CN1800970A - 遮蔽掩模图案的形成方法 - Google Patents
遮蔽掩模图案的形成方法 Download PDFInfo
- Publication number
- CN1800970A CN1800970A CNA2005100923243A CN200510092324A CN1800970A CN 1800970 A CN1800970 A CN 1800970A CN A2005100923243 A CNA2005100923243 A CN A2005100923243A CN 200510092324 A CN200510092324 A CN 200510092324A CN 1800970 A CN1800970 A CN 1800970A
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- pattern
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 74
- 238000003466 welding Methods 0.000 claims abstract description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 10
- 230000007261 regionalization Effects 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000007740 vapor deposition Methods 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 description 24
- 230000008020 evaporation Effects 0.000 description 24
- 239000000758 substrate Substances 0.000 description 23
- 238000010586 diagram Methods 0.000 description 20
- 238000009826 distribution Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- 229910000942 Elinvar Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR958/05 | 2005-01-05 | ||
KR1020050000958A KR100700839B1 (ko) | 2005-01-05 | 2005-01-05 | 수직증착용 섀도우마스크 패턴 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1800970A true CN1800970A (zh) | 2006-07-12 |
CN1800970B CN1800970B (zh) | 2011-02-09 |
Family
ID=36796207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005100923243A Active CN1800970B (zh) | 2005-01-05 | 2005-08-26 | 遮蔽掩模图案的形成方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4508979B2 (zh) |
KR (1) | KR100700839B1 (zh) |
CN (1) | CN1800970B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101289046A (zh) * | 2007-04-17 | 2008-10-22 | 厦门虹泰光学有限公司 | 具有隐形图案的基材及其加工方法 |
CN104532183A (zh) * | 2015-01-26 | 2015-04-22 | 深圳市华星光电技术有限公司 | 高精度掩膜板的制作方法 |
CN104797733A (zh) * | 2012-11-15 | 2015-07-22 | 株式会社V技术 | 成膜掩模的制造方法 |
CN105355796A (zh) * | 2012-01-12 | 2016-02-24 | 大日本印刷株式会社 | 拼版蒸镀掩模 |
CN105349947A (zh) * | 2015-10-27 | 2016-02-24 | 唐军 | 高精度金属掩模板加工方法 |
CN105358732A (zh) * | 2013-07-02 | 2016-02-24 | 株式会社V技术 | 成膜掩模和成膜掩模的制造方法 |
CN106350768A (zh) * | 2015-07-17 | 2017-01-25 | 凸版印刷株式会社 | 蒸镀用金属掩模以及蒸镀用金属掩模的制造方法 |
CN107851716A (zh) * | 2015-08-10 | 2018-03-27 | Ap系统股份有限公司 | 用于使用混合加工方法来制造荫罩的方法以及由此制造的荫罩 |
CN111095591A (zh) * | 2017-09-04 | 2020-05-01 | 应用材料公司 | 用于高res fmm的fmm工艺 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100947442B1 (ko) | 2007-11-20 | 2010-03-12 | 삼성모바일디스플레이주식회사 | 수직 증착형 마스크 제조장치 및 이를 이용한 수직 증착형마스크의 제조방법 |
KR101097331B1 (ko) | 2010-01-28 | 2011-12-23 | 삼성모바일디스플레이주식회사 | 박막 증착용 마스크의 제조 방법 |
JP5534093B1 (ja) * | 2013-01-11 | 2014-06-25 | 大日本印刷株式会社 | メタルマスクおよびメタルマスクの製造方法 |
JP6078747B2 (ja) | 2013-01-28 | 2017-02-15 | 株式会社ブイ・テクノロジー | 蒸着マスクの製造方法及びレーザ加工装置 |
JP6300257B1 (ja) | 2017-08-31 | 2018-03-28 | 堺ディスプレイプロダクト株式会社 | 成膜マスクの製造方法 |
KR20220030437A (ko) | 2020-08-31 | 2022-03-11 | 삼성디스플레이 주식회사 | 마스크, 이의 제조 방법, 및 표시 패널 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH065415A (ja) * | 1992-06-22 | 1994-01-14 | Nippon Filcon Co Ltd | シート状コイル,及びその製造方法 |
US5663018A (en) * | 1996-05-28 | 1997-09-02 | Motorola | Pattern writing method during X-ray mask fabrication |
