRG-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000003153 chemical reaction reagent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000008139 complexing agent Substances 0.000 description 5
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 5
- 229910000397 disodium phosphate Inorganic materials 0.000 description 5
- 235000019800 disodium phosphate Nutrition 0.000 description 5
- 239000006210 lotion Substances 0.000 description 5
- 239000006174 pH buffer Substances 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 5
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 4
- 235000019799 monosodium phosphate Nutrition 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- JCDVTZPJEWWGHU-UHFFFAOYSA-N gold sulfurous acid Chemical compound [Au].S(O)(O)=O JCDVTZPJEWWGHU-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000001988 toxicity Effects 0.000 description 3
- 231100000419 toxicity Toxicity 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- XKUKSGPZAADMRA-UHFFFAOYSA-N glycyl-glycyl-glycine Chemical compound NCC(=O)NCC(=O)NCC(O)=O XKUKSGPZAADMRA-UHFFFAOYSA-N 0.000 description 2
- YMAWOPBAYDPSLA-UHFFFAOYSA-N glycylglycine Chemical compound [NH3+]CC(=O)NCC([O-])=O YMAWOPBAYDPSLA-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 231100000167 toxic agent Toxicity 0.000 description 2
- 239000003440 toxic substance Substances 0.000 description 2
- UCGZDNYYMDPSRK-UHFFFAOYSA-L trisodium;gold;hydroxy-oxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [Na+].[Na+].[Na+].[Au].OS([S-])(=O)=O.OS([S-])(=O)=O UCGZDNYYMDPSRK-UHFFFAOYSA-L 0.000 description 2
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 108010008488 Glycylglycine Proteins 0.000 description 1
- 229910003803 Gold(III) chloride Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 description 1
- JYXGIOKAKDAARW-UHFFFAOYSA-N N-(2-hydroxyethyl)iminodiacetic acid Chemical compound OCCN(CC(O)=O)CC(O)=O JYXGIOKAKDAARW-UHFFFAOYSA-N 0.000 description 1
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 1
- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 239000007998 bicine buffer Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- FGRVOLIFQGXPCT-UHFFFAOYSA-L dipotassium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [K+].[K+].[O-]S([O-])(=O)=S FGRVOLIFQGXPCT-UHFFFAOYSA-L 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- PCAXGMRPPOMODZ-UHFFFAOYSA-N disulfurous acid, diammonium salt Chemical compound [NH4+].[NH4+].[O-]S(=O)S([O-])(=O)=O PCAXGMRPPOMODZ-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- IFQUWYZCAGRUJN-UHFFFAOYSA-N ethylenediaminediacetic acid Chemical compound OC(=O)CNCCNCC(O)=O IFQUWYZCAGRUJN-UHFFFAOYSA-N 0.000 description 1