US6878208B2 (en) * | 2002-04-26 | 2005-04-12 | Tohoku Pioneer Corporation | Mask for vacuum deposition and organic EL display manufactured by using the same |
JP2004225077A (ja) * | 2003-01-21 | 2004-08-12 | Dainippon Screen Mfg Co Ltd | 蒸着用マスクの製造方法および蒸着用マスク |
JP2004323888A (ja) * | 2003-04-23 | 2004-11-18 | Dainippon Printing Co Ltd | 蒸着マスク及び蒸着方法 |
KR100687486B1 (ko) * | 2004-11-19 | 2007-03-02 | 알투스주식회사 | 유기 이엘용 스트레칭 마스크 제조장치 및 방법 |
KR100700838B1 (ko) * | 2005-01-05 | 2007-03-27 | 삼성에스디아이 주식회사 | 섀도우마스크 패턴 형성방법 |
-
2005
- 2005-01-05 KR KR1020050000958A patent/KR100700839B1/ko active IP Right Grant
- 2005-08-15 JP JP2005235505A patent/JP4508979B2/ja active Active
- 2005-08-26 CN CN2005100923243A patent/CN1800970B/zh active Active
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101289046A (zh) * | 2007-04-17 | 2008-10-22 | 厦门虹泰光学有限公司 | 具有隐形图案的基材及其加工方法 |
CN105355796B (zh) * | 2012-01-12 | 2017-06-13 | 大日本印刷株式会社 | 拼版蒸镀掩模 |
CN105355796A (zh) * | 2012-01-12 | 2016-02-24 | 大日本印刷株式会社 | 拼版蒸镀掩模 |
US10208373B2 (en) | 2012-11-15 | 2019-02-19 | V Technology Co., Ltd. | Production method for deposition mask |
CN104797733A (zh) * | 2012-11-15 | 2015-07-22 | 株式会社V技术 | 成膜掩模的制造方法 |
CN104797733B (zh) * | 2012-11-15 | 2017-06-23 | 株式会社V技术 | 成膜掩模的制造方法 |
US10053767B2 (en) | 2013-07-02 | 2018-08-21 | V Technology Co., Ltd. | Deposition mask and method for producing deposition mask |
CN105358732A (zh) * | 2013-07-02 | 2016-02-24 | 株式会社V技术 | 成膜掩模和成膜掩模的制造方法 |
CN105358732B (zh) * | 2013-07-02 | 2017-12-19 | 株式会社V技术 | 成膜掩模和成膜掩模的制造方法 |
US10301716B2 (en) | 2013-07-02 | 2019-05-28 | V Technology Co., Ltd. | Deposition mask and method for producing deposition mask |
CN104532183A (zh) * | 2015-01-26 | 2015-04-22 | 深圳市华星光电技术有限公司 | 高精度掩膜板的制作方法 |
CN106350768A (zh) * | 2015-07-17 | 2017-01-25 | 凸版印刷株式会社 | 蒸镀用金属掩模以及蒸镀用金属掩模的制造方法 |
CN107851716A (zh) * | 2015-08-10 | 2018-03-27 | Ap系统股份有限公司 | 用于使用混合加工方法来制造荫罩的方法以及由此制造的荫罩 |
CN107851716B (zh) * | 2015-08-10 | 2020-08-21 | Ap系统股份有限公司 | 用于使用混合加工方法来制造荫罩的方法以及由此制造的荫罩 |
CN105349947B (zh) * | 2015-10-27 | 2018-01-12 | 深圳浚漪科技有限公司 | 高精度金属掩模板加工方法 |
CN105349947A (zh) * | 2015-10-27 | 2016-02-24 | 唐军 | 高精度金属掩模板加工方法 |
CN111095591A (zh) * | 2017-09-04 | 2020-05-01 | 应用材料公司 | 用于高res fmm的fmm工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN1800970B (zh) | 2011-02-09 |
JP2006188748A (ja) | 2006-07-20 |
KR20060080476A (ko) | 2006-07-10 |
KR100700839B1 (ko) | 2007-03-27 |
JP4508979B2 (ja) | 2010-07-21 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090109 Address after: Gyeonggi Do, South Korea Applicant after: Samsung Mobile Display Co., Ltd. Address before: Gyeonggi Do, South Korea Applicant before: Samsung SDI Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MOBILE DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG SDI CO., LTD. Effective date: 20090109 |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MONITOR CO., LTD. Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD. Effective date: 20121029 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121029 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Display Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Mobile Display Co., Ltd. |