- 108010067216 glycyl-glycyl-glycine Proteins 0.000 description 1
- 229940043257 glycylglycine Drugs 0.000 description 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 1
- 229940076131 gold trichloride Drugs 0.000 description 1
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 description 1
- 229910021505 gold(III) hydroxide Inorganic materials 0.000 description 1
- TVGIYTJTDDLBJP-UHFFFAOYSA-N gold;thiocyanic acid Chemical compound [Au].SC#N TVGIYTJTDDLBJP-UHFFFAOYSA-N 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229940045641 monobasic sodium phosphate Drugs 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- RWPGFSMJFRPDDP-UHFFFAOYSA-L potassium metabisulfite Chemical compound [K+].[K+].[O-]S(=O)S([O-])(=O)=O RWPGFSMJFRPDDP-UHFFFAOYSA-L 0.000 description 1
- 235000010263 potassium metabisulphite Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- HRZFUMHJMZEROT-UHFFFAOYSA-L sodium disulfite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])(=O)=O HRZFUMHJMZEROT-UHFFFAOYSA-L 0.000 description 1
- 235000010262 sodium metabisulphite Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- PODWXQQNRWNDGD-UHFFFAOYSA-L sodium thiosulfate pentahydrate Chemical compound O.O.O.O.O.[Na+].[Na+].[O-]S([S-])(=O)=O PODWXQQNRWNDGD-UHFFFAOYSA-L 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
实施例 | |||||
1 | 2 | 3 | 4 | ||
浴液组成 | 金化合物添加剂添加剂稳定剂络合剂pH缓冲剂 | 亚硫酸金钠:1g/L(金)焦亚硫酸钠:5g/L硫代硫酸钠:50mg/L亚硫酸钠:5g/L乙二胺四乙酸:10g/L磷酸二氢钠:30g/L | 氯金酸钠:1g/L(金)焦亚硫酸钠:10g/L硫代硫酸钠:100mg/L亚硫酸钠:10g/L氨三乙酸:10g/L磷酸氢二钠:30g/L | 亚硫酸金钠:1g/L(金)焦亚硫酸钠:5g/L硫代硫酸钠:50mg/L亚硫酸钠:5g/L乙二胺四乙酸:10g/L磷酸二氢钠:30g/L | 氯金酸钠:1g/L(金)焦亚硫酸钠:10g/L硫代硫酸钠:100mg/L亚硫酸钠:10g/L氨三乙酸:10g/L磷酸氢二钠:30g/L |
镀敷条件 | pH | 7.5 | 7.5 | 7.5 | 7.5 |
处理温度(℃) | 80 | 80 | 80 | 80 | |
处理时间(分钟) | 20 | 20 | 20 | 20 | |
评价结果 | 膜厚(μm) | 0.05 | 0.05 | 0.05 | 0.05 |
腐蚀孔 | 无 | 无 | 无 | 无 | |
焊接粘结强度 | 1641 | 1610 | 1423 | 1402 | |
被膜粘结性 | 无剥离 | 无剥离 | 无剥离 | 无剥离 |
比较例 | 实施例 | ||||
1 | 2 | 5 | 6 | ||
浴液组成 | 金化合物添加剂添加剂稳定剂络合剂pH缓冲剂 | 亚硫酸金钠:1g/L(金)焦亚硫酸钠:5g/L-亚硫酸钠:5g/L乙二胺四乙酸:10g/L磷酸二氢钠:30g/L | 氯金酸钠:1g/L(金)焦亚硫酸钠:10g/L-亚硫酸钠:10g/L氨三乙酸:10g/L磷酸氢二钠:30g/L | 亚硫酸金钠:1g/L(金)焦亚硫酸钠:50g/L硫代硫酸钠:50mg/L亚硫酸钠:5g/L乙二胺四乙酸:10g/L磷酸二氢钠:30g/L | 氯金酸钠:1g/L(金)焦亚硫酸钠:10g/L硫代硫酸钠:100mg/L亚硫酸钠:10g/L氨三乙酸:10g/L磷酸氢二钠:30g/L |
镀敷条件 | pH | 7.5 | 7.5 | 7.5 | 7.5 |
处理温度(℃) | 80 | 80 | 80 | 80 | |
处理时间(分钟) | 20 | 20 | 20 | 20 | |
评价结果 | 膜厚(μm) | 0.05 | 0.05 | 0.05 | 0.05 |
腐蚀孔 | 无 | 无 | 无 | 无 | |
焊接粘结强度 | 1216 | 1195 | 1587 | 1536 | |
被膜粘结性 | 无剥离 | 无剥离 | 无剥离 | 无剥离 |
实施例 | |||||
7 | 8 | 9 | 10 | ||
浴液组成 | 金化合物添加剂添加剂稳定剂络合剂pH缓冲剂 | 亚硫酸金钠:1g/L(金)焦亚硫酸钠:1g/L硫代硫酸钠:10mg/L亚硫酸钠:10g/L乙二胺四乙酸:5g/L磷酸三钠:30g/L | 氯金酸钠:1g/L(金)焦亚硫酸钠:2g/L硫代硫酸钠:100mg/L亚硫酸钠:5g/L氨三乙酸:10g/L磷酸氢二钠:20g/L | 亚硫酸金钠:1g/L(金)焦亚硫酸钠:50g/L硫代硫酸钠:50mg/L亚硫酸钠:10g/L乙二胺四乙酸:10g/L磷酸二氢钠:30g/L | 氯金酸钠:1g/L(金)焦亚硫酸钠:100g/L硫代硫酸钠:75mg/L亚硫酸钠:15g/L氨三乙酸:20g/L焦磷酸钾:40g/L |
镀敷条件 | pH | 7.5 | 7.5 | 7.5 | 7.5 |
处理温度(℃) | 80 | 80 | 80 | 80 | |
处理时间(分钟) | 20 | 20 | 20 | 20 | |
评价结果 | 膜厚(μm) | 0.05 | 0.05 | 0.05 | 0.05 |
腐蚀孔 | 无 | 无 | 无 | 无 | |
焊接粘结强度 | 1421 | 1438 | 1467 | 1455 | |
被膜粘结性 | 无剥离 | 无剥离 | 无剥离 | 无剥离 |
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004203044 | 2004-07-09 | ||
JP203044/2004 | 2004-07-09 | ||
JP328671/2004 | 2004-11-12 |
Publications (2)
Publication Number | Publication Date |
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CN1842616A true CN1842616A (zh) | 2006-10-04 |
CN100441738C CN100441738C (zh) | 2008-12-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2005800009024A Active CN100441738C (zh) | 2004-07-09 | 2005-06-23 | 化学镀金液 |
Country Status (1)
Country | Link |
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Cited By (7)
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CN102080223A (zh) * | 2009-12-01 | 2011-06-01 | 三星电机株式会社 | 置换无电镀金溶液及使用该溶液形成金镀层的方法 |
CN105112953A (zh) * | 2015-09-17 | 2015-12-02 | 深圳市瑞世兴科技有限公司 | 无氰镀金液 |
CN105543816A (zh) * | 2016-02-01 | 2016-05-04 | 哈尔滨工业大学(威海) | 一种化学镀金液 |
CN107058987A (zh) * | 2017-04-28 | 2017-08-18 | 苏州鑫旷新材料科技有限公司 | 一种无氰的化学镀金液 |
CN108220934A (zh) * | 2018-01-22 | 2018-06-29 | 昆山成功环保科技有限公司 | 一种无氰化学浸金溶液 |
CN112695306A (zh) * | 2020-12-16 | 2021-04-23 | 昆山成功环保科技有限公司 | 应用在印制线路板领域的无毒环保的化学沉金溶液 |
TWI737414B (zh) * | 2019-07-31 | 2021-08-21 | 日商昭和電工股份有限公司 | 積層體及其製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3876634B2 (ja) * | 2001-03-14 | 2007-02-07 | トヨタ自動車株式会社 | 合金触媒と排気ガス浄化用触媒の製造方法 |
JP2004176171A (ja) * | 2002-09-30 | 2004-06-24 | Shinko Electric Ind Co Ltd | 非シアン電解金めっき液 |
-
2005
- 2005-06-23 CN CNB2005800009024A patent/CN100441738C/zh active Active
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Publication number | Priority date | Publication date | Assignee | Title |
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CN102080223A (zh) * | 2009-12-01 | 2011-06-01 | 三星电机株式会社 | 置换无电镀金溶液及使用该溶液形成金镀层的方法 |
CN105112953A (zh) * | 2015-09-17 | 2015-12-02 | 深圳市瑞世兴科技有限公司 | 无氰镀金液 |
CN105543816A (zh) * | 2016-02-01 | 2016-05-04 | 哈尔滨工业大学(威海) | 一种化学镀金液 |
CN107058987A (zh) * | 2017-04-28 | 2017-08-18 | 苏州鑫旷新材料科技有限公司 | 一种无氰的化学镀金液 |
CN108220934A (zh) * | 2018-01-22 | 2018-06-29 | 昆山成功环保科技有限公司 | 一种无氰化学浸金溶液 |
TWI737414B (zh) * | 2019-07-31 | 2021-08-21 | 日商昭和電工股份有限公司 | 積層體及其製造方法 |
US12031213B2 (en) | 2019-07-31 | 2024-07-09 | Resonac Corporation | Laminate |
CN112695306A (zh) * | 2020-12-16 | 2021-04-23 | 昆山成功环保科技有限公司 | 应用在印制线路板领域的无毒环保的化学沉金溶液 |
